Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

692results about "Feed-through capacitors" patented technology

Non-ferromagnetic tank filters in lead wires of active implantable medical devices to enhance MRI compatibility

InactiveUS20080049376A1High impedanceMuch smaller and volumetrically efficientMultiple-port networksAnti-noise capacitorsCapacitanceEngineering
A TANK filter is provided for a lead wire of an active medical device (AMD). The TANK filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the TANK filter is resonant at a selected frequency. In a preferred form, the TANK filter reduces or even eliminates the use of ferro-magnetic materials, and instead uses non-ferromagnetic materials so as to reduce or eliminate MRI image artifacts or the force or torque otherwise associated during an MRI image scan.
Owner:WILSON GREATBATCH LTD

Apparatus and process for reducing the susceptability of active implantable medical devices to medical procedures such as magnetic resonance imaging

A feedthrough terminal assembly for an active implantable medical device (AIMD) includes a plurality of leadwires extending from electronic circuitry of the AIMD, and a lossy ferrite inductor through which the leadwires extend in non-conductive relation for increasing the impedance of the leadwires at selected RF frequencies and reducing magnetic flux core saturation of the lossy ferrite inductor through phase cancellation of signals carried by the leadwires. A process is also provided for filtering electromagnetic interference (EMI) in an implanted leadwire extending from an AIMD into body fluids or tissue, wherein the leadwire is subjected to occasional high-power electromagnetic fields such as those produced by medical diagnostic equipment including magnetic resonance imaging.
Owner:GREATBATCH SIERRA INC

Hermetic feedthrough terminal assembly with wire bond pads for human implant applications

A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.
Owner:WILSON GREATBATCH LTD

Capacitor and method for producing a capacitor

An electrode for a capacitor includes a substrate comprising at least one of glassy carbon and a metal. According to various embodiments, the substrate may be provided as glassy carbon or any of a variety of metals for use in capacitors. The capacitor also includes an activated carbon material adjacent the substrate. The activated carbon layer includes oxygen-containing functional groups. A material is provided in contact with the activated carbon layer for providing enhanced capacitance for the electrode. Various types of capacitance-enhancing materials may be utilized, including carbon nanotubes and conductive metal oxides.
Owner:MEDTRONIC INC

Tank filters adaptable for placement with a guide wire, in series with the lead wires or circuits of active medical devices to enhance MRI compatibility

A tank filter is provided for a lead wire of an active medical device (AMD). The tank filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the tank filter is resonant at a selected frequency. A passageway through the tank filter permits selective slidable passage of a guide wire therethrough for locating the lead wire in an implantable position. The Q of the inductor may be relatively maximized and the Q of the capacitor may be relatively minimized to reduce the overall Q of the tank filter to attenuate current flow through the lead wire along a range of selected frequencies. In a preferred form, the tank filter is integrated into a TIP and / or RING electrode for an active implantable medical device.
Owner:WILSON GREATBATCH LTD

Tank filters utilizing very low k materials, in series with lead wires or circuits of active medical devices to enhance MRI compatibility

A TANK filter is provided for a lead wire of an active medical device (AMD). In a preferred form, the TANK filter is integrated into a TIP and / or RING electrode for an active implantable medical device. The TANK filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the TANK filter is resonant at a selected frequency to attenuate current flow through the lead wire along a range of selected frequencies. In a particularly preferred form, the TANK filter is manufactured using very low k materials of sufficient strength to handle forces applied thereto during installation and use.
Owner:WILSON GREATBATCH LTD

Cylindrical bandstop filters for medical lead systems

A one-piece cylindrical bandstop filter for medical lead systems incorporates parallel capacitive and inductive elements in a compact cylindrical configuration. The compact cylindrical configuration of the bandstop filter does not add significantly to the size or weight of the medical lead system. Preferably, the bandstop filters are of biocompatible materials or hermetically sealed in biocompatible containers. The parallel capacitive and inductive elements are placed in series with the medical lead system, and are selected so as to resonate at one or more selected frequencies, typically MRI pulsed frequencies.
Owner:WILSON GREATBATCH LTD

Apparatus and process for reducing the susceptibility of active implantable medical devices to medical procedures such as magentic resonance imaging

A feedthrough terminal assembly for an active implantable medical device (AIMD) includes magnetic shielding elements to block incident magnetic fields during medical procedures such as Magnetic Resonance Imaging. The assembly includes conductive or ground plate(s) embedded in an insulator surrounding elements of the assembly, a plurality of lead wires extending from electronic circuitry of the AIMD, and a lossy ferrite inductor through which the lead wires extend in non-conductive relation for increasing the impedance of the lead wires at selected RF frequencies. Alternatively, the assembly includes a conductive sleeve or cap surrounding the feedthrough capacitor and / or conductive support.
Owner:WILSON GREATBATCH LTD

EMI feedthrough filter terminal assembly utilizing hermetic seal for electrical attachment between lead wires and capacitor

ActiveUS6888715B2Reliable electrical attachmentAnti-noise capacitorsElectrotherapyHermetic sealEngineering
EMI feedthrough filter terminal assembly includes a feedthrough filter capacitor having first and second sets of electrode plates, and a first passageway having a first termination surface conductively coupling the first set of electrode plates. At least one lead wire extends through the first passageway and is conductively attached to a first oxide resistant conductive pad. The first pad is conductively coupled to the first termination surface independently of the lead wire. The terminal assembly may also include a conductive ferrule through which the lead wire passes in non-conductive relation, and an insulator fixed to the ferrule for conductively isolating the lead wire from the ferrule. The ferrule and insulator form a pre-fabricated hermetic terminal pin sub-assembly. The capacitor may include a second passageway having a second termination surface conductively coupling the second set of electrode plates, and a conductive ground lead extending therethrough.
Owner:WILSON GREATBATCH LTD

EMI filter terminal assembly with wire bond pads for human implant applications

An electromagnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.
Owner:WILSON GREATBATCH LTD

Low loss band pass filter for RF distance telemetry pin antennas of active implantable medical devices

A hermetic terminal for an active implantable medical device (AIMD), includes an RF distance telemetry pin antenna, a capacitor conductively coupled between the antenna and a ground for the AIMD, and an inductor electrically disposed in parallel with the capacitor and conductively coupled between the antenna and a ground for the AIMD. The capacitor and the inductor form a band pass filter for attenuating electromagnetic signals through the antenna except at a selected frequency band. Values of capacitance and inductance are selected such that the band pass filter is resonant at the selected frequency band.
Owner:WILSON GREATBATCH LTD

Capacitor-integrated feedthrough assembly with improved grounding for an implantable medical device

A feedthrough assembly for use with implantable medical devices having a shield structure, the feedthrough assembly engaging with the remainder of the associated implantable medical device to form a seal with the medical device to inhibit unwanted gas, liquid, or solid exchange into or from the device. One or more feedthrough wires extend through the feedthrough assembly to facilitate transceiving of the electrical signals with one or more implantable patient leads. The feedthrough assembly is connected to a mechanical support which houses one or more filtering capacitors that are configured to filter and remove undesired frequencies from the electrical signals received via the feedthrough wires before the signals reach the electrical circuitry inside the implantable medical device.
Owner:PACESETTER INC

Using interrupted through-silicon-vias in integrated circuits adapted for stacking

In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide signal paths other than common parallel paths between the ICs of the stack. This permits IC identification schemes and other functionalities to be implemented using TSVs, without requiring angular rotation of alternate ICs of the stack.
Owner:MOSAID TECH

Internally grounded filtering feedthrough

ActiveUS7046499B1Save additional assembly stepMinimize functional impactAnti-noise capacitorsElectrotherapyCounterboreFilter capacitor
A feedthrough device includes a conductive ferrule having an outer peripheral surface defining the outermost boundary of the feedthrough device, an insulator, a lead wire electrically isolated from the ferrule extending through the insulator, a filter capacitor adjacent the insulator through which the lead wire extends in conductive relation therewith, and a ground wire coupled to the ferrule and to the insulator within the outermost boundary of the feedthrough device. The ferrule has an inner peripheral surface defining an opening therethrough and each of the insulator and the filter capacitor has an outer peripheral surface proximate the inner peripheral surface, a counterbore in the outer peripheral surface of each of the insulator and filter capacitor, an end of the ground wire being received in the counterbore and brazed to the ferrule and insulator. Alternatively, an end of the ground wire is welded to the inner peripheral surface of the ferrule.
Owner:PACESETTER INC

EMI filtered connectors using internally grounded feedthrough capacitors

An EMI filtered connector includes a plurality of conductive terminal pins, a grounded conductive connector housing through which the terminal pins pass in non-conductive relation, and an array of feedthrough filter capacitors. Each of the feedthrough filtered capacitors has a distinct first set of electrode plates, a non-distinct second set of electrode plates, and a first passageway through which a respective terminal pin extends in conductive relation with the first set of electrode plates. At least one ground lead is conductively coupled to the conductive connector housing and extends into a second passageway through the array of feedthrough filter capacitors in conductive relation with the second set of electrode plates. An insulator is disposed in or adjacent to the connector for mounting the conductive terminal pins for passage through the conductive connector with the conductive terminal pins and the connector in non-conductive relation. The outer peripheral surface of the array of feedthrough filter capacitors is non-conductive.
Owner:WILSON GREATBATCH LTD

Electronic network components utilizing biocompatible conductive adhesives for direct body fluid exposure

An implantable passive or active electronic network component or component network is provided which is suitable for prolonged direct body fluid exposure and is attachable to a conductive surface, circuit trace, lead or electrode. The electronic network component or component network includes (1) a non-conductive body of biocompatible and non-migratable material, (2) a conductive termination surface of biocompatible and non-migratable material, associated with the body, and (3) a connection material of biocompatible and non-migratable material, for conductively coupling the termination surface to the conductive surface, circuit trace, lead or electrode. The electronic network component may include a capacitor, a resistor, an inductor, a diode, a transistor, an electronic switch, a MEMs device, or a microchip. A biocompatible and non-migratable adhesive is utilized to conductively couple components of the individual components of the electronic network, such as the conductive surface, circuit trace, lead or electrode.
Owner:WILSON GREATBATCH LTD

Integrated Filter Feedthrough Assemblies Made From Low Temperature Co-Fired (LTCC) Tape

A filter capacitor comprising a substrate of at least one layer of a low temperature co-fires ceramic (LTCC) tape supporting alternating active and ground electrode layers segregated by a dielectric layer is described. The substrate is preferably a laminate of three LTCC tapes pieces that are heated under pressure and at a relatively low temperature to become a laminate that maintains its shape and structure dimensions even after undergoing numerous sintering steps. Consequently, relatively thin active and ground electrode layers along with the intermediate dielectric layer can be laid down or deposited on the LTCC substrate by a screen-printing technique. A second laminate of LTCC tapes is positioned on top of the active / dielectric / ground layers to finish the capacitor. Consequently, a significant amount of space is saved in comparison to a comparably rated capacitor or, a capacitor of a higher rating can be provided in the same size as a conventional prior art capacitor.
Owner:WILSON GREATBATCH LTD

Elevated Hermetic Feedthrough Insulator Adapted for Side Attachment of Electrical Conductors on the Body Fluid Side of an Active Implantable Medical Device

ActiveUS20130184796A1Minimizes damaging tensile stressTensile stress is particularly damagingAnti-noise capacitorsLine/current collector detailsElectricityElectrical conductor
An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
Owner:WILSON GREATBATCH LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products