203results about "Feed-through capacitors" patented technology

A self-centering washer is positioned between a feedthrough and a filter circuit board. The washer has openings through which first and second terminal pins extend. A first opening has an inner arcuate portion contacting the first terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. A second opening has an inner arcuate portion contacting the second terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. In an imaginary configuration with the first and second washer openings superimposed one on top of the other, the cumulative arcuate distance of the inner arcuate portions about one of the terminal pins, subtracting overlap, results in a gap between the superimposed washer openings that is less than a diameter of the first and second terminal pins so that the washer is prevented from lateral movement.

The technology described herein is directed towards a capacitor with a modified design (relative to standard capacitors), in which a first conductor is coupled to a second conductor via a distributed array of conducting interconnects through a dielectric that separates the conductors. The array of interconnects facilitates electrical surface current flow between the first conductor and the second conductor, and determines the self-resonant frequency of the capacitor. The array (or enlarged area) of conducting interconnects, not present in standard capacitors, results in capacitors with larger self-resonant frequency, e.g., having a substantially stable capacitance over a range of high radio frequencies, including millimeter wave frequencies. This further provides an improved quality factor. The improvements resulting from the technology described herein facilitate more optimal surface current density. The modified capacitor provides benefits in various circuits, e.g., in an impedance or a millimeter wave frequency phase shifter for antenna elements.

A trench capacitor manufacturing method is provided. The method includes forming a deep trench in a wafer, forming a trench capacitor structure including a plurality of dielectric films and a plurality of conductive layers in the deep trench; determining if the wafer has a tensile stress based on the forming of the trench capacitor structure; performing a high temperature heat treatment to the trench capacitor structure to change a form of the wafer to a direction that offsets the tensile stress; forming an inter-layer insulating film on the trench capacitor structure; and forming a metal interconnect on the inter-layer insulating film.

A feedthrough terminal pin connector assembly for an active implantable medical device (AIMD) includes first and second terminal pin connectors, each comprising a sidewall having an exterior surface spaced from an interior surface defining a connector opening extending along a longitudinal axis. At least a first portion of the sidewall is electrically conductive. An electrically conductive compliant structure is supported by the electrically conductive portion of the sidewall in each of the first and second connector openings. A common housing contains the first and second terminal pin connectors with an insulative material electrically isolating the first and second electrically conductive sidewall portions from each other. The common housing is configured to be supported on a circuit board having at least a first and a second electrical circuits with the first and second electrically conductive portions being electrically connected to the respective first and second electrical circuits.

A filtered feedthrough comprises an insulator sealed in a ferrule opening. A terminal pin sealed in an insulator via hole has a first end that extends outwardly beyond an insulator device side. A filter capacitor adjacent to the insulator device side has a dielectric supporting interleaved active and ground electrode plates. A passageway extending through the dielectric has an internal metallization. An external metallization is on a terminated portion as opposed to an unterminated portion of the dielectric outer surface. The capacitor ground electrode plates extend to the external metallization at the terminated portion, but they do not extend to the unterminated outer surface portion. The outwardly extending terminal pin end is connected to the internal metallization in the dielectric passageway which in turn is connected to the active electrode plates. A conductive material connects the capacitor external metallization at the terminated dielectric outer surface portion to a system ground.

A self-centering ceramic washer is positioned between a feedthrough and a filter circuit board. The washer has openings through which first and second terminal pins extend. A first opening has an inner arcuate portion contacting the first terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. A second opening has an inner arcuate portion contacting the second terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. In an imaginary configuration with the first and second washer openings superimposed one on top of the other, the cumulative arcuate distance of the inner arcuate portions about one of the terminal pins, subtracting overlap, results in a gap between the superimposed washer openings that is less than a diameter of the first and second terminal pins so that the washer is prevented from lateral movement.

A deep trench is formed in a substrate. A layer stack including at least three metallic electrode layers interlaced with at least two node dielectric layers is formed over the substrate. The layer stack continuously extends into the deep trench, and a cavity is present in an unfilled volume of the deep trench. A dielectric fill material layer including a dielectric fill material is formed in the cavity and over the substrate. The dielectric fill material layer encapsulates a void that is free of any solid phase and is formed within a volume of the cavity. The void may expand or shrink under stress during subsequently handling of a deep trench capacitor including the layer stack to absorb mechanical stress and to increase mechanical stability of the deep trench capacitor.

A capacitor that includes a substrate having a surface; a lower electrode opposing the surface of the substrate; a dielectric film on the lower electrode; an upper electrode on the dielectric film; a protective layer on the lower electrode, the dielectric film, and the upper electrode, the protective layer defining a through-hole exposing at least one of the lower electrode and the upper electrode; at least one protrusion in the through-hole; and an outer electrode covering the through-hole and the at least one protrusion.

A filtered feedthrough comprises an insulator sealed in a ferrule opening. A terminal pin sealed in an insulator via hole has a first end that extends outwardly beyond an insulator device side. A filter capacitor adjacent to the insulator device side has a dielectric supporting interleaved active and ground electrode plates. A passageway extending through the dielectric has an internal metallization. An external metallization is on a terminated portion as opposed to an unterminated portion of the dielectric outer surface. The capacitor ground electrode plates extend to the external metallization at the terminated portion, but they do not extend to the unterminated outer surface portion. The outwardly extending terminal pin end is connected to the internal metallization in the dielectric passageway which in turn is connected to the active electrode plates. A conductive material connects the capacitor external metallization at the terminated dielectric outer surface portion to a system ground.

A feedthrough capacitor not packaged by glass and applicable to an airtight device includes a disk-like ceramic capacitor body (1) of a multilayer laminated structure. A Kovar tube (3) is disposed in an inner hole (2) of the disk-like ceramic capacitor body (1), a conductive pin (4) penetrates through an inner hole (2) of the Kovar tube (3), and the conductive pin (4) and the Kovar tube (3) as well as the Kovar tube (3) and the disk-like ceramic capacitor body (1) are soldered and fixed with gold-tin alloy solder. The distance between the conductive pin (4) and the inner hole (2) of the disk-like ceramic capacitor body (1) is shortened by adding the Kovar tube (3) between the conductive pin (4) and the disk-like ceramic capacitor body (1), so that the amount of the gold-tin alloy solder used in a soldering process is effectively reduced. Because the amount of the gold-tin alloy solder used is reduced, the influence of thermal expansion and contraction of the gold-tin alloy solder on a ceramic capacitor can be greatly relieved, thereby improving the quality of the ceramic capacitor. Moreover, the entire product can be easily cleaned, with no flux left, and dense solder joints are formed to meet specific airtightness requirements.

A connector for a body of a hair care appliance is described. The connector is arranged to connect the body with a power cable, where the body is configured to be held by a user during use of the hair care appliance, and the power cable is used to supply power to the body. The connector includes a capacitor for reducing an amount of electrical noise generated in the body that is transmitted to the power cable. A body comprising the connector and a hair care appliance comprising such a body are also described.

A three-terminal multilayer ceramic capacitor includes end-surface external electrodes on end surfaces, and a side-surface external electrode on at least one side surface. An internal electrode includes an end-surface exposed internal electrode exposed on an end surface and connected to the end-surface external electrode, and a side-surface exposed internal electrode on a side surface and connected to the side-surface external electrode. A lengthwise dimension of the side-surface external electrode satisfies about 0.10 mm<Li<about 0.25 mm, and a total dimension Lall and a total dimension Wall satisfy a relationship of about 0.4 Wall≤Lall≤about 1.0 Wall.

Class Y capacitor (1, 7, 12, 16, 27), which can be connected between a line and ground, comprising a first and a second electric conductor (2, 3), which are separated by a dielectric medium, wherein the first electric conductor (2) is connected to a first leg (4, 8, 9, 13, 18) and the second electric conductor (3) is connected to a second leg (5, 10, 11, 19), wherein the first leg (4, 8, 9, 13, 18) has a larger cross-section than the second leg (5, 10, 11, 19). In addition, an inverter (23) with a class Y capacitor (1, 7, 12, 16, 27) is described.

The utility model discloses a low noise capacitor, and specifically relates to the power capacitor technology field, comprising a capacitor housing, the left and right side walls of the capacitor housing are welded with connecting frames, the two connecting frames are internally provided with filter frames, the filter frames are connected with filter screens, the filter frames are symmetrically welded with two spacing seats, and the spacing seats are arranged on the two spacing seats. A connecting seat is welded on the surface of the capacitor shell, a sliding seat is movably arranged on the surface of the connecting seat in a penetrating mode, one end of the sliding seat is connected with a socket connected with the limiting seat in an inserted mode, and an extrusion spring is connected between the connecting seat and the sliding seat; through the arrangement of the structure, limiting mounting or dismounting cleaning of the filter frame and the filter screen can be rapidly and conveniently achieved, and the practicability of the device is improved.

An interposer device comprising an interposer substrate;a plurality of conducting vias extending through the interposer substrate;a conductor pattern on the interposer substrate, and a nanostructure energy storage device. The nanostructure energy storage device comprises at least a first plurality of conductive nanostructures formed on the interposer substrate;a conduction controlling material embedding each nanostructure in the first plurality of conductive nanostructures;a first electrode connected to each nanostructure in the first plurality of nanostructures; and a second electrode separated from each nanostructure in the first plurality of nanostructures by the conduction controlling material,wherein the first electrode and the second electrode are configured to allow electrical connection of the nanostructure energy storage device to the integrated circuit.

A filtered feedthrough comprises an insulator sealed in a ferrule opening. A terminal pin sealed in an insulator via hole has a first end that extends outwardly beyond an insulator device side. A filter capacitor has a square- or rectangularly-shaped dielectric supporting interleaved active and ground electrode plates. A passageway extending through the dielectric has an internal metallization. An external metallization is contacted to opposed longitudinal sides of the dielectric outer surface. The capacitor ground electrode plates extend to the opposed external metallizations. The outwardly extending terminal pin end is connected to the internal metallization in the dielectric passageway which in turn is connected to the active electrode plates. A conductive material connects the capacitor external metallization at one of the longitudinal sides to an oxide-resistant surface on the ferrule while the other external metallization is connected to an oxidized surface of the ferrule.

A self-centering ceramic washer is positioned between a feedthrough and a filter circuit board. The washer has openings through which first and second terminal pins extend. A first opening has an inner arcuate portion contacting the first terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. A second opening has an inner arcuate portion contacting the second terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. In an imaginary configuration with the first and second washer openings superimposed one on top of the other, the cumulative arcuate distance of the inner arcuate portions about one of the terminal pins, subtracting overlap, results in a gap between the superimposed washer openings that is less than a diameter of the first and second terminal pins so that the washer is prevented from lateral movement.

A deep trench structure may be formed between electrodes of a capacitive device. The deep trench structure may be formed to a depth, a width, and / or an aspect ratio that increases the volume of the deep trench structure relative to a trench structure formed using a metal etch-stop layer. Thus, the deep trench structure is capable of being filled with a greater amount of dielectric material, which increases the capacitance value of the capacitive device. Moreover, the parasitic capacitance of the capacitive device may be decreased by omitting the metal etch-stop layer. Accordingly, the deep trench structure (and the omission of the metal etch-stop layer) may increase the sensitivity of the capacitive device, may increase the humidity-sensing performance of the capacitive device, and / or may increase the performance of devices and / or integrated circuits in which the capacitive device is included.

Systems, devices, and methods discussed herein include wireless midfield transmitters and implantable receiver devices. A midfield transmitter can be configured to provide signals outside of tissue that give rise to propagating signals inside of tissue. The present subject matter includes a protection circuit for a transmitter device, a layered transmitter device, an implantable receiver device, implantation and extraction methods, test and assembly methods, and the like. In an example, a protection circuit includes a first control circuit to receive an RF drive signal and conditionally provide an output signal to an antenna. A second control circuit can generate a control signal based on the antenna output signal and / or information about the RF drive signal. A gain circuit can provide the RF drive signal to the first control circuit. The gain circuit can change an amplitude of the RF drive signal based on the control signal from the second control circuit.

A multilayer ceramic capacitor includes a multilayer body including an inner layer portion in which dielectric layers and internal electrodes are alternately stacked and outer layer portions on both sides of the inner layer portion in a stacking direction, and external electrodes on at least one surface of the multilayer body in a direction intersecting the stacking direction and including main-surface-side folded-back sections and covering a portion of the outer layer portions. A mixture layer of a dielectric and a metal is provided in covered sections of the outer layer portions covered by the main-surface-side folded-back sections.

Systems, devices, and methods discussed herein include wireless midfield transmitters and implantable receiver devices. A midfield transmitter can be configured to provide signals outside of tissue that give rise to propagating signals inside of tissue. The present subject matter includes a protection circuit for a transmitter device, a layered transmitter device, an implantable receiver device, implantation and extraction methods, test and assembly methods, and the like. In an example, a protection circuit includes a first control circuit to receive an RF drive signal and conditionally provide an output signal to an antenna. A second control circuit can generate a control signal based on the antenna output signal and / or information about the RF drive signal. A gain circuit can provide the RF drive signal to the first control circuit. The gain circuit can change an amplitude of the RF drive signal based on the control signal from the second control circuit.

An internally grounded filter feedthrough having a filter capacitor connected to a feedthrough is described. The feedthrough comprises an insulator having an active conductive pathway extending to its device and body fluid sides, and a ground conductive pathway extending part-way through the insulator thickness from the insulator device side. An undercut extending into the insulator sidewall communicates with the ground conductive pathway but does not extend to the insulator device or body fluid sides or to the active conductive pathway. A braze seals the insulator sidewall to the ferrule and extends into the undercut so that the braze contacts the ground conductive pathway. That way, the braze provides a ground electrical path from a capacitor ground via to the ground conductive pathway in the insulator connected to the braze sealed to the ferrule.

The invention discloses a multilayer ceramic capacitor, comprising a ceramic body, a first terminal electrode and a second terminal electrode; the ceramic body comprises a plurality of dielectric layers and a plurality of internal electrodes, and also comprises an upper surface and a lower surface of the ceramic body arranged oppositely, a first end surface and a second end surface arranged oppositely, and a first side surface and a second side surface arranged oppositely; the first terminal electrode is located at the first end surface and covers the upper surface, the lower surface, the first side surface and a part of the second side surface, the second terminal electrode is located at the second end surface and covers the upper surface, the lower surface, the first side surface and a part of the second side surface; the internal electrode comprises a first internal electrode, a second internal electrode and a third internal electrode, one end of the first internal electrode is connected to the first terminal electrode, and the other end forms a gap with the second terminal electrode, one end of the second internal electrode is connected to the second end surface, and the other end forms a gap with the first terminal electrode, and at least one dielectric layer is arranged between the third internal electrode and the first internal electrode and the second internal electrode respectively. The withstand voltage performance of the capacitor is improved.

Provided is a multilayer ceramic electronic component that can handle a larger current.　A multilayer ceramic electronic component 100 according to the present invention comprises: a multilayer ceramic capacitor provided with a laminate and at least four or more external electrodes 30, the laminate having a first main surface 12a and a second main surface 12b opposing each other in a lamination direction, a first surface 12c and a second surface 12d opposing each other in a first direction orthogonal to the lamination direction, and a third surface 12e and a fourth surface 12f opposing each other in a second direction orthogonal to the lamination direction and the first direction, and the at least four or more external electrodes 30 being disposed on any of the first surface 12c, the second surface 12d, the third surface 12e, and the fourth surface 12f; and a junction electrode 40 disposed on the first main surface 12a or the second main surface 12b and electrically connecting at least two or more external electrodes of the same potential among the external electrodes 30. The present invention is characterized by satisfying, when the DC resistance of the multilayer ceramic capacitor 10 is denoted by Rdc1 and the DC resistance of the junction electrode 40 is denoted by Rdc3, Rdc1 ≤ Rdc3.

The utility model relates to a circuit board assembly and electronic equipment, the circuit board assembly comprises a circuit board and a capacitor arranged on the circuit board, the capacitor comprises a capacitor body, the capacitor body is opposite to a first surface of the circuit board, and the capacitor body comprises a plurality of electrode slice units arranged in a preset arrangement mode. Each electrode plate unit comprises a positive electrode plate and a negative electrode plate which are stacked, and the preset arrangement mode is configured in the mode that the vibration directions of the at least two electrode plate units are opposite, or the vibration directions of the electrode plate units are parallel to the first surface or form a non-vertical included angle with the first surface. Therefore, the vibration directions of the electrode plate units are opposite, so that the vibration of the electrode plate units can be mutually counteracted, and the vibration directions of the electrode plate units are parallel to the circuit board or form a non-vertical included angle with the circuit board, so that the vibration of the electrode plate units in the direction perpendicular to the circuit board can be effectively reduced or eliminated; the problem of noise squeal generated by vibration of the circuit board driven by the capacitor is reduced, and the use experience of a user is further improved.

A capacitor module is provided between a power storage body and an inverter. The capacitor module comprises a first film capacitor and a second film capacitor that are wound. The first film capacitor includes a first outer peripheral surface. The second film capacitor is connected in parallel to the first film capacitor and includes a second outer peripheral surface opposed to the first outer peripheral surface. A space x between the first outer peripheral surface and the second outer peripheral surface meets a predetermined expression.

Provided is a double-sided copper-clad laminate for forming a capacitor, which, when used as a capacitor, can exhibit excellent characteristics in terms of voltage resistance and peel strength while ensuring high capacitor capacitance. [Solution] A double-sided copper-clad laminate comprising an adhesive layer and copper foil, in that order, on each side of a resin film, the resin film being in a cured state at 25°C, and the copper foil on the side in contact with the adhesive layer has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less, measured in accordance with ISO 25178.

A semiconductor structure includes a substrate containing first-type deep trenches and second-type deep trenches. The first-type deep trenches and the second-type deep trenches have lengthwise sidewalls that laterally extend along different directions. The semiconductor structure includes a capacitor structure, which includes a layer stack containing at least three metallic electrode layers interlaced with at least two node dielectric layers. Each layer within the layer stack includes a horizontally-extending portion that overlies a top surface of the substrate and vertically-extending portions that protrude downward into a respective one of the first-type deep trenches and second-type deep trenches. The different orientations of the lengthwise directions of the deep trenches reduces deformation of the semiconductor structure. Stress-relief structures may be formed in corner regions of the capacitor structure to provide structural reinforcement.

The present invention provides a multilayer ceramic capacitor which makes it possible to prevent layer separation while also reducing internal stress differences. Provided is a multilayer ceramic capacitor 1 comprising end face exposure internal electrodes 15A and lateral face exposure internal electrodes 15B and comprising first dielectric layers 14A in which the end face exposure internal electrodes 15A are disposed and second dielectric layers 14B in which the lateral face exposure internal electrodes 15B are disposed. In each of the first dielectric layers 14A or the second dielectric layers 14B, an auxiliary internal electrode 16 is disposed toward one surface in which an internal electrode is not disposed, said auxiliary internal electrode 16 being separate from the internal electrode, being exposed at said one surface, and being opposite from a lead-out portion of another internal electrode that is adjacent to said internal electrode in the layering direction. Provided in each auxiliary internal electrode 16 is a through hole 17h which passes therethrough in the layering direction and in which is disposed a dielectric of the same material as the dielectric layer. The dielectric connects a dielectric layer that is on one main surface side and that contacts the auxiliary internal electrode 16 with a dielectric layer that is on another main surface side.