604results about "Structural fixed capacitor combinations" patented technology

The invention comprises a method and apparatus for processing power, comprising the steps of: generating / using 3-phase power; feeding an AC drive with the 3-phase power, the AC drive generating a first output; and transforming the first output with a zigzag transformer, the zigzag transformer linked to at least one load output / load connector. The method and apparatus comprises an optional filter for filtering the 3-phase power prior to the step of transforming, the filter including a distributed gap core material.

To provide a laminated filter capable of improving performance.SOLUTION: A laminated filter 1 comprises a wall 13 which is disposed and grounded between a first inductor 11 and a second inductor 12. Therefore, electromagnetic coupling between the first inductor 11 and the second inductor 12 can be suppressed. A penetration part 30 penetrating in an opposing direction, in which the first inductor 11 and the second inductor 12 are opposed, is formed in the wall 13. In a lamination direction, a size of the penetration part 30 is larger than a size of one insulator layer 7. The wall 13 includes the large penetration part 30 to make a magnetic flux of the second inductor 12 which is a longitudinally wound inductor pass from the penetration part 30. Therefore, it is possible to suppress disturbance of the magnetic flux of the second inductor 12 to enhance a Q-value.SELECTED DRAWING: Figure 2

To provide a circuit element that can improve its characteristics.SOLUTION: According to an embodiment, a circuit element includes a first conductive member, a second conductive member, a first layer, and a dielectric film. The first layer is between the first conductive layer and the second conductive layer. The first layer includes a first structure and a plurality of second structures. The plurality of second structures are arranged side by side on a first plane intersecting a first direction from the first conductive member to the second conductive member. At least part of the first structure is between the plurality of second structures on the first plane. A second conductivity of the plurality of second structures is different from a first conductivity of the first structure. The first layer is electrically connected to the second conductive member. The dielectric film is between the first conductive member and the first layer.SELECTED DRAWING: Figure 1

A capacitor assembly includes a traction inverter system housing and a set of power electronics defining two or more contacts, the set of power electronics mounted within the traction inverter system housing. A capacitor housing containing a capacitor is mounted within the traction inverter system housing. The capacitor includes two or more terminals extending outwardly therefrom and overlapping the two or more contacts. A terminal block is secured to the capacitor housing independent of attachment of the two or more contacts to the two or more terminals. The terminal block is configured to support the two or more terminals during a fastening operation attaching the two or more terminals to the two or more contacts. The terminal block may also be secured to the capacitor housing.

According to an embodiment, a biopotential measurement system includes an analog front-end and digital circuits. The analog front-end circuit includes a sensing electrode, a forward amplifier, and a feedback amplifier with an integration capacitor. A feature is the attenuation circuit between the forward and feedback amplifiers, which provides an attenuation factor determining the integration capacitor's value for achieving the desired high-pass corner frequency. With configurable attenuation factors, the system can process different biopotential signals. Multiple analog front-end circuits can be used to process different signals simultaneously. The digital circuit includes a processor for signal processing, dynamic adjustment of attenuation factors, and anomaly detection. Additional components like switched capacitors, pseudo-resistors, and multiplexers can enhance the system's functionality. The design allows flexible, multi-parameter physiological monitoring with adjustable frequency responses and gain settings.

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate with a first surface and a second surface, where the substrate comprises glass. In an embodiment, the electronic package further comprises a via opening through the substrate, where sidewalls of the via opening have a root mean squared (RMS) surface roughness that is approximately 100 nm or greater. In an embodiment, the electronic package further comprises a liner over the sidewalls of the via opening, where an RMS surface roughness of the liner is approximately 50 nm or smaller. An electronic package may further comprise a via through the via opening.

A semiconductor device includes: a filter circuit including: a resistor; a MOS capacitor; and a MOM capacitor stacked on at least one of the resistor or the MOS capacitor, wherein the following inequalities are satisfied:Mc≥β−γ / β+γ×Mr Mr≤√{square root over (1 / 2πftαβ)}  [Math. 1]where ft denotes a cutoff frequency of the filter circuit, Mr denotes a resistor area of a resistor-provided region in which the resistor is provided, Mc denotes a MOS capacitor area of a MOS capacitor-provided region in which the MOS capacitor is provided, α denotes a resistivity of the resistor, β denotes a MOS capacitance rate of the MOS capacitor, and γ denotes a MOM capacitance rate of the MOM capacitor.

Systems and methods for press-forming a flexible thin sheet of ceramic paste, such as, e.g., barium titanate, into a wavy shape. The wave may be 1-dimensional, such as, e.g., a sinusoid, or 2-dimensional, such as, e.g., an egg-crate shape. A mold embossed with a reverse, or negative, of an intended form of the wavy shape may be used. The egg-crate shape ceramic layers may be stacked with alternating sheets of a conductive, or electrode, material before being sintered and densified. Alternatively, the ceramic sheets can be layered with the sheets of conductive material, and then pressed into the wavy shape together. Optionally, conductive ink may be applied to the ceramic sheets instead of using sheets of conductive material in both cases.

Various aspects of the present disclosure generally relate to wireless communication, and to a pillar that includes one or more structures configured to define a capacitor. For example, a device includes a die, a substrate, and a pillar having an embedded capacitor. The pillar is electrically connected to one or more conductors of the die and to one or more conductors of the substrate. The pillar includes a first conductive structure and a second conductive structure. The pillar also includes a dielectric layer disposed between the first conductive structure and the second conductive structure to define the embedded capacitor.

Power converter (1) with: a switching circuit (20); a capacitor module (3) which is electrically connected to the switching circuit; an auxiliary capacitor module (5) connected in parallel to the capacitor module; and a device housing (12) which contains the switching circuit, the capacitor module and the auxiliary capacitor module, wherein The capacitor module includes: a capacitor element (31), a capacitor housing (32) that contains the capacitor element, an encapsulation resin (33) that encapsulates the capacitor element in the capacitor housing, and a capacitor busbar (4) which connects the capacitor element to a power terminal of the switching circuit, wherein the capacitor busbar includes: an element connection section (41) that is connected to the capacitor element within the encapsulation resin, a connecting section (42) which is connected to the power connection outside the encapsulation resin, and a power supply connection section (43) which is connected to a power supply wiring (54) outside the encapsulation resin, wherein the power supply wiring is electrically connected to a DC power supply, wherein the capacitor busbar includes a DC path (44) which represents a current path between the terminal connection section and the power supply connection section, and the DC path is exposed to the outside of the encapsulation resin, the auxiliary capacitor module is connected to the power supply connection section of the capacitor busbar, the auxiliary capacitor module is detachably attached to the power supply connection section by means of a fastening element (11), and a fastening direction of a fastening element (135) that secures the auxiliary capacitor module and a fastening direction of the fixing element are the same.

Systems and methods for additive printing of barium titanate (BaTiO3) components using precursors of barium titanate, i.e., barium carbonate (BaCO3) and titanium dioxide (TiO2), to prevent clogging of nozzles. Solid of barium carbonate and titanium dioxide are prepared by an electrical-assisted breakdown process, such as, e.g., milling, blending, and / or grinding. The assisted breakdown process allows for the reduction of particle size, thorough mixing, and consistent particle distribution of the precursors. In addition, the finer particles possess a much higher sinterability of the precursors while giving rise to denser final products. A planetary ball milling system with zirconia vial and balls at a fixed rotation speed may be used. The precursors are then printed into a green part. A solid-state reaction between barium carbonate and titanium dioxide to form barium titanate is activated by the application of heat, such as, e.g., through a sintering process, which forms the final product.

The reliability of an electronic device provided with a conductor pattern covered by a dielectric film is improved. An electronic device (100) is provided with: a substrate (110) including regions (111, 112); a resistance element (40) formed in the region (112); a dielectric film (21) covering the region (111) and the resistance element (40); a conductor pattern (31) formed in the region (111) via the dielectric film (21); an adhesion film (50) that does not cover the region (112) but covers the upper surface (31a) and the side surfaces (31b) of the conductor pattern (31); and a dielectric film (22) that covers the upper surface (31a) and the side surfaces (31b) of the conductor pattern (31) via an adhesion film (50).

A device according to some embodiments includes a first IPD die including a first SiC substrate. The first IPD die has a first surface and a second surface on the first SiC substrate opposite the first surface and includes a first contact and at least one first metal portion on the respective surfaces of the first SiC substrate. The device further includes a second IPD die including a second SiC substrate. The second IPD die has a third surface and a fourth surface on the second SiC substrate opposite the third surface and includes a second contact and at least one second metal portion on the respective surfaces of the second SiC substrate. The device further includes an electrical interconnection structure between one of the first and second surfaces of the first IPD die and one of the third and fourth surfaces of the second IPD die.

Provided is an electronic component that can suppress changes in characteristics even when stacking misalignment occurs. [Solution] The electronic component 1 comprises a base body 2, a capacitor conductor 32 having a main body portion 32A and a connection portion 32B electrically connecting the main body portion 32A to one terminal electrode, and a ground conductor 34 arranged within the base body 2 in a position opposite the capacitor conductor 32 in a second direction D2, wherein the ground conductor 34 has a first recess 34A when viewed from the second direction D2, and the connection portion 32B has a first portion 32Ba extending in the first direction D1 and having one end connected to the main body portion 32A, and a second portion 32Bb extending in a third direction D3 and having one end connected to the other end of the first portion 32Ba, wherein when viewed from the second direction D2, a part of the first portion 32Ba faces the ground conductor 34, and the second portion 32Bb is located in the first recess 34A.

Various aspects of the present disclosure generally relate to wireless communication, and to a pillar that includes one or more structures configured to define a capacitor. For example, a device (100) includes a die (102), a substrate (104), and a pillar (106) having an embedded capacitor. The pillar is electrically connected to one or more conductors of the die and to one or more conductors of the substrate. The pillar includes a first conductive structure (1102) and a second conductive structure (112). The pillar also includes a dielectric layer (114) disposed between the first conductive structure and the second conductive structure to define the embedded capacitor.

A capacitor module that includes: a plurality of capacitors each including: a first electrode and a second electrode that face each other, and a side surface joining the first electrode and the second electrode, the side surface having a pair of flat portions that face each other, and a pair of curved portions joining the pair of flat portions to each other, the plurality of capacitors being arrayed in a row such that the flat portions of adjacent capacitors face each other; at least one metal sheet arranged in any of spaces between the flat portions of the adjacent capacitors, the at least one metal sheet being in contact with the first electrode of at least one of the adjacent capacitors; a first bus-bar electrically connected to the at least one metal sheet; and a second bus-bar electrically connected to each of the second electrodes of the plurality of capacitors.

The present disclosure provides a capacitor which is advantageous from the perspective of capacitance and insulation breakdown electric field. This capacitor (1a) is provided with a first electrode (11), a second electrode (12), and a dielectric (20). The dielectric (20) is disposed between the first electrode (11) and the second electrode (12). The dielectric (20) contains a composite oxide. The composite oxide is composed of Cs, at least one element selected from the group consisting of Ti, Zr, and Hf, and W.

A filter device, method of manufacture and use thereof. The filter device comprises a foil-wound inductor formed by a first conductive foil strip having a first terminal and a second terminal, the first conductive foil strip wound around a core to form a plurality of winding layers such that the first terminal is proximate the core and the second terminal is located at an outermost winding layer, and a continuous dielectric insulating layer between the plurality of winding layers of the first conductive foil strip; and a tunable capacitor formed by a second conductive foil strip at least partially encircling the outermost winding layer of the foil-wound inductor and a dielectric insulating layer disposed therebetween, the second conductive foil strip having a portion that can be trimmed to alter a capacitance between the second conductive foil strip and the first or second terminal of the foil-wound inductor.

To provide a filter and an electronic component that can suppress changes in characteristics even in an environment where fluctuations in inductor components may occur in an electronic device in which it is mounted.SOLUTION: In an electronic component 1, the second end of a first LC parallel resonator R1 and the second end of a second LC parallel resonator R2 are connected at contacts P3 and P4, the capacitor C3 and the inductor L3 are connected in series to the contact P1, the capacitor C5 and the inductor L4 are connected in series to the contact P2, the capacitor C4 and the inductors L5 and L6 are connected in series to the contact P4, the capacitor C3 and the inductor L3, the capacitor C5 and the inductor L4, and the capacitor C4 and the inductors L5 and L6 are connected at contacts P6 and P7, and the inductors L7 and L8 are connected to the contacts P6 and P7.SELECTED DRAWING: Figure 1

Class Y capacitor (1, 7, 12, 16, 27), which can be connected between a line and ground, comprising a first and a second electric conductor (2, 3), which are separated by a dielectric medium, wherein the first electric conductor (2) is connected to a first leg (4, 8, 9, 13, 18) and the second electric conductor (3) is connected to a second leg (5, 10, 11, 19), wherein the first leg (4, 8, 9, 13, 18) has a larger cross-section than the second leg (5, 10, 11, 19). In addition, an inverter (23) with a class Y capacitor (1, 7, 12, 16, 27) is described.

In embodiments herein, multiple circuit component assemblies are coupled together in a device, which is embedded within a core layer of a substrate. Each circuit component assembly includes a respective layer of conductive traces that are oriented in a planar direction that is substantially orthogonal to a planar direction of the core layer.

The invention aims to provide the capacitor which is convenient to combine, the circuit breaker is safe and reliable, and the capacitor can be quickly disassembled and assembled to realize quick reset. A PCBA terminal board is arranged on the lower shell, a circuit breaker is arranged above the PCBA terminal board, an upper shell is detachably installed on the upper portion of the lower shell, the circuit breaker is detachably installed on the inner wall of the upper shell, the circuit breaker can be taken out from the upper portion of the upper shell, a low-voltage capacitor unit is arranged on the lower portion of the lower shell and comprises a capacitor shell fixedly and detachably installed with the lower shell, and the capacitor shell is connected with the circuit breaker. The capacitor shell is provided with at least two capacitor modules, the capacitor modules are fixed on the drawer type slide rails, and the capacitor modules are provided with quick-plug conductive columns. Dual backup of mechanical bimetallic strip temperature protection and electronic protection is achieved, reliable action is achieved when the temperature reaches the preset temperature, response is rapid, and an overload, over-temperature and over-voltage comprehensive protection mechanism is achieved; rapid plugging and independent replacement of the capacitor module are realized, a drawer type slide rail structure is supported, and maintenance operation is facilitated.

This invention relates to a parallel-structure capacitor and its fault repair method. In the parallel-structure capacitor, at least one capacitor branch has a variable resistor connected in series with the capacitor unit. The variable resistor comprises a phase change material. The resistance of the variable resistor increases when the phase change material changes from a crystalline state to an amorphous state. When a short-circuit fault occurs in a capacitor branch with a variable resistor, the resistance can be increased by changing the phase change material from a crystalline state to an amorphous state, thereby changing the short-circuit state of the corresponding capacitor branch and achieving fault repair. Furthermore, the variable resistor does not require additional substrate area, eliminating the need for metal fuses, avoiding cumbersome manufacturing processes, and preventing impacts on product design and miniaturization, thus contributing to improved product yield and production efficiency. The fault repair method for the parallel-structure capacitor provided by this invention has similar advantages to the aforementioned parallel-structure capacitor.

A multi-layer device having a transparent or semi-transparent substrate; a solar cell layer coupled to the substrate; an energy storage layer coupled to the solar cell layer; and a converter layer coupled to the energy storage layer. The solar cell layer has a plurality of solar cells for receiving light through the substrate and converting energy of the received light into first electrical energy; the energy storage layer has one or more energy storage units for storing second electrical energy; and the converter layer has one or more power converters electrically connected to the solar cell layer and the energy storage layer for receiving the first electrical energy and the second electrical energy from the solar cell layer and the energy storage layer and outputting third electrical energy through an output thereof.

The invention relates to an apparatus for mounting a DC choke to a DC link capacitor. A capacitor assembly includes a capacitor housing including a capacitor, the capacitor housing defining at least one capacitor fastener opening and at least one capacitor feature. The capacitor includes a first input terminal and a second input terminal. A direct current (DC) choke defines a terminal opening having the first input terminal and the second input terminal extending outwardly therefrom. The DC choke defines at least one choke fastener opening, the at least one choke fastener opening being configured to receive at least one fastener passing through the at least one capacitor fastener opening. The DC choke further defines at least one choke feature configured to engage the at least one capacitor feature to maintain a position of the DC choke relative to the capacitor housing.

Provided is a stacked ceramic capacitor package, for an electronic device, preventing noise, vibration and cracks due to piezoelectric properties. The ceramic capacitor package for an electronic device comprises: stacked ceramic capacitors; a first terminal structure connected to a first side surface of the stacked ceramic capacitors; and a second terminal structure connected to a second side surface of the stacked ceramic capacitors and disposed so as to face the first terminal structure with the stacked ceramic capacitors therebetween. The first terminal structure has a first groove defined in an area coming into contact with the first side surface of the stacked ceramic capacitors. The horizontal length of the first groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.

The present invention improves the insertion loss of a resonant element. In the resonant element (10), a first via electrode (111) and a second via electrode (112) connect a first planar electrode (101) and a third planar electrode (103). A third via electrode (113) and a fourth via electrode (114) connect the first planar electrode (101) and a second planar electrode (102). When the first planar electrode (101) is viewed from the normal direction (Z) of the first planar electrode (101), a first imaginary line (VL11) connecting the first via electrode (111) and the second via electrode (112) and a second imaginary line (VL12) connecting the third via electrode (113) and the fourth via electrode (114) cross.