804results about "Structural fixed capacitor combinations" patented technology

A hard start capacitor replacement unit includes a capacitor container having a cover, a plurality of capacitors received within the container, each of said capacitors having a capacitance value, a common terminal mounted on the cover and electrically connected to a common terminal of each of said plurality of capacitors, a plurality of cover terminals mounted on the cover spaced apart from the common terminal and from each other, each cover terminal respectively electrically connected to one of the plurality of capacitors, a relay having contacts and being capable of opening and closing said contacts in response to a monitored condition of the motor, the relay having relay terminals, a fuse electrically connected to one of the relay terminals by a first wire wherein the fuse electrically disconnects the hard start capacitor replacement unit and the motor upon a failure, and a second wire electrically connecting one of the relay terminals and the motor, a third wire electrically connecting the common terminal and one of the relay terminals, a fourth wire electrically connecting one or more cover terminals to one of the relay terminals, wherein the contacts of the relay close to electrically connect one or more capacitors of the plurality of capacitors to the motor, and the contacts of the relay open to electrically disconnect the one or more capacitors of the plurality of capacitors from the motor.

A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality of capacitors, which may be connected singly or in combination to provide a selected capacitance. An electronic or other relay connects the selected capacitance in parallel with a motor run capacitor. The hard start capacitor replacement unit is thereby adapted to replace a wide variety of hard start capacitors.

A filter device includes a body, a ground terminal, and resonators in the body and coupled to each other by electromagnetic field coupling. The resonators include a first resonator coupled to an input terminal, a second resonator coupled to an output terminal, and third and fourth resonators. The second resonator is adjacent to the first resonator in a first direction. The third resonator is adjacent to the first resonator in a second direction perpendicular to the first direction. The fourth resonator is adjacent to the third resonator in the first direction. The third and fourth resonators partially share a path to the ground terminal.

The invention discloses an intelligent capacitor, and belongs to the technical field of capacitors. An intelligent capacitor comprises a shell, a power capacitor and a filter reactor, the power capacitor and the filter reactor are installed in the shell, the intelligent capacitor further comprises a heat conduction base fixedly connected into the shell, the power capacitor is fixedly connected to the heat conduction base, and the two ends of the filter reactor are each provided with a heat conduction bottom plate and an installation base. The heat dissipation box is fixedly connected to the interior of the shell, the double-end connecting plate is installed on the heat conduction bottom plate and the heat conduction base in a sliding mode, a heat conduction inserting plate is fixedly connected to the double-end connecting plate, the heat conduction inserting plate is installed in the heat dissipation box in a sliding mode, and a transverse partition plate and a longitudinal partition plate are arranged in the heat dissipation box; according to the invention, through the cooperation between the heat conduction plug board and the heat dissipation box, the heat dissipation box separates the power capacitor and the reactor through the heat insulation board and dissipates heat independently, so that the working temperature of equipment is reduced.

An electronic component is provided that includes a substrate, an insulator layer expanding over a surface of the substrate, a planar conductor on the substrate or in the insulator layer and expanding in a plane parallel to the surface of the substrate, and an inductor conductor pattern on the insulator layer or in the insulator layer. When viewed in a direction perpendicular to the surface of the substrate, a length in a longitudinal direction of a region in which a region with the inductor conductor pattern overlapping the planar conductor is represented by Ls, and a distance between the inductor conductor pattern and the planar conductor is represented by d, such that Ls / d is 1 or more and 60 or less.

The invention relates to the technical field of capacitors, and particularly discloses a compensation capacitor with an explosion-proof function, which comprises a protective shell and a capacitor body, the capacitor body is movably mounted in the protective shell, a stabilizing mechanism is arranged in the protective shell, a top cover is mounted at the top of the protective shell, and a heat dissipation mechanism is arranged on the top cover. And a plurality of third openings are uniformly formed in the top of the top cover. According to the invention, through the arrangement of the protection shell and the movable plate, when the capacitor body explodes, a relatively closed space is formed in the protection shell, and when the capacitor body explodes, the protection shell absorbs explosion shock waves, so that the capacitor body can be prevented from damaging surrounding equipment during explosion; the use safety of the device is improved; in the use process of the capacitor body, when equipment vibrates and a vibration value is transmitted to a movable plate, the vibration value can be absorbed through a first spring telescopic rod.

The invention relates to a capacitor module for optimizing an air-cooled heat dissipation structure, the capacitor module comprises a plurality of capacitor banks, each capacitor bank is composed of a plurality of capacitor monomers, the positive and negative electrodes of the capacitor monomers are electrically connected through a connecting sheet group, and the connecting sheet group comprises a plurality of first connecting sheets and second connecting sheets. The parallel connection and the series connection between the capacitor monomers are realized by adopting the first connecting sheet with a claw-shaped structure; the air cooling module is composed of a plurality of cooling fans, a temperature sensor and a speed regulation control system, the air speed of the cooling fans is regulated through the intelligent frequency conversion technology, regulation is conducted according to real-time data fed back by the temperature sensor, and therefore precise cooling control is achieved; the capacitor module is internally provided with a main air channel and an auxiliary air channel, the size and layout design of the air channels optimizes an airflow path, and the heat exchange area between air and the surface of the capacitor monomer is increased; the design can effectively reduce the heat dissipation efficiency, reduce the system energy consumption, prolong the service life of the capacitor module, and is suitable for the fields of energy storage systems, power equipment and the like.

A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor die, and a first capacitor. The substrate has a wiring structure. The redistribution layer is disposed over the substrate. The first semiconductor die is disposed over the redistribution layer. The first capacitor is disposed in the substrate and is electrically coupled to the first semiconductor die. The first capacitor includes a first capacitor substrate, a plurality of first capacitor cells, and a first through via. The first capacitor substrate has a first top surface and a first bottom surface. The first capacitor cells are disposed in the first capacitor substrate. The first through via is disposed in the first capacitor substrate and electrically couples the first capacitor cells to the wiring structure on the first top surface and the first bottom surface.

A filter device includes a dielectric substrate, first and second ground electrodes connected to a ground terminal, and resonators between the ground electrodes and electromagnetically coupled to each other. The ground electrodes are at different positions in a normal direction of the dielectric substrate. Each of the resonators includes a first capacitor electrode partially overlapping with the first ground electrode in plan view of the dielectric substrate, a second capacitor electrode partially overlapping with the second ground electrode in plan view of the dielectric substrate, and a via connecting the capacitor electrodes. The resonators include a first resonator connected to an input terminal, a second resonator connected to an output terminal, and a third resonator between the first and second resonators. Shunt electrodes are connected to the via and the ground terminal in the first and second resonators, respectively.

An improved capacitor is provided. The capacitor is of the wound-type category and surface-mountable to provide high capacities in a compact form factor.

An energy storage system including one or more battery cells connected in series, one or more isolated DC / DC converters, each isolated DC / DC converter having one end connected to one battery cell and an other end connected to another battery cell adjacent to the one battery cell so as to equalize a cell voltage through charging and discharging of the two battery cells which are each electrically connected to one of the plurality of battery cells, and a plurality of battery modules each including a controller configured to control a charge mode and a discharge mode of the plurality of isolated DC / DC converters.

A filter circuit includes a pair of balanced input ports, a pair of balanced output ports, first and second resonators provided in parallel between the pair of balanced input ports and the pair of balanced output ports in a circuit configuration, a first capacitor connected in parallel to the first resonator, and a second capacitor connected in parallel to the second resonator. The first and second resonators are magnetically coupled to each other and electrically connected to each other. The first and second capacitors are not electrically connected to ground.

Multiple LC parallel resonators in which inductors and capacitors are connected in parallel are located inside a multilayer body. The inductors each include a loop inductor including a line-shaped conductor pattern and at least one pair of via conductors connected to the line-shaped conductor pattern. When the multilayer body is seen through in a height direction, in all the loop inductors of the LC parallel resonators, open via conductors are closer to a center of the multilayer body, and short-circuit via conductors are closer to an outer side of the multilayer body in at least one of a width direction and a length direction.

The invention comprises a method and apparatus for processing power, comprising the steps of: generating / using 3-phase power; feeding an AC drive with the 3-phase power, the AC drive generating a first output; and transforming the first output with a zigzag transformer, the zigzag transformer linked to at least one load output / load connector. The method and apparatus comprises an optional filter for filtering the 3-phase power prior to the step of transforming, the filter including a distributed gap core material.

To provide a laminated filter capable of improving performance.SOLUTION: A laminated filter 1 comprises a wall 13 which is disposed and grounded between a first inductor 11 and a second inductor 12. Therefore, electromagnetic coupling between the first inductor 11 and the second inductor 12 can be suppressed. A penetration part 30 penetrating in an opposing direction, in which the first inductor 11 and the second inductor 12 are opposed, is formed in the wall 13. In a lamination direction, a size of the penetration part 30 is larger than a size of one insulator layer 7. The wall 13 includes the large penetration part 30 to make a magnetic flux of the second inductor 12 which is a longitudinally wound inductor pass from the penetration part 30. Therefore, it is possible to suppress disturbance of the magnetic flux of the second inductor 12 to enhance a Q-value.SELECTED DRAWING: Figure 2

Provided is a smaller filter circuit. The filter circuit has an LC circuit, one end of which is connected to a signal path connecting an input terminal and an output terminal, and the other end of which is connected to a reference potential. A filter circuit according to a first embodiment includes a substrate and a plurality of electrodes provided on a main surface or inside of the substrate. The LC circuit includes a first capacitor, a first inductor connected in parallel, and a second capacitor connected in series. The electrodes overlap each other at least partially when viewed in the thickness direction of the substrate. The portion where the electrodes overlap each other is the electrode of the first capacitor or the second capacitor.

To provide a circuit element that can improve its characteristics.SOLUTION: According to an embodiment, a circuit element includes a first conductive member, a second conductive member, a first layer, and a dielectric film. The first layer is between the first conductive layer and the second conductive layer. The first layer includes a first structure and a plurality of second structures. The plurality of second structures are arranged side by side on a first plane intersecting a first direction from the first conductive member to the second conductive member. At least part of the first structure is between the plurality of second structures on the first plane. A second conductivity of the plurality of second structures is different from a first conductivity of the first structure. The first layer is electrically connected to the second conductive member. The dielectric film is between the first conductive member and the first layer.SELECTED DRAWING: Figure 1

A capacitor assembly includes a traction inverter system housing and a set of power electronics defining two or more contacts, the set of power electronics mounted within the traction inverter system housing. A capacitor housing containing a capacitor is mounted within the traction inverter system housing. The capacitor includes two or more terminals extending outwardly therefrom and overlapping the two or more contacts. A terminal block is secured to the capacitor housing independent of attachment of the two or more contacts to the two or more terminals. The terminal block is configured to support the two or more terminals during a fastening operation attaching the two or more terminals to the two or more contacts. The terminal block may also be secured to the capacitor housing.

According to an embodiment, a biopotential measurement system includes an analog front-end and digital circuits. The analog front-end circuit includes a sensing electrode, a forward amplifier, and a feedback amplifier with an integration capacitor. A feature is the attenuation circuit between the forward and feedback amplifiers, which provides an attenuation factor determining the integration capacitor's value for achieving the desired high-pass corner frequency. With configurable attenuation factors, the system can process different biopotential signals. Multiple analog front-end circuits can be used to process different signals simultaneously. The digital circuit includes a processor for signal processing, dynamic adjustment of attenuation factors, and anomaly detection. Additional components like switched capacitors, pseudo-resistors, and multiplexers can enhance the system's functionality. The design allows flexible, multi-parameter physiological monitoring with adjustable frequency responses and gain settings.

An intermediate circuit capacitor for a multi-phase system, comprising a first surface electrode (10) and a second surface electrode (20) spaced apart from the first surface electrode, and comprising at least one capacitor structure (3) having at least one dielectric (2) and inserted between the first surface electrode (10) and the second surface electrode (20), and with a first voltage layer (11) angled from the first surface electrode (10) and a second voltage layer (21) angled from the second surface electrode (20), and with at least one first pole connection (12) for contacting the first voltage level (11) and with at least one second pole connection (22) for contacting the second voltage level (21), wherein the first voltage level (11) and the second voltage level (21) of the intermediate circuit capacitor (1) form an overlap region (4) in which the first voltage level (11) and the second voltage level (21) are arranged parallel to one another and spaced apart from one another by a gap (5), directly above one another on a base side (6) of the intermediate circuit capacitor (1), and that the at least one first pole connection (12) in lateral continuation of the first voltage level (11) and parallel thereto the at least one second pole connection (22) in lateral continuation of the second voltage level (21) extend beyond the overlap region (4) and thus form at least one pair of contacting lugs (7) projecting from the base side (6) of the intermediate circuit capacitor (1), characterized in that in the second surface electrode (20) at least one recess (24) is formed complementary to the at least one first pole connection (12) and the at least one first pole connection (12) projects through the recess (24).

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate with a first surface and a second surface, where the substrate comprises glass. In an embodiment, the electronic package further comprises a via opening through the substrate, where sidewalls of the via opening have a root mean squared (RMS) surface roughness that is approximately 100 nm or greater. In an embodiment, the electronic package further comprises a liner over the sidewalls of the via opening, where an RMS surface roughness of the liner is approximately 50 nm or smaller. An electronic package may further comprise a via through the via opening.

A semiconductor device includes: a filter circuit including: a resistor; a MOS capacitor; and a MOM capacitor stacked on at least one of the resistor or the MOS capacitor, wherein the following inequalities are satisfied:Mc≥β−γ / β+γ×Mr Mr≤√{square root over (1 / 2πftαβ)}  [Math. 1]where ft denotes a cutoff frequency of the filter circuit, Mr denotes a resistor area of a resistor-provided region in which the resistor is provided, Mc denotes a MOS capacitor area of a MOS capacitor-provided region in which the MOS capacitor is provided, α denotes a resistivity of the resistor, β denotes a MOS capacitance rate of the MOS capacitor, and γ denotes a MOM capacitance rate of the MOM capacitor.

A filter device, method of manufacture and use thereof. The filter device comprises a foil-wound inductor formed by a first conductive foil strip having a first terminal and a second terminal, the first conductive foil strip wound around a core to form a plurality of winding layers such that the first terminal is proximate the core and the second terminal is located at the outermost winding layer, and a continuous dielectric insulating layer between the plurality of layers of the first conductive foil strip; and, a tunable capacitor formed by a second conductive foil strip at least partially encircling the outermost layer of the foil-wound inductor and a dielectric insulating layer disposed therebetween, the second conductive foil strip having a portion that can be trimmed to alter a capacitance between the second conductive foil strip and the first or second terminal of the foil-wound inductor. When used in a circuit, the tunable capacitor can be trimmed to compensate for parasitic capacitance associated with the foil-wound inductor.

Systems and methods for press-forming a flexible thin sheet of ceramic paste, such as, e.g., barium titanate, into a wavy shape. The wave may be 1-dimensional, such as, e.g., a sinusoid, or 2-dimensional, such as, e.g., an egg-crate shape. A mold embossed with a reverse, or negative, of an intended form of the wavy shape may be used. The egg-crate shape ceramic layers may be stacked with alternating sheets of a conductive, or electrode, material before being sintered and densified. Alternatively, the ceramic sheets can be layered with the sheets of conductive material, and then pressed into the wavy shape together. Optionally, conductive ink may be applied to the ceramic sheets instead of using sheets of conductive material in both cases.

Various aspects of the present disclosure generally relate to wireless communication, and to a pillar that includes one or more structures configured to define a capacitor. For example, a device includes a die, a substrate, and a pillar having an embedded capacitor. The pillar is electrically connected to one or more conductors of the die and to one or more conductors of the substrate. The pillar includes a first conductive structure and a second conductive structure. The pillar also includes a dielectric layer disposed between the first conductive structure and the second conductive structure to define the embedded capacitor.

An embodiment is a structure including a first semiconductor device and a second semiconductor device, a first set of conductive connectors mechanically and electrically bonding the first semiconductor device and the second semiconductor device, a first underfill between the first and second semiconductor devices and surrounding the first set of conductive connectors, a first encapsulant on at least sidewalls of the first and second semiconductor devices and the first underfill, and a second set of conductive connectors electrically coupled to the first semiconductor device, the second set of conductive connectors being on an opposite side of the first semiconductor device as the first set of conductive connectors.

Power converter (1) with: a switching circuit (20); a capacitor module (3) which is electrically connected to the switching circuit; an auxiliary capacitor module (5) connected in parallel to the capacitor module; and a device housing (12) which contains the switching circuit, the capacitor module and the auxiliary capacitor module, wherein The capacitor module includes: a capacitor element (31), a capacitor housing (32) that contains the capacitor element, an encapsulation resin (33) that encapsulates the capacitor element in the capacitor housing, and a capacitor busbar (4) which connects the capacitor element to a power terminal of the switching circuit, wherein the capacitor busbar includes: an element connection section (41) that is connected to the capacitor element within the encapsulation resin, a connecting section (42) which is connected to the power connection outside the encapsulation resin, and a power supply connection section (43) which is connected to a power supply wiring (54) outside the encapsulation resin, wherein the power supply wiring is electrically connected to a DC power supply, wherein the capacitor busbar includes a DC path (44) which represents a current path between the terminal connection section and the power supply connection section, and the DC path is exposed to the outside of the encapsulation resin, the auxiliary capacitor module is connected to the power supply connection section of the capacitor busbar, the auxiliary capacitor module is detachably attached to the power supply connection section by means of a fastening element (11), and a fastening direction of a fastening element (135) that secures the auxiliary capacitor module and a fastening direction of the fixing element are the same.

Systems and methods for additive printing of barium titanate (BaTiO3) components using precursors of barium titanate, i.e., barium carbonate (BaCO3) and titanium dioxide (TiO2), to prevent clogging of nozzles. Solid of barium carbonate and titanium dioxide are prepared by an electrical-assisted breakdown process, such as, e.g., milling, blending, and / or grinding. The assisted breakdown process allows for the reduction of particle size, thorough mixing, and consistent particle distribution of the precursors. In addition, the finer particles possess a much higher sinterability of the precursors while giving rise to denser final products. A planetary ball milling system with zirconia vial and balls at a fixed rotation speed may be used. The precursors are then printed into a green part. A solid-state reaction between barium carbonate and titanium dioxide to form barium titanate is activated by the application of heat, such as, e.g., through a sintering process, which forms the final product.

The reliability of an electronic device provided with a conductor pattern covered by a dielectric film is improved. An electronic device (100) is provided with: a substrate (110) including regions (111, 112); a resistance element (40) formed in the region (112); a dielectric film (21) covering the region (111) and the resistance element (40); a conductor pattern (31) formed in the region (111) via the dielectric film (21); an adhesion film (50) that does not cover the region (112) but covers the upper surface (31a) and the side surfaces (31b) of the conductor pattern (31); and a dielectric film (22) that covers the upper surface (31a) and the side surfaces (31b) of the conductor pattern (31) via an adhesion film (50).