1014results about "Structural fixed capacitor combinations" patented technology

A hard start capacitor replacement unit includes a capacitor container having a cover, a plurality of capacitors received within the container, each of said capacitors having a capacitance value, a common terminal mounted on the cover and electrically connected to a common terminal of each of said plurality of capacitors, a plurality of cover terminals mounted on the cover spaced apart from the common terminal and from each other, each cover terminal respectively electrically connected to one of the plurality of capacitors, a relay having contacts and being capable of opening and closing said contacts in response to a monitored condition of the motor, the relay having relay terminals, a fuse electrically connected to one of the relay terminals by a first wire wherein the fuse electrically disconnects the hard start capacitor replacement unit and the motor upon a failure, and a second wire electrically connecting one of the relay terminals and the motor, a third wire electrically connecting the common terminal and one of the relay terminals, a fourth wire electrically connecting one or more cover terminals to one of the relay terminals, wherein the contacts of the relay close to electrically connect one or more capacitors of the plurality of capacitors to the motor, and the contacts of the relay open to electrically disconnect the one or more capacitors of the plurality of capacitors from the motor.

A multilayer structure including a plurality of interposers and a plurality of electronic components disposed between the plurality of interposers is provided. The plurality of interposers and the plurality of electronic components are arranged in at least two layers, each layer comprising at least one electronic component of the plurality of electronic components disposed between two interposers of the plurality of interposers. The at least two layers are stacked adjacent to one another such that one interposer of the plurality of interposers is common to adjacent layers of the at least two layers. A first external terminal and a second external terminal may electrically connect the multilayer structure with an additional electronic component and / or within an assembly. Microelectronic assemblies incorporating a multilayer structure are also provided.

A hard start capacitor replacement unit includes a capacitor container having a cover, a plurality of capacitors received within the container, each of said capacitors having a capacitance value, a common terminal mounted on the cover and electrically connected to a common terminal of each of said plurality of capacitors, a plurality of cover terminals mounted on the cover spaced apart from the common terminal and from each other, each cover terminal respectively electrically connected to one of the plurality of capacitors, a relay having contacts and being capable of opening and closing said contacts in response to a monitored condition of the motor, the relay having relay terminals, a fuse electrically connected to one of the relay terminals by a first wire wherein the fuse electrically disconnects the hard start capacitor replacement unit and the motor upon a failure, and a second wire electrically connecting one of the relay terminals and the motor, a third wire electrically connecting the common terminal and one of the relay terminals, a fourth wire electrically connecting one or more cover terminals to one of the relay terminals, wherein the contacts of the relay close to electrically connect one or more capacitors of the plurality of capacitors to the motor, and the contacts of the relay open to electrically disconnect the one or more capacitors of the plurality of capacitors from the motor.

A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality of capacitors, which may be connected singly or in combination to provide a selected capacitance. An electronic or other relay connects the selected capacitance in parallel with a motor run capacitor. The hard start capacitor replacement unit is thereby adapted to replace a wide variety of hard start capacitors.

A filter device includes a body, a ground terminal, and resonators in the body and coupled to each other by electromagnetic field coupling. The resonators include a first resonator coupled to an input terminal, a second resonator coupled to an output terminal, and third and fourth resonators. The second resonator is adjacent to the first resonator in a first direction. The third resonator is adjacent to the first resonator in a second direction perpendicular to the first direction. The fourth resonator is adjacent to the third resonator in the first direction. The third and fourth resonators partially share a path to the ground terminal.

The invention discloses an intelligent capacitor, and belongs to the technical field of capacitors. An intelligent capacitor comprises a shell, a power capacitor and a filter reactor, the power capacitor and the filter reactor are installed in the shell, the intelligent capacitor further comprises a heat conduction base fixedly connected into the shell, the power capacitor is fixedly connected to the heat conduction base, and the two ends of the filter reactor are each provided with a heat conduction bottom plate and an installation base. The heat dissipation box is fixedly connected to the interior of the shell, the double-end connecting plate is installed on the heat conduction bottom plate and the heat conduction base in a sliding mode, a heat conduction inserting plate is fixedly connected to the double-end connecting plate, the heat conduction inserting plate is installed in the heat dissipation box in a sliding mode, and a transverse partition plate and a longitudinal partition plate are arranged in the heat dissipation box; according to the invention, through the cooperation between the heat conduction plug board and the heat dissipation box, the heat dissipation box separates the power capacitor and the reactor through the heat insulation board and dissipates heat independently, so that the working temperature of equipment is reduced.

An electronic component is provided that includes a substrate, an insulator layer expanding over a surface of the substrate, a planar conductor on the substrate or in the insulator layer and expanding in a plane parallel to the surface of the substrate, and an inductor conductor pattern on the insulator layer or in the insulator layer. When viewed in a direction perpendicular to the surface of the substrate, a length in a longitudinal direction of a region in which a region with the inductor conductor pattern overlapping the planar conductor is represented by Ls, and a distance between the inductor conductor pattern and the planar conductor is represented by d, such that Ls / d is 1 or more and 60 or less.

The invention relates to the technical field of capacitors, and particularly discloses a compensation capacitor with an explosion-proof function, which comprises a protective shell and a capacitor body, the capacitor body is movably mounted in the protective shell, a stabilizing mechanism is arranged in the protective shell, a top cover is mounted at the top of the protective shell, and a heat dissipation mechanism is arranged on the top cover. And a plurality of third openings are uniformly formed in the top of the top cover. According to the invention, through the arrangement of the protection shell and the movable plate, when the capacitor body explodes, a relatively closed space is formed in the protection shell, and when the capacitor body explodes, the protection shell absorbs explosion shock waves, so that the capacitor body can be prevented from damaging surrounding equipment during explosion; the use safety of the device is improved; in the use process of the capacitor body, when equipment vibrates and a vibration value is transmitted to a movable plate, the vibration value can be absorbed through a first spring telescopic rod.

Liquefied natural gas brings energy overriding and environmental disruption. However, the liquefied natural gas is a liquid dielectric medium, can be easily liquefied by pressurizing at room temperature, can be expanded by more than 250 times in volume during gasification, and is relatively high in dielectric constant and relatively low in voltage resistance. As a capacitor, such a liquid dielectric is considered; the energy of the liquid dielectric capacitor is consumed inside the capacitor for an engine, welding or buoyancy gas generation, or is consumed outside the capacitor for use as an on-board capacitor for a vehicle. [Solution] A liquid dielectric capacitor is considered as a dielectric breakdown induced igniter that can replace a conventional spark plug. In order to utilize the principle of such an igniter as an energy source for an engine, a welding device or a buoyancy bag for lifting a subsea resource, an electrical charge is applied to the liquid dielectric thin layer, and then the thickness of the liquid dielectric thin layer is made close to zero to cause dielectric breakdown, or the thickness of the liquid dielectric thin layer is increased to cause breakdown of the liquid dielectric thin layer. A high voltage source is established for a vehicle-mounted capacitor of the vehicle. Therefore, a world without environmental damage is realized.

In an embodiment a choke module includes a choke with a magnetic core and at least two windings, a thermally conductive pad, and a footprint capacitor, which is a plate capacitor, and which is configured to provide a mechanical support for the choke, wherein the footprint capacitor comprises at least one first electrode layer, at least one dielectric layer and at least one second electrode layer located one above the other, wherein the choke is located on the footprint capacitor, wherein an upper surface of the footprint capacitor faces the choke, and wherein the thermally conductive pad is arranged on the upper surface of the footprint capacitor.

The present disclosure provides a chip part. The chip part includes a substrate, a capacitor portion and a substrate body portion. The capacitor portion includes a plurality of wall portions having a lengthwise direction and separated from each other by a trench formed on a first main surface of the substrate. The substrate body portion is formed around the capacitor portion using a portion of the substrate. The plurality of wall portions are formed of a plurality of pillar units. The capacitor portion, in the plan view, includes a first capacitor portion and a second capacitor portion. The first capacitor portion includes the plurality of wall portions having the lengthwise direction as a first lengthwise direction. The second capacitor portion includes the plurality of wall portions having the lengthwise direction as a second lengthwise direction orthogonal to the first lengthwise direction.

Disclosed is a semiconductor device. In an aspect, a semiconductor device includes: a first-tier passive device including a substrate portion, a passive device portion, and a metallization portion disposed in a stacked configuration; and one or more second-tier passive devices disposed over the first-tier passive device. Each one of the one or more second-tier passive devices includes: a substrate portion, a passive device portion, and a metallization portion disposed in a stacked configuration; and a set of through substrate vias (TSVs) passing through a corresponding substrate portion and electrically coupled to a corresponding metallization portion. The semiconductor device comprises a passive component including the passive device portion of the first-tier passive device electrically coupled to one or more passive device portions of the one or more second-tier passive devices through the metallization portions of the first-tier passive device and the one or more second-tier passive devices.

A stacked varistor having a small variation in electrostatic capacitance is obtained. The stacked varistor includes first internal electrode projection extending from third internal electrode toward first end surface between first side surface and first varistor region, and second internal electrode projection extending from third internal electrode toward second end surface between first side surface and second varistor region. First internal electrode projection extends closer to first end surface than a line connecting point closest to first end surface of first varistor region and point closest to first end surface of third external electrode is. Second internal electrode projection extends closer to second end surface than a line connecting point closest to second end surface of second varistor region and point closest to second end surface of third external electrode is.

The invention relates to a capacitor module for optimizing an air-cooled heat dissipation structure, the capacitor module comprises a plurality of capacitor banks, each capacitor bank is composed of a plurality of capacitor monomers, the positive and negative electrodes of the capacitor monomers are electrically connected through a connecting sheet group, and the connecting sheet group comprises a plurality of first connecting sheets and second connecting sheets. The parallel connection and the series connection between the capacitor monomers are realized by adopting the first connecting sheet with a claw-shaped structure; the air cooling module is composed of a plurality of cooling fans, a temperature sensor and a speed regulation control system, the air speed of the cooling fans is regulated through the intelligent frequency conversion technology, regulation is conducted according to real-time data fed back by the temperature sensor, and therefore precise cooling control is achieved; the capacitor module is internally provided with a main air channel and an auxiliary air channel, the size and layout design of the air channels optimizes an airflow path, and the heat exchange area between air and the surface of the capacitor monomer is increased; the design can effectively reduce the heat dissipation efficiency, reduce the system energy consumption, prolong the service life of the capacitor module, and is suitable for the fields of energy storage systems, power equipment and the like.

A film capacitor includes a stack including at least one dielectric film and a plurality of metal films, the at least one dielectric film including a polyarylate film, wherein each of the at least one of dielectric film and each of the plurality of metal films are alternately stacked in a stacking direction, each of the plurality of metal films deposited on each of the at least one dielectric film by vapor deposition, cover films on two first side surfaces, the two first side surfaces facing each other in a first direction, the first direction orthogonal to the stacking direction, the cover films containing a polyester hot-melt resin, and metal-sprayed electrodes on two second side surfaces, the two second side surfaces facing each other in a second direction, the second direction perpendicular to the first direction and orthogonal to the stacking direction.

A capacitor array that includes: a capacitor part including a plurality of capacitor elements disposed in a planar arrangement in an in-plane direction orthogonal to a thickness direction, the plurality of capacitor elements including mutually adjacent capacitor elements that are separated from each other, wherein the plurality of capacitor elements each include a first electrode layer and a second electrode layer that face each other in the thickness direction with a dielectric layer interposed between the first electrode layer and the second electrode layer; a built-in member disposed at an outer periphery of the capacitor part in the in-plane direction; and a sealing layer that seals the capacitor part and the built-in member, wherein the built-in member has a higher melting temperature than the sealing layer.

A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor die, and a first capacitor. The substrate has a wiring structure. The redistribution layer is disposed over the substrate. The first semiconductor die is disposed over the redistribution layer. The first capacitor is disposed in the substrate and is electrically coupled to the first semiconductor die. The first capacitor includes a first capacitor substrate, a plurality of first capacitor cells, and a first through via. The first capacitor substrate has a first top surface and a first bottom surface. The first capacitor cells are disposed in the first capacitor substrate. The first through via is disposed in the first capacitor substrate and electrically couples the first capacitor cells to the wiring structure on the first top surface and the first bottom surface.

A filter device includes a dielectric substrate, first and second ground electrodes connected to a ground terminal, and resonators between the ground electrodes and electromagnetically coupled to each other. The ground electrodes are at different positions in a normal direction of the dielectric substrate. Each of the resonators includes a first capacitor electrode partially overlapping with the first ground electrode in plan view of the dielectric substrate, a second capacitor electrode partially overlapping with the second ground electrode in plan view of the dielectric substrate, and a via connecting the capacitor electrodes. The resonators include a first resonator connected to an input terminal, a second resonator connected to an output terminal, and a third resonator between the first and second resonators. Shunt electrodes are connected to the via and the ground terminal in the first and second resonators, respectively.

A capacitor includes a first electrode, a second electrode, and a dielectric. The dielectric is disposed between the first electrode and the second electrode. The dielectric includes a halide and satisfies a requirement 1 / 2<r<2 / 3. In this requirement, r is a ratio of the number of cations to the number of anions in the halide included in the dielectric.

An embodiment is a structure including a first semiconductor device and a second semiconductor device, a first set of conductive connectors mechanically and electrically bonding the first semiconductor device and the second semiconductor device, a first underfill between the first and second semiconductor devices and surrounding the first set of conductive connectors, a first encapsulant on at least sidewalls of the first and second semiconductor devices and the first underfill, and a second set of conductive connectors electrically coupled to the first semiconductor device, the second set of conductive connectors being on an opposite side of the first semiconductor device as the first set of conductive connectors.

An improved capacitor is provided. The capacitor is of the wound-type category and surface-mountable to provide high capacities in a compact form factor.

A film capacitor including: a capacitor element including a laminate of a dielectric film and an internal electrode, a first end surface electrode on a first end surface of the laminate, and a second end surface electrode on a second end surface of the laminate; a laminate film including a covering part covering the capacitor element, and a flange extending from an outer edge of the covering part; a first terminal electrode connected to the first end surface electrode inside the laminate film and exposed outside of the laminate film, and a second terminal electrode connected to the second end surface electrode inside the laminate film and exposed outside of the laminate film; and a fixing member including a main body disposed along the capacitor element inside the laminate film, and a fixing part extending from the main body and exposed to the outside of the laminate film.

An energy storage system including one or more battery cells connected in series, one or more isolated DC / DC converters, each isolated DC / DC converter having one end connected to one battery cell and an other end connected to another battery cell adjacent to the one battery cell so as to equalize a cell voltage through charging and discharging of the two battery cells which are each electrically connected to one of the plurality of battery cells, and a plurality of battery modules each including a controller configured to control a charge mode and a discharge mode of the plurality of isolated DC / DC converters.

Disclosed is a semiconductor device. In an aspect, a semiconductor device includes: a first-tier passive device including a. substrate portion, a passive device portion, and a metallization portion disposed in a stacked configuration; and one or more second-tier passive devices disposed over the first-tier passive device. Each one of the one or more second-tier passive devices includes: a substrate portion, a passive device portion, and a metallization portion disposed in a stacked configuration; and a set of through substrate vias (TSVs) passing through a corresponding substrate portion and electrically coupled to a corresponding metallization portion. The semiconductor device comprises a passive component including the passive device portion of the first-tier passive device electrically coupled to one or more passive device portions of the one or more second-tier passive devices through the metallization portions of tire first-tier passive device and the one or more second-tier passive devices.

A capacitor assembly (100) for a capacitor device for a motor vehicle inverter comprises at least one capacitor (105), a housing (115), a first busbar (110), and a second busbar (120). The housing (115) is designed to accommodate the at least one capacitor (105). The first busbar (110) and the second busbar (120) are designed for electrical contacting the capacitor assembly (100). The capacitor (105) is electrically contacted, or can be contacted, between the first busbar (110) and the second busbar (120).

A filter circuit includes a pair of balanced input ports, a pair of balanced output ports, first and second resonators provided in parallel between the pair of balanced input ports and the pair of balanced output ports in a circuit configuration, a first capacitor connected in parallel to the first resonator, and a second capacitor connected in parallel to the second resonator. The first and second resonators are magnetically coupled to each other and electrically connected to each other. The first and second capacitors are not electrically connected to ground.

Multiple LC parallel resonators in which inductors and capacitors are connected in parallel are located inside a multilayer body. The inductors each include a loop inductor including a line-shaped conductor pattern and at least one pair of via conductors connected to the line-shaped conductor pattern. When the multilayer body is seen through in a height direction, in all the loop inductors of the LC parallel resonators, open via conductors are closer to a center of the multilayer body, and short-circuit via conductors are closer to an outer side of the multilayer body in at least one of a width direction and a length direction.

The invention comprises a method and apparatus for processing power, comprising the steps of: generating / using 3-phase power; feeding an AC drive with the 3-phase power, the AC drive generating a first output; and transforming the first output with a zigzag transformer, the zigzag transformer linked to at least one load output / load connector. The method and apparatus comprises an optional filter for filtering the 3-phase power prior to the step of transforming, the filter including a distributed gap core material.

To provide a laminated filter capable of improving performance.SOLUTION: A laminated filter 1 comprises a wall 13 which is disposed and grounded between a first inductor 11 and a second inductor 12. Therefore, electromagnetic coupling between the first inductor 11 and the second inductor 12 can be suppressed. A penetration part 30 penetrating in an opposing direction, in which the first inductor 11 and the second inductor 12 are opposed, is formed in the wall 13. In a lamination direction, a size of the penetration part 30 is larger than a size of one insulator layer 7. The wall 13 includes the large penetration part 30 to make a magnetic flux of the second inductor 12 which is a longitudinally wound inductor pass from the penetration part 30. Therefore, it is possible to suppress disturbance of the magnetic flux of the second inductor 12 to enhance a Q-value.SELECTED DRAWING: Figure 2

Provided is a smaller filter circuit. The filter circuit has an LC circuit, one end of which is connected to a signal path connecting an input terminal and an output terminal, and the other end of which is connected to a reference potential. A filter circuit according to a first embodiment includes a substrate and a plurality of electrodes provided on a main surface or inside of the substrate. The LC circuit includes a first capacitor, a first inductor connected in parallel, and a second capacitor connected in series. The electrodes overlap each other at least partially when viewed in the thickness direction of the substrate. The portion where the electrodes overlap each other is the electrode of the first capacitor or the second capacitor.