1582results about "Fixed capacitor housing/encapsulation" patented technology

An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

An apparatus includes a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, and each capacitor having a capacitive value. The apparatus also includes a cover assembly with a peripheral edge secured to the case. The cover assembly includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly. Each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements. The cover assembly also includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.

An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.

The invention discloses a high-voltage multi-core ceramic capacitor and a preparation method thereof, and the multi-core ceramic capacitor comprises a pedestal, two connection frames which are oppositely disposed on the pedestal, and a plurality of capacitor modules which are sequentially arranged in the length direction of the connection frames. The capacitor module comprises a plurality of capacitors which are sequentially connected in series between two connecting frames and a plurality of series connecting sheets which are respectively arranged between two adjacent capacitors, and the connecting frames are connected with the opposite capacitors; the capacitor comprises a capacitor body, two parallel frames oppositely arranged on the two sides of the capacitor body, a potting shell used for installing the capacitor body and a potting layer arranged in the potting shell and wrapping the capacitor body. The specific structure of the capacitor module is limited to be matched with the connecting frame, so that parallel capacity increasing and series voltage dividing of the multiple capacitor chips are achieved, other capacitor modules are not affected after a certain capacitor module fails, and the market requirement of higher-voltage products is met.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

The invention relates to the technical field of capacitors, and particularly discloses a compensation capacitor with an explosion-proof function, which comprises a protective shell and a capacitor body, the capacitor body is movably mounted in the protective shell, a stabilizing mechanism is arranged in the protective shell, a top cover is mounted at the top of the protective shell, and a heat dissipation mechanism is arranged on the top cover. And a plurality of third openings are uniformly formed in the top of the top cover. According to the invention, through the arrangement of the protection shell and the movable plate, when the capacitor body explodes, a relatively closed space is formed in the protection shell, and when the capacitor body explodes, the protection shell absorbs explosion shock waves, so that the capacitor body can be prevented from damaging surrounding equipment during explosion; the use safety of the device is improved; in the use process of the capacitor body, when equipment vibrates and a vibration value is transmitted to a movable plate, the vibration value can be absorbed through a first spring telescopic rod.

A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.

An anti-impact pulse capacitor comprises a capacitor body, and the capacitor body comprises two supports which are oppositely arranged and a plurality of capacitor chips which are vertically arranged in the two supports at intervals. The support comprises a plurality of support plates which are arranged up and down at intervals, connecting pins which are vertically arranged among the plurality of support plates, and a plurality of fixing plates which are respectively arranged on the plurality of support plates and are used for fixing the connecting pins, and the plurality of support plates are opposite to the end parts of the plurality of capacitor chips. The structure of a capacitor body and the structure of a plastic package shell are improved, the structure of a support is specifically limited, a plurality of capacitor chips are vertically arranged at intervals, the capacitor chips are arranged in a large-gap mode, enough deformation space is reserved, and the capacitor chips can be integrally distorted and deformed to a certain degree at the moment when impact is borne, and the reliability of the capacitor is not affected.

The invention relates to a capacitor module for optimizing an air-cooled heat dissipation structure, the capacitor module comprises a plurality of capacitor banks, each capacitor bank is composed of a plurality of capacitor monomers, the positive and negative electrodes of the capacitor monomers are electrically connected through a connecting sheet group, and the connecting sheet group comprises a plurality of first connecting sheets and second connecting sheets. The parallel connection and the series connection between the capacitor monomers are realized by adopting the first connecting sheet with a claw-shaped structure; the air cooling module is composed of a plurality of cooling fans, a temperature sensor and a speed regulation control system, the air speed of the cooling fans is regulated through the intelligent frequency conversion technology, regulation is conducted according to real-time data fed back by the temperature sensor, and therefore precise cooling control is achieved; the capacitor module is internally provided with a main air channel and an auxiliary air channel, the size and layout design of the air channels optimizes an airflow path, and the heat exchange area between air and the surface of the capacitor monomer is increased; the design can effectively reduce the heat dissipation efficiency, reduce the system energy consumption, prolong the service life of the capacitor module, and is suitable for the fields of energy storage systems, power equipment and the like.

A multilayer electronic component includes a body including a dielectric layer and first to fourth internal electrode layers disposed alternately in a first direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces respectively, wherein the internal electrode layer includes an internal electrode and a dummy electrode spaced apart from each other with a spacing portion therebetween, and at least two of the spacing portions may include regions overlapping each other in the first direction and other regions do not overlapping each other.

The invention relates to the field of processing of capacitor packaging coatings, and particularly discloses a quick-drying packaging coating for a thin-film capacitor, a preparation method and application. The quick-drying packaging coating for the thin film capacitor consists of a component A and a component B in a mass ratio of 100: (90-100), the component A comprises 30-50 parts of organic silicon modified epoxy resin, 20-30 parts of polyether polyol, 10-25 parts of toughening filler, 1-3 parts of a coating tackifier, 1-3 parts of a flow promoter and 0.5-1 part of a defoaming agent; the component B comprises the following components in parts by weight: 45-75 parts of a curing agent, 1-2 parts of an accelerant, 1-1.5 parts of an antioxidant and 1-2 parts of a weather-resistant agent; the preparation method comprises the following steps: respectively preparing the component A and the component B, respectively packaging, and mixing while using to obtain the packaging coating. The method is applied to a thin-film capacitor. The quick-drying water-based paint has the advantages of quick drying, good moisture resistance, good flexibility and high adhesion stability.

The invention discloses a chip capacitor end sealing production line based on a thick rubber plate. The chip capacitor end sealing production line comprises an assembling mechanism, an implanting mechanism, a pressing-in mechanism, a leveling mechanism, a slurry soaking mechanism, a drying mechanism, a cooling and storing mechanism, a plate replacing mechanism, a discharging mechanism and a transferring clamping jaw. The number of the dipping mechanisms, the number of the drying mechanisms and the number of the cooling storage mechanisms are all two, and the assembling mechanism, the implanting mechanism, the pressing-in mechanism, the leveling mechanism, one dipping mechanism, one drying mechanism, one cooling storage mechanism, the plate changing mechanism, the other dipping mechanism, the other drying mechanism, the other cooling storage mechanism and the discharging mechanism are sequentially arranged. The assembling mechanism is used for placing the guide-in plate to the top of the thick rubber plate and forming an assembly. According to the chip capacitor end sealing production line based on the thick rubber plate, full-automatic operation in the end sealing process of the chip capacitor is achieved, the end sealing efficiency of the chip capacitor can be effectively improved, the end sealing precision of the chip capacitor can be improved, and meanwhile the labor cost in the end sealing process can be reduced.

An improved capacitor is provided. The capacitor is of the wound-type category and surface-mountable to provide high capacities in a compact form factor.

The utility model discloses a ceramic dielectric capacitor, which comprises a single ceramic dielectric capacitor A, a single ceramic dielectric capacitor B, a bonding pad A, a bonding pad B, a bonding pad C, a flexible lead A, a flexible lead B and a shell, the single ceramic dielectric capacitors A are connected through the bonding pad A to form a ceramic dielectric capacitor bank A, and the single ceramic dielectric capacitors B are connected through the bonding pad C to form a ceramic dielectric capacitor bank B; and the ceramic dielectric capacitor bank A is connected with the ceramic dielectric capacitor bank B. A plurality of ceramic dielectric capacitors are connected in series and in parallel in a series-parallel mode, the welding sheets are welded and assembled in the cuboid shell of the capacitor through soldering tin, and the electrodes are welded and led out through the flexible leads, so that the capacitance and the voltage resistance value of the capacitor are improved, the assembling process is optimized, and the problems that the assembled large-size products of 6560 and above are poor in mechanical stress resistance and poor in reliability are solved. Welding points fall off, and the porcelain body cracks are solved.

The utility model relates to the technical field of capacitors, and discloses a sealing device for capacitors, which comprises a base, the top of the base is fixedly provided with an annular baffle plate, the interior of the annular baffle plate is rotatably connected with a turntable, the edge of the top of the turntable is provided with accommodating grooves in a penetrating array, and the right side of the annular baffle plate is provided with a feeding assembly. A sealing assembly is arranged above the clamping assembly, and a discharging hopper is fixedly installed on the lower portion of the left side of the base. The rotating roller rotates to drive the upper half part of the conveying belt to move from right to left, so that the capacitor is conveyed from right to left; an external driving source drives the rotating disc to rotate, the capacitors penetrate through the feeding port to enter the containing grooves, the rotating disc is located on the side walls of the containing grooves to push the capacitors to move anticlockwise, and the follow-up capacitors sequentially enter the containing grooves of the array. After the capacitor is sealed, when the capacitor moves to the discharging port, the capacitor is transferred out through the discharging hopper, and therefore the purposes of automatic feeding and discharging and high machining efficiency are achieved.

The present invention discloses a chip capacitor termination production line based on a thick rubber plate, comprising an assembly mechanism, an implantation mechanism, a pressing mechanism, a leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, a discharge mechanism and a transfer clamp; the slurry dipping mechanism, the drying mechanism and the cooling storage mechanism are each provided with two, and the assembly mechanism, the implantation mechanism, the pressing mechanism, the leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, another slurry dipping mechanism, another drying mechanism, another cooling storage mechanism and a discharge mechanism are provided in sequence; the assembly mechanism is used to place the lead-in plate on top of the thick rubber plate and form an assembly. The chip capacitor termination production line based on a thick rubber plate proposed in this scheme realizes the fully automatic operation of the chip capacitor termination process, can effectively improve the termination efficiency and the termination accuracy of the chip capacitor, and is conducive to reducing the labor cost in the termination process.

A tantalum capacitor includes a tantalum body including a tantalum element including tantalum powder, and a tantalum wire passing through at least a portion of the tantalum element in a first direction, a molded portion having fifth and sixth surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, first and second surfaces opposing each other in a third direction, the molded portion formed to surround the tantalum body, an anode lead frame connected to the tantalum wire, a cathode lead frame spaced apart from the anode lead frame, the cathode lead frame connected to the tantalum body, and a frame terminal disposed on the anode lead frame and the cathode lead frame to be spaced apart from the second surface of the molded portion.

A capacitor device (5) includes a capacitor (30), a capacitor bus bar (29), and a heat dissipation bus bar (26). One end of a capacitor bus bar (29) is electrically connected to the capacitor, the other end is electrically connected to the electrical component, and the capacitor bus bar extends in the arrangement direction of the capacitor and the electrical component. The heat dissipation bus bar (26) is provided with an end portion on the capacitor bus bar so as not to be present in the capacitor bus bar in the extending direction of the capacitor bus bar, and dissipates heat of the capacitor. Consequently, it is possible to suppress an increase in inductance of the capacitor bus bar and to improve heat dissipation of the capacitor at the same time.

The utility model provides a film capacitor glue pouring shaping and pin positioning work fixture, which is characterized by comprising a base, a filler strip and a tooth-shaped positioning clamping plate, the tooth-shaped positioning clamping plate, the filler strip and the base are sequentially arranged from top to bottom, the base is provided with a plurality of cavities, the sizes of the cavities are matched with the sizes of product shells, and the tooth-shaped positioning clamping plate and the filler strip are matched with each other. The product shell is loaded with a product and then is arranged in the base cavity; the appearance size of the tooth-shaped positioning clamping plate is consistent with that of the base, the middle of the tooth-shaped positioning clamping plate is an empty slot, a plurality of convex teeth are vertically symmetrical in the empty slot and are provided with cavities matched with sheet pins to insert, and the neutral lines of the convex teeth are consistent with the neutral line of the cavity of the base; the base cavity is through up and down, so that the product is easy to demould after the glue pouring material is cured; the hollowed-out parts of the tooth-shaped positioning clamping plate are more, so that the glue filling operation is easy to complete; a cavity of a base of the product shell is matched, so that deformation of the shell in the high-temperature drying process is prevented; the tooth-shaped positioning clamping plate fixes the sheet pins, so that the pin positioning problem of the capacitor is solved, and deviation of the pins in the transfer process after glue pouring is prevented.

Provided is a multilayer ceramic capacitor of which the specifications or the like can be identified on the basis of a lamination direction view.　A multilayer ceramic capacitor 10 according to the present invention is characterized by comprising: a laminate having a first main face and a second main face opposite each other in the lamination direction, a first lateral face and a second lateral face opposite each other in a first direction orthogonal to the lamination direction, and a first end face and a second end face opposite each other in a second direction orthogonal to the lamination direction and the first direction; a first external electrode disposed on the first end face and the first main face; a second external electrode disposed on the second end face and the first main face; a third external electrode disposed on the first end face and the first main face; and a fourth external electrode disposed on the second end face and the first main face, wherein provided that flatness D1 is the maximum distance among the distances in the lamination direction x (vertical) between the first main face surface and a point where the first main face intersects with the first end face or the second end face and flatness D2 is the maximum distance among the distances in the lamination direction x (vertical) between the first main face surface and a point where the second main face intersects with the first end face or the second end face at the halfway position of the width connecting the first lateral face and the second lateral face of the laminate, then flatness D1 ≥ flatness D2.

A multilayer ceramic electronic component includes a component body, a first external electrode provided on a first end surface of the component body, and a second external electrode provided on a second end surface of the component body. An absolute value of a difference between a surface roughness of a first side surface and a surface roughness of a second side surface of the component body is smaller than an absolute value of a difference between a surface roughness of a first main surface and a surface roughness of a second main surface.

A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately arranged in a first direction and cover portions disposed on the capacitance formation portion in the first direction, first to sixth surfaces; external electrodes disposed on the third and fourth surfaces; side margin portions disposed on the fifth and sixth surfaces; and a first extension portion disposed to extend to portions of the first and second surfaces, and wherein at least a partial region of the first extension portion has a curvature, wherein when an average thickness of the side margin portion is WM0 and a radius of curvature of at least a portion of the first extension portion is R, WM0 and R may satisfy 1.1<R / WM0<2.

The present disclosure provides a multilayer ceramic capacitor which can be manufactured even at a relatively low firing temperature and has excellent moisture resistance. The capacitor includes: a capacitor portion in which dielectric layers and internal electrode layers are alternately stacked; and a coating layer disposed on the outside in the stacking direction of the capacitor part, in which the coating layer contains a perovskite-type compound represented by general formula ABO3 and contains, in a metal state, one or more elements selected from Cu, Au, Ag, Al, Ir, and W, and the number of atoms of the elements is 0.002-0.15 with respect to the number of atoms of B-site elements of the general formula 100.

In a multilayer electronic component according to an embodiment of the present disclosure, a step of the multilayer electronic component may be alleviated by adjusting the shape of the reinforcing pattern included in the reinforcing portion disposed on at least one of one surface and the other surface of the capacitance formation portion in the first direction, and the occurrence of bending cracks may be suppressed.

To provide a laminate type electronic component that relieves a problem of deterioration in moisture resistance reliability of the laminate type electronic component that occurs due to the decrease in a moisture resistance permeation path.SOLUTION: A laminate type electronic component includes: a dielectric layer 111; internal electrodes 121 and 122 disposed alternately with the dielectric layer in a first direction; a lamination part 110 having a first surface and a second surface which face each other in the first direction, a third surface and a fourth surface which face each other in a second direction that is perpendicular to the first direction and is coupled to at least a part of the internal electrodes, and a fifth surface and a sixth surface which face each other in a third direction that is perpendicular to the first direction and the second direction; a protection part 120 disposed on the third surface and the fourth surface; and external electrodes 131 and 132 disposed on the lamination part and the protection part and coupled to the internal electrodes. The dielectric layer includes a first dielectric crystal grain and the protection part includes a second dielectric crystal grain. An average size of the second dielectric crystal grains may be smaller than an average size of the first dielectric crystal grains.SELECTED DRAWING: Figure 3