1711results about "Fixed capacitor housing/encapsulation" patented technology

Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.

A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.

Surface mount components and related methods of manufacture involve one or more thin film circuits provided between first and second insulating substrates. The thin film circuits may include one or more passive components, including resistors, capacitors, inductors, arrays of one or more passive components, networks or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads being exposed between the substrates on end and / or side surfaces of the surface mount component. The exposed conductive pads are then electrically connected to external terminations. The external terminations may include a variety of different materials, including at least one layer of conductive polymer and may be formed as termination stripes, end caps or the like. Optional shield layers may also be provided on top and / or bottom device surfaces to protect the surface mount components from signal interference. For embodiments where one or more thin film circuits are provided between insulating base and cover substrates, such thin film circuit(s) can be formed with conductive pads that extend to and are initially exposed along one or more surfaces of the resultant component. The cover substrate is formed with a plurality of conductive elements (e.g., internal active electrodes, internal anchor electrodes and / or external anchor electrodes) that are designed to generally align with the conductive pads formed on the base substrate such that conductive element portions are exposed in groups along one or more peripheral surfaces of a device. External plated terminations are then formed directly to the exposed portions of the conductive elements.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six concentrically wound capacitor sections of a capacitive element each having a capacitance value. The capacitor sections each have a respective section element terminal at a first end of the capacitive element and the capacitor sections have a common element terminal at a second end of the capacitive element. A pressure interrupter cover assembly is sealingly secured to the open end a case for the element and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitive element to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals. Deformation of the cover caused by failure of the capacitor element breaks at least some of the frangible connections sufficient to disconnect the capacitive element from an electric circuit in which it is connected. A cover insulation barrier mounted on the deformable cover, has a barrier cup substantially surrounding the common cover terminal and a plurality of barrier fins each extending radially outwardly from the barrier cup, and deployed between adjacent section cover.

The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance.The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

The invention provides a film capacitor and its manufacturing method suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic. A film capacitor comprises a film capacitor element 1, a bus bar 3 as metal terminal connected to electrode 2 of this film capacitor element 1, and a case 8 for containing them, in which the film capacitor element 1 and bus bar 3 are packed within the case 8 by plural layers of epoxy resin compositions 6, 7, and the plural layers of epoxy resin compositions 6, 7 are formed in layers, and are composed so that the coefficient of linear expansion may be smallest in the epoxy resin composition 7 disposed in the uppermost layer, and therefore resin cracks can be prevented at the time of heat cycle, and a film capacitor of high reliability excellent inhumidity resistance is obtained.

A chip socket defined by an organic matrix framework, wherein the organic matrix framework comprises at least one via post layer where at least one via through the framework around the socket includes at least one capacitor comprising a lower electrode, a dielectric layer and an upper electrode in contact with the via post.

A film-covered electric device has an electric device element and casing films. The casing films include a sealing area formed by thermally fusing the facing surfaces of the casing films together around the periphery of the electric device element, an electric device element receiving part encapsulating the electric device element inside the sealing area, and unfused portions formed in the shape of cove communicating with the electric device element receiving part. The casing films further include a stress concentrating portion touching the unfused portions for concentrating thereon the peeling stress of the casing films generated at the sealing area by the expansion of the electric device element receiving part, and a pressure releasing part is formed in the stress concentrating portion.

A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.

A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

A capacitor assembly is provided with a plurality of wound capacitor elements aligned horizontally in a longitudinally extended housing, whereby the largest capacitor element solely occupies a tier in the housing, another tier in the housing is solely occupied by two of the capacitor elements, and wherein the capacitor elements are configurable to provide various capacitance values.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.

An electronic component includes an electronic element including external electrodes on a surface and a substrate terminal on which the electronic element is mounted. The substrate terminal includes a first main surface, a second main surface opposite the first main surface, and a peripheral surface joining the first main surface and the second main surface. The substrate terminal includes mounting electrodes provided on the second main surface and electrically connected to the external electrodes of the electronic element, and connection electrodes provided on the first main surface and electrically connected to lands of a circuit substrate. A maximum width of the connection electrodes is greater than a maximum width of the mounting electrodes.

The invention relates to a polyester film comprising a hydrolysis stabilizer, wherein the hydrolysis stabilizer is an epoxidized alkyl ester of fatty acid or is a mixture of epoxidized alkyl esters of fatty acid or is an epoxidized fatty acid glyceride or is a mixture of epoxidized fatty acid glycerides. The form in which the hydrolysis stabilizer is added to the polyester is that of dry liquid, absorbed by a carrier material.

A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.

There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes including respective lead-out portions having an overlapping area, the overlapping area being exposed to one surface of the ceramic body; first and second external electrodes formed on the one surface of the ceramic body and connected to the respective lead-out portions; and an insulation layer formed on the one surface of the ceramic body to which the lead-out portions are exposed.

A ceramic electronic component has a chip element body having a conductor arranged inside, external electrodes, and a discrimination layer. The chip element body has first and second end faces facing each other, first and second side faces being perpendicular to the first and second end faces and facing each other, and third and fourth side faces being perpendicular to the first and second end faces and to the first and second side faces and facing each other. The external electrodes are formed on the first and second end faces, respectively, of the chip element body. The discrimination layer is provided on at least one side face out of the first side face and the second side face in the chip element body. The chip element body is comprised of a first ceramic. The discrimination layer is comprised of a second ceramic different from the first ceramic and has a color different from that of the third and fourth side faces.

A stacked film capacitor including a resin protective film having excellent durability is provided which can stably secure desired properties. The stacked film capacitor includes a capacitor element 12 including a plurality of dielectric layers 14, 18a and a plurality of vapor-deposited metal film layers 16a. Each dielectric layer and each vapor-deposited metal film layer are stacked with each other so as to be arranged alternately. The stacked film capacitor further includes a pair of external electrodes 26a, 26b provided on opposing side surfaces of the capacitor element, and at least one resin protective film 28a, 28b formed on at least one side surfaces other than the side surfaces on which the external electrodes are formed, in which the at least one resin protective film is provided by deposition polymerization.

The invention relates to a potting wax composition for metalized film capacitors, which comprises petroleum wax, synthetic wax, malthene and a tackiffer. The invention provides a potting wax composition for metalized film capacitors with suitable properties, and the defect of prior art that no special product exists in the field is made up. The invention is suitable for the potting of low voltage self-recover metalized polypropylene film power capacitors, CBB series capacitors and other metalized film capacitors. The invention has the advantages of good electrical properties, good moistureproof property, good fluidity, good heat resistant, good cold tolerance, suitable physical and chemical properties and processing property, innocuity, no corrosion, no impurity, and other advantages.

A capacitor device includes: a film capacitor element that comprises a coiled body in which an insulating layer and an electrification layer are laminated and wound together, and a pair of collector electrodes that are formed upon two opposite end faces of the coiled body; a case that comprises a capacitor housing portion within which the film capacitor element is received; a pair of inserts having insulation properties, one of which is inserted between one of the pair of collector electrodes and one of inner walls of the capacitor housing portion; and a mass of sealing and insulating material that is charged between the film capacitor element and the one of the inner walls of the capacitor housing portion.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.

An organic encapsulant composition applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards allows the capacitor to resist printed wiring board chemicals and pass 1000 hours of accelerated life testing conducted under high humidity, elevated temperature and applied DC bias.

A power conversion apparatus includes a switching circuit including semiconductor switches, and a main circuit capacitor connected between a DC power source and the switching circuit. The main circuit capacitor includes a capacitor element, first wiring members that connect the DC power source to the switching circuit, and second wiring members that connect the capacitor element to the switching circuit. The capacitor element, the first wiring members, and the second wiring members are received in a case.