1678results about "Fixed capacitor housing/encapsulation" patented technology

Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.

A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.

The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance.

The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

The invention provides a film capacitor and its manufacturing method suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic.

A film capacitor comprises a film capacitor element 1, a bus bar 3 as metal terminal connected to electrode 2 of this film capacitor element 1, and a case 8 for containing them, in which the film capacitor element 1 and bus bar 3 are packed within the case 8 by plural layers of epoxy resin compositions 6, 7, and the plural layers of epoxy resin compositions 6, 7 are formed in layers, and are composed so that the coefficient of linear expansion may be smallest in the epoxy resin composition 7 disposed in the uppermost layer, and therefore resin cracks can be prevented at the time of heat cycle, and a film capacitor of high reliability excellent inhumidity resistance is obtained.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.

An electronic component includes an electronic element including external electrodes on a surface and a substrate terminal on which the electronic element is mounted. The substrate terminal includes a first main surface, a second main surface opposite the first main surface, and a peripheral surface joining the first main surface and the second main surface. The substrate terminal includes mounting electrodes provided on the second main surface and electrically connected to the external electrodes of the electronic element, and connection electrodes provided on the first main surface and electrically connected to lands of a circuit substrate. A maximum width of the connection electrodes is greater than a maximum width of the mounting electrodes.

The invention relates to a polyester film comprising a hydrolysis stabilizer, wherein the hydrolysis stabilizer is an epoxidized alkyl ester of fatty acid or is a mixture of epoxidized alkyl esters of fatty acid or is an epoxidized fatty acid glyceride or is a mixture of epoxidized fatty acid glycerides. The form in which the hydrolysis stabilizer is added to the polyester is that of dry liquid, absorbed by a carrier material.

A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.

There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes including respective lead-out portions having an overlapping area, the overlapping area being exposed to one surface of the ceramic body; first and second external electrodes formed on the one surface of the ceramic body and connected to the respective lead-out portions; and an insulation layer formed on the one surface of the ceramic body to which the lead-out portions are exposed.

A ceramic electronic component has a chip element body having a conductor arranged inside, external electrodes, and a discrimination layer. The chip element body has first and second end faces facing each other, first and second side faces being perpendicular to the first and second end faces and facing each other, and third and fourth side faces being perpendicular to the first and second end faces and to the first and second side faces and facing each other. The external electrodes are formed on the first and second end faces, respectively, of the chip element body. The discrimination layer is provided on at least one side face out of the first side face and the second side face in the chip element body. The chip element body is comprised of a first ceramic. The discrimination layer is comprised of a second ceramic different from the first ceramic and has a color different from that of the third and fourth side faces.

The invention relates to a potting wax composition for metalized film capacitors, which comprises petroleum wax, synthetic wax, malthene and a tackiffer. The invention provides a potting wax composition for metalized film capacitors with suitable properties, and the defect of prior art that no special product exists in the field is made up. The invention is suitable for the potting of low voltage self-recover metalized polypropylene film power capacitors, CBB series capacitors and other metalized film capacitors. The invention has the advantages of good electrical properties, good moistureproof property, good fluidity, good heat resistant, good cold tolerance, suitable physical and chemical properties and processing property, innocuity, no corrosion, no impurity, and other advantages.

A capacitor assembly is provided having a case containing an upper capacitor and a lower capacitor in vertical alignment, each of the capacitor elements are separately sealed and provided with a pressure interrupter. A terminal board overlays the cover of the upper capacitor and is affixed to the top of the case. The terminals associated with the upper capacitor are mounted on the cover and extend through openings in the terminal board. The terminals associated with the lower capacitor are mounted on the terminal board and connected to contacts on the cover of the lower capacitor. The common leads of all of the capacitor elements are connected, thereby allowing any or all of the capacitor elements to be connected in parallel by accessing the terminals from the terminal board.

A multilayer ceramic capacitor includes a ceramic element body including internal electrodes therein. External electrodes are provided on end surfaces of the ceramic element body and electrically connected to exposed portions of respective ones of the internal electrodes. Each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer. In a cross section including a first interface between the sintered metal layer and the conductive resin layer, the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer, each of the recesses having a shape in which a dimension of the inner portion is larger than a dimension of the inlet measured along the first interface, and in a cross section including a second interface between the conductive resin layer and the plating layer, a number of the metal particles exposed from the conductive resin layer in a portion of the second interface with a length of about 1 mm is 50 to 250.

An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal.