612results about "Fixed capacitor housing/encapsulation" patented technology

A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately arranged in a first direction and cover portions disposed on the capacitance formation portion in the first direction, first to sixth surfaces; external electrodes disposed on the third and fourth surfaces; side margin portions disposed on the fifth and sixth surfaces; and a first extension portion disposed to extend to portions of the first and second surfaces, and wherein at least a partial region of the first extension portion has a curvature, wherein when an average thickness of the side margin portion is WM0 and a radius of curvature of at least a portion of the first extension portion is R, WM0 and R may satisfy 1.1<R / WM0<2.

A method for manufacturing a multi-layer ceramic capacitor (MLCC) end electrode and printing a full-area inner electrode protective layer is disclosed. The method uses thin dielectric ceramic layer thickness and a plurality of nickel inner electrode stacks to achieve high capacitance. The method produces high-density electrode-to-ceramic ratio end edges and side edges. The method uses an ultralow-temperature electrochemical deposition coating technology to manufacture a low-stress multi-layer ceramic capacitor end electrode and an insulating protective layer, thereby improving the yield of the multi-layer ceramic capacitor and reducing manufacturing costs.

A multilayer ceramic capacitor includes internal electrode layers including first internal electrode layers, second internal electrode layers, and intermediate electrode layers. At least a portion of each of the intermediate electrode layers has a coverage higher than a coverage of a region of a first counter portion of each of the first internal electrode layers adjacent to a first end surface, and a coverage higher than a coverage of a region of a second counter portion of each of the second internal electrode layers adjacent to a second end surface.

An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.

Provided is a multilayer ceramic capacitor that maintains electrical characteristics and ensures sufficient mechanical strength. In a multilayer ceramic capacitor (1), in a surface layer region (400), a side edge portion (16) includes a first segregation substance (133) having silicon as a main component and having a major diameter of 10 nm to 50 nm, and a second segregation substance (135) having silicon as a main component and having a major diameter of 1 [mu] m or more, a plurality of second segregation substances (135) are present in a cross section, and in the surface layer region (400), an additive component is included. The additive component includes at least one of zirconium, aluminum, titanium, and calcium, and the concentration of the additive component in the surface layer region (400) is higher than the concentration of the additive component in the inner region (402).

The base portion includes: a first outer layer portion (X1) positioned closer to the first main surface side than an internal electrode layer closest to the first main surface side in the stacking direction among the plurality of internal electrode layers; and a second outer layer section that is positioned closer to the second main surface side than an internal electrode layer that is closest to the second main surface side in the stacking direction among the plurality of internal electrode layers. The first outer layer portion (X1) and the second outer layer portion each include an outermost layer portion (Xa) disposed on the outermost side and an inner layer portion (Xb) located on the inner side of the outermost layer portion (Xa). The maximum height (Ha) of the irregularities on the outer surface of the outermost layer section (Xa) is smaller than the maximum height (Hb) of the irregularities on the outer surface of the inner outer layer section (Xb).

Power converter (1) with: a switching circuit (20); a capacitor module (3) which is electrically connected to the switching circuit; an auxiliary capacitor module (5) connected in parallel to the capacitor module; and a device housing (12) which contains the switching circuit, the capacitor module and the auxiliary capacitor module, wherein The capacitor module includes: a capacitor element (31), a capacitor housing (32) that contains the capacitor element, an encapsulation resin (33) that encapsulates the capacitor element in the capacitor housing, and a capacitor busbar (4) which connects the capacitor element to a power terminal of the switching circuit, wherein the capacitor busbar includes: an element connection section (41) that is connected to the capacitor element within the encapsulation resin, a connecting section (42) which is connected to the power connection outside the encapsulation resin, and a power supply connection section (43) which is connected to a power supply wiring (54) outside the encapsulation resin, wherein the power supply wiring is electrically connected to a DC power supply, wherein the capacitor busbar includes a DC path (44) which represents a current path between the terminal connection section and the power supply connection section, and the DC path is exposed to the outside of the encapsulation resin, the auxiliary capacitor module is connected to the power supply connection section of the capacitor busbar, the auxiliary capacitor module is detachably attached to the power supply connection section by means of a fastening element (11), and a fastening direction of a fastening element (135) that secures the auxiliary capacitor module and a fastening direction of the fixing element are the same.

Provided are multilayer ceramic capacitors that are each able to increase the capacitance without increasing the size of the multilayer ceramic capacitor. A multilayer ceramic capacitor 1 includes a first counter portion EA including a first region EA1, a second region EA2, and a first middle region EA0 located between the first region EA1 and the second region EA2 and including coverage higher than coverages of them; a second counter portion EB including a third region EB1, a fourth region EB2, and a second middle region located between the third region EB1 and the fourth region EB2 and including coverage higher than coverage of them. A thickness of each of the first middle region EA0 and the second middle region EB0 is 101.6% or more and 111.3% or less of a thickness of each of the first region E1, the second region EA2, the third region EB1, and the fourth region EB2, and a difference between coverage of each of the first middle region EA0 and the second middle region EB0 and coverage of each of the first region EA1, the second region EA2, the third region EB1, and the fourth region EB2 is 2.2 percentage points or more.

The utility model discloses a power capacitor device with an improved heat dissipation structure. The power capacitor device comprises a device shell, a plurality of power capacitor bodies and a gathering power shell. The utility model relates to the technical field of electrical auxiliary equipment, and the device realizes efficient heat dissipation management of a plurality of power capacitor main bodies running in the device shell through a split position adjusting blowing and pressing structure, and once the power capacitor main bodies are detected to be abnormal in heating, the power capacitor main bodies can be cooled. According to the device, a plurality of synchronous displacement modules and blowing air nozzles carried by the synchronous displacement modules can be rapidly adjusted to be gathered together, compressed air is blown downwards in a concentrated mode, heat diffusion is rapidly suppressed, meanwhile, a continuously-circulating horizontal air channel is constructed in the device through a pair of first fans which efficiently operate, and the heat dissipation efficiency is improved. The design ensures that a large amount of heat released by the power capacitor main body can be quickly and effectively taken away, so that the operation stability and safety of the power capacitor main body are greatly improved.

An energy storage dielectric capacitor disclosed by the present invention comprises an explosion-proof assembly, the explosion-proof assembly comprises a first pressure relief hole formed in a cover body and a cover body covering the top end of the cover body, the cover body is provided with a plurality of second pressure relief holes, the second pressure relief holes and the first pressure relief hole form a pressure relief channel communicating the interior of a shell with the outside, and a core is electrically connected with a first conductive column. The end, away from the core, of the first conductive column extends into the first pressure relief hole, the terminal is fixedly connected with a second conductive column, and the end, away from the terminal, of the second conductive column is located on the inner side of the cover body and provided with a metal conduction block. The explosion-proof assembly with a linkage function is integrated on the cover body, in a normal working state, the movable part of the metal conduction block abuts against the first conductive column under the action of pre-tightening force, normal operation of the capacitor is guaranteed, when the pressure in the shell is abnormally increased due to a fault, internal air pressure directly acts on the movable part, and the safety of the capacitor is guaranteed. And the electrical connection between the core and the external circuit is immediately disconnected, thereby preventing continuous input of fault current from aggravating thermal runaway.

The disclosure provides a multilayer ceramic electronic component including: a ceramic main body including a capacitance forming part, an edge part, and a cover part, the capacitance forming part including a dielectric layer, a first internal electrode, and a second internal electrode, the first and second internal electrodes being disposed to be stacked in a third direction with the dielectric layer interposed therebetween, the edge part being disposed on both surfaces of the capacitance forming part in a second direction, the cover part being disposed on both surfaces of the capacitance forming part in the third direction; first and second external electrodes disposed on first and second surfaces of the ceramic main body opposite to each other in a first direction, respectively; and an auxiliary electrode spaced apart from the capacitance forming part and disposed to be in contact with one of the first and second external electrodes. The auxiliary electrode is spaced apart from the first and second surfaces of the ceramic main body in the first direction.

To provide multilayer ceramic electronic components in which the protective effect of the side margin is less likely to be compromised. [Solution] The multilayer ceramic electronic component comprises a laminate and a pair of side margins. The laminate has a plurality of internal electrodes stacked in the first axial direction and a pair of sides perpendicular to a second axis orthogonal to the first axis, with the ends of the plurality of internal electrodes in the second axial direction aligned within 0.5 μm in the second axial direction. The pair of side margins mainly consist of a polycrystalline ceramic material and contain a plurality of glass particles dispersed in the polycrystalline material, covering the pair of side margins. The median diameter of the plurality of glass particles is 0.20 μm or more and is 90% or more of the median diameter of the plurality of crystal particles constituting the polycrystalline material.

The invention relates to the technical field of thin-film capacitors, in particular to a standardized and modularized thin-film direct-current support capacitor which can reduce design complexity and cost budget, is convenient to combine and expand, can operate in a high-temperature environment and is high in applicability, and the standardized and modularized thin-film direct-current support capacitor comprises a capacitor unit and a busbar. Each capacitor unit comprises a capacitor shell and a core arranged in the capacitor shell, clamping groove structures matched with each other are arranged on two sides of the outer wall of the capacitor shell, a positioning groove is formed in the inner wall of the capacitor shell, and a lead-out pin of the capacitor unit penetrates through the positioning groove; the film base film of the core is formed by mixing and co-extruding 70%-80% of polypropylene and 20%-30% of cycloolefin copolymer.

Provided is a capacitor that is lightweight yet can reduce moisture absorption. The capacitor comprises a capacitor element and a protective film. The capacitor element has a first end-face electrode, a second end-face electrode, and an outer peripheral surface. The second end-face electrode exists at the side opposite to the first end-face electrode. The outer peripheral surface exists between the first end-face electrode and the second end-face electrode. The protective film has a first protective part, a second protective part, and a third protective part. The first protective part protects the peripheral edge part of the first end-face electrode. The second protective part protects the peripheral edge part of the second end-face electrode. The third protective part is connected to the first protective part and the second protective part, and protects the outer peripheral surface.

A multilayer ceramic capacitor may include a main body, comprising a first surface and a second surface which are opposite to each other in a first direction, a third surface and a fourth surface which are opposite to each other in a second direction which intersects with the first direction, and a fifth surface and a sixth surface which are opposite to each other in a third direction which intersects with both the first direction and the second direction, and the body includes a plurality of dielectric layers and a plurality of internal electrodes stacked in the third direction; and an outer electrode disposed on an outer side of the body, where the body may include an edge region in which the inner electrodes are not disposed, the edge region being disposed on an outer periphery of the plurality of inner electrodes facing the third surface and an outer periphery of the plurality of inner electrodes facing the fourth surface, a ratio of a width of the edge region to a width of the body measured in the second direction is greater than 8.5% and less than or equal to 9.5%, and wherein an average porosity of the edge region is greater than 0% and less than 1.1%.

In one embodiment, an electronic device is disclosed, comprising a substrate, a core having an upper plane and a lower plane, the core including a cavity extending through the core; an electronic component at least partially disposed within the cavity, the electronic component having an upper plane with one or more electronic component terminals; a first cured resin layer, the first cured resin layer in which the upper plane of the electronic component is at least partially embedded in the first cured resin layer in at least the upper portion of the cavity; and an upper metallization structure disposed on the upper plane of the core, the upper metallization structure configured to provide one or more conductive paths from one or more electronic component terminals to one or more upper metal terminals of the upper metallization structure.

The invention relates to a capacitive element (1) comprising: - a cylindrical casing (10) extending along a longitudinal axis (X); - a core (3) extending along the longitudinal axis (X) between an upper end (31) and a lower end (32); - a roll (2), housed inside the casing (10) and formed: o of a first film (20) provided with a first insulating portion (200) extended by a first conductive portion (201), and o of a second film (21) provided with a second insulating portion (210) extended by a second conductive portion (211), the two films (20, 21) being stacked and wound around the core (3) so that the first insulating portion (200) is in contact with the second insulating portion (210) and so that the first conductive portion (201) and the second conductive portion (211) are opposite along a longitudinal axis of the capacitive element (1), the first conductive portion (201) forming a first end of the roll, the second conductive portion (211) forming a second end of the roll, - a first metallized layer (40) formed on an upper surface of the roll at the location of the first end of the roll; - a second metallized layer (41) formed on a lower surface of the roll at the location of the second end of the roll; - two radial outlets (50, 51), one of the two radial outlets (50) being in electrical connection with the first metallized layer (40), the other of the two radial outlets (51) being in electrical connection with the second metallized layer (41), the two radial outlets (50, 51) being mounted at least partially projecting from an upper surface (100) of the casing (10), characterized in that the core (3) is made at least partially from a metal material, and has an outer surface at least partially covered with a layer of insulating material (30).

A multilayer ceramic capacitor includes a multilayer body including an active portion and inactive portions, side margin portions, a first terminal electrode, and a second terminal electrode. The side margin portions include a first segregate including silicon as a main ingredient and having a longest dimension of about 10 nm or greater and about 50 nm or smaller, and second segregates including silicon as a main ingredient and having a longest dimension of about 1 μm or greater.

The utility model discloses a new energy automobile battery swap station's PCB board 4 pin film capacitor, including plastic shell and the capacitor body of encapsulation in plastic shell, capacitor body includes the capacitor core that is composed of multiple single core and the laminated busbar that is connected with capacitor core through soldering tin, and the laminated busbar is connected with two outgoing terminals, and each outgoing terminal has two parallel interval opposite pins and the connecting portion of connecting two pins, and the connecting portion is integrally formed with two pins and is combined into U shape, and the pin stretches out plastic shell outside, and the connecting portion of each outgoing terminal is welded and connects the laminated busbar. Through setting laminated busbar, U type outgoing terminal, multiple core combination arrangement capacitor core in the inside of plastic shell, the soldering connection process that laminated busbar is used with electric core, makes capacitor presents high stable ESL, ESR parameter on high frequency resonance road, and the current capacity of capacitor improves self heating little, and circuit output high quality steady voltage waveform.

To provide a multilayer ceramic electronic component that can increase reliability, and a method for manufacturing the same.SOLUTION: A multilayer ceramic electronic component is provided with: a functional part that has internal electrodes stacked in a first direction; a cover part that covers the functional part from the first direction; and a side margin part that covers the functional part from a second direction orthogonal to the first direction. The functional part has, on a predetermined cross section, first straight line parts in contact with the cover part and extending in the second direction, second straight line parts in contact with the side margin part and extending in the first direction, and corner parts connecting the first straight line parts and the second straight line parts. When the distance along the first direction between a first virtual line obtained by extending the first straight line part in the second direction and an end point of the second straight line part on a side of the first virtual line is defined as a, and the distance along the second direction between a second virtual line obtained by extending the second straight line part in the first direction and an end point of the first straight line part on a side of the second virtual line is defined as b, the corner part is curved so as to satisfy the conditions of a≥1 μm and 0.1≤a / b≤0.4.SELECTED DRAWING: Figure 10

The utility model discloses a large-current large-capacity direct current support capacitor, which comprises a shell, a capacitor core module and a leading-out terminal, the capacitor core module comprises an absorption capacitor core group and a thin film capacitor core group, the absorption capacitor core group and the thin film capacitor core group are respectively provided with a plurality of capacitor core single groups which are respectively arranged in an array, and the leading-out terminal is connected with the absorption capacitor core group and the thin film capacitor core group. The absorption capacitor core group is positioned above the thin-film capacitor core group; electrodes at the two ends of the capacitor core module are respectively welded in parallel through a plurality of sub-copper plates, the upper ends of the sub-copper plates are connected with the laminated busbar, the leading-out terminal is arranged on the laminated busbar and extends out of the top of the shell, and the capacitor core module, the sub-copper plates and the laminated busbar are packaged in the shell through a potting material. According to the structure that the wire inlet end of the large-current large-capacity direct-current support capacitor is connected with the absorption capacitor in parallel to share high-frequency harmonic current, current impact can be borne under the condition that current distribution is not uniform, and heating breakdown failure is avoided.

A stacked capacitor assembly and a stacked capacitor packaging structure. The stacked capacitor packaging structure includes a stacked capacitor assembly, an electrode assembly and an insulating package body. The stacked capacitor assembly includes a plurality of conductive substrates. The insulating package body can cover the stacked capacitor assembly and carry the electrode assembly. The conductive substrates can conform to the following formula: H=nt+(n−1) d, in which H is a total thickness of the conductive substrates, n is the number of the conductive substrates, t is a thickness of each conductive substrate, and d is a distance between two adjacent conductive substrates. The number of the conductive substrates is between 2 and 30, the thickness of each conductive substrate is between 80 μm and 150 μm, the distance between the two adjacent conductive substrates is between 0.05 μm and 30 μm, and the ratio d / H is between 0.35 and 350.

The present disclosure provides a multilayer ceramic capacitor. The multilayer ceramic capacitor includes: a body including a plurality of internal electrodes and a plurality of dielectric layers alternately stacked in a first direction with each dielectric layer interposed between adjacent ones of the plurality of internal electrodes, and having a first surface and a second surface opposite to each other in the first direction; an external electrode disposed on an outer side of the main body; a first outer region facing the first surface; a second outer region facing the second surface; and an inner region between the first outer region and the second outer region, in which the inner electrode in the first outer region and the inner electrode in the second outer region are thinner than the inner electrode in the inner region, and the dielectric layer in the first outer region and the dielectric layer in the second outer region are thicker than the dielectric layer in the inner region.

The utility model discloses a film capacitor for flexible direct current power transmission, which belongs to the technical field of capacitors and comprises a shell, a plurality of capacitor cores and extraction electrodes, the shell is made of metal materials, the plurality of capacitor cores are grouped to form a plurality of capacitor core independent groups, and the extraction electrodes are arranged in the shell. Each capacitor core independent group is connected with a tinned copper plate, the lead-out electrode is provided with a laminated busbar and is connected with the tinned copper plate in a matched manner through the laminated busbar, and the plurality of capacitor core independent groups are packaged in the shell through a potting material. The thin-film capacitor can simultaneously meet the performance requirements of low self-inductance, low temperature rise, high energy density, light weight and long service life, thereby effectively improving the safety and reliability of the thin-film capacitor for flexible direct-current power transmission.

The invention provides an array device for an equal-side-width MLCC multilayer capacitor and a manufacturing method of the array device. The device comprises a first bearing plate, a second guide plate, a third main mechanism array platform, a fourth stamping mechanism and a fifth line / surface scanning CCD. Wherein the first bearing plate is provided with a positioning groove for clamping an MLCC multilayer capacitor; the second guide plate is provided with positioning grooves capable of accommodating the MLCC, the positioning grooves of the second guide plate are correspondingly matched with the positioning grooves of the first bearing plate in arrangement array position, and the bottoms of the positioning grooves of the second guide plate are provided with through holes penetrating through the second guide plate; the third main mechanism array platform is provided with an air passage hole and a vibration / swinging mechanism, and the air passage hole corresponds to a through hole in the bottom of a positioning groove of the second guide plate; and the fourth punching mechanism is provided with punching needles corresponding to the positioning groove array of the second guide plate. According to the invention, the electrodes in the wide and thick surfaces of the equal-side-width MLCC are uniformly arranged in the same direction in an array manner, and the array arrangement with high accuracy and high efficiency is realized, so that the immersion sealing coating of the external electrodes is realized in a special end sealing machine for the MLCC.

Provided is a stacked ceramic capacitor package, for an electronic device, preventing noise, vibration and cracks due to piezoelectric properties. The ceramic capacitor package for an electronic device comprises: stacked ceramic capacitors; a first terminal structure connected to a first side surface of the stacked ceramic capacitors; and a second terminal structure connected to a second side surface of the stacked ceramic capacitors and disposed so as to face the first terminal structure with the stacked ceramic capacitors therebetween. The first terminal structure has a first groove defined in an area coming into contact with the first side surface of the stacked ceramic capacitors. The horizontal length of the first groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.

The utility model discloses a lightweight DC-Link capacitor, which belongs to the technical field of capacitors and comprises an outer shell, the outer shell is formed by packaging a plurality of plates, a plurality of capacitor cores are arranged in the outer shell, extraction electrodes are arranged on the outer shell, and the capacitor cores are connected with busbars and are connected with the extraction electrodes through the busbars. The DC-Link capacitor can meet the use requirement in a high-temperature and high-humidity environment, can isolate the current leaked from the capacitor core, ensures the normal use of the capacitor core, can reduce the production cost, reduces the surplus during model selection, and achieves the light-weight arrangement.

To provide a highly reliable multilayer ceramic capacitor in which deterioration of insulation resistance is suppressed.SOLUTION: The multilayer ceramic capacitor includes an inner layer portion 16 including a main surface and an end surface, an outer layer portion 18a covering the main surface in a stacking direction, and a side margin covering the 18b and the inner layer portion from one side in an outer layer portion widthwise direction. The dielectric particles constituting the inner layer portion and the side margin portion have pores therein, and the intragranular pore ratio in the center portion of the inner layer portion (N [inner layer center portion]) and the intragranular pore ratio in the side margin portion (N [side margin portion]) satisfy a relationship of an expression N [inner layer center portion] <N [side margin portion]. The D50 size (D5 [(inner layer W end)]) of the dielectric particles at the width-direction end (inner layer W end) of the inner layer portion and the D50 size (D50 [inner layer center]) of the dielectric particles at the center (inner layer center) of the inner layer portion satisfy the relationship of 1.00 ≤ D50 [inner layer W end] / D50 [inner layer center] ≤ 1.40.SELECTED DRAWING: Figure 2

Provided is a multilayer ceramic capacitor having higher moisture resistance and reliability. In the laminated ceramic capacitor (1), the difference between the first silicon concentration at the outer layer position (A) and the first silicon concentration at the side edge position (B) is 0.2-2.5 mol%, and the first silicon concentration at the origin (O) is at least the first silicon concentration at the outer layer position (A) and not more than the first silicon concentration at the side edge position (B), or the first silicon concentration at the outer layer position (A) and not more than the first silicon concentration at the side edge position (B).

The invention discloses an anti-vibration solid-state capacitor for vehicle-mounted electronics, which is suitable for a new energy automobile. The capacitor comprises an external frame and an internal capacitor body, a sliding contact is arranged at the tail end of a lead of the capacitor body, a sliding rod matched with the sliding contact is arranged on the frame, and the bottom end of the sliding rod is connected with a pin. The upper surface and the lower surface of the body are connected with an upper hydraulic buffering mechanism and a lower hydraulic buffering mechanism respectively, and the two buffering mechanisms are connected through a communicating pipe and fixed to the frame through side fixing blocks. During work, vibration enables the body and the frame to move relatively, the sliding block extrudes a buffer solution, the solution flows through the communicating pipe to achieve buffering, and meanwhile the sliding contact slides along the sliding rod to keep the circuit communicated. The capacitor is excellent in anti-vibration effect, stable in electric conduction, high in environmental adaptability, and capable of improving the reliability and prolonging the service life of a vehicle-mounted electronic system.