1002results about "Fixed capacitor housing/encapsulation" patented technology

The invention discloses a high-voltage multi-core ceramic capacitor and a preparation method thereof, and the multi-core ceramic capacitor comprises a pedestal, two connection frames which are oppositely disposed on the pedestal, and a plurality of capacitor modules which are sequentially arranged in the length direction of the connection frames. The capacitor module comprises a plurality of capacitors which are sequentially connected in series between two connecting frames and a plurality of series connecting sheets which are respectively arranged between two adjacent capacitors, and the connecting frames are connected with the opposite capacitors; the capacitor comprises a capacitor body, two parallel frames oppositely arranged on the two sides of the capacitor body, a potting shell used for installing the capacitor body and a potting layer arranged in the potting shell and wrapping the capacitor body. The specific structure of the capacitor module is limited to be matched with the connecting frame, so that parallel capacity increasing and series voltage dividing of the multiple capacitor chips are achieved, other capacitor modules are not affected after a certain capacitor module fails, and the market requirement of higher-voltage products is met.

The present invention discloses a chip capacitor termination production line based on a thick rubber plate, comprising an assembly mechanism, an implantation mechanism, a pressing mechanism, a leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, a discharge mechanism and a transfer clamp; the slurry dipping mechanism, the drying mechanism and the cooling storage mechanism are each provided with two, and the assembly mechanism, the implantation mechanism, the pressing mechanism, the leveling mechanism, a slurry dipping mechanism, a drying mechanism, a cooling storage mechanism, a plate changing mechanism, another slurry dipping mechanism, another drying mechanism, another cooling storage mechanism and a discharge mechanism are provided in sequence; the assembly mechanism is used to place the lead-in plate on top of the thick rubber plate and form an assembly. The chip capacitor termination production line based on a thick rubber plate proposed in this scheme realizes the fully automatic operation of the chip capacitor termination process, can effectively improve the termination efficiency and the termination accuracy of the chip capacitor, and is conducive to reducing the labor cost in the termination process.

A multilayer ceramic electronic component includes a component body, a first external electrode provided on a first end surface of the component body, and a second external electrode provided on a second end surface of the component body. An absolute value of a difference between a surface roughness of a first side surface and a surface roughness of a second side surface of the component body is smaller than an absolute value of a difference between a surface roughness of a first main surface and a surface roughness of a second main surface.

A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately arranged in a first direction and cover portions disposed on the capacitance formation portion in the first direction, first to sixth surfaces; external electrodes disposed on the third and fourth surfaces; side margin portions disposed on the fifth and sixth surfaces; and a first extension portion disposed to extend to portions of the first and second surfaces, and wherein at least a partial region of the first extension portion has a curvature, wherein when an average thickness of the side margin portion is WM0 and a radius of curvature of at least a portion of the first extension portion is R, WM0 and R may satisfy 1.1<R / WM0<2.

The present disclosure provides a multilayer ceramic capacitor which can be manufactured even at a relatively low firing temperature and has excellent moisture resistance. The capacitor includes: a capacitor portion in which dielectric layers and internal electrode layers are alternately stacked; and a coating layer disposed on the outside in the stacking direction of the capacitor part, in which the coating layer contains a perovskite-type compound represented by general formula ABO3 and contains, in a metal state, one or more elements selected from Cu, Au, Ag, Al, Ir, and W, and the number of atoms of the elements is 0.002-0.15 with respect to the number of atoms of B-site elements of the general formula 100.

To provide a laminate type electronic component that relieves a problem of deterioration in moisture resistance reliability of the laminate type electronic component that occurs due to the decrease in a moisture resistance permeation path.SOLUTION: A laminate type electronic component includes: a dielectric layer 111; internal electrodes 121 and 122 disposed alternately with the dielectric layer in a first direction; a lamination part 110 having a first surface and a second surface which face each other in the first direction, a third surface and a fourth surface which face each other in a second direction that is perpendicular to the first direction and is coupled to at least a part of the internal electrodes, and a fifth surface and a sixth surface which face each other in a third direction that is perpendicular to the first direction and the second direction; a protection part 120 disposed on the third surface and the fourth surface; and external electrodes 131 and 132 disposed on the lamination part and the protection part and coupled to the internal electrodes. The dielectric layer includes a first dielectric crystal grain and the protection part includes a second dielectric crystal grain. An average size of the second dielectric crystal grains may be smaller than an average size of the first dielectric crystal grains.SELECTED DRAWING: Figure 3

To provide a multilayer ceramic capacitor in which occurrence of cracking or chipping at a boundary part between an end face side ineffective part and a vertical ridge line ineffective part of a laminated body is prevented.SOLUTION: A multilayer ceramic capacitor 1 includes: a multilayer body 10 including a plurality of stacked dielectric layers 20 and a plurality of internal electrode layers 30; and an external electrode 40 disposed so as to be electrically connected to the internal electrode layers 30. An outer surface of the multilayer body 10 at a boundary part VLB between an end face side ineffective part LG and a vertical ridge line ineffective part VG, the outer surface of a vertical ridge line ineffective part VG, and the outer surface of the multilayer body at a boundary part VWB between the vertical ridge line ineffective part VG and the side face side ineffective part WG form a continuous curved surface VR protruding outward in a plan view from a multilayer direction T, and a protective film SC containing carbon and silicon as constituent elements is formed on the curved surface VR.SELECTED DRAWING: Figure 3

A capacitor assembly includes a traction inverter system housing and a set of power electronics defining two or more contacts, the set of power electronics mounted within the traction inverter system housing. A capacitor housing containing a capacitor is mounted within the traction inverter system housing. The capacitor includes two or more terminals extending outwardly therefrom and overlapping the two or more contacts. A terminal block is secured to the capacitor housing independent of attachment of the two or more contacts to the two or more terminals. The terminal block is configured to support the two or more terminals during a fastening operation attaching the two or more terminals to the two or more contacts. The terminal block may also be secured to the capacitor housing.

A method for manufacturing a multi-layer ceramic capacitor (MLCC) end electrode and printing a full-area inner electrode protective layer is disclosed. The method uses thin dielectric ceramic layer thickness and a plurality of nickel inner electrode stacks to achieve high capacitance. The method produces high-density electrode-to-ceramic ratio end edges and side edges. The method uses an ultralow-temperature electrochemical deposition coating technology to manufacture a low-stress multi-layer ceramic capacitor end electrode and an insulating protective layer, thereby improving the yield of the multi-layer ceramic capacitor and reducing manufacturing costs.

A multilayer ceramic capacitor includes internal electrode layers including first internal electrode layers, second internal electrode layers, and intermediate electrode layers. At least a portion of each of the intermediate electrode layers has a coverage higher than a coverage of a region of a first counter portion of each of the first internal electrode layers adjacent to a first end surface, and a coverage higher than a coverage of a region of a second counter portion of each of the second internal electrode layers adjacent to a second end surface.

An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.

Provided is a multilayer ceramic capacitor that maintains electrical characteristics and ensures sufficient mechanical strength. In a multilayer ceramic capacitor (1), in a surface layer region (400), a side edge portion (16) includes a first segregation substance (133) having silicon as a main component and having a major diameter of 10 nm to 50 nm, and a second segregation substance (135) having silicon as a main component and having a major diameter of 1 [mu] m or more, a plurality of second segregation substances (135) are present in a cross section, and in the surface layer region (400), an additive component is included. The additive component includes at least one of zirconium, aluminum, titanium, and calcium, and the concentration of the additive component in the surface layer region (400) is higher than the concentration of the additive component in the inner region (402).

The base portion includes: a first outer layer portion (X1) positioned closer to the first main surface side than an internal electrode layer closest to the first main surface side in the stacking direction among the plurality of internal electrode layers; and a second outer layer section that is positioned closer to the second main surface side than an internal electrode layer that is closest to the second main surface side in the stacking direction among the plurality of internal electrode layers. The first outer layer portion (X1) and the second outer layer portion each include an outermost layer portion (Xa) disposed on the outermost side and an inner layer portion (Xb) located on the inner side of the outermost layer portion (Xa). The maximum height (Ha) of the irregularities on the outer surface of the outermost layer section (Xa) is smaller than the maximum height (Hb) of the irregularities on the outer surface of the inner outer layer section (Xb).

Power converter (1) with: a switching circuit (20); a capacitor module (3) which is electrically connected to the switching circuit; an auxiliary capacitor module (5) connected in parallel to the capacitor module; and a device housing (12) which contains the switching circuit, the capacitor module and the auxiliary capacitor module, wherein The capacitor module includes: a capacitor element (31), a capacitor housing (32) that contains the capacitor element, an encapsulation resin (33) that encapsulates the capacitor element in the capacitor housing, and a capacitor busbar (4) which connects the capacitor element to a power terminal of the switching circuit, wherein the capacitor busbar includes: an element connection section (41) that is connected to the capacitor element within the encapsulation resin, a connecting section (42) which is connected to the power connection outside the encapsulation resin, and a power supply connection section (43) which is connected to a power supply wiring (54) outside the encapsulation resin, wherein the power supply wiring is electrically connected to a DC power supply, wherein the capacitor busbar includes a DC path (44) which represents a current path between the terminal connection section and the power supply connection section, and the DC path is exposed to the outside of the encapsulation resin, the auxiliary capacitor module is connected to the power supply connection section of the capacitor busbar, the auxiliary capacitor module is detachably attached to the power supply connection section by means of a fastening element (11), and a fastening direction of a fastening element (135) that secures the auxiliary capacitor module and a fastening direction of the fixing element are the same.

A feedthrough capacitor not packaged by glass and applicable to an airtight device includes a disk-like ceramic capacitor body (1) of a multilayer laminated structure. A Kovar tube (3) is disposed in an inner hole (2) of the disk-like ceramic capacitor body (1), a conductive pin (4) penetrates through an inner hole (2) of the Kovar tube (3), and the conductive pin (4) and the Kovar tube (3) as well as the Kovar tube (3) and the disk-like ceramic capacitor body (1) are soldered and fixed with gold-tin alloy solder. The distance between the conductive pin (4) and the inner hole (2) of the disk-like ceramic capacitor body (1) is shortened by adding the Kovar tube (3) between the conductive pin (4) and the disk-like ceramic capacitor body (1), so that the amount of the gold-tin alloy solder used in a soldering process is effectively reduced. Because the amount of the gold-tin alloy solder used is reduced, the influence of thermal expansion and contraction of the gold-tin alloy solder on a ceramic capacitor can be greatly relieved, thereby improving the quality of the ceramic capacitor. Moreover, the entire product can be easily cleaned, with no flux left, and dense solder joints are formed to meet specific airtightness requirements.

The invention relates to a glue pouring positioning tool for a capacitor, which comprises a positioning frame, more than one positioning block and at least two locking strips, and is characterized in that the positioning frame is sleeved outside a shell of the capacitor and is positioned at the upper part of the shell; the locking bar is used for fixing the positioning frame on the upper part of the shell; the two end parts of the positioning block are connected with the upper end of the positioning frame, and the middle part of the positioning block is locked with a connecting terminal of a core group of the capacitor. According to the invention, the glue filling positioning tool is applied to the preparation process of the capacitor, so that the upper cover of the capacitor can be welded after glue filling is completed, the glue filling liquid level height and the glue curing effect can be confirmed in the glue filling process of the capacitor, and the glue filling liquid level height and the glue curing effect can meet the requirements; therefore, the yield of the capacitor is improved.

To provide a multilayer capacitor with improved moisture resistance reliability, and a manufacturing method for the same.SOLUTION: A multilayer capacitor includes: a main body 110 including a multilayer structure where a plurality of dielectric layers 111 are stacked and a plurality of internal electrodes 121 and 122 stacked with the dielectric layers held therebetween; external electrodes 131 and 132 disposed outside the main body and connected to the internal electrode; and an insulating layer 112 covering a surface of the main body. The external electrode includes a metal layer 31 connected to the insulating layer. The insulating layer includes oxide of a metal component of the metal layer.SELECTED DRAWING: Figure 2

Provided are multilayer ceramic capacitors that are each able to increase the capacitance without increasing the size of the multilayer ceramic capacitor. A multilayer ceramic capacitor 1 includes a first counter portion EA including a first region EA1, a second region EA2, and a first middle region EA0 located between the first region EA1 and the second region EA2 and including coverage higher than coverages of them; a second counter portion EB including a third region EB1, a fourth region EB2, and a second middle region located between the third region EB1 and the fourth region EB2 and including coverage higher than coverage of them. A thickness of each of the first middle region EA0 and the second middle region EB0 is 101.6% or more and 111.3% or less of a thickness of each of the first region E1, the second region EA2, the third region EB1, and the fourth region EB2, and a difference between coverage of each of the first middle region EA0 and the second middle region EB0 and coverage of each of the first region EA1, the second region EA2, the third region EB1, and the fourth region EB2 is 2.2 percentage points or more.

To provide a multilayer ceramic electronic component that reduces the possibility of having interlayer peeling, while satisfying requests for a reduction in size and an increase in capacitance.SOLUTION: A multilayer ceramic capacitor 1 comprises: a laminate 2 having two outer layer parts 7 arranged on both sides in a lamination direction T of an inner layer part 6, a first side gap part 8A located on a side of a first side face B1 of the inner layer part 6, and a second side gap part 8B located on a side of a second side face B2; and external electrodes 3 arranged respectively on a first end face C1 and a second end face C2. The dimensions in a width direction W of the inner layer part 6 on a side of a first principal surface A1 and on a side of a second principal surface A2 in the lamination direction T are substantially equal to each other. On a cross section passing through the lamination direction T and the width direction W at the center in a lengthwise direction L, the dimensions in the width direction W of the first side gap part 8A on a side of the first principal surface A1 and on a side of the second principal surface A2 in the lamination direction T are substantially equal to each other, and the dimension in the width direction W of the second side gap part 8B gradually increases from the center in the lamination direction T toward the second principal surface.SELECTED DRAWING: Figure 3

The utility model discloses a power capacitor device with an improved heat dissipation structure. The power capacitor device comprises a device shell, a plurality of power capacitor bodies and a gathering power shell. The utility model relates to the technical field of electrical auxiliary equipment, and the device realizes efficient heat dissipation management of a plurality of power capacitor main bodies running in the device shell through a split position adjusting blowing and pressing structure, and once the power capacitor main bodies are detected to be abnormal in heating, the power capacitor main bodies can be cooled. According to the device, a plurality of synchronous displacement modules and blowing air nozzles carried by the synchronous displacement modules can be rapidly adjusted to be gathered together, compressed air is blown downwards in a concentrated mode, heat diffusion is rapidly suppressed, meanwhile, a continuously-circulating horizontal air channel is constructed in the device through a pair of first fans which efficiently operate, and the heat dissipation efficiency is improved. The design ensures that a large amount of heat released by the power capacitor main body can be quickly and effectively taken away, so that the operation stability and safety of the power capacitor main body are greatly improved.

A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes facing each other in a second axis direction. The ceramic body includes internal electrodes, and has a rectangular parallelepiped shape having first and second end surfaces, and four connection surfaces each connecting the first and second end surfaces. The connection surface has an uneven region located between the first and second external electrodes. The uneven region includes recess portions formed along an extension direction intersecting the second axis direction and arranged along an arrangement direction orthogonal to a depth direction and the extension direction, and a protrusion portion located between the recess portions. A depth of the recess portion in the depth direction is 0.1 μm or greater and less than 2.5 μm. An arrangement pitch of the recess portions along the arrangement direction is 1 μm or greater and 80 μm or less.

An energy storage dielectric capacitor disclosed by the present invention comprises an explosion-proof assembly, the explosion-proof assembly comprises a first pressure relief hole formed in a cover body and a cover body covering the top end of the cover body, the cover body is provided with a plurality of second pressure relief holes, the second pressure relief holes and the first pressure relief hole form a pressure relief channel communicating the interior of a shell with the outside, and a core is electrically connected with a first conductive column. The end, away from the core, of the first conductive column extends into the first pressure relief hole, the terminal is fixedly connected with a second conductive column, and the end, away from the terminal, of the second conductive column is located on the inner side of the cover body and provided with a metal conduction block. The explosion-proof assembly with a linkage function is integrated on the cover body, in a normal working state, the movable part of the metal conduction block abuts against the first conductive column under the action of pre-tightening force, normal operation of the capacitor is guaranteed, when the pressure in the shell is abnormally increased due to a fault, internal air pressure directly acts on the movable part, and the safety of the capacitor is guaranteed. And the electrical connection between the core and the external circuit is immediately disconnected, thereby preventing continuous input of fault current from aggravating thermal runaway.

A system for a capacitor of an inverter of an electric vehicle. A system includes an inverter for converting direct current (DC) power from a battery to alternating current (AC) power to drive an electric machine, where the inverter includes: a capacitor assembly including: a planar busbar including a first DC busbar and a second DC busbar; a capacitor on the same side of the first DC busbar and the second DC busbar, the capacitor including a first end cap extending in a direction substantially perpendicular to a longitudinal direction of the planar busbar; and a first connection plate disposed at the first end cap to connect the capacitor to the first DC bus bar, and a second connection plate disposed at the second end cap to connect the capacitor to the second DC bus bar.

The disclosure provides a multilayer ceramic electronic component including: a ceramic main body including a capacitance forming part, an edge part, and a cover part, the capacitance forming part including a dielectric layer, a first internal electrode, and a second internal electrode, the first and second internal electrodes being disposed to be stacked in a third direction with the dielectric layer interposed therebetween, the edge part being disposed on both surfaces of the capacitance forming part in a second direction, the cover part being disposed on both surfaces of the capacitance forming part in the third direction; first and second external electrodes disposed on first and second surfaces of the ceramic main body opposite to each other in a first direction, respectively; and an auxiliary electrode spaced apart from the capacitance forming part and disposed to be in contact with one of the first and second external electrodes. The auxiliary electrode is spaced apart from the first and second surfaces of the ceramic main body in the first direction.

To provide multilayer ceramic electronic components in which the protective effect of the side margin is less likely to be compromised. [Solution] The multilayer ceramic electronic component comprises a laminate and a pair of side margins. The laminate has a plurality of internal electrodes stacked in the first axial direction and a pair of sides perpendicular to a second axis orthogonal to the first axis, with the ends of the plurality of internal electrodes in the second axial direction aligned within 0.5 μm in the second axial direction. The pair of side margins mainly consist of a polycrystalline ceramic material and contain a plurality of glass particles dispersed in the polycrystalline material, covering the pair of side margins. The median diameter of the plurality of glass particles is 0.20 μm or more and is 90% or more of the median diameter of the plurality of crystal particles constituting the polycrystalline material.

The invention relates to the technical field of thin-film capacitors, in particular to a standardized and modularized thin-film direct-current support capacitor which can reduce design complexity and cost budget, is convenient to combine and expand, can operate in a high-temperature environment and is high in applicability, and the standardized and modularized thin-film direct-current support capacitor comprises a capacitor unit and a busbar. Each capacitor unit comprises a capacitor shell and a core arranged in the capacitor shell, clamping groove structures matched with each other are arranged on two sides of the outer wall of the capacitor shell, a positioning groove is formed in the inner wall of the capacitor shell, and a lead-out pin of the capacitor unit penetrates through the positioning groove; the film base film of the core is formed by mixing and co-extruding 70%-80% of polypropylene and 20%-30% of cycloolefin copolymer.

Provided is a capacitor that is lightweight yet can reduce moisture absorption. The capacitor comprises a capacitor element and a protective film. The capacitor element has a first end-face electrode, a second end-face electrode, and an outer peripheral surface. The second end-face electrode exists at the side opposite to the first end-face electrode. The outer peripheral surface exists between the first end-face electrode and the second end-face electrode. The protective film has a first protective part, a second protective part, and a third protective part. The first protective part protects the peripheral edge part of the first end-face electrode. The second protective part protects the peripheral edge part of the second end-face electrode. The third protective part is connected to the first protective part and the second protective part, and protects the outer peripheral surface.

A system including an inverter to convert direct current (DC) power from a battery to alternating current (AC) power to drive a motor, wherein the inverter includes: a capacitor assembly, the capacitor assembly including: a planar busbar including a first DC busbar and a second DC busbar; a capacitor on a same side of the first DC busbar and the second DC busbar, the capacitor including a first end cap extending in a direction substantially perpendicular to a longitudinal direction of the planar busbar; and a first connection plate shaped to transfer heat from the first end cap of the capacitor and the first connection plate to a first external surface.

A multilayer ceramic capacitor may include a main body, comprising a first surface and a second surface which are opposite to each other in a first direction, a third surface and a fourth surface which are opposite to each other in a second direction which intersects with the first direction, and a fifth surface and a sixth surface which are opposite to each other in a third direction which intersects with both the first direction and the second direction, and the body includes a plurality of dielectric layers and a plurality of internal electrodes stacked in the third direction; and an outer electrode disposed on an outer side of the body, where the body may include an edge region in which the inner electrodes are not disposed, the edge region being disposed on an outer periphery of the plurality of inner electrodes facing the third surface and an outer periphery of the plurality of inner electrodes facing the fourth surface, a ratio of a width of the edge region to a width of the body measured in the second direction is greater than 8.5% and less than or equal to 9.5%, and wherein an average porosity of the edge region is greater than 0% and less than 1.1%.

In one embodiment, an electronic device is disclosed, comprising a substrate, a core having an upper plane and a lower plane, the core including a cavity extending through the core; an electronic component at least partially disposed within the cavity, the electronic component having an upper plane with one or more electronic component terminals; a first cured resin layer, the first cured resin layer in which the upper plane of the electronic component is at least partially embedded in the first cured resin layer in at least the upper portion of the cavity; and an upper metallization structure disposed on the upper plane of the core, the upper metallization structure configured to provide one or more conductive paths from one or more electronic component terminals to one or more upper metal terminals of the upper metallization structure.