371 results about "Potting" patented technology

The invention relates to the technical field of pouring sealant coatings, in particular to a two-component polyurethane circuit board pouring sealant and a preparation method thereof. Comprising a component A and a component B. The component A comprises liquefied MDI, a phosphate flame retardant and a plasticizer. The component B comprises a hydroxyl acrylate oligomer, bio-based polyol, a defoaming agent and a catalyst, the viscosity of the hydroxyl acrylate oligomer at the temperature of 25 DEG C is 8000-15000 mPa.s, and the hydroxyl value of the hydroxyl acrylate oligomer is 100-150 mgKOH / g. The viscosity of the hydroxyl acrylate oligomer at 25 DEG C is limited to be 8000-12000 mPa.s, and the hydroxyl value is 100-140 mgKOH / g, so that the mechanical properties and aging resistance of the pouring sealant can be improved at the same time.

The invention discloses a high-voltage multi-core ceramic capacitor and a preparation method thereof, and the multi-core ceramic capacitor comprises a pedestal, two connection frames which are oppositely disposed on the pedestal, and a plurality of capacitor modules which are sequentially arranged in the length direction of the connection frames. The capacitor module comprises a plurality of capacitors which are sequentially connected in series between two connecting frames and a plurality of series connecting sheets which are respectively arranged between two adjacent capacitors, and the connecting frames are connected with the opposite capacitors; the capacitor comprises a capacitor body, two parallel frames oppositely arranged on the two sides of the capacitor body, a potting shell used for installing the capacitor body and a potting layer arranged in the potting shell and wrapping the capacitor body. The specific structure of the capacitor module is limited to be matched with the connecting frame, so that parallel capacity increasing and series voltage dividing of the multiple capacitor chips are achieved, other capacitor modules are not affected after a certain capacitor module fails, and the market requirement of higher-voltage products is met.

The invention discloses a manufacturing method of an encapsulation type driver transformer with high heat dissipation efficiency, and belongs to the technical field of power electronic equipment manufacturing. The invention aims to solve the technical problems of low heat dissipation efficiency and insufficient long-term reliability caused by limited heat-conducting property of a potting material, simple surface heat dissipation structure and difficulty in coordination of internal thermal stress of the existing driver transformer. The method comprises the following steps: constructing a three-dimensional digital model of a reinforced heat dissipation structure with a boss array and a groove array, and preparing a corresponding forming mold; a magnetic core and a winding are used as inserts to be positioned in a mold cavity, insulating colloids with different mechanical and heat conduction characteristics are poured in a vacuum environment in batches, internal gaps are fully filled with flexible colloids and stress is buffered through a segmented curing process, meanwhile, high-heat-conduction rigid colloids form an external main body and a heat dissipation structure, and an integrated potting body is formed. The method is used for manufacturing the driver transformer suitable for scenes with high power density and high heat dissipation requirements, and the heat dissipation capability and the operation reliability of the driver transformer can be remarkably improved.

The invention provides a spherical complex vibration type vector hydrophone based on an MEMS accelerometer, and relates to the technical field of underwater acoustic signal detection, and the spherical complex vibration type vector hydrophone comprises an MEMS accelerometer, a built-in core, a piezoelectric ceramic spherical shell, a sound transmission sealing shell, and a suspension ring. The MEMS accelerometer is orthogonally arranged in the built-in core; the built-in core is nested in the lower half ball of the piezoelectric ceramic spherical shell; the upper hemisphere of the perforated piezoelectric ceramic spherical shell is adhered to the upper edge of the built-in core; the sound transmission sealing shell coats the piezoelectric ceramic spherical shell through an encapsulation process; the suspension ring is bonded with the sound transmission sealing shell, and the hydrophone is suspended on the fixing support for use. The composite hydrophone can detect sound pressure signals and vibration velocity signals at the same position underwater, solves the problem of omnidirectional detection of the composite hydrophone on the sound pressure signals, and has the advantages of small size, simple structure, high reliability, wide application range and the like.

The invention relates to the field of electric appliance potting materials, in particular to a low-carbon two-component polyurethane potting adhesive for a circuit board and a preparation method of the low-carbon two-component polyurethane potting adhesive. The preparation raw materials of the low-carbon double-component polyurethane pouring sealant for the circuit board comprise a component A and a component B, wherein the component A is prepared from the following raw materials: isocyanate, a flame retardant and a plasticizer; and the component B is prepared from the following raw materials: PCE, castor oil, a hydrophobic acrylate oligomer, a catalyst and a defoaming agent. The PCE and the castor oil are used as core raw materials, and the low-carbon and environment-friendly characteristics are achieved; by introducing the hydrophobic acrylate oligomer and combining the structural advantages of PCE, the water absorption rate of the product is remarkably reduced, meanwhile, the product has balanced mechanical properties and excellent aging resistance, the pouring sealant can effectively protect a circuit board from being affected by environments such as moisture and high temperature, and the actual use effect is excellent.

The invention discloses a self-adaptive vacuum filling and sealing device and method, and mainly solves the problems that the existing vacuum filling and sealing technology is difficult to realize accurate adaptation and optimal adjustment of multiple types of filling and sealing adhesives, and the filling and sealing consistency and the product reliability under complex working conditions are influenced. Comprising a vacuum box, a vacuum pump, a vacuum pressure digital display meter, a control panel and an air inlet valve, wherein a liquid flow meter is arranged at a glue injection and pouring outlet in the vacuum box, and instantaneous flow data of pouring sealant is detected and fed back in real time; a refrigerating device is arranged on the side wall to inhibit local temperature rise of the two-component pouring sealant caused by heat release of a chemical reaction; a heating device is arranged at the upper part to compensate the adverse effect of environment temperature reduction on the fluidity of the pouring sealant; and meanwhile, a fusion algorithm for self-adaptive adjustment of multiple types of pouring sealants is deployed in the microprocessor, so that self-adaptive temperature balance and regulation in the pouring process are realized. According to the invention, the automation degree and the response sensitivity of the potting process can be obviously improved, and the stability and the reliability of the potting process are improved.

The invention discloses a light-cured hyperbranched organic silicon electronic packaging adhesive composition based on sulfydryl-alkene click reaction and a preparation method thereof, and belongs to the technical field of electronic packaging materials. The hyperbranched organic silicon electronic packaging adhesive composition disclosed by the invention is prepared from the following components in parts by weight: 10 to 50 parts of vinyl hyperbranched polysiloxane, 10 to 50 parts of mercaptopropyl hyperbranched polysiloxane, 1 to 20 parts of diluent, 0.5 to 3 parts of photoinitiator and 0 to 50 parts of functional filler. The hyperbranched organic silicon electronic packaging adhesive disclosed by the invention has excellent mechanical property, good adhesive property, excellent double 85 aging resistance and good flowability, and has a wide application prospect in the fields of electronics, electricity, new energy industry and the like.

The invention discloses a two-component polyurethane pouring sealant for capacitor potting and a preparation method thereof, and belongs to the field of pouring sealants. The pouring sealant comprises a component A and a component B in a mass ratio of 100: 30, wherein the component A is a main agent and comprises modified castor oil, a diluent, polyether polyol, a defoaming aid, a heat-conducting filler, a special waterproof material, a common filler and a molecular sieve filler; the component B is a curing agent and comprises modified isocyanate, bifunctional polyether polyol and a stabilizer. The polyurethane pouring sealant has the advantages of high heat conductivity, excellent water resistance, damp-heat aging resistance, long room-temperature operable time and the like, and is suitable for multiple industries such as electronic and electric appliances, insulating materials, adhesives, composite materials and the like.

The invention discloses a two-component flexible epoxy potting composition as well as a preparation method and application thereof. According to the flexible encapsulating material obtained by the invention, the Shore A range is 60-80, the Tg range is-15 to + 10 DEG C, the cold and hot impact (-40 / 125 DEG C) is more than or equal to 200 times, and the operable time at 25 DEG C is more than or equal to 90-150 minutes. The method is suitable for integral potting and stress buffering of electronic and power supply modules such as ABS, PA, aluminum alloy, PCB and the like.

The invention discloses a surface-mounted tubular fuse structure and a preparation method thereof, and belongs to the technical field of overcurrent protection electronic components. The fuse structure comprises an insulating tube, a fuse body, an arc extinguishing body, an inner copper cap, an outer copper cap and a sealing colloid. The fuse body is arranged in the insulating tube body, the arc extinguishing body is filled in the insulating tube body and wraps the fuse body, the inner copper cap and the outer copper cap form a combined electrode cap, the sealing colloid is filled between the end part of the insulating tube body and a circular inner cap of the combined electrode cap, and the circular inner copper cap and the end part of the insulating tube body realize preliminary airtight packaging through welding or interference fit. And the sealing colloid is combined for secondary reinforced sealing, and the square outer copper cap provides a flat surface-mounted welding surface. The preparation method comprises the process steps of inner copper cap pressing, threading and spot welding, arc extinguishing material potting, outer copper cap assembling, sealant potting and the like. The problems that a traditional tubular fuse is large in installation space, has reliability hidden danger and is limited in high breaking capacity are solved. The fuse is widely applied to the technical field of tubular fuses.

Described herein are examples of pressure sensors, and methods to assemble pressure sensors. In some examples, a pressure sensor uses gauges attached to a sensor tube of a sensor body to detect a pressure of fluid flowing within the sensor tube. In some examples, the sensor tube helps to isolate the gauges from some of the stresses that the rest of the sensor body may experience due to intense fluid pressures. In some examples, the sensor body has a one piece design that increases durability. In some examples, a sensor adapter may be attached to the sensor body and / or hardened by one or more techniques to reduce the chance of fluid leakage and / or further increase durability. The gauges, the sensor body, and / or the sensor adapter can be enclosed within a sensor cover, and encased within a potting material, to protect and / or insulate the components.

The invention provides a modified heat-conducting filler, a pouring sealant and a photovoltaic module, the modified heat-conducting filler comprises a modified heat-conducting filler base material and a surface modifier coating at least part of the surface of the modified heat-conducting filler base material, and the modified heat-conducting filler base material is aluminum nitride, boron nitride and silicon carbide; the particle size of the aluminum nitride is 150-200 nm, the particle size of the boron nitride is 50-80 nm, the particle size of the silicon carbide is 80-150 nm, and the mass ratio of the aluminum nitride to the boron nitride to the silicon carbide is (35-45): (25-35): (10-20). The modified heat-conducting filler provided by the invention can synergistically improve the heat conductivity, weather resistance stability, high light transmittance and curing efficiency of the pouring sealant by virtue of the high-heat-conductivity modified heat-conducting filler base material, the gradient particle size range, the mass ratio and the surface modifier.

The invention discloses a waterproof method for a water meter. The waterproof method comprises the following steps: optimizing a structural layout; according to the water meter installation environment, all key components are arranged on one face of a PCB in a centralized mode, the face is defined as a face A, and the other face of the PCB is defined as a face B; performing thick potting protection on the A surface; constructing a metal foil layer on the surface B; and carrying out thin potting sealing on the surface B. The metal foil is additionally arranged, an ideal water vapor barrier can be provided, the problem of water vapor permeation of the water meter in a long-term soaking environment is solved, the potting layer and the metal foil layer are compounded to form a gas-proof and water-proof barrier difficult to permeate, and the protection efficiency of the gas-proof and water-proof barrier is far better than that of a technical scheme purely depending on the potting layer. The scheme of large-area metal foil covering and a small amount of potting materials has the optimal comprehensive performance in the water meter application environment, and the protection effect, cost control and process maturity are optimally balanced.

The present invention relates to a power module unit (10) for an electronic unit, comprising an electrically conductive cladding (12) with at least one conductor element (14), wherein the conductor element (14) is at least partially surrounded by a potting material (16), wherein the conductor element (14) and the potting material (16) are designed to form a substantially fluid-tight surface (18), wherein the fluid-tight surface (18) is substantially free of an insulating layer.

The invention relates to an automation field device comprising: - a housing (2) which forms an interior (2.8) having, with respect to a longitudinal axis of the housing (2), at least a first rotationally symmetrical inner region (2.21) with a first internal diameter (D1) and a second rotationally symmetrical inner region (2.22) with a second internal diameter (D2); - an electronic unit (7) which is arranged in the interior and has at least a printed circuit board (7.1), an electronic component (7.3) to which a specified maximum potting height (7.31) is assigned, up to which the component can be potted with a potting compound (13) without impairing the functionality of the electronic component, and a pin projection (7.2), wherein the first and second diameters (D1, D2) of the rotationally symmetrical regions (2.21, 2.22) are coordinated with one another in such a way that, even in the case of a volume tolerance of the total volume of the potting compound in the interior, the printed circuit board (7.1) and the pin projection (7.2) are completely potted and the electronic component (7.3) is not potted beyond the specified maximum potting height (7.31).

The invention provides an integral battery assembly, comprising: a plurality of cell arrays wherein a single cell array comprises a plurality of cells arranged in a common orientation; the top surfaces of each cell are substantially aligned, and wherein the array of cells forms a substantially horizontal plane along the top surfaces of the cells; the cooling liquid channel is formed on the battery cell array; a potting material formed from a resin compound, the potting material surrounding the cell array and providing structural support for the cell array; the bottom surface is used for supporting and protecting the plurality of battery cell arrays; the top surface covers the plurality of battery cell arrays; wherein the material thickness of the top surface is preferably greater than 0.3 mm; the cell array may include one or more cells. Through integration of the encapsulating material, the energy density of the battery can be improved, and the strength of a battery system can be enhanced.

A battery pack includes a box, a cold plate and a cell assembly. The box is provided with an accommodation space. The cell assembly is located in the accommodation space and includes multiple cells. The multiple cells are arranged in a horizontal plane and are disposed at equal spacing. A potting adhesive is filled in the cell assembly. The cold plate fits an upper side and / or a lower side of the cell assembly and the potting adhesive.

The invention relates to a method for potting a drive unit (12), at least having a dynamo-electric machine (11) with an end shield (10) and a converter (14) which has at least one power electronics element (13), wherein the converter (14) is integrated or at least partially integrated into the end shield (10), the method comprising the following steps: mounting the end shield (10) in the axial direction; rotating the end shield (10); applying a potting material (2) to the end shield (10); and curing the potting material (2), wherein the end shield is rotated during curing until the potting material gels.

The invention belongs to the technical field of semiconductor device preparation, and discloses a preparation method of a high-temperature high-power-density SiC power semiconductor device, which is low in equipment requirement: because the sintering time is short, the sintering times are few, and the sintering is plane sintering, a common hot press and a heating table can be used for sintering preparation in the air, and the manufacturing cost is low. And expensive nitrogen is not needed to burn a pressed silver sintering furnace. The process is simple and rapid, and the preparation of the double-sided cooling 250-DEG C high-temperature SiC power semiconductor device comprising the heat dissipation bottom plate and the insulating potting can be completed only through twice sintering, twice welding, once bonding and once potting. According to the low-cost scheme applied at the high temperature of 250 DEG C, expensive materials such as nano-silver are only used at part of key positions, and high-temperature welding flux instead of the nano-silver is used at a heat dissipation bottom plate-substrate welding interface where heat flow is fully diffused by utilizing the heat diffusion characteristic; and the problems of high difficulty and high material cost of a large-area silver sintering process are avoided on the premise that the heat dissipation performance is not obviously reduced.

The utility model relates to the technical field of lamp controllers, in particular to a high-heat-dissipation integrated solar controller, which is characterized in that a driving circuit board and a control circuit board are respectively arranged in a shell; the driving circuit board is fixed on the heat dissipation bottom plate; the control circuit board is fixed to the side, away from the heat dissipation bottom plate, of the shell. A wire outlet hole is formed in the side wall of the shell; a glue pouring frame communicated with the wire outlet hole is arranged in the shell; the end face, away from the wire outlet hole, of the glue pouring frame abuts against the drive circuit board. The glue pouring frame is sleeved outside a wire outlet of the driving circuit board; the base material of the driving circuit board is an aluminum substrate. The LED lamp has the advantages that the use amount of glue is reduced to the maximum extent, the driving circuit board mainly generating heat is directly attached to the heat dissipation bottom plate for heat dissipation, and the heat dissipation efficiency is improved.

This invention relates to the field of electronic component packaging and heat dissipation technology, specifically disclosing a partition-type PCB potting heat dissipation system and method for high-end chip packaging. The system includes a partition-type potting cavity, a multi-zone independent temperature control unit, a colloid flow monitoring unit, and a closed-loop feedback control unit. This invention constructs a closed-loop intelligent control system that deeply integrates real-time monitoring, model prediction, and actuator regulation. The system not only relies on a preset colloid rheology model but also utilizes real-time data such as ultrasonic viscosity monitoring and laser thickness measurement verification, and employs an online parameter identification algorithm to continuously correct the model. This enables the system to adapt to performance fluctuations in different batches of materials and dynamic changes in the process, transforming the potting process from an open-loop, passive physical filling into a closed-loop, predictable, and optimizable intelligent manufacturing process, thereby stably producing high-end chip heat dissipation packages with high consistency and high reliability.

A battery module includes a housing having a sidewall structure, an upper shear plate, and a lower shear plate. A vent pan assembly is disposed within the housing and includes a cell pan and a vent pan, which together form a plurality of vent channels therebetween. The cell pan includes a bottom plate having a plurality of vent openings communicating with one of the plurality of vent channels. The vent pan assembly includes a plurality of vent openings isolated from the plurality of vent channels. A plurality of battery cells each have one end with a vent opening aligned with one of the vent openings in the bottom plate of the cell pan. An encapsulating foam is distributed within the housing and between the batteries.

The utility model relates to an anti-seepage structure of a PCCP (prestressed concrete cylinder pipe) interface, which comprises a socket and a bellmouth which are respectively arranged on two sections of PCCPs, and an insertion gap, the insertion gap comprises a first longitudinal gap, a transverse gap and a second longitudinal gap, and a first elastic potting material, an elastic compression rod and a sealant are sequentially arranged in the second longitudinal gap from inside to outside. According to the utility model, a comprehensive anti-seepage treatment structure combining the high-molecular elastic grouting material, the elastic compression rod and the flexible waterproof layer is adopted, so that a multi-layer waterproof system is constructed, the phenomenon of water leakage at the joint part of the PCCP can be effectively avoided, the durability of the anti-seepage structure is improved, and the repair frequency of the anti-seepage structure is reduced.

The present invention relates to the field of electric machines and discloses a structure for cooling a lead frame and winding coils of an electric generator or motor and an electric generator or motor. The stator core comprises a plurality of circumferentially distributed stator teeth. The lead frame electrically connects a first inverter to a first set of coil windings mounted on the stator core of the electric motor or generator. The lead frame comprises a printed circuit board having a plurality of layers of circuit board, wherein each layer of circuit board comprises an insulating substrate and an electrically conductive layer disposed on the insulating substrate. The lead frame is positioned between a cooling channel and the stator teeth. A potting material is positioned between the cooling channel and the lead frame, wherein the potting material acts as a heat transfer between the cooling channel and the lead frame. The cooling channel is formed in the stator housing. The present invention increases the cooling of the lead frame mounted on the stator. The arrangement of the lead frame provides a large current between the inverter and the coil windings of the electric motor or generator, thereby producing a large torque and power value.

The present invention provides an integrated potted power module, electrical equipment, and vehicle, comprising a liquid-cooled bridge tube, multiple power tubes, and a potting shell. A liquid-cooled flow channel is provided in the liquid-cooled bridge tube along its length. The liquid-cooled bridge tube is provided with liquid-cooling interfaces at both ends of the liquid-cooling flow channel in the length direction. The packages of the multiple power tubes are thermally connected to the outer wall of the liquid-cooled bridge tube by means of a potting shell. The potting shell is filled with potting glue, which is wrapped around the packages of the multiple power tubes. The liquid-cooling interfaces and the pins of the multiple power tubes are all located outside the potting shell. Through the thermal conduction connection between the power tubes and the liquid-cooled bridge tube, waste heat from the power tubes can be efficiently conducted to the liquid-cooled bridge tube for heat dissipation. The potting shell is surrounded by the liquid-cooled bridge tube and the multiple power tubes, and the potting glue therein is used to wrap around the packages of the multiple power tubes, thereby further improving heat conduction efficiency and protection.

The utility model relates to material mixing technical field, concretely to a kind of mixing device for electronic potting adhesive preparation, it include: mixed material bucket, mixing material bucket is provided with stirring frame, fixed bearing is provided in the mixed material bucket, fixed bearing, fixed bearing inner ring surface is provided with scraping ring, the stirring frame is clamped in scraping ring;Cover, cover surface is provided with driving motor and vacuum pump;Beneficial effect is: starting driving motor can be mixed by stirring frame to the potting in the mixed material bucket, and vacuum pump is pumped to the mixed material bucket in mixing process, after mixing is completed, because the stirring frame is clamped in the scraping ring of fixed bearing inner ring surface as a whole, the adhering potting of stirring frame outer wall is scraped by scraping ring, prevent stirring frame adhering more potting after stirring is completed, so as to avoid the problem that the surface has more glue material when stirring frame is taken out causes material waste.

The present invention discloses a radial magnetic levitation bearing potting base and a potting method, wherein the radial magnetic levitation bearing potting base comprises a magnetic bearing base, a central through hole is opened in the middle of the magnetic bearing base, a positioning plate is arranged in the central through hole of the magnetic bearing base and near its lower end, a mounting position is arranged above the positioning plate in the magnetic bearing base, and an airbag is arranged in the middle of the magnetic bearing base, which is inflated and expands freely; the overall structure of the invention is simple, the manufacturing process is concise, and it can improve the assembly efficiency and achieve a good fixing effect, and can make the coil, silicon steel sheet and base become a whole to form standardized production; and it can also improve the durability of the potted magnetic bearing in corrosive and acidic environments.

The present invention belongs to the technical field of magnetic levitation motors, and in particular relates to a position sensor for a high-speed magnetic levitation motor, comprising a base, a mounting hole for a rotor to pass through, an inductance component and a circuit board arranged in the mounting hole, an insulation component arranged between the inductance component and the circuit board, the inductance component, the insulation component and the circuit board being fixedly connected to the base, a potting glue layer being potted at positions around the inductance component, the insulation component and the circuit board in the mounting hole, and a circular ring-shaped gap being provided between the potting glue layer and the rotor. The present invention also discloses a potting method for a position sensor for a high-speed magnetic levitation motor, the present invention having a reasonable structure, a simple and efficient potting process, and a reliable potting effect.

The present disclosure relates to a rigid-core laminate that includes a core section formed of a first material with a first modulus of at least 50 GPa, a number of sacrificial sockets embedded in the core section through a potting material, a number of top dielectric layers formed over a top surface of the core section and covering a top surface of each sacrificial socket, a number of bottom dielectric layers formed underneath a bottom surface of the core section and covering a bottom surface of each sacrificial socket, and a number of tooling-holes. Herein, each sacrificial socket is formed of a second material with a second modulus that is smaller than the first modulus. Each tooling-hole extends vertically through the top dielectric layers, a corresponding sacrificial socket, and the bottom dielectric layers. No portion of the core section is exposed in any one of the tooling-holes.

The invention relates to an electrical energy storage device, in particular in the form of a rechargeable battery pack, comprising at least one electrical energy storage cell, in particular a plurality of electrical energy storage cells, in particular in the form of rechargeable battery cells, wherein: the electrical energy storage device comprises a housing; the at least one electrical energy storage cell is accommodated in an accommodating space defined by the housing; the housing comprises at least one first housing part and at least one second housing part; the electrical energy storage device comprises an open-loop and / or closed-loop control device for open-loop and / or closed-loop control of the charging and / or discharging of the at least one electrical energy storage cell; the open-loop and / or closed-loop control device is accommodated in the first housing part and is at least partially, in particular entirely, potted therein with a curing potting compound which forms a potting body; a housing sealing element is arranged or formed between the first housing part and the second housing part in order to seal off the accommodating space; and the housing sealing element is formed from the potting compound. The invention also relates to an improved electrical appliance system and to an improved method for producing an electrical energy storage device.