605 results about "Potting" patented technology

The invention relates to the technical field of pouring sealant coatings, in particular to a two-component polyurethane circuit board pouring sealant and a preparation method thereof. Comprising a component A and a component B. The component A comprises liquefied MDI, a phosphate flame retardant and a plasticizer. The component B comprises a hydroxyl acrylate oligomer, bio-based polyol, a defoaming agent and a catalyst, the viscosity of the hydroxyl acrylate oligomer at the temperature of 25 DEG C is 8000-15000 mPa.s, and the hydroxyl value of the hydroxyl acrylate oligomer is 100-150 mgKOH / g. The viscosity of the hydroxyl acrylate oligomer at 25 DEG C is limited to be 8000-12000 mPa.s, and the hydroxyl value is 100-140 mgKOH / g, so that the mechanical properties and aging resistance of the pouring sealant can be improved at the same time.

The invention discloses a high-voltage multi-core ceramic capacitor and a preparation method thereof, and the multi-core ceramic capacitor comprises a pedestal, two connection frames which are oppositely disposed on the pedestal, and a plurality of capacitor modules which are sequentially arranged in the length direction of the connection frames. The capacitor module comprises a plurality of capacitors which are sequentially connected in series between two connecting frames and a plurality of series connecting sheets which are respectively arranged between two adjacent capacitors, and the connecting frames are connected with the opposite capacitors; the capacitor comprises a capacitor body, two parallel frames oppositely arranged on the two sides of the capacitor body, a potting shell used for installing the capacitor body and a potting layer arranged in the potting shell and wrapping the capacitor body. The specific structure of the capacitor module is limited to be matched with the connecting frame, so that parallel capacity increasing and series voltage dividing of the multiple capacitor chips are achieved, other capacitor modules are not affected after a certain capacitor module fails, and the market requirement of higher-voltage products is met.

A smart ring includes a curved housing having a U-shape interior storing components including: a curved battery approximately conforming to the curved housing, a semi-flexible PCB approximately conforming to the curved housing and having mounted theron: a motion sensor for generating motion data from physical perturbations of the smart ring, a memory for storing executable instructions, a transceiver for sending data to a client computer, a temperature sensor, and a processor for receiving motion data and performing executable instructions in response thereto, and a potting material disposed in the interior, forming an interior wall of the smart ring, wherein the potting material encapsulates the components and is substantially transparent to visible light, infrared light, and / or ultraviolet light.

The invention relates to novel casting resin compositions and their use in heat-curing electrical potting, which is used, for example, in the production of electrical components such as transformers, insulators, capacitors, coils and assemblies. The invention also relates to shaped bodies obtainable from the casting resins, and to the use of such shaped bodies. The invention proposes for the first time a casting resin for heat-curing electrical encapsulation, in which plasticizers and toughening agents can be omitted. This is achieved by mixing an epoxy resin base with a cycloaliphatic epoxy resin and adding highly dispersed nanoparticles.

The invention discloses polytetrahydrofuran ether amine polyurea with high elongation at break as well as a preparation method and application thereof, and belongs to the technical field of macromolecules. The raw materials comprise a component (A) and a component (B), wherein the component (A) is diisocyanate with a symmetrical linear molecular structure; the component (B) is polytetrahydrofuran ether amine with a symmetrical linear structure, and the molar ratio of the NCO functional group of the diisocyanate to the NH2 functional group of the polytetrahydrofuran ether amine is 1.07-1.00; the molecular structure of the polytetrahydrofuran ether amine polyurea with high elongation at break is a microphase separation structure composed of a hard segment and a soft segment, and the weight percentage of the hard segment relative to the soft segment is greater than 20%. The elongation at break of the polytetrahydrofuran ether amine polyurea product with high elongation at break is 1500% or above, and the polytetrahydrofuran ether amine polyurea product can meet the requirements of expansion joints of ballastless tracks of high-speed railways, expansion joints of highways and airport runways, electronic element potting and the like on the elongation at break of high-elasticity materials.

The invention discloses a manufacturing method of an encapsulation type driver transformer with high heat dissipation efficiency, and belongs to the technical field of power electronic equipment manufacturing. The invention aims to solve the technical problems of low heat dissipation efficiency and insufficient long-term reliability caused by limited heat-conducting property of a potting material, simple surface heat dissipation structure and difficulty in coordination of internal thermal stress of the existing driver transformer. The method comprises the following steps: constructing a three-dimensional digital model of a reinforced heat dissipation structure with a boss array and a groove array, and preparing a corresponding forming mold; a magnetic core and a winding are used as inserts to be positioned in a mold cavity, insulating colloids with different mechanical and heat conduction characteristics are poured in a vacuum environment in batches, internal gaps are fully filled with flexible colloids and stress is buffered through a segmented curing process, meanwhile, high-heat-conduction rigid colloids form an external main body and a heat dissipation structure, and an integrated potting body is formed. The method is used for manufacturing the driver transformer suitable for scenes with high power density and high heat dissipation requirements, and the heat dissipation capability and the operation reliability of the driver transformer can be remarkably improved.

The invention provides a spherical complex vibration type vector hydrophone based on an MEMS accelerometer, and relates to the technical field of underwater acoustic signal detection, and the spherical complex vibration type vector hydrophone comprises an MEMS accelerometer, a built-in core, a piezoelectric ceramic spherical shell, a sound transmission sealing shell, and a suspension ring. The MEMS accelerometer is orthogonally arranged in the built-in core; the built-in core is nested in the lower half ball of the piezoelectric ceramic spherical shell; the upper hemisphere of the perforated piezoelectric ceramic spherical shell is adhered to the upper edge of the built-in core; the sound transmission sealing shell coats the piezoelectric ceramic spherical shell through an encapsulation process; the suspension ring is bonded with the sound transmission sealing shell, and the hydrophone is suspended on the fixing support for use. The composite hydrophone can detect sound pressure signals and vibration velocity signals at the same position underwater, solves the problem of omnidirectional detection of the composite hydrophone on the sound pressure signals, and has the advantages of small size, simple structure, high reliability, wide application range and the like.

An axial flux motor water pump comprising a housing, a cover attached to the housing, a stator mounted within the housing, the stator comprising a plurality of stator poles mounted in a ring, each stator pole comprising an electric wire winding, a rotor journaled to the housing in cooperating relation to the stator on a single bearing, an impeller fixed to an end of the rotor, a plurality of magnets mounted to an end of the rotor in cooperative relation to the stator poles, a seal between the rotor and housing whereby the stator and magnets are in a dry zone, the stator enrobed in thermal potting within the housing; and power electronics contained in the cover. The rotor portion of the rotor may be manufactured in a sintering process.

The invention relates to a pouring sealant pouring device and method applied to PCBA electronic module sealing, a preheating bin is used for preheating pouring sealant and a to-be-poured PCBA electronic module, so that the flowability of the pouring sealant after pouring is improved, it is ensured that the pouring sealant can completely wrap all electronic elements of the PCBA electronic module, and meanwhile due to the good flowability, the pouring sealant can be prevented from falling off due to the good flowability. The pouring sealant can effectively discharge gas generated in the pouring process, in the normal-temperature environment between the preheating bin and the drying bin, the PCBA electronic module subjected to pouring is slowly cooled, meanwhile, the pouring sealant continues to discharge gas and finally enters the drying bin, the pouring sealant is rapidly cured through high temperature, the curing speed of the pouring sealant is shortened, and the production efficiency of the PCBA electronic module is improved. And finally, the technical effects of improving the encapsulation exhaust effect and the encapsulation speed of the PCBA electronic module are achieved. The technical problem that the curing speed and the exhaust effect are difficult to consider in the pouring sealant curing process is effectively solved.

The invention belongs to the technical field of preparation of polyurethane adhesives, and relates to a serinol derivative damp-heat latent curing single-component polyurethane pouring sealant and a preparation method thereof. The problem that the bonding strength is affected due to embrittlement of a cured adhesive layer formed by a common technology is solved. Comprising a serinol derivative damp-heat latent curing agent, a polyurethane prepolymer, a cross-linking agent and a catalyst. The pouring sealant prepared by the invention is free of VOCs emission, safe, environment-friendly and convenient to use, can be continuously cured at room temperature by utilizing moisture in air after being pre-cured at 100 DEG C for 1 hour, is free of bubbles after being cured, is strong in adhesive strength and resistant to damp-heat aging, and can meet the pouring requirements in the fields of electronic component and power battery assembly and the like.

A mechanism for providing ingress protection for an electrical device. A protective element is coupled between an electrical element and a support element supporting the electrical element. Potting material covers exposed areas of the electrical element, support element and protective element. The adhesion between the protective element and the potting material is greater / stronger than between the support element and the potting material.

The utility model discloses a capacitor plastic housing capable of improving potting sealing consistency, comprising a bottom surface and four vertical side surfaces connected with the bottom surface, the inner bottom surface of the plastic housing is provided with a plurality of first ribs, the inner sides of two long side surfaces are provided with a plurality of vertical second ribs, and the inner sides of two short side surfaces are provided with a plurality of vertical third ribs. And the first rib, the second rib and the third rib are not connected with one another. The first rib, the second rib and the third rib are matched to clamp the capacitor core, sufficient space for filling epoxy resin is guaranteed between the capacitor core and the plastic shell, the first rib, the second rib and the third rib are separated, full flowing direction filling of potting materials in the potting process is guaranteed, and bubbles generated due to the fact that epoxy cannot cover dead corners in the process are reduced.

The utility model discloses an intelligent temperature, humidity and pressure sensor, which is characterized by comprising a shell structure, a connector, a protective cover, an analog board, a main board, a probe board, a pressure sensitive element and an upper cover structure, the analog board, the main board and the pressure sensitive element are accommodated in the shell structure, and the probe board extends out of one end of the shell structure, is in contact with the environment and is used for measuring environment temperature and humidity information; the main board is used for data acquisition and communication control, and the analog board is used for power conversion and analog current driving; the hollow part of the upper cover structure accommodates the connector, and the connector is protected on the opposite side through the protective cover; the pressure sensitive element is used for measuring environment pressure information; the pressure sensitive element and the probe plate output digital signals. Three laser welding connecting parts are arranged at the joint of the shell structure, between the upper cover structure and the shell structure and between the connector and the upper cover structure; and the interior of the shell structure is completely isolated from the external environment through a potting method.

The present invention relates to the field of electrical connector technology, and specifically to a nuclear-grade instrument connector assembly and a nuclear-grade instrument cable assembly with a plug. The nuclear-grade instrument cable assembly with a plug includes a cable having a core wire, a cable shielding layer and an outer sheath, a plug is provided at the front end of the cable, the plug includes a plug housing, a plug insulator is positioned and assembled in the plug housing, a plug contact is provided in the plug insulator, the front end of the plug contact is a plug-in end, and the rear end is conductively connected to the core wire, and the rear part of the plug housing is provided with an outer potting sealant wrapped outside the outer sheath of the cable by a potting process between the plug housing and the cable. In the nuclear-grade instrument cable assembly with a plug provided by the present invention, glue is poured between the cable and the plug housing to form an outer potting sealant, and the outer potting sealant can not only improve the sealing effect, but also effectively improve the sealing effect at the connection between the nuclear-grade instrument cable and the plug. Moreover, it can also form a support and positioning for the cable.

The invention relates to the field of electric appliance potting materials, in particular to a low-carbon two-component polyurethane potting adhesive for a circuit board and a preparation method of the low-carbon two-component polyurethane potting adhesive. The preparation raw materials of the low-carbon double-component polyurethane pouring sealant for the circuit board comprise a component A and a component B, wherein the component A is prepared from the following raw materials: isocyanate, a flame retardant and a plasticizer; and the component B is prepared from the following raw materials: PCE, castor oil, a hydrophobic acrylate oligomer, a catalyst and a defoaming agent. The PCE and the castor oil are used as core raw materials, and the low-carbon and environment-friendly characteristics are achieved; by introducing the hydrophobic acrylate oligomer and combining the structural advantages of PCE, the water absorption rate of the product is remarkably reduced, meanwhile, the product has balanced mechanical properties and excellent aging resistance, the pouring sealant can effectively protect a circuit board from being affected by environments such as moisture and high temperature, and the actual use effect is excellent.

The invention relates to a strong wind cooling dry-type transformer winding encapsulation structure which comprises a transformer box body, a transformer three-phase cylinder, an iron core, an iron core upper clamping piece, an iron core lower clamping piece, a lower wind shield and a heat pipe heat dissipation assembly, and the transformer three-phase cylinder is arranged on the iron core in a surrounding mode; the iron core is arranged in the transformer box body; the lower wind shield is fixedly arranged in the transformer box body; the transformer box body is divided into an upper air outlet part and a lower air supply part by the lower wind shield; a plurality of ventilation channels are formed in a high-voltage winding epoxy potting cylinder of the transformer three-phase cylinder in the axial direction. The heat pipe heat dissipation assembly is arranged on the top of the low-voltage winding epoxy potting cylinder and the top of the high-voltage winding epoxy potting cylinder of the transformer three-phase cylinder. The method has the advantages that the heat dissipation efficiency of the winding in each package is improved by increasing the convection heat dissipation area of epoxy resin and air; the air circulation path is reasonably designed, and air is fully utilized to take away heat, so that the temperature rise of the iron core and the winding is inhibited.

The invention discloses a self-adaptive vacuum filling and sealing device and method, and mainly solves the problems that the existing vacuum filling and sealing technology is difficult to realize accurate adaptation and optimal adjustment of multiple types of filling and sealing adhesives, and the filling and sealing consistency and the product reliability under complex working conditions are influenced. Comprising a vacuum box, a vacuum pump, a vacuum pressure digital display meter, a control panel and an air inlet valve, wherein a liquid flow meter is arranged at a glue injection and pouring outlet in the vacuum box, and instantaneous flow data of pouring sealant is detected and fed back in real time; a refrigerating device is arranged on the side wall to inhibit local temperature rise of the two-component pouring sealant caused by heat release of a chemical reaction; a heating device is arranged at the upper part to compensate the adverse effect of environment temperature reduction on the fluidity of the pouring sealant; and meanwhile, a fusion algorithm for self-adaptive adjustment of multiple types of pouring sealants is deployed in the microprocessor, so that self-adaptive temperature balance and regulation in the pouring process are realized. According to the invention, the automation degree and the response sensitivity of the potting process can be obviously improved, and the stability and the reliability of the potting process are improved.

This application is applicable to the field of material technology, and provides a composite phase change material, a preparation method thereof, a potting material, and an electronic device; the composite phase change material has a phase change microcapsule as the inner layer, and carbon nanotubes and silicon dioxide are sequentially coated on the surface layer of the phase change microcapsule, and is obtained by modification with a vinyl silane coupling agent. This application can take into account high thermal conductivity and high enthalpy value, without the need to be used in combination with thermal conductive powders, and improves the flammability defect of conventional organic phase change materials when used alone; in addition, the potting material prepared from this composite phase change material can take into account excellent properties such as high enthalpy value, high thermal conductivity, high fluidity, insulation, and flame retardancy; and this composite phase change material has good compatibility with the silicone matrix, will not cause phase separation, and can prevent sedimentation; its surface contains vinyl groups, which can participate in the silicone addition reaction during curing, and after curing, the phase change material and the silicone matrix form a quasi-3D network structure, and the composite thermal conductive phase change filler is more closely combined with the silicone matrix.

The invention relates to the technical field of electronic heat dissipation, in particular to heat-conducting pouring sealant and electrical equipment, the heat-conducting pouring sealant comprises a heat-conducting framework and heat-conducting glue, the heat-conducting framework is composed of a plurality of heat-conducting fibers, and the heat-conducting glue is filled in the heat-conducting framework. In the heat-conducting pouring sealant, the heat-conducting framework is composed of the plurality of heat-conducting fibers, the plurality of heat-conducting fibers are mutually staggered and contacted to form the heat-conducting channel, and compared with a traditional spherical powder heat-conducting filler, the heat-conducting channel formed by the heat-conducting fibers is larger in space and lower in heat resistance, so that the heat-conducting property of the heat-conducting pouring sealant is more favorably improved; besides, the space of a heat transfer channel formed by the heat-conducting fibers is larger, so that the fluidity of the heat-conducting glue during potting is better, the narrow space is easier to caulk, the hardness of the cured heat-conducting potting glue is lower, the resistance is smaller when the heat-conducting potting glue is detached (taken out of the shell), the heat-conducting potting glue is easier to detach, and the maintenance convenience of the electrical equipment can be improved.

The invention relates to a pouring sealant for a battery pack of a new energy electric vehicle and a preparation method of the pouring sealant, and mainly solves the technical problems that a polyurethane pouring sealant in the prior art is difficult to simultaneously consider UL 94V0 flame retardant property and double 85 (the temperature is 85 DEG C and the relative humidity is 85%) 1000h aging property, and the hardness is not high enough. The pouring sealant for the new energy electric vehicle battery pack is composed of a component A and a component B, and the mass ratio of the component A to the component B is 100: (45-55); the component A is prepared from the following components in parts by weight: 15 to 20 parts of polyether polyol I; 10 to 15 parts of polyester polyol; 3 to 6 parts of polyether polyol II; 10 to 18 parts of a flame retardant; 38-45 parts of an inorganic filler; 0.4 to 1 part of an auxiliary agent; 2-4 parts of silicone oil; 0.3 to 0.9 part of water; the component B is isocyanate; according to the technical scheme, the problem is well solved.

The utility model provides a high-temperature-resistant wireless food probe, which comprises a probe main body, a high-temperature-resistant wireless food probe and a high-temperature-resistant wireless food probe, one end of the handle is connected with the probe main body, and a sealing block is arranged at the joint of the handle and the probe main body; the first pole is embedded in one side of the probe main body, and one side of the first pole is exposed; and the circuit board is arranged in the probe main body. The sealing block is used for blocking the second part to form a closed space, steam or grease can be prevented from entering the probe main body during temperature measurement, a glue filling hole does not need to be reserved in the handle, the handle can be made to be small, the temperature sensing speed of the second temperature sensing element is increased, the glass material is good in high temperature resistance, and the service life of the probe is prolonged. The sealing block has a long service life at a high temperature, has a good infiltration effect between the sealing block and stainless steel during sintering, and has fewer processing steps compared with brazing, so that the sealing block has higher yield and lower manufacturing cost.

The invention discloses a light-cured hyperbranched organic silicon electronic packaging adhesive composition based on sulfydryl-alkene click reaction and a preparation method thereof, and belongs to the technical field of electronic packaging materials. The hyperbranched organic silicon electronic packaging adhesive composition disclosed by the invention is prepared from the following components in parts by weight: 10 to 50 parts of vinyl hyperbranched polysiloxane, 10 to 50 parts of mercaptopropyl hyperbranched polysiloxane, 1 to 20 parts of diluent, 0.5 to 3 parts of photoinitiator and 0 to 50 parts of functional filler. The hyperbranched organic silicon electronic packaging adhesive disclosed by the invention has excellent mechanical property, good adhesive property, excellent double 85 aging resistance and good flowability, and has a wide application prospect in the fields of electronics, electricity, new energy industry and the like.

Tubular member electromagnetic inspection apparatus, systems and methods for inspecting tubulars. An EMI shoe includes a generally arcuate body having a non-working major face, a working major face, a trough configured to hold one or more sensors embedded in a potting material, and at least one through hole for mechanical connection to an EMI apparatus. The generally arcuate body includes at least one non-central through hole in which are positioned respective externally threaded cylindrically-shaped set screws, each of the at least one non-central through holes having a wear-resistant friction member movably secured therein and positioned such that a distal portion of each wear-resistant friction member protrudes away from the major working face an initial distance (d1) and configured to wear down over time to a generally arcuate surface that is a distance d2 from the major working face, where d2<d1, forming a degraded wear-resistant member.

The invention discloses a two-component polyurethane pouring sealant for capacitor potting and a preparation method thereof, and belongs to the field of pouring sealants. The pouring sealant comprises a component A and a component B in a mass ratio of 100: 30, wherein the component A is a main agent and comprises modified castor oil, a diluent, polyether polyol, a defoaming aid, a heat-conducting filler, a special waterproof material, a common filler and a molecular sieve filler; the component B is a curing agent and comprises modified isocyanate, bifunctional polyether polyol and a stabilizer. The polyurethane pouring sealant has the advantages of high heat conductivity, excellent water resistance, damp-heat aging resistance, long room-temperature operable time and the like, and is suitable for multiple industries such as electronic and electric appliances, insulating materials, adhesives, composite materials and the like.

The utility model discloses a multistage filtering structure integrated with current acquisition, which is used for filtering at a high-voltage end of a motor controller and comprises an injection molding shell, a nanocrystalline magnetic ring, a ferrite magnetic core and a filtering PCBA board, the injection molding shell is provided with a magnetic ring potting groove and a ferrite magnetic core potting groove, the injection molding shell is used for plastic coating of a positive / negative electrode copper bar, and the ferrite magnetic core potting groove is provided with a magnetic ring potting groove and a ferrite magnetic core potting groove. A magnetic gathering iron core is arranged on an output terminal of the positive pole copper bar and used for collecting current of a high-voltage input end, the filtering PCBA board is installed on the top of the injection molding shell in an inverted buckling mode, and a first filtering circuit located in front of the ferrite magnetic core and a second filtering circuit located behind the ferrite magnetic core are arranged on the filtering PCBA board. And the filter circuit I and the filter circuit II are respectively connected with the positive / negative copper bar to take electricity. According to the utility model, through the modular design, the product assembly process is simplified. A magnetism gathering iron core is designed at the high-voltage output end, a chip is inserted into a main control board to be used for collecting bus current, and monitoring of the current of the high-voltage input end is achieved.

The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises:a first part comprising:(a) a vinyl organopolysiloxane,(c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm,(d) an alumina and / or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm,(e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm,(f) a catalyst, anda second part comprising:(b) a hydride organopolysiloxane,(c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm,(d) an alumina and / or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm,(e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm. The present invention also provides a thermal potting adhesive containing the thermally conductive silicone potting composition, a use of the thermally conductive silicone potting composition in an electronic component, and an electronic component, which is potted using the thermally conductive silicone potting composition.

An optoelectronic component (1) comprises a housing (2) with a carrier (3) and a frame (4), a potting material (12), and at least one optoelectronic semiconductor chip (7) designed to emit electromagnetic radiation. The frame (4) is arranged on a mounting surface (5) of the carrier (3) and, together with the carrier (3), encloses a cavity (6). The optoelectronic semiconductor chip (7) and the potting material (12) are arranged in the cavity (6), and the optoelectronic semiconductor chip (7) is embedded in the potting material (12). The potting material (12) protrudes from the cavity (6) in a direction perpendicular to the mounting surface (5).

The invention discloses a two-component flexible epoxy potting composition as well as a preparation method and application thereof. According to the flexible encapsulating material obtained by the invention, the Shore A range is 60-80, the Tg range is-15 to + 10 DEG C, the cold and hot impact (-40 / 125 DEG C) is more than or equal to 200 times, and the operable time at 25 DEG C is more than or equal to 90-150 minutes. The method is suitable for integral potting and stress buffering of electronic and power supply modules such as ABS, PA, aluminum alloy, PCB and the like.

The invention provides a potting joint, which belongs to the technical field of power transmission equipment and comprises a pair of pouring buses, the ends of the pair of pouring buses are connected through a connector, joint side plate profiles are arranged on the front side and the rear side of the connector, and joint cover plate profiles are arranged on the upper side and the lower side of the connector. A connector sealing cavity is formed in the connector, a pouring space is defined by the outer side of the connector sealing cavity, the connector side plate sectional material and the connector cover plate sectional material, and an insulating potting material is poured into the pouring space. The problems that an existing pouring bus joint needs to be installed and poured on site, transportation of resin, a catalyst and a curing agent needed by the pouring joint is troublesome, meanwhile, the proportion of pouring materials is difficult to control, disassembly and installation of the joint are inconvenient, and the cost is increased are solved.