210 results about "Potting" patented technology

The invention relates to a high-transparency high-deep-layer-curing-speed double-component condensed organic silicon potting adhesive which comprises a component A and a component B, wherein the component A comprises hydroxyl-terminated polydimethylsiloxane and low-viscosity hydroxy silicon oil; and the component B comprises a crosslinking agent, a chain extender, a coupling agent and a catalyst. Compared with the existing condensed technique, no water or water-containing substance is added into the two components, the low-viscosity hydroxy silicon oil is condensed and dehydrated under the action of the catalyst when the components A and B are mixed, and the water participates into the reaction between the crosslinking agent and hydroxyl-terminated polydimethylsiloxane, thereby finally forming the crosslinked body; and therefore, the potting adhesive provided by the invention avoids transparency decrease due to the addition of the water or water-containing substance, the light transmittance is up to 90% above, and meanwhile, the water molecules which are generated and uniformly released in the A and B reaction process can enable the quick deep layer curing of the whole system. The potting adhesive provided by the invention is applicable to potting electronic components, is especially suitable for integral potting of LED (light-emitting diode) lamp bars, and has higher assembly efficiency.

Method and apparatus for potting an electronic device. The apparatus comprises an enclosure having a first inner volume with the electronic device disposed therein; a fill control element disposed within the first inner volume, wherein a second inner volume of the fill control element is fluidly coupled to the first inner volume; and a sealant disposed within a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, wherein air is trapped within at least a first portion of the second inner volume.

A liquid organopolysiloxane composition is provided. This composition can readily form a cured article having a matted surface without requiring separate step such as mechanical surface roughening, and this composition is well adapted for use as a potting material or a coating material in electric and electronic components such as LED. An article having a matted surface produced by curing such composition is also provided. The liquid organopolysiloxane composition for matting comprises (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition, and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., a specific weight of 0.01 to 0.8, and a particle size of up to 200 μm. The composition has a viscosity at room temperature of 100 to 100,000 mPa·s. The resulting cured article has a surface glossiness of up to 40.

Addition-crosslinking silicone resin compositions containing selected high functionality addition curable organosilicon compounds can be cured at relatively low temperatures and can produce highly transparent, hard polymers which are suitable for many uses, in particular for the potting or embedding of electrical componts such as LEDs.

Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

The invention relates to a bonding and potting technology method for an aerial integrated motor, wherein the method covers a bonding method, preparation of a potting material for an elastic film, a potting die and a potting method. According to the invention, an elastic film is employed as a carrier and a characteristic of shape expansion by squeezing is utilized, so that an end commutator is isolated from an adhesive and a potting material and it can be ensured that there is no superfluity at the surface of the commutator after the bonding and potting processing; meanwhile, an axiality after the potting processing can also be ensured. Besides, the elastic film comprises the following components according to mass percentage: 100% of GN 521 raw material; 100% of a GN 521 vulcanizing agent; and 10% to 50% of a filler. According to the invention, bonding and potting production and processing problems of an aerial integrated motor are solved and a purpose that a circularity of a commutator meets a requirement after the bonding and potting processing of the aerial integrated motor can be achieved; meanwhile, an effect that the surface of the commutator on the winding is free of gel after the bonding and potting processing is realized; and a defect of a circularity deviation of an inserted motor can be overcome.

The invention discloses an internal temperature on-line testing method of a zinc oxide lightning protector with 6-35 KV high-voltage capacitors connected in parallel, which uses a thermistor PTC embedded into the lightning protector to measure the heating condition of a valve plate inside the zinc oxide lightning protector, thereby judging the running condition of the zinc oxide valve plate. The method comprises the improvement on the structure of a sleeve inside the zinc oxide lightning protector and comprises the following steps: making a groove on one side of the sleeve; after installing the valve plate, pouring heat-conducting potting adhesive into the groove, embedding a PTC resistor into the surface of the adhesive, leading the wire of the resistor out from the bottommost part of thelightning protector, and meanwhile, connecting high-voltage capacitors in parallel on the exterior of the sleeve and the zinc oxide valve plate to improve the performance of the zinc oxide lightningprotector; and after the potting adhesive is dried, carrying out die casting. For the leading-out wire of each PTC resistor, a 5V/5V isolation transformer, a rectification circuit and a light emittingdiode constitute a loop; when the PTC resistor senses a temperature change, the resistance value changes, thus, the current flowing through the loop changes, and the light intensity of the light emitting diode changes; the light signal is transmitted to a central processor through an optical cable and restored into an electric signal through a photosensitive tube to complete the photoelectric isolation and collect the heating condition inside the lightning protector.

The invention relates to a structure of a high-thermal-reliability multi-unit power integration module (PIM) and a processing technology thereof. The structure comprises a silicon-based IGBT chip, a silicon carbide Schottky barrier diode chip, a silicon-based diode chip, a copper/graphene nanosheet (Cu/GN) heterogeneous thin film, graphene-based packaging resin, a copper-clad ceramic lining plate, a solder layer, a nano-silver conductive adhesive, a bonding wire, a copper gasket, a plastic packaging shell, an aluminum silicon carbide substrate, heat-conducting silicone grease and a radiator. The Cu/GN heterogeneous thin film is adopted to replace a local bonding wire, local heat of a chopper circuit IGBT chip in a high-power PIM is dissipated through an upper heat conduction path and a lower heat conduction path, and the local hot spot temperature on the chip is reduced; and meanwhile, the graphene is uniformly added into the epoxy resin to serve as a potting material so that the overall thermal resistance of the high-power PIM from a chip to the environment is reduced, and the heat dissipation efficiency is improved.

A method of manufacturing an electronic component assembly is disclosed comprising disposing an electronic component in a housing such that there is at least one void space between the component and the housing, disposing non-conductive microspheres in the void space to substantially fill the void space, and disposing a fluid potting material in the housing and hardening or curing the potting material to pot the component in the housing. An assembly is also disclosed comprising a housing, an electronic component disposed in the housing such that there is at least one space between the component and the housing and the space is substantially filled with non-conductive microspheres, and a material that potting the first electronic component in the housing. The invention enables an electronic component in a housing with a space left between the housing to be potted with reduced formation of bubbles in the hardened potting material.

The invention discloses a miniaturized MEMS capacitive composite resonance type vector hydrophone, and belongs to the technical field of underwater acoustic signal detection. The vector hydrophone comprises an MEMS capacitive accelerometer, a fixed core, a vertical suspension rod, a piezoelectric ceramic ring, an acoustic transmission sealing shell, and a conical spiral spring. The MEMS capacitiveacceleration sensor is orthogonally arranged in the fixed core; the vertical suspension rod penetrates through the whole fixed core; the piezoelectric ceramic ring sleeves the outside of the fixed core; and the acoustic transmission sealing shell covers the piezoelectric ceramic ring through a potting process. The conical spiral spring is connected with the vertical suspension rod, and the hydrophone is hung on a fixing support for use. The size of the hydrophone is reduced, sound pressure signals and vibration velocity signals at the same underwater position can be detected, the accuracy ofsignal detection is improved, and the hydrophone is simple in structure, good in consistency and high in reliability.

The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which potting compound at least partially encloses the substrate. The potting compound can adhere to the housing. Furthermore, the device has a wall, from which the potting compound can detach.

The invention discloses a light-emitting diode (LED) drive power supply which comprises a shell body, a PCBA component arranged in the shell body and a wire which is led out from the shell body to the outside of the shell body. Two ends of the shell body form openings and respectively provided with a first end cover and a second end cover. Potting adhesive is poured into two ends in the shell body. A hollow interlayer without potting adhesive is reserved between the potting adhesive at two ends. The invention further discloses a pouring method of the LED drive power supply. The pouring method of the LED drive power supply includes the following steps. Firstly, a first end of the shell body is sealed, secondly, the potting adhesive is poured for the first time and thirdly, after the potting adhesive poured for the first time is solidified, second pouring is performed and a second end of the shell body is sealed. Fourthly, the shell body is inverted. The potting adhesive is poured into the two ends in the shell body for two times and the hollow interlayer is reserved in the middle of the shell body, production technology is simple, good airtight performance is achieved, potting adhesive consumption is reduced, the whole weight of the drive power supply is reduced, manufacturing cost is reduced and meanwhile, tensile strength of the wire is improved and forced detachment is prevented.

The invention relates to the field of design and manufacturing techniques of LED power sources and particularly discloses an LED power source. The LED power source comprises a power source shell, end covers, a power source assembly and filling glue. The two ends of the power source shell are covered with the end covers respectively. The power source assembly is arranged inside the power source shell, and the power source shell is filled with the filling glue. By the adoption of the technical scheme, the power source shell can be filled with the filling glue with a low expansion coefficient, the combined portion of the power source shell is prevented from being squeezed, and the waterproof performance is maintained; meanwhile, the power source assembly is protected against squeeze damage, the service life is prolonged, the filling glue is equivalent to diluted heat conductive potting adhesive, and the production cost is reduced.

The invention relates to a silicon rubber for room-temperature quick-curing potting and a preparation method thereof, belonging to the technical field of organosilicon sealants. The silicon rubber comprises 71-80 parts of 107 liquid silicon rubber, 25-35 parts of methyl triacetoxime silane, 8-12 parts of ethyl orthosilicate, 4-6 parts of butyl tin dilaurate, 0.3-2 parts of additive KH-550 and 10-15 parts of fumed silica. The silicon rubber can keep elasticity for a long time within a wide temperature range, and has excellent chemical stability and water resistance. The silicon rubber is especially suitable for application occasions with requirements for deep curing, has higher curing speed at room temperature, and is suitable for potting electronic products.

Addition-crosslinkable silicone resin compositions containing a branched organopolysiloxane bearing each of Si—H groups, alkenyl groups, and aryl groups, and also containing blocks of linear organopolysiloxane free of Si—H and alkenyl groups with a chain length of at least three siloxy groups, and further bearing at least one aryl group, serve as excellent potting compositions for electronic devices, particularly LEDs, with high refractive index and optical transmittance, and wide processing latitude.

A mechanism is provided to reduce a distance of a waveguide antenna from transmit and receive circuitry in an integrated circuit device die. This distance reduction is performed by providing vertical access to radio frequency connections on a top surface of the IC device die. A cavity in the encapsulant of the package can be formed to provide access to the connections and plated to perform a shielding function. A continuous connection from the RF pads is used as a vertical interconnect. The region around the vertical interconnect can be filled with encapsulant potting material and back grinded to form a surface of the semiconductor device package. A waveguide antenna feed can be plated or printed on the vertical interconnect on the surface of the package.

The invention discloses a high-protection multifunctional explosion-proof temperature measuring device and a manufacturing method thereof. The high-protection multifunctional explosion-proof temperature measuring device comprises a shell, the top of the shell is in threaded connection with a shell cover, the bottom of the shell is provided with a wire leading-in end, the two sides of the shell are each provided with a cable leading-in end, and the bottom of the wire leading-in end is provided with a temperature measuring connecting structure; a boss is arranged in the shell, an intelligent temperature transmitter is fixedly installed on the top of the boss, and a stud is arranged on the top of the intelligent temperature transmitter. According to the invention, a four-wire system PW RTD platinum high-precision temperature sensing element, high-temperature-resistant silica gel potting, an intelligent temperature transmitter module, a stepped multi-stage sealing structure, a universal connection structure and the like are adopted; and therefore, the device has the advantages of high precision, wide range, instantaneous response, extremely small temperature drift, low failure rate, long service life, high anti-corrosion grade, high shell strength, light weight, simplicity in installation and fixation and capability of being fixed at any angle.

The invention relates to a solenoid and relates to the field of ignition coils, the solenoid comprises a metal sleeve, one end of the metal sleeve is opened to form a mounting opening; a cylinder framework is inserted into the metal sleeve, a coil is wound on the peripheral side of the cylinder framework, a conductive terminal is arranged at one end of the cylinder framework and electrically connected with the coil, a plurality of inserting grooves are formed in the end, close to the conductive terminal, of the cylinder framework, and a plurality of protruding parts matched with the insertinggrooves in an inserted mode are arranged on the inner wall of the metal sleeve. Aiming at the problem that the position of a cylinder framework in a metal sleeve deviates when epoxy resin potting is carried out on an existing solenoid, the solenoid has the effects that the position of the cylinder framework in the metal sleeve is stable, and position deviation is not likely to happen, meanwhile, the coaxiality of the cylinder framework and the metal sleeve can be improved, and the quality of the solenoid is improved.

Phase change heat storage asphalt comprises the following components in parts by weight: 20-70 parts of asphalt and 20-70 parts of a phase change material, the phase change material is graphite adsorption phase change energy storage powder or aerogel adsorption phase change energy storage powder, and the specific heat capacity (J/(g.K)) of the phase change heat storage asphalt is greater than or equal to 2.5; the phase change enthalpy (J/g) is about 30-180; the phase transition temperature (DEG C) is 5-90 DEG C; according to the present invention, the phase change heat storage asphalt is usedas the electronic potting material, the phase change latent heat is released through the phase change material, the phase change heat storage asphalt adopting the formula and the preparation method has excellent heat storage temperature control performance, and the cost is far lower than the cost of a potting adhesive on the market.

An assembly for an electric machine including a core with a plurality of teeth extending radially inward from the core, the plurality of teeth defining a plurality of slots for receiving coils, a plurality of coils, each coil wrapping around a respective tooth, a separator in one of the slots including a first leg joined at an angle to a second leg for separating adjacent coils within the slot, an insert between the first leg and the second leg for at least partially filling a space between the first leg and the second leg, and a potting filling space within the slot between the separator, the plurality of coils, and the insert.

The invention discloses a transformer realizing instantaneous boosting and a production method of the transformer. The transformer comprises a bakelite skeleton, an iron core, a potting shell, a primary coil and a secondary coil, wherein the primary coil and the secondary coil are wound on the bakelite skeleton, the iron core is inserted into a through hole in the middle iron core of the bakeliteskeleton and is perpendicular to the primary coil and the secondary coil which are wound on the bakelite skeleton; the assembled primary coil, secondary coil, bakelite skeleton and iron core are encapsulated in the potting shell; the coil, close to the bakelite skeleton, on the bakelite skeleton is the primary coil, and the secondary coil is wound on the periphery of the primary coil; insulating paper is laid between the primary coil and the secondary coil, between layers of the primary coil, between layers of the secondary coil and on the periphery of the secondary coil; a gap is formed between each of two end boundaries of the primary coil and the secondary coil and the bakelite skeleton, the gaps are filled with electronic thermal conductive silica gel, and the assembled primary coil, secondary coil, bakelite skeleton and iron core are encapsulated in the potting shell by the electronic thermal conductive silica gel.

The invention relates to a low-viscosity organosilicon sealant for LED (light-emitting diode) potting and a preparation method thereof, belonging to the technical field of organosilicon sealants. The organosilicon sealant is prepared from the following raw materials in parts by weight: 180-200 parts of 107 silicon rubber, 20-26 parts of kaolin, 40-42 parts of light calcium carbonate, 18-21 parts of lithopone, 15-18 parts of 201 silicone oil, 5-8 parts of crosslinking agent XR-500, 0.5-5 parts of coupling agent KH-570 and 0.5-2 parts of catalyst. The sealant main body silicon rubber main chain contains a silicon-oxygen structure, and has excellent insulation property, excellent ageing resistance, excellent sealing property and the like. The RTV (room-temperature vulcanizing) sealant has the characteristics of no toxicity, environment friendliness, high/low temperature resistance, weather resistance, radiation resistance, high void filling capacity, medium/pressure resistance, favorable sealability and the like, has excellent electric properties, and has favorable applicability in the aspect of LED potting.