223 results about "Potting" patented technology

The invention discloses a manufacturing method of an encapsulation type driver transformer with high heat dissipation efficiency, and belongs to the technical field of power electronic equipment manufacturing. The invention aims to solve the technical problems of low heat dissipation efficiency and insufficient long-term reliability caused by limited heat-conducting property of a potting material, simple surface heat dissipation structure and difficulty in coordination of internal thermal stress of the existing driver transformer. The method comprises the following steps: constructing a three-dimensional digital model of a reinforced heat dissipation structure with a boss array and a groove array, and preparing a corresponding forming mold; a magnetic core and a winding are used as inserts to be positioned in a mold cavity, insulating colloids with different mechanical and heat conduction characteristics are poured in a vacuum environment in batches, internal gaps are fully filled with flexible colloids and stress is buffered through a segmented curing process, meanwhile, high-heat-conduction rigid colloids form an external main body and a heat dissipation structure, and an integrated potting body is formed. The method is used for manufacturing the driver transformer suitable for scenes with high power density and high heat dissipation requirements, and the heat dissipation capability and the operation reliability of the driver transformer can be remarkably improved.

The invention relates to the field of electric appliance potting materials, in particular to a low-carbon two-component polyurethane potting adhesive for a circuit board and a preparation method of the low-carbon two-component polyurethane potting adhesive. The preparation raw materials of the low-carbon double-component polyurethane pouring sealant for the circuit board comprise a component A and a component B, wherein the component A is prepared from the following raw materials: isocyanate, a flame retardant and a plasticizer; and the component B is prepared from the following raw materials: PCE, castor oil, a hydrophobic acrylate oligomer, a catalyst and a defoaming agent. The PCE and the castor oil are used as core raw materials, and the low-carbon and environment-friendly characteristics are achieved; by introducing the hydrophobic acrylate oligomer and combining the structural advantages of PCE, the water absorption rate of the product is remarkably reduced, meanwhile, the product has balanced mechanical properties and excellent aging resistance, the pouring sealant can effectively protect a circuit board from being affected by environments such as moisture and high temperature, and the actual use effect is excellent.

The invention discloses a self-adaptive vacuum filling and sealing device and method, and mainly solves the problems that the existing vacuum filling and sealing technology is difficult to realize accurate adaptation and optimal adjustment of multiple types of filling and sealing adhesives, and the filling and sealing consistency and the product reliability under complex working conditions are influenced. Comprising a vacuum box, a vacuum pump, a vacuum pressure digital display meter, a control panel and an air inlet valve, wherein a liquid flow meter is arranged at a glue injection and pouring outlet in the vacuum box, and instantaneous flow data of pouring sealant is detected and fed back in real time; a refrigerating device is arranged on the side wall to inhibit local temperature rise of the two-component pouring sealant caused by heat release of a chemical reaction; a heating device is arranged at the upper part to compensate the adverse effect of environment temperature reduction on the fluidity of the pouring sealant; and meanwhile, a fusion algorithm for self-adaptive adjustment of multiple types of pouring sealants is deployed in the microprocessor, so that self-adaptive temperature balance and regulation in the pouring process are realized. According to the invention, the automation degree and the response sensitivity of the potting process can be obviously improved, and the stability and the reliability of the potting process are improved.

The invention discloses a two-component flexible epoxy potting composition as well as a preparation method and application thereof. According to the flexible encapsulating material obtained by the invention, the Shore A range is 60-80, the Tg range is-15 to + 10 DEG C, the cold and hot impact (-40 / 125 DEG C) is more than or equal to 200 times, and the operable time at 25 DEG C is more than or equal to 90-150 minutes. The method is suitable for integral potting and stress buffering of electronic and power supply modules such as ABS, PA, aluminum alloy, PCB and the like.

The invention discloses a surface-mounted tubular fuse structure and a preparation method thereof, and belongs to the technical field of overcurrent protection electronic components. The fuse structure comprises an insulating tube, a fuse body, an arc extinguishing body, an inner copper cap, an outer copper cap and a sealing colloid. The fuse body is arranged in the insulating tube body, the arc extinguishing body is filled in the insulating tube body and wraps the fuse body, the inner copper cap and the outer copper cap form a combined electrode cap, the sealing colloid is filled between the end part of the insulating tube body and a circular inner cap of the combined electrode cap, and the circular inner copper cap and the end part of the insulating tube body realize preliminary airtight packaging through welding or interference fit. And the sealing colloid is combined for secondary reinforced sealing, and the square outer copper cap provides a flat surface-mounted welding surface. The preparation method comprises the process steps of inner copper cap pressing, threading and spot welding, arc extinguishing material potting, outer copper cap assembling, sealant potting and the like. The problems that a traditional tubular fuse is large in installation space, has reliability hidden danger and is limited in high breaking capacity are solved. The fuse is widely applied to the technical field of tubular fuses.

Described herein are examples of pressure sensors, and methods to assemble pressure sensors. In some examples, a pressure sensor uses gauges attached to a sensor tube of a sensor body to detect a pressure of fluid flowing within the sensor tube. In some examples, the sensor tube helps to isolate the gauges from some of the stresses that the rest of the sensor body may experience due to intense fluid pressures. In some examples, the sensor body has a one piece design that increases durability. In some examples, a sensor adapter may be attached to the sensor body and / or hardened by one or more techniques to reduce the chance of fluid leakage and / or further increase durability. The gauges, the sensor body, and / or the sensor adapter can be enclosed within a sensor cover, and encased within a potting material, to protect and / or insulate the components.

The invention provides a modified heat-conducting filler, a pouring sealant and a photovoltaic module, the modified heat-conducting filler comprises a modified heat-conducting filler base material and a surface modifier coating at least part of the surface of the modified heat-conducting filler base material, and the modified heat-conducting filler base material is aluminum nitride, boron nitride and silicon carbide; the particle size of the aluminum nitride is 150-200 nm, the particle size of the boron nitride is 50-80 nm, the particle size of the silicon carbide is 80-150 nm, and the mass ratio of the aluminum nitride to the boron nitride to the silicon carbide is (35-45): (25-35): (10-20). The modified heat-conducting filler provided by the invention can synergistically improve the heat conductivity, weather resistance stability, high light transmittance and curing efficiency of the pouring sealant by virtue of the high-heat-conductivity modified heat-conducting filler base material, the gradient particle size range, the mass ratio and the surface modifier.

The invention discloses a waterproof method for a water meter. The waterproof method comprises the following steps: optimizing a structural layout; according to the water meter installation environment, all key components are arranged on one face of a PCB in a centralized mode, the face is defined as a face A, and the other face of the PCB is defined as a face B; performing thick potting protection on the A surface; constructing a metal foil layer on the surface B; and carrying out thin potting sealing on the surface B. The metal foil is additionally arranged, an ideal water vapor barrier can be provided, the problem of water vapor permeation of the water meter in a long-term soaking environment is solved, the potting layer and the metal foil layer are compounded to form a gas-proof and water-proof barrier difficult to permeate, and the protection efficiency of the gas-proof and water-proof barrier is far better than that of a technical scheme purely depending on the potting layer. The scheme of large-area metal foil covering and a small amount of potting materials has the optimal comprehensive performance in the water meter application environment, and the protection effect, cost control and process maturity are optimally balanced.

The invention relates to an automation field device comprising: - a housing (2) which forms an interior (2.8) having, with respect to a longitudinal axis of the housing (2), at least a first rotationally symmetrical inner region (2.21) with a first internal diameter (D1) and a second rotationally symmetrical inner region (2.22) with a second internal diameter (D2); - an electronic unit (7) which is arranged in the interior and has at least a printed circuit board (7.1), an electronic component (7.3) to which a specified maximum potting height (7.31) is assigned, up to which the component can be potted with a potting compound (13) without impairing the functionality of the electronic component, and a pin projection (7.2), wherein the first and second diameters (D1, D2) of the rotationally symmetrical regions (2.21, 2.22) are coordinated with one another in such a way that, even in the case of a volume tolerance of the total volume of the potting compound in the interior, the printed circuit board (7.1) and the pin projection (7.2) are completely potted and the electronic component (7.3) is not potted beyond the specified maximum potting height (7.31).

A battery pack includes a box, a cold plate and a cell assembly. The box is provided with an accommodation space. The cell assembly is located in the accommodation space and includes multiple cells. The multiple cells are arranged in a horizontal plane and are disposed at equal spacing. A potting adhesive is filled in the cell assembly. The cold plate fits an upper side and / or a lower side of the cell assembly and the potting adhesive.

The invention relates to a method for potting a drive unit (12), at least having a dynamo-electric machine (11) with an end shield (10) and a converter (14) which has at least one power electronics element (13), wherein the converter (14) is integrated or at least partially integrated into the end shield (10), the method comprising the following steps: mounting the end shield (10) in the axial direction; rotating the end shield (10); applying a potting material (2) to the end shield (10); and curing the potting material (2), wherein the end shield is rotated during curing until the potting material gels.

This invention relates to the field of electronic component packaging and heat dissipation technology, specifically disclosing a partition-type PCB potting heat dissipation system and method for high-end chip packaging. The system includes a partition-type potting cavity, a multi-zone independent temperature control unit, a colloid flow monitoring unit, and a closed-loop feedback control unit. This invention constructs a closed-loop intelligent control system that deeply integrates real-time monitoring, model prediction, and actuator regulation. The system not only relies on a preset colloid rheology model but also utilizes real-time data such as ultrasonic viscosity monitoring and laser thickness measurement verification, and employs an online parameter identification algorithm to continuously correct the model. This enables the system to adapt to performance fluctuations in different batches of materials and dynamic changes in the process, transforming the potting process from an open-loop, passive physical filling into a closed-loop, predictable, and optimizable intelligent manufacturing process, thereby stably producing high-end chip heat dissipation packages with high consistency and high reliability.

The present invention relates to the field of electric machines and discloses a structure for cooling a lead frame and winding coils of an electric generator or motor and an electric generator or motor. The stator core comprises a plurality of circumferentially distributed stator teeth. The lead frame electrically connects a first inverter to a first set of coil windings mounted on the stator core of the electric motor or generator. The lead frame comprises a printed circuit board having a plurality of layers of circuit board, wherein each layer of circuit board comprises an insulating substrate and an electrically conductive layer disposed on the insulating substrate. The lead frame is positioned between a cooling channel and the stator teeth. A potting material is positioned between the cooling channel and the lead frame, wherein the potting material acts as a heat transfer between the cooling channel and the lead frame. The cooling channel is formed in the stator housing. The present invention increases the cooling of the lead frame mounted on the stator. The arrangement of the lead frame provides a large current between the inverter and the coil windings of the electric motor or generator, thereby producing a large torque and power value.

The utility model relates to material mixing technical field, concretely to a kind of mixing device for electronic potting adhesive preparation, it include: mixed material bucket, mixing material bucket is provided with stirring frame, fixed bearing is provided in the mixed material bucket, fixed bearing, fixed bearing inner ring surface is provided with scraping ring, the stirring frame is clamped in scraping ring;Cover, cover surface is provided with driving motor and vacuum pump;Beneficial effect is: starting driving motor can be mixed by stirring frame to the potting in the mixed material bucket, and vacuum pump is pumped to the mixed material bucket in mixing process, after mixing is completed, because the stirring frame is clamped in the scraping ring of fixed bearing inner ring surface as a whole, the adhering potting of stirring frame outer wall is scraped by scraping ring, prevent stirring frame adhering more potting after stirring is completed, so as to avoid the problem that the surface has more glue material when stirring frame is taken out causes material waste.

The invention relates to an electrical energy storage device, in particular in the form of a rechargeable battery pack, comprising at least one electrical energy storage cell, in particular a plurality of electrical energy storage cells, in particular in the form of rechargeable battery cells, wherein: the electrical energy storage device comprises a housing; the at least one electrical energy storage cell is accommodated in an accommodating space defined by the housing; the housing comprises at least one first housing part and at least one second housing part; the electrical energy storage device comprises an open-loop and / or closed-loop control device for open-loop and / or closed-loop control of the charging and / or discharging of the at least one electrical energy storage cell; the open-loop and / or closed-loop control device is accommodated in the first housing part and is at least partially, in particular entirely, potted therein with a curing potting compound which forms a potting body; a housing sealing element is arranged or formed between the first housing part and the second housing part in order to seal off the accommodating space; and the housing sealing element is formed from the potting compound. The invention also relates to an improved electrical appliance system and to an improved method for producing an electrical energy storage device.

A charging inlet (1) comprises: a plurality of terminals (10) for power supply; an inlet housing (20) that holds the plurality of terminals (10); a rear case (40) that is connected to the inlet housing (20); a plurality of inner terminals (70); and a rear cover (60) that is attached to a connection work port portion (44), which is an opening portion of the rear case (40), so as to close the opening of the connection work port portion (44). The rear case (40) includes an accommodating portion (41) that accommodates, at least, a base portion (12) of each of the plurality of terminals (10) and the plurality of inner terminals (70). The rear cover (60) has a top plate portion (61) including a hole portion (61c) that penetrates between an inner surface (61a) facing the accommodating portion (41) and an outer surface (61b) facing the outside. A filling portion (80) filled with a potting material is shaped in the remaining part of the accommodating portion (41). A portion of the filling portion (80) is exposed to the outside through the hole portion (61c) of the top plate portion (61).

The utility model relates to the technical field of sensor processing, in particular to a sensor encapsulation jig which comprises a bottom plate, a silica gel plate is arranged on the bottom plate, two rows of holes are formed in the silica gel plate, a sensor shell is matched with the holes in an inserted connection mode, a support is arranged on the bottom plate, a silica gel rod is arranged on the support, and the silica gel rod is arranged on the silica gel plate. The silica gel rod is located above the silica gel plate, the two opposite sides of the silica gel rod are each provided with a plurality of inserting grooves, the inserting grooves correspond to the holes in position, and sensor signal lines are matched with the inserting grooves in a clamped mode. According to the utility model, the signal line and the housing are not easy to deflect.

The application discloses a kind of anatomizing methods of potting microcircuit module, belong to electronic component technical field;Solve the problem that traditional potting microcircuit module anatomizing method either residual potting glue is difficult to remove, hinders subsequent observation and analysis, or destroys module internal components, solder point, wire, printed board and process structure, so that subsequent analysis cannot be carried out.The application uses the method of sampling-test control group to test a kind of most effective dissolvent for sample potting glue first, and then use it to the whole sample;With the smallest cost (including reagent cost and time cost) to achieve the purpose, not only can clean remove the package including potting glue, but also perfectly retain module internal components, solder point, wire, printed board and process structure.

The utility model provides a fuze device with a miniaturized proximity detector and a projectile body, and the fuze device comprises an air cap with a hollow structure, a detachably connected base, and a proximity detector which is located in the hollow structure of the air cap and is fixedly connected to the upper part of the base, according to the proximity detector, the encapsulation shell used for fixedly placing the circuit board device is arranged, the circuit board device is fixed by pouring the encapsulation glue, and the maximum radial diameter of the encapsulation shell is matched with the radial inner diameter of the upper end part of the hollow structure of the hood, so that the miniaturization of the proximity detector is realized, and the reliability of the proximity detector is improved. The geomagnetic satellite navigation system is adaptively installed at the front position of the front end of a projectile body, more layout space is provided for high-performance design of a guide cabin where a detector is located and a rear cabin section, the power of the detector and the geomagnetic satellite navigation system is increased, and the detection distance, the anti-interference capability, the positioning precision and the signal strength are all greatly improved.

The invention discloses a thread defect detection instrument based on electromagnetic pulse eddy current, which belongs to the field of electromagnetic pulse eddy current nondestructive testing, and comprises a detection probe shell, an array detection coil, a DDS direct digital frequency synthesis circuit, a power amplification circuit, a signal conditioning circuit, a data acquisition circuit and a communication circuit, the detection probe shell is filled with electronic pouring sealant; the array detection coil is arranged in the detection probe shell, the DDS direct digital frequency synthesis circuit is electrically connected with the power amplification circuit, the power amplification circuit is electrically connected with an excitation coil of the array detection coil, a receiving coil of the array detection coil is electrically connected with the signal conditioning circuit, and the signal conditioning circuit is electrically connected with the data acquisition circuit. The data acquisition circuit is electrically connected with the communication circuit, and the communication circuit is used for establishing data interaction with an external upper computer. According to the invention, defects with different depths on the thread surface and the near surface can be detected, and different detection requirements can be met.

Described herein are examples of pressure sensors, and methods to assemble pressure sensors. In some examples, a pressure sensor uses gauges attached to a sensor tube of a sensor body to detect a pressure of fluid flowing within the sensor tube. In some examples, the sensor tube helps to isolate the gauges from some of the stresses that the rest of the sensor body may experience due to intense fluid pressures. In some examples, the sensor body has a one piece design that increases durability. In some examples, a sensor adapter may be attached to the sensor body and / or hardened by one or more techniques to reduce the chance of fluid leakage and / or further increase durability. The gauges, the sensor body, and / or the sensor adapter can be enclosed within a sensor cover, and encased within a potting material, to protect and / or insulate the components.

The present application provides a battery module, a battery pack, an electrical device, and a manufacturing method for a battery module. The battery module comprises: a battery cell assembly comprising a plurality of battery cells. Each battery cell comprises an electrode terminal. A first member comprises a bottom wall, side walls, a protrusion, a first space, a first opening, and a second opening. The bottom wall and the side walls form a recess. Part of each electrode terminal is located in the recess. The protrusion is connected to the surface of the bottom wall facing away from the battery cell assembly. In the first direction, the first opening penetrates through the bottom wall. In the second direction, the second opening penetrates though a side wall and the protrusion. The first space, the first opening, and the second opening are in communication. A first conductive element penetrates through the first space and the first opening. The first conductive element is connected to the battery cell assembly. A first adhesive blocking member is located on the side of the first conductive member facing the second opening. At least part of a first potting resin is provided in the first space. The first adhesive blocking member is configured to restrict the flow of the first potting resin to the recess. At least part of a second potting resin is provided in the recess.

A printed circuit board assembly for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner.

A membrane module comprising a cylindrical housing containing a plurality of flat sheet membranes oriented parallel with a longitudinal central axis of the housing, the edges of the one or more flat sheet membranes being embedded in a potting material.

The invention belongs to the field of preparation of potting capacitors, and particularly relates to a preparation method of a potting pulse capacitor module, the potting pulse capacitor module comprises a potting shell, a capacitor module arranged in the potting shell and a potting adhesive layer filled in the potting shell and used for fixing the capacitor module, the inner wall of the potting shell is provided with a plurality of notch grooves, and the notch grooves are formed in the inner wall of the potting shell. The multiple notch grooves are formed in the inner wall of the encapsulation shell at intervals in the vertical direction. The preparation method comprises the following steps of air gun cleaning, plasma treatment, pre-coating of a potting bottom coating agent, pouring of potting glue for several times and curing molding. By limiting the structural composition and the preparation method of the potting pulse capacitor module, the interior of the potting product is compact, no pore is generated, the structural strength of the prepared product is ensured, and the production efficiency is improved. The embedded pulse capacitor module can be used in a high-impact and vibration environment, and the use requirement of the embedded pulse capacitor module is met.

A printed circuit board assembly for use in a power tool includes a potting boat, a printed circuit board, a thermally conductive gap pad, potting material, and a secondary heat sink. The potting boat includes primary heat sink fins. The electronic components are mounted on a first surface of the printed circuit board. The gap pad contacts the electronic component and the stand-off. The potting material at least partially encapsulates the printed circuit board within the potting boat. The secondary heat sink contacts a second surface of the printed circuit board opposite the first surface. The secondary heat sink includes secondary heat sink fins. Heat generated by the electronic components is transferred via conduction to both the primary heat sink fins and the secondary heat sink fins. The heat is dissipated to the surroundings of the printed circuit board assembly.

The invention provides a battery pack potting method and a battery pack potting system. The battery pack glue pouring method comprises the following steps: closing a pouring tool and a to-be-poured battery box to form a closed to-be-filled cavity between the pouring tool and the to-be-poured battery box; and when the temperatures of the potting tool and the to-be-potting battery box are adjusted to a preset temperature suitable for flowing of the potting adhesive, injecting the potting adhesive into the to-be-filled cavity through the potting tool. The pouring tool and the battery box to be poured are adjusted to the preset temperature suitable for flowing of the pouring sealant, and the pouring sealant can be heated by the pouring tool and the battery cell box body in the pouring sealant injection process, so that the flowability of the pouring sealant in the pouring tool and the battery box to be poured can be enhanced; the fluidity and the filling rate of the pouring sealant in a complex structure and a narrow area are enhanced, and the pouring efficiency and the pouring quality of the to-be-poured battery box are improved.

Electronic device, with a housing (1) which is filled up to a predetermined filling level (H) with a first potting compound (15) made from a first potting compound, at least one printed circuit board (3) arranged in the housing (1), and at least one component (5) arranged on one of the circuit boards (3), comprising one or more recesses (7) extending through the respective component (5) and designed and arranged in the housing (1) such that a connection exists via its recesses (7) between a component side (17) arranged inside the housing interior filled with the first potting compound (15) and an end face (19) of the respective component (5) arranged outside the housing interior filled with the first potting compound (15), the recesses (7) of which are each designed at least section by section in such a way that they act as capillaries towards media whose viscosity is less than a specified limit value and as barriers towards media whose viscosity is greater than the limit value, characterized in that for the component (5), at least one of the components (5) or each component (5) a second potting compound (21) made from a second potting compound with a viscosity exceeding the limit value is arranged in a spatially limited area adjacent to the component side (17) of the respective component (5), which is designed in such a way that it provides an end-side seal of the connections formed by the recesses (7) of the respective component (5) against the first potting compound used to produce the first potting compound (15).

A connector comprises a housing, a signal contact, an outer shield, a first potting reservoir, and a second potting reservoir. The signal contact is arranged within the housing, and the outer shield defines a standing wall surrounding the signal contact in a circumferential direction. The first potting reservoir is defined by a first face of the standing wall and a second face of the standing wall facing opposite the first face. The standing wall forms a boundary between the first potting reservoir and the second potting reservoir and defines a passage adapted to permit an uncured potting agent to pass between the first potting reservoir and the second potting reservoir.

The invention relates to the field of seismic exploration equipment, in particular to a node instrument battery compartment structure and a pouring sealant method thereof. Comprising an upper shell and a lower shell, the upper shell and the lower shell are fixedly connected, a containing cavity used for containing is formed in the upper shell and the lower shell, flow guide openings are formed in the side walls of the upper shell and the lower shell, and the flow guide openings are communicated with the interior of the containing cavity. The method has the advantages that spontaneous combustion risks are reduced, node instrument safety accidents are reduced, and use safety of node instruments is guaranteed to the maximum extent.