The present invention relates to the technical field of
photoresist coating for
wafer-level packaging, specifically a
resonant cavity structure and
coating method for fine atomization, comprising a
resonant cavity, a spherical
resonant cavity disposed within the resonant cavity, the
diameter of the spherical resonant cavity being an integral multiple of half the
wavelength of
ultrasonic excitation, an opening for
ultrasonic excitation input disposed at the top of the resonant cavity, and an
acoustic resonance cavity disposed at the bottom of the resonant cavity; a liquid supply needle is inserted into the
acoustic resonance cavity from the resonant cavity. This structure and method can improve the uniformity of
photoresist spraying and the quality of the film layer. By utilizing precise acoustic field control, no microchannel is required to provide fluid flow, thus avoiding the potential problem of
nozzle blockage. By focusing the
acoustic wave in the resonant cavity, the droplets will break up in a very short time, resulting in a small atomized particle size and
high concentration, thereby achieving uniform and controllable
photoresist film thickness. The film layer has high uniformity and few film defects, is not restricted by the
wafer surface morphology, and can achieve
conformal coating of complex three-dimensional microstructures.