This invention relates to a
moisture-proof protection device and packaging method for circuit boards, belonging to the field of circuit board
processing technology. The
moisture-proof protection device and packaging method for circuit boards includes a support frame, a conveying mechanism on the upper side of the support frame, a
fixed frame above the conveying mechanism in the middle of the support frame, a spraying mechanism on the
fixed frame, and a reciprocating mechanism on the
fixed frame to drive the spraying mechanism to move back and forth. The spraying mechanism includes a
nozzle slidably mounted on the upper side of the fixed frame, a
metering pump fixedly mounted on the upper side of the fixed frame, and a paint tank on the upper side of the fixed frame. The input end of the
metering pump is connected to the paint tank via a hose, and the output end of the
metering pump is connected to the
nozzle via a hose. This invention uses the reciprocating mechanism to drive a slide to move back and forth within a groove, allowing the
nozzle on the slide to reciprocate during the application of
conformal coating to the circuit board, thus improving the efficiency and uniformity of the spraying process.