79 results about "Co-fired ceramic" patented technology

The invention discloses a metallization preparation method for a side cavity wall of a small-size multi-layer co-fired ceramic product. The metallization preparation method comprises the following steps: reserving process edges around a plurality of single small-size multi-layer co-fired ceramic products, and arranging the single small-size multi-layer co-fired ceramic products on a green ceramic chip in an array; processing the green ceramic chip and the metal slurry by adopting a multi-layer co-fired ceramic product manufacturing process to obtain a full-page formed green ceramic body; processing a side cavity on the green ceramic body; two cavity opening tools are manufactured, a whole green ceramic body is fixed in the two cavity opening tools, the surfaces of the cavity opening tools are scraped through rubber scrapers, metal slurry is squeezed into side face cavities, redundant metal slurry is pumped away through a vacuum adsorption table, and the metal slurry is attached to the walls of the side face cavities; separating a single product to obtain an independent multilayer ceramic product green body; and sintering to obtain a multilayer ceramic product with metalized side cavity walls. According to the invention, the problems of deformation of a metallized cavity of a side cavity wall of a small-size multi-layer co-fired ceramic product, high operation difficulty and low production efficiency can be solved.

The invention discloses a metallization method for the side wall of a cavity of a low-temperature co-fired ceramic substrate. The metallization method comprises the following steps of: sequentially performing punching treatment on each layer of green ceramic chip according to a preset cavity outline; during lamination, the hole sites on the adjacent green ceramic chips are arranged in a staggered and overlapped manner; the holes are filled with metal slurry in a solid mode, and a blank plate with solid metal points is obtained after drying and leveling treatment; each layer of blank plate is cut according to the cavity contour in sequence; the outline of the cavity is a line connected with each solid metal point on the blank plate; and laminating and pressing the cut blank plates, and co-firing to obtain the ceramic substrate with the metalized cavity side wall. The round holes are designed in the contour lines of the cavities of the green ceramic chips, then the solid metal slurry is filled in the green ceramic chip stage, and the green ceramic chips are laminated and co-fired, so that metal interconnection in all the round holes in the contour area of the substrate is realized, after the cavities are formed, the filled metal slurry is immediately exposed, and metallization of the side walls of the cavities of the substrate is completed.

The invention provides an aerosol generating device and a coil assembly thereof, the coil assembly comprises a ceramic base body and a conductive heating body, the ceramic base body defines a heating cavity, and the heating cavity is used for accommodating an aerosol forming substrate; and the conductive heating body is arranged on the ceramic substrate, and is used for heating the aerosol forming substrate to generate aerosol. According to the coil assembly, the co-fired ceramic coil and the integrated design of the coil and the heating cavity are adopted, the distance between the coil and the cigarette is closer, meanwhile, a heating cavity base body is a ceramic base body, the heat conduction capacity is higher, heat generated by the coil can be better transmitted to a tobacco section, and effective utilization of the heat is facilitated.

The present invention discloses a low-temperature co-fired ceramic / glass composite material and its preparation method and application, belonging to the technical field of ceramic materials. The present invention uses aluminum oxide (Al2O3) as a ceramic phase, CaO-B2O3-SiO2 (CBS) and zinc-boron glass as a glass phase, and adds K2O, CuO, and Nb2O5. When the low-temperature co-fired ceramic / glass composite material is used to prepare microelectronic components, its firing temperature can be reduced to 800°C to 850°C, and the dielectric constant can be reduced to 7.0-8.5, and the dielectric loss can be reduced to 0.3×10 ‑3 ~0.7×10 ‑3 (1MHz).

The invention discloses a 3dB bridge which comprises a multi-layer dielectric body, and a first coupling line and a second coupling line are arranged on the two opposite sides of the multi-layer dielectric body respectively and are overlapped on the wide side of a coupling part. The first coupling line and the second coupling line are respectively divided into parallel finger-shaped conductor sections at the coupling part, and the adjacent finger sections correspond in a cross-layer staggered manner to form a multi-scale coupling channel of the same coupling part; corresponding input ends and output ends are respectively led out from the first coupling line and the second coupling line; and a parasitic resonance unit which is electromagnetically coupled with the finger section is arranged in the multilayer dielectric body at a distance d1 from the transverse edge of the coupling part. The 3dB bridge enables in-band coupling to be self-balanced along with frequency, a parasitic unit compensates a band edge in situ in a near field, the problem that single-scale coupling and boundary cannot be quantized is solved, wider fractional bandwidth, flatter amplitude and phase and improvement of band edge directivity and port isolation are achieved, repeatability and mass production consistency are ensured through d1, d2, T, k1 and k2 constraints, and the 3dB bridge adapts to co-fired ceramic packaging.

The application provides a low-temperature co-fired ceramic powder material and a preparation method and application thereof, and relates to the technical field of electronic ceramic materials.The low-temperature co-fired ceramic powder material provided by the application comprises the following raw material components in parts by weight: borosilicate glass powder 50-60 parts, quartz glass powder 30-40 parts, and powder additives 5-10 parts, wherein the powder additives comprise at least one of Al2O3, ZrO2, MgO and BaO.The low-temperature co-fired ceramic powder material prepared by compounding borosilicate glass powder, quartz glass powder and powder additives has a dielectric constant εr=3.8-4.5 after sintering, a low dielectric loss tan δ=0.001-0.0025, and a resistivity ρ=1.0-9.9*10 12 Ω*cm, the sintering temperature is in the range of 850-900 DEG C, and the density after sintering is good, and can be up to 99.8%.

The method comprises the following steps: (1) preparing high-temperature inorganic binding phase glass powder: heating silicon dioxide, aluminum oxide, calcium oxide, titanium oxide and barium oxide to a melting temperature, quenching, completely cooling, and crushing to obtain high-temperature inorganic binding phase glass powder; the inorganic binding phase glass powder is obtained; (2) weighing a conductive phase, a sintering framework, a catalyst and inorganic binding phase glass powder, and mechanically mixing to obtain composite powder; (3) preparing an organic carrier: uniformly mixing the additive solution with a solvent to obtain the organic carrier; and (4) preparing the copper oxide-tungsten conductive paste: mixing the composite powder with an organic carrier, grinding, and defoaming to obtain the copper oxide-tungsten conductive paste adaptive to the medium-temperature co-fired ceramic. The blank in the field of medium-temperature co-fired ceramic conductive paste is filled, and the medium-temperature co-fired ceramic conductive paste has an obvious price advantage.

This invention relates to the field of glass-ceramic technology, specifically providing a low-temperature co-fired ceramic, its preparation method, and its application. The raw materials for the low-temperature co-fired ceramic include VSBBS glass frit and ceramic frit, with the total weight of the VSBBS glass frit and ceramic frit being 100%. The mass percentages of the VSBBS glass frit and ceramic frit are 20-40% and 60-80%, respectively. The raw materials for the VSBBS glass frit, by mass percentage, include 10-30 wt% vanadium oxide, 10-30 wt% antimony oxide, 10-30 wt% barium oxide, 10-20 wt% boron oxide, and 30-50 wt% silicon oxide, with the sum of all oxides being 100%. The LTCC material obtained by this invention achieves excellent millimeter-wave dielectric properties, with a relative permittivity between 4.8 and 6.8, a dielectric loss less than or equal to 0.001, and a flexural strength of 180-230 MPa.

The invention discloses a first-tearing and second-pressing laminating machine for flexible low-temperature co-fired ceramics. The first-tearing and second-pressing laminating machine comprises a feeding mechanism, a fine adjustment mechanism, a first visual positioning mechanism, a cutting mechanism, a liftable adjusting mechanism, a second visual positioning mechanism, a film tearing mechanism, a waste recycling box, a laminating mechanism and a discharging bin. Ceramic in the feeding bin is grabbed through a feeding mechanical arm and placed on a fine adjustment platform of the fine adjustment mechanism; the fine tuning platform is combined with the first visual positioning mechanism to perform visual positioning adjustment on the ceramic on the fine tuning platform; the cutting mechanism is used for trimming the upper ceramic layer of the ceramic on the fine adjustment platform and transferring the upper ceramic layer to a liftable adjusting platform of the liftable adjusting mechanism after trimming is completed; the liftable adjusting platform is combined with the second visual positioning mechanism to carry out secondary visual positioning adjustment on the ceramic on the liftable adjusting platform; and the laminating mechanism receives the ceramic on the lifting adjusting platform, PET film tearing is carried out through the film tearing mechanism, and then laminating operation is carried out. The device is high in automation degree, high in production efficiency, high in quality and low in labor cost.

The invention belongs to the technical field of low-temperature co-fired ceramics, and particularly relates to a preparation method of a low-temperature co-fired ceramic high-density green ceramic chip. The preparation method comprises the following steps: glass powder modification, ceramic powder modification, primary ball milling, secondary ball milling and tape casting. According to the technical scheme provided by the invention, two ionic or organic substances which can attract or combine with each other are adopted to modify the surfaces of the glass powder and the ceramic powder respectively, so that the problem of sedimentation after primary ball milling is avoided; the two kinds of inorganic powder are subjected to ball milling, mixing and dispersing, and the distance between the two kinds of powder in the slurry is shortened through the interaction between ions or groups on the surfaces of the powder, so that the affinity between the powder is improved, and the compactness of the green ceramic chip is improved.

This invention relates to the field of special ceramic product manufacturing technology, specifically to a method for preparing an airtight ceramic base, comprising: a co-fired ceramic substrate, wherein the co-fired ceramic substrate is provided with a dense support layer, an interconnected functional layer, and a cavity sealing layer sequentially from bottom to top; the dense support layer is a high-purity alumina dense ceramic layer with a thickness ≥0.2mm; the interconnected functional layer is an integral sintered layer composed of a multi-layered stacked alumina ceramic dielectric layer and an embedded tungsten metallized three-dimensional interconnected structure; the cavity sealing layer is an alumina ceramic layer with a concave cavity structure, and the edge of the concave cavity is provided with an annular stress buffer groove. The airtight ceramic base of this invention, through structural innovation and synergistic optimization of the manufacturing process, adopts a three-layer integral co-fired ceramic substrate structure of the same material, combined with a rounded corner annular stress buffer groove design at the cavity edge, solving the problems of sintering warping, interlayer delamination, and stress concentration cracking.

This application discloses a method for fabricating conductive lines on a multilayer co-fired ceramic substrate and the multilayer co-fired ceramic substrate itself, relating to the field of electronic ceramic multilayer co-fired manufacturing technology. The method for fabricating conductive lines on the multilayer co-fired ceramic substrate includes: providing a green ceramic film strip for multilayer stacking and co-firing; forming conductive patterns on the surface of the green ceramic film strip using nanoimprinting technology, aligning and stacking it with at least one other green ceramic film strip, and laminating it to form a stack; and performing adhesive removal and co-firing treatment on the stack to form embedded conductive lines within the stack. The fabrication method proposed in this application can fabricate conductive lines with linewidths and spacings less than 50 μm, achieving embedded forming of conductive lines in multilayer structures. It can be used in conjunction with via drilling / filling and stack alignment processes for precision packaging of three-dimensional integrated circuits such as high-density multilayer wiring, high-frequency and high-speed circuits, and power electronic integration.

The utility model belongs to the technical field of material science, and particularly relates to a low-temperature co-fired ceramic dielectric material forming performance testing device which comprises a workbench, a fixing plate is fixedly installed on the side face of one end of the workbench, a fixing support is fixedly installed on the side face of the fixing plate, and a supporting plate is fixedly installed on the side face of the fixing support. A motor is fixedly installed at the top of the supporting plate, the output end of the motor penetrates through the interior of the fixing support and is fixedly provided with a threaded rod, a nut is installed outside one end of the threaded rod in a threaded mode, a first moving block is fixedly installed outside the nut, and fixing rods are fixedly installed at the two ends of one side of the fixing support. The motor drives the threaded rod to rotate, the threaded rod drives the first moving block to move, the first moving block drives the second moving block, and the second moving block moves to drive the clamp to move, so that the effect of fixing the detected object is achieved, and the consistency and reliability of the test result of the detected object are effectively improved.

The invention provides an embedded fan-out packaging method and a packaging structure thereof, and the preparation method comprises the steps: S1, manufacturing a co-fired ceramic embedded substrate which is provided with a plurality of through cavities penetrating through the substrate, the thickness of the lower part of each through cavity is greater than the thickness of a chip, and the area of the upper part of each through cavity is greater than that of the lower part of each through cavity; s2, bonding the co-fired ceramic embedded substrate on the temporary bonding substrate by using a temporary bonding film; s3, the chip is attached into the through cavity, and the front face of the chip is tightly attached to the temporary bonding film; s4, filling glue is injected into the through cavity, and the height is larger than the height of the lower portion of the through cavity and smaller than the height of the upper portion of the through cavity; s5, the cover plate is placed on the upper portion of the through cavity, and the filling glue is extruded so that the gap between the cover plate and the through cavity can be filled with the filling glue; s6, carrying out de-bonding, so that the packaging body structure is separated from the temporary bonding film; s7, preparing single-layer or multi-layer fan-out rewiring on the lower surface of the packaging body structure; and S8, packaging components on the upper surface of the packaging body structure, and planting solder balls on the lower surface of the packaging body structure.

A copper powder having a surface treatment layer, the copper powder containing at least one organic acid salt from among organic acid salts containing Al and organic acid salts containing Ti.

According to the technical scheme, the aluminum oxide high-temperature co-fired ceramic with the double-layer cover plate comprises a ceramic substrate, an enclosure frame is welded to the upper surface of the ceramic substrate, the height of an internal partition wall of the enclosure frame is reduced, the height of an outer frame of the enclosure frame is increased, and a step table is formed. The shape of an internal partition wall of the enclosure frame can be designed in various shapes according to actual tube shell radio frequency requirements and internal component distribution, an outer frame of the enclosure frame is always kept in a regular shape, a lower-layer cover plate is bonded in the outer frame of the enclosure frame, and an upper-layer cover plate is welded to the upper surface of the outer frame of the enclosure frame in parallel in a sealing mode. According to the utility model, the original special-shaped cover plate can be divided into two parts through the stepped special-shaped enclosure frame, the lower-layer cover plate retains the special-shaped characteristic to be embedded into the partition wall and is fixed by conductive adhesive and the like, and the upper-layer cover plate is a cover plate with a regular appearance and can be packaged by adopting parallel seal welding, so that the cost of the parallel seal welding is lower than that of gold-tin welding; and the process difficulty is lower.

The utility model belongs to the technical field of mixing of low-temperature co-fired ceramic dielectric materials, and particularly relates to a mixing device of low-temperature co-fired ceramic dielectric materials, which comprises a mounting frame, a rectangular frame is fixedly mounted on the mounting frame, a screening box is mounted on the rectangular frame, a first feed port is arranged above the screening box, and a second feed port is arranged above the screening box. A first supporting frame is installed on the outer side face of the screening box, a first motor is installed on the first supporting frame, and the output end of the first motor is connected with a driving gear. The screening device is arranged in the smashing box to screen ceramic powder, the scraping rod piece is arranged in the stirring box, the bottom face in the stirring box is scraped through rotation of the arc-shaped rod piece, the overall yield of ceramic dielectric materials after mixing is improved, and the working efficiency is improved.

The embodiment of the invention provides a phased array system heat dissipation structure based on fan-out packaging and a working method. The heat dissipation structure comprises a fan-out packaged radio frequency chip and antenna array, a high-temperature co-fired ceramic substrate, a printed circuit board, a radio frequency feed network, a control and power supply network, a metal piece, a radio frequency interface and a power module. Wherein the fan-out packaged radio frequency chip and the antenna array are welded on the upper surface of the high-temperature co-fired ceramic substrate; the high-temperature co-fired ceramic substrate and the printed circuit board are respectively welded and fixed on the upper surface of the metal piece; the radio frequency feed network and the control and power supply network are embedded in the high-temperature co-fired ceramic substrate and the printed circuit board; the radio frequency interface and the power supply module penetrate through the metal piece and are welded to the lower surface of the printed circuit board.

The present invention discloses a semiconductor ceramic-based circuit board and a high-precision processing method thereof, specifically including: providing a substrate, on which a low-temperature co-fired ceramic raw material layer is preset; opening through holes in the low-temperature co-fired ceramic raw material layer and filling metal paste in the through holes; performing low-temperature co-firing on the low-temperature co-fired ceramic raw material layer and the metal paste by microwave, so that the low-temperature co-fired ceramic raw material layer is sintered into a co-fired ceramic layer, and metal columns formed by the metal paste are embedded in the co-fired ceramic layer; covering the column end faces of the metal columns with nickel powder, and melting and covering the nickel powder on the metal columns by laser to form a nickel layer. By microwave heating, the inside and outside of the low-temperature co-fired ceramic raw material layer are heated synchronously, improving the position accuracy and size accuracy of the through holes. By laser cladding, the nickel powder is melted and covered on the column end faces of the metal columns to form a nickel layer, which can prevent the metal columns from separating from the through holes; the position accuracy and size accuracy of the through holes can be maintained, and the stability of the structure can be maintained.

To provide a whole crystal phase low temperature co-fired ceramic powder and a manufacturing method and application thereof, for overcoming performance deterioration due to introduction of a glass phase to a low temperature co-fired ceramic.SOLUTION: A raw material composition of a low temperature co-fired ceramic powder comprises xRO yM2O3 zXO2, where R is at least one kind of Mg, Ca, Ba, Zn, Cu and Pb, M is at least one kind of B, Al, Co, In, Bi, Nd, Sm and La, X is at least one kind of Si, Ge, Sn, Ti, Zr and Hf, 0≤x≤85 wt.%, 15 wt.%≤y≤90 wt.%, 10 wt.%≤z≤85 wt.%, and x+y+z=1 are satisfied, the low temperature co-fired ceramic powder is obtained by high temperature melting, hardening treatment, and recrystallization treatment, a temperature of the high temperature melting is 1200°C-1600°C, and a temperature of the recrystallization treatment is 500°C-900°C.SELECTED DRAWING: Figure 3

The invention provides an adhesive for low-temperature co-fired ceramic tape casting as well as a preparation method and application of the adhesive. The adhesive for low-temperature co-fired ceramic tape casting comprises an acrylated polyacrylate prepolymer, a reactive diluent, a photoinitiator, a plasticizer and a dispersing agent. The adhesive for low-temperature co-fired ceramic tape casting does not need to be added with volatile organic matter as a solvent, has low viscosity, can solve the problem that a large amount of VOC is generated in the preparation process of an existing low-temperature co-fired ceramic substrate, and a cured film formed after curing has good tensile strength.

The application discloses a method for electroless nickel-palladium-gold plating on an alumina high-temperature co-fired ceramic substrate, and belongs to the technical field of electroless nickel-palladium-gold plating. The method comprises the following steps: hanging, oil removal, micro-etching, glass micro-etching, acid pickling, palladium activation, inhibition, electroless nickel-boron plating, pre-plating of palladium, electroless palladium plating and electroless gold plating. The method is used for electroless nickel-palladium-gold plating on an alumina high-temperature ceramic tungsten metal to modify the metal, so that the workpiece has good weldability and bondability, the gold wire bonding strength can reach 280 mN, the average gold ribbon bonding tension is greater than 500 mN, and the average chip shear strength reaches 5.11 Kgf, all of which reach the relevant technical standards of the national military standard.

The utility model belongs to the technical field of forming dies, and particularly relates to a low-temperature co-fired ceramic dielectric material forming die which comprises a working plate, a material mixing assembly is arranged on one side of the top end of the working plate, a spraying assembly is arranged on the other side of the working plate, and a forming assembly is arranged between the spraying assembly and the material mixing assembly. The forming assembly comprises a first motor, a fixing frame is arranged on the bottom side of the working plate, the first motor is arranged in the fixing frame, the output end of the first motor is connected with a first rotating shaft through a coupler, the first rotating shaft penetrates through the top end of the working plate, and a rotating disc is arranged at the top end of the first rotating shaft. A lower mold is arranged on the rotating disc, a shaping groove is formed in the lower mold, a plurality of mounting openings are formed in the top end of the lower mold, mounting columns are inserted into the mounting openings, and upper molds are arranged at the top ends of the mounting columns, so that air in a mold cavity is exhausted during operation, and the shaping effect is improved.

Provided in the present disclosure is a quantum random number generator integrated on the basis of a co-fired ceramic. The quantum random number generator comprises: a co-fired ceramic substrate, and a quantum state preparation unit, a quantum state measurement chip, a first processing unit and a second processing unit, which are jointly integrated on the co-fired ceramic substrate and are connected in sequence, wherein the quantum state preparation unit comprises a laser chip, the quantum state measurement chip comprises an end face coupler, and three-dimensional alignment is achieved between a light outlet of the laser chip and an input end of the end face coupler by means of a preset alignment structure formed on the co-fired ceramic substrate.

This copper powder having a surface treated layer contains a Si compound having a Si-O bond, an amphoteric metal X, and an alkaline earth metal Y, wherein the substance amount α (mol) of Si, the substance amount β (mol) of the amphoteric metal X, and the substance amount γ (mol) of the alkaline earth metal Y satisfy formula (I): α / β ≥ 0.8, formula (II): γ / β ≥ 0.4, and formula (III): 4α ≥ 2.4β +1.6γ.

The utility model discloses a filament lamp with multiple LED chips integrally packaged. The filament lamp comprises a lampshade, a ceramic substrate filament, a socket and a base. The socket is connected with the base; the ceramic substrate lamp filament is inserted into the socket, and the lampshade covers the ceramic substrate lamp filament and is connected with the socket; the ceramic substrate lamp filament is of a multi-layer high-temperature co-fired ceramic substrate structure, is in a long strip shape and sequentially comprises a surface wiring layer, a first through hole filling layer, a buried layer circuit layer, a plurality of second through hole filling layers, a buried layer circuit layer, a first through hole filling layer and a surface wiring layer. The two side faces of the ceramic substrate are connected with the two surface wiring layers through side face printing. One or more LED chip assemblies are fixedly packaged on the surface wiring layer on the periphery of the ceramic substrate lamp filament and the top of the ceramic substrate lamp filament. The LED packaging structure is simple and high in luminous efficiency.

The invention discloses a preparation method of a high-binding-force HTCC ceramic chemical nickel-gold plating layer, and belongs to the technical field of electronic components. The preparation method comprises the following steps: carrying out pretreatment on a tungsten slurry HTCC co-fired ceramic tube shell or a substrate through sand blasting, etching, Pd activation and other processes before chemical plating of a metal layer, immersing the pretreated substrate into a chemical nickel plating tank with adjusted parameters for chemical nickel plating to obtain a bright nickel layer, and then putting the bright nickel layer into a hydrogen atmosphere heat treatment furnace for heat treatment, the method comprises the following steps: carrying out heat treatment on a nickel / gold layer to obtain a nickel layer with high binding force strength, carrying out gold rolling plating, and finally carrying out heat treatment on the nickel / gold layer subjected to gold plating to obtain the HTCC metallized layer with high binding force strength. The binding force strength of the metalized layer manufactured by the technical scheme is greater than 35gf. The problems of low binding force and poor adhesive force of a chemical plating metallization nickel-gold layer on the surface of an existing HTCC ceramic substrate are solved. The method can be widely applied to the technical field of chemical plating of metallized layers of HTCC ceramic tube shells or substrates.

Disclosed in the present application are a power module, a power device, and a photovoltaic power generation system. The power module comprises a substrate, a first power device, a co-fired ceramic module, and a package body. The first power device is located on a surface of the substrate and is electrically connected to the substrate. The co-fired ceramic module is located on the side of the first power device facing away from the substrate, and the co-fired ceramic module and the first power device are spaced apart. The co-fired ceramic module comprises a co-fired ceramic base and a second power device, wherein the second power device is embedded in the co-fired ceramic base and is electrically connected to at least one of the substrate and the first power device. The package body encapsulates the substrate, the first power device, and the co-fired ceramic module. By means of the design scheme of the power module, the integration level and power density of the power module are improved while ensuring the structural reliability of the power module, and improvement to the power conversion performance of the power module is also facilitated, thereby improving the power density of the power device and thus improving the power generation efficiency of the photovoltaic power generation system.

This invention discloses a tungsten-copper electronic paste for medium-temperature co-fired ceramic substrates and its preparation method, belonging to the field of electronic pastes. By mass percentage, the paste consists of 80%–85% tungsten-copper powder, 5%–15% organic carrier, and 5%–10% binder phase. The preparation method includes: first preparing the organic carrier, then uniformly mixing the tungsten-copper powder and binder phase, followed by adding the organic carrier, and then thoroughly grinding and dispersing the mixture using a stirring and three-roll mill to obtain a uniform and stable tungsten-copper electronic paste. This invention, by optimizing the powder size and paste ratio, significantly reduces the sheet resistance of the conductive layer after sintering and improves conductivity while ensuring good co-firing compatibility with medium-temperature co-fired ceramics. The resulting paste exhibits excellent printability and rheological stability, with clear printed lines and a smooth surface. It shows no bubbling or delamination during sintering and is suitable for high-performance, high-reliability electronic packaging and substrate circuit manufacturing.