37 results about "Co-fired ceramic" patented technology

The application provides a low-temperature co-fired ceramic powder material and a preparation method and application thereof, and relates to the technical field of electronic ceramic materials.The low-temperature co-fired ceramic powder material provided by the application comprises the following raw material components in parts by weight: borosilicate glass powder 50-60 parts, quartz glass powder 30-40 parts, and powder additives 5-10 parts, wherein the powder additives comprise at least one of Al2O3, ZrO2, MgO and BaO.The low-temperature co-fired ceramic powder material prepared by compounding borosilicate glass powder, quartz glass powder and powder additives has a dielectric constant εr=3.8-4.5 after sintering, a low dielectric loss tan δ=0.001-0.0025, and a resistivity ρ=1.0-9.9*10 12 Ω*cm, the sintering temperature is in the range of 850-900 DEG C, and the density after sintering is good, and can be up to 99.8%.

This invention relates to the field of glass-ceramic technology, specifically providing a low-temperature co-fired ceramic, its preparation method, and its application. The raw materials for the low-temperature co-fired ceramic include VSBBS glass frit and ceramic frit, with the total weight of the VSBBS glass frit and ceramic frit being 100%. The mass percentages of the VSBBS glass frit and ceramic frit are 20-40% and 60-80%, respectively. The raw materials for the VSBBS glass frit, by mass percentage, include 10-30 wt% vanadium oxide, 10-30 wt% antimony oxide, 10-30 wt% barium oxide, 10-20 wt% boron oxide, and 30-50 wt% silicon oxide, with the sum of all oxides being 100%. The LTCC material obtained by this invention achieves excellent millimeter-wave dielectric properties, with a relative permittivity between 4.8 and 6.8, a dielectric loss less than or equal to 0.001, and a flexural strength of 180-230 MPa.

This invention relates to the field of special ceramic product manufacturing technology, specifically to a method for preparing an airtight ceramic base, comprising: a co-fired ceramic substrate, wherein the co-fired ceramic substrate is provided with a dense support layer, an interconnected functional layer, and a cavity sealing layer sequentially from bottom to top; the dense support layer is a high-purity alumina dense ceramic layer with a thickness ≥0.2mm; the interconnected functional layer is an integral sintered layer composed of a multi-layered stacked alumina ceramic dielectric layer and an embedded tungsten metallized three-dimensional interconnected structure; the cavity sealing layer is an alumina ceramic layer with a concave cavity structure, and the edge of the concave cavity is provided with an annular stress buffer groove. The airtight ceramic base of this invention, through structural innovation and synergistic optimization of the manufacturing process, adopts a three-layer integral co-fired ceramic substrate structure of the same material, combined with a rounded corner annular stress buffer groove design at the cavity edge, solving the problems of sintering warping, interlayer delamination, and stress concentration cracking.

This application discloses a method for fabricating conductive lines on a multilayer co-fired ceramic substrate and the multilayer co-fired ceramic substrate itself, relating to the field of electronic ceramic multilayer co-fired manufacturing technology. The method for fabricating conductive lines on the multilayer co-fired ceramic substrate includes: providing a green ceramic film strip for multilayer stacking and co-firing; forming conductive patterns on the surface of the green ceramic film strip using nanoimprinting technology, aligning and stacking it with at least one other green ceramic film strip, and laminating it to form a stack; and performing adhesive removal and co-firing treatment on the stack to form embedded conductive lines within the stack. The fabrication method proposed in this application can fabricate conductive lines with linewidths and spacings less than 50 μm, achieving embedded forming of conductive lines in multilayer structures. It can be used in conjunction with via drilling / filling and stack alignment processes for precision packaging of three-dimensional integrated circuits such as high-density multilayer wiring, high-frequency and high-speed circuits, and power electronic integration.

According to the technical scheme, the aluminum oxide high-temperature co-fired ceramic with the double-layer cover plate comprises a ceramic substrate, an enclosure frame is welded to the upper surface of the ceramic substrate, the height of an internal partition wall of the enclosure frame is reduced, the height of an outer frame of the enclosure frame is increased, and a step table is formed. The shape of an internal partition wall of the enclosure frame can be designed in various shapes according to actual tube shell radio frequency requirements and internal component distribution, an outer frame of the enclosure frame is always kept in a regular shape, a lower-layer cover plate is bonded in the outer frame of the enclosure frame, and an upper-layer cover plate is welded to the upper surface of the outer frame of the enclosure frame in parallel in a sealing mode. According to the utility model, the original special-shaped cover plate can be divided into two parts through the stepped special-shaped enclosure frame, the lower-layer cover plate retains the special-shaped characteristic to be embedded into the partition wall and is fixed by conductive adhesive and the like, and the upper-layer cover plate is a cover plate with a regular appearance and can be packaged by adopting parallel seal welding, so that the cost of the parallel seal welding is lower than that of gold-tin welding; and the process difficulty is lower.

The embodiment of the invention provides a phased array system heat dissipation structure based on fan-out packaging and a working method. The heat dissipation structure comprises a fan-out packaged radio frequency chip and antenna array, a high-temperature co-fired ceramic substrate, a printed circuit board, a radio frequency feed network, a control and power supply network, a metal piece, a radio frequency interface and a power module. Wherein the fan-out packaged radio frequency chip and the antenna array are welded on the upper surface of the high-temperature co-fired ceramic substrate; the high-temperature co-fired ceramic substrate and the printed circuit board are respectively welded and fixed on the upper surface of the metal piece; the radio frequency feed network and the control and power supply network are embedded in the high-temperature co-fired ceramic substrate and the printed circuit board; the radio frequency interface and the power supply module penetrate through the metal piece and are welded to the lower surface of the printed circuit board.

The application discloses a method for electroless nickel-palladium-gold plating on an alumina high-temperature co-fired ceramic substrate, and belongs to the technical field of electroless nickel-palladium-gold plating. The method comprises the following steps: hanging, oil removal, micro-etching, glass micro-etching, acid pickling, palladium activation, inhibition, electroless nickel-boron plating, pre-plating of palladium, electroless palladium plating and electroless gold plating. The method is used for electroless nickel-palladium-gold plating on an alumina high-temperature ceramic tungsten metal to modify the metal, so that the workpiece has good weldability and bondability, the gold wire bonding strength can reach 280 mN, the average gold ribbon bonding tension is greater than 500 mN, and the average chip shear strength reaches 5.11 Kgf, all of which reach the relevant technical standards of the national military standard.

Provided in the present disclosure is a quantum random number generator integrated on the basis of a co-fired ceramic. The quantum random number generator comprises: a co-fired ceramic substrate, and a quantum state preparation unit, a quantum state measurement chip, a first processing unit and a second processing unit, which are jointly integrated on the co-fired ceramic substrate and are connected in sequence, wherein the quantum state preparation unit comprises a laser chip, the quantum state measurement chip comprises an end face coupler, and three-dimensional alignment is achieved between a light outlet of the laser chip and an input end of the end face coupler by means of a preset alignment structure formed on the co-fired ceramic substrate.

The invention discloses a preparation method of a high-binding-force HTCC ceramic chemical nickel-gold plating layer, and belongs to the technical field of electronic components. The preparation method comprises the following steps: carrying out pretreatment on a tungsten slurry HTCC co-fired ceramic tube shell or a substrate through sand blasting, etching, Pd activation and other processes before chemical plating of a metal layer, immersing the pretreated substrate into a chemical nickel plating tank with adjusted parameters for chemical nickel plating to obtain a bright nickel layer, and then putting the bright nickel layer into a hydrogen atmosphere heat treatment furnace for heat treatment, the method comprises the following steps: carrying out heat treatment on a nickel / gold layer to obtain a nickel layer with high binding force strength, carrying out gold rolling plating, and finally carrying out heat treatment on the nickel / gold layer subjected to gold plating to obtain the HTCC metallized layer with high binding force strength. The binding force strength of the metalized layer manufactured by the technical scheme is greater than 35gf. The problems of low binding force and poor adhesive force of a chemical plating metallization nickel-gold layer on the surface of an existing HTCC ceramic substrate are solved. The method can be widely applied to the technical field of chemical plating of metallized layers of HTCC ceramic tube shells or substrates.

Disclosed in the present application are a power module, a power device, and a photovoltaic power generation system. The power module comprises a substrate, a first power device, a co-fired ceramic module, and a package body. The first power device is located on a surface of the substrate and is electrically connected to the substrate. The co-fired ceramic module is located on the side of the first power device facing away from the substrate, and the co-fired ceramic module and the first power device are spaced apart. The co-fired ceramic module comprises a co-fired ceramic base and a second power device, wherein the second power device is embedded in the co-fired ceramic base and is electrically connected to at least one of the substrate and the first power device. The package body encapsulates the substrate, the first power device, and the co-fired ceramic module. By means of the design scheme of the power module, the integration level and power density of the power module are improved while ensuring the structural reliability of the power module, and improvement to the power conversion performance of the power module is also facilitated, thereby improving the power density of the power device and thus improving the power generation efficiency of the photovoltaic power generation system.

This invention discloses a tungsten-copper electronic paste for medium-temperature co-fired ceramic substrates and its preparation method, belonging to the field of electronic pastes. By mass percentage, the paste consists of 80%–85% tungsten-copper powder, 5%–15% organic carrier, and 5%–10% binder phase. The preparation method includes: first preparing the organic carrier, then uniformly mixing the tungsten-copper powder and binder phase, followed by adding the organic carrier, and then thoroughly grinding and dispersing the mixture using a stirring and three-roll mill to obtain a uniform and stable tungsten-copper electronic paste. This invention, by optimizing the powder size and paste ratio, significantly reduces the sheet resistance of the conductive layer after sintering and improves conductivity while ensuring good co-firing compatibility with medium-temperature co-fired ceramics. The resulting paste exhibits excellent printability and rheological stability, with clear printed lines and a smooth surface. It shows no bubbling or delamination during sintering and is suitable for high-performance, high-reliability electronic packaging and substrate circuit manufacturing.

The invention provides a manufacturing method for preparing an organic packaging ceramic substrate from co-fired ceramic, and relates to the technical field of semiconductors. The invention discloses a manufacturing method for preparing an organic packaging ceramic substrate from co-fired ceramic. The manufacturing method comprises the following steps: S110, preparing ceramic slurry and metal conductor slurry; s210, preparing a raw ceramic chip; s310, circuit forming is carried out; s410, carrying out multi-layer lamination; s510, degreasing and sintering are carried out; and S610, post-treatment is carried out. S710, coating the ceramic core plate with a film; and S810, laying a solder mask layer. According to the manufacturing method for preparing the organic packaging ceramic substrate from the co-fired ceramic, the heat conductivity coefficient can be effectively increased, the temperature resistance range is enlarged, and the requirements for high-power heat dissipation and high temperature resistance can be effectively met.

The application relates to a high-precision cutting pre-laminating machine and relates to the technical field of low-temperature co-fired ceramic production. The pre-laminating machine comprises a rack and a control screen, the upper surface of the rack is provided with the control screen, and the pre-laminating machine further comprises a transmission module, a transfer assembly, a positioning and jacking cutting assembly and a pre-laminating assembly. The positioning and jacking cutting assembly comprises a supporting plate and a cutting knife, the upper surface of the rack is fixedly connected with a first fixed plate, and the upper surface of the first fixed plate is fixedly connected with two symmetrical second fixed plates. The iron frame positioning pin is adopted for positioning, the positioning precision is high, the total repeat error is small, and the laminating is positioned in comparison with visual positioning; the cutting function is added, the laminating and cutting functions are combined, the product inflow and outflow adopt the assembly line mode, a gluing machine and a laminating machine are respectively spliced in front and back, full-automatic production can be conveniently realized, the efficiency is high, and manual touching is avoided to cause dirt.

The invention discloses a preparation method of low-temperature co-fired ceramic with an adjustable thermal expansion coefficient and the low-temperature co-fired ceramic. The preparation method comprises the following steps: adding inorganic powder and an organic system into a solvent, carrying out ball milling to obtain ball-milled slurry, and carrying out tape casting, cutting and stacking, isostatic cool pressing and glue discharging sintering on the ball-milled slurry to obtain an LTCC ceramic matrix. According to the modified additive, gamma-spodumene and beta-spodumene can be separated out, a part of glass phase is reserved, the CTE adjustable range can be widened, dielectric loss is reduced, and the bending strength is enhanced.

The utility model discloses a flexible low-temperature co-fired ceramic straight-pull type laminating machine which comprises a machine frame, a stock bin, a material taking mechanism, a four-corner cutting mechanism, a transfer mechanism, a laminating mechanism, a discharging carrying mechanism and a discharging conveying mechanism, and the stock bin, the material taking mechanism, the four-corner cutting mechanism, the transfer mechanism, the laminating mechanism, the discharging carrying mechanism and the discharging conveying mechanism are arranged on the machine frame. The material taking mechanism is located on one side of the stock bin and the four-corner cutting mechanism, the to-be-machined ceramic chips in the stock bin are taken out through the material taking mechanism and placed on the four-corner cutting mechanism, and the four-corner cutting mechanism is used for cutting the four corners of the casting ceramic layers of the to-be-machined ceramic chips. The cut to-be-machined ceramic chips are transferred to the laminating mechanism through the transferring mechanism to be laminated, the laminating mechanism compacts the multiple to-be-machined ceramic chips through hydraulic pressure according to the laminating requirement, and the laminated finished products are carried to the discharging conveying mechanism through the discharging carrying mechanism to be discharged. According to the utility model, the connection strength between two adjacent layers of ceramic chips is high, and the ceramic chips are not easy to deform.

The application discloses a copper paste, a preparation method and application thereof, and a multilayer ceramic device and a preparation method thereof, and relates to the technical field of low-temperature co-fired ceramics, wherein the copper paste comprises the following components in the following mass fractions: resin: 3-8 parts; organic solvent: 6.7-19 parts; organic additive: 0.1-2 parts; copper powder: 60-90 parts; glass powder: 0.1-10 parts; inorganic additive: 0.1-10 parts; and the median particle size D50 of the copper powder is 0.5-10 microns. When the copper powder is co-fired with a green tape, the shrinkage rate of the copper powder is consistent with that of the green tape, so that the copper paste and the green tape can be perfectly co-fired, and the problems of cracking, delamination or warping of the finally-prepared ceramic device can be avoided.

The present application relates to the technical fields of multilayer co-fired ceramic packaging substrate and shell, and discloses a multilayer co-fired ceramic packaging inner cavity side wall metallization pattern printing method, which comprises the following steps: completing green ceramic surface pattern and via metallization according to a multilayer ceramic production process; sequentially laminating adjacent layers with the same cavity pattern into a laminated body; coating the upper and lower surfaces of the laminated body, and completing the first cavity gap cutting; filling the metallization paste into the cavity gap by using a screen printing process; removing the excess paste in the cavity gap through a paste extraction table; drying the paste; completing the second cavity pattern cutting; and sequentially laminating each laminated body into a complete laminated body after film tearing. The method is used for printing the metallization pattern of the inner cavity side wall of the multilayer co-fired ceramic packaging, and the side wall metallization area accounts for more than 90%, which solves the problem of high-frequency signal crosstalk, and has uniform metallization thickness, good appearance quality and high production efficiency.

This invention relates to a high-precision wall-mounted and flat-panel printing mechanism, belonging to the field of low-temperature co-fired ceramic production technology. The mechanism includes a base frame, a control cabinet, and a control panel. The control cabinet is housed within the base frame, and the control panel is mounted on the upper surface of the base frame. It also includes a printing module and a conveying module. The printing module comprises a moving component and a scraper component. This invention achieves high-precision alignment and stable reliability of the printing screen through individual fine adjustments in the X, Y, and θ directions. By using height adjustment rings on four mounting bases, the printing screen is individually adjusted at four points, ensuring that the parallelism between the printing screen and the printing platform assembly is ≤0.01mm. Simultaneously, the adjustment rings employ conical surface positioning, ensuring that the accuracy is not affected after the screen is raised and reset as a whole. By switching between the multi-hole suction plate and the support frame, flat-panel printing and wall-mounted printing can be switched, achieving multi-purpose functionality and expanding the printing machine's process range.

The invention discloses a power module, power equipment and a photovoltaic power generation system. The power module comprises a substrate, a first power device, a co-fired ceramic module and a packaging body. The first power device is located on one surface of the substrate, and the first power device is electrically connected with the substrate. The co-fired ceramic module is located on the side, away from the substrate, of the first power device, and the co-fired ceramic module and the first power device are arranged in a spaced mode. The co-fired ceramic module comprises a co-fired ceramic substrate and a second power device, the second power device is embedded in the co-fired ceramic substrate, and the second power device is electrically connected with at least one of the substrate and the first power device. The packaging body wraps the substrate, the first power device and the co-fired ceramic module. By adopting the power module design scheme, the integration level and the power density of the power module are improved, the structural reliability of the power module is ensured, and the power conversion performance of the power module is improved, so that the power density of power equipment is improved, and the power generation efficiency of a photovoltaic power generation system is improved.

The invention relates to the technical field of multi-layer co-fired ceramic packaging substrates and shells, and discloses a multi-layer co-fired ceramic packaging inner cavity side wall metalized pattern printing method which comprises the following steps: completing green ceramic surface pattern and through hole metallization according to a multi-layer ceramic production process; sequentially laminating adjacent layers with the same cavity pattern to form a laminated split body; coating the upper surface and the lower surface of the laminated split body with a film to finish the first time of cavity gap cutting; filling the metalized slurry into the cavity gap by adopting a silk-screen printing process; redundant slurry in the gap of the cavity is pumped away through the slurry pumping table; drying the slurry; the second time of cavity pattern cutting is completed; and after the film is torn off, the laminated split bodies are laminated in sequence to form a complete laminated body. The method is used for multi-layer co-fired ceramic packaging inner cavity side wall metallization pattern printing, the side wall metallization area accounts for 90% or above, the high-frequency signal crosstalk problem is solved, the metallization thickness is uniform, the appearance quality is good, and the production efficiency is high.

The invention discloses tungsten slurry of high-temperature co-fired ceramic and a preparation method of the tungsten slurry, and belongs to the technical field of aluminum oxide ceramics for HTCC (high temperature co-fired ceramic), the tungsten slurry comprises the following components in percentage by weight: 70-89% of tungsten powder, 2-15% of ceramic powder and 5-25% of an organic carrier, the organic carrier comprises a solvent, resin and an auxiliary agent, the solvent comprises two or three of terpilenol, diethylene glycol monobutyl ether and texanol, and the tungsten slurry is prepared according to the technological process of weighing, ball milling and mixing, sieving and drying, organic carrier preparation, mixed material rolling and centrifugal defoaming. According to the preparation method, the types of solvents (including two or three of terpilenol, diethylene glycol monobutyl ether and texanol) in an organic carrier are increased, a compound solution system is adopted, the surface tension and the volatilization gradient are regulated and controlled, the surface tension of the tungsten slurry is reduced, and the surface tension of the tungsten slurry is reduced. And the phenomena of net blockage, line defect and the like during continuous production and printing are avoided.

The present disclosure relates to the field of low-temperature co-fired ceramic, and a low-warp LTCC multilayer ceramic substrate and a preparation method thereof, comprising the following steps: S1, aging treatment is performed on an LTCC green body, and punching and electrode printing are sequentially performed on the aged LTCC green body; S2, the green body on which the punching and electrode printing are completed is subjected to multilayer lamination and hot pressing to obtain a multilayer laminated green body, and a heat release constraint layer is formed on the upper and lower surfaces of the multilayer laminated green body; S3, the multilayer laminated green body on which the heat release constraint layer is formed is subjected to segmented temperature rising and glue removal; and S4, gradient temperature rising sintering is performed under a protective atmosphere, the heat release constraint layer is decomposed or collapsed in the sintering process, low-speed cooling is adopted after sintering, and a low-warp LTCC multilayer ceramic substrate is obtained. Through the setting of aging treatment, low-pressure hot pressing, a heat release constraint layer, segmented glue removal and gradient slow sintering, the present disclosure significantly improves the qualified rate and size accuracy of the product.

The invention provides an electrical component of a multi-layer low-temperature co-fired ceramic chip. The design that laser punching areas are overlapped is adopted on a low-temperature co-fired ceramic material sheet, so that the machining ranges of adjacent laser holes are partially overlapped or closed together, and a composite through hole structure is formed. By means of overlapping of laser processing areas, the degree of freedom of through hole design can be effectively increased, the hole shape stability can be improved, the alignment precision requirement of multiple layers of low-temperature co-fired ceramic material pieces during lamination is lowered, the overall structure can still maintain the conduction quality under the design of high layers of low-temperature co-fired ceramic material pieces, and the product quality is improved. And the multi-layer circuit design of the low-temperature co-fired ceramic material sheet has the advantages of higher density, smaller size and better process tolerance.

The application discloses a low dielectric constant low-temperature co-fired ceramic material system, a preparation method and application, and belongs to the technical field of electronic ceramic materials. In mass percentage, components of the ceramic material system are as follows: a ceramic matrix is 93-99 wt%; a sintering aid is 1-7 wt%; a composition expression of the ceramic matrix is xBaO-yCuO-zSiO2, wherein x in the xBaO-yCuO-zSiO2 ranges from 32 wt% to 44 wt%, y ranges from 16 wt% to 30 wt%, and z ranges from 30 wt% to 52 wt%; and the sintering aid comprises at least one of Li2O-B2O3-SiO2-CaO-Al2O3 glass powder, LiF and BaO-CuO-B2O3 oxide.

The application provides a three-dimensional integrated low-temperature co-fired ceramic radio frequency microsystem containing parallel embedded microchannels, relates to the technical field of radio frequency microsystem integration and thermal management, and aims to solve the technical problem that the prior art cannot simultaneously meet the comprehensive requirements of high heat dissipation efficiency, thermal balance, structural reliability and process compatibility of the three-dimensional integrated radio frequency microsystem. The system comprises: a plurality of low-temperature co-fired ceramic substrate layers which are sequentially stacked from bottom to top; wherein the low-temperature co-fired ceramic substrate layers are respectively provided with array-distributed metallized heat-conducting through holes and metal ground layers; wherein the top low-temperature co-fired ceramic substrate layer and the bottom low-temperature co-fired ceramic substrate layer are respectively provided with embedded microchannels, the microchannels of the top and bottom low-temperature co-fired ceramic substrate layers are arranged in parallel, and the positions of the microchannels are close to the radio frequency chips, so that the heat-conducting through holes and the metal ground layers can timely conduct the heat generated by the radio frequency chips to the microchannels, and the heat dissipation of the radio frequency microsystem is realized.

The invention discloses a surface-mounted small-size high-frequency LTCC (Low Temperature Co-Fired Ceramic) transformer structure and a preparation method thereof, and belongs to the technical field of miniature transformers. Comprising a magnetic core, a winding, a shell, electrodes and a magnetic core mounting cavity. The magnetic core mounting cavity is an annular cavity and is manufactured in the middle area of the LTCC multi-layer low-temperature co-fired ceramic substrate; the magnetic core is an annular magnetic core and is nested in the annular cavity; the winding is manufactured in the LTCC substrate; the electrode is manufactured in the LTCC substrate, and the outer electrode is led out from the surface of the top layer of the LTCC substrate; the inner electrodes are correspondingly connected with the electrodes of the primary coil and the secondary coil of the winding respectively; and the shell, the winding and the electrode are LTCC substrate communities. The problems that an existing transformer cannot be comprehensively compatible with small size, good high-frequency characteristic, small product performance fluctuation, small magnetic leakage, excellent heat dissipation and high insulation and voltage endurance capability are solved. The miniature transformer can be widely applied to the miniature transformer technology in the fields of 5G communication, new energy automobiles, industrial automation, consumer electronics and the like.

The invention discloses a multi-pin electrode LTCC (Low Temperature Co-fired Ceramic) product with an embedded electrode and a preparation method, belongs to the technical field of LTCC, and solves the problem that the plating thickness of a non-conducting pin after electroplating is lower than that of a conducting pin due to small current throughput at the non-conducting pin during electroplating. The method comprises the following steps of: punching a first layer of raw ceramic tape at a position corresponding to a non-conducting pin position, and filling silver paste to obtain a thickening layer; laying a second layer of raw ceramic tape on the thickening layer to obtain an insulating layer; and preparing a main body electrical layer on the insulating layer. According to the manufacturing method, holes are formed in the positions, corresponding to the non-conducting pin positions, of the first layer of raw ceramic tape, the first layer of raw ceramic tape is filled with the metal silver paste, the filled metal silver paste is pressed out of the holes after a product is subsequently sintered according to the material sintering shrinkage principle, and the thickness of the non-conducting pin positions is increased; therefore, the non-conducting pin position after sintering is thicker than the conducting pin position, the thickness difference of an electrode of 7-30 microns after electroplating can be made up, and the problem of high and low pin positions is avoided.

The invention belongs to the field of low-temperature co-fired ceramic materials, and particularly relates to a high-thermal-expansion low-temperature co-fired ceramic material and a preparation method thereof. The preparation method comprises the following steps: by taking fluoride and glass as double sintering aids, mixing calcium oxide powder, fluoride powder and glass powder, adding a binder, carrying out powder tabletting to prepare a circular sheet with uniform thickness, and carrying out vacuum hot-pressing solid-phase sintering to obtain the low-temperature co-fired ceramic material with a high thermal expansion coefficient. The method is simple to operate, easy in condition control and low in cost. The heat conductivity coefficient of the prepared low-temperature co-fired ceramic material is 3-5W / (mK), the thermal expansion coefficient is matched with that of a third-generation semiconductor device, and the low-temperature co-fired ceramic material has a great application prospect in the fields of electronic packaging materials and manufacturing thereof.

The invention provides a multi-layer co-fired ceramic hot cutting process simulation method and system. The method comprises the steps that all material attributes in the multi-layer co-fired ceramic hot cutting process are determined; the method comprises the following steps of: establishing a two-dimensional model for predicting changes of a stress field and a temperature field in a hot cutting process of the multi-layer co-fired ceramic by adopting COMSOL simulation software by adopting a method for generating non-overlapping random particles in a limited region; constructing a physical field based on each material attribute and the two-dimensional model; setting parameters and boundary conditions of a physical field, and constructing a control equation; solving the control equation to obtain stress field and temperature field changes of each part of the multi-layer co-fired ceramic in different time periods; stress field distribution and temperature field distribution of the multi-layer co-fired ceramic in the hot cutting process are simulated and analyzed. According to the method, the calculation efficiency is considered, the understanding of the microcosmic behavior of the multi-layer co-fired ceramic in the thermal cutting process is remarkably improved, and theoretical support is provided for process optimization and structural design.