103 results about "Co-fired ceramic" patented technology

The invention belongs to the technical field of low-temperature co-fired ceramics, and particularly relates to a high-density and high-strength LTCC (Low Temperature Co-fired Ceramic) raw ceramic chip as well as a preparation method and application thereof. The preparation method comprises the steps that stacking phase powder and filling phase powder in raw materials are fully mixed and then subjected to tape casting, the equivalent particle size ratio of the stacking phase powder to the filling phase powder is 1: (0.4-0.8), and the volume ratio of the stacking phase powder to the filling phase powder is 1: (0.15-0.45). The high-density and high-strength LTCC raw ceramic chip is used for preparing a low-temperature co-fired ceramic substrate. According to the technical scheme provided by the invention, the raw ceramic chip raw materials can be tightly arranged after being fully mixed through the inorganic powder with different particle sizes and matching the dosage ratio of the inorganic powder to the raw ceramic chip raw materials, and low porosity in the sintered substrate is realized on the basis of not changing the substrate raw material composition or crystal whiskers; and therefore, the bending strength is improved, and other properties are not influenced.

The invention discloses a metallization preparation method for a side cavity wall of a small-size multi-layer co-fired ceramic product. The metallization preparation method comprises the following steps: reserving process edges around a plurality of single small-size multi-layer co-fired ceramic products, and arranging the single small-size multi-layer co-fired ceramic products on a green ceramic chip in an array; processing the green ceramic chip and the metal slurry by adopting a multi-layer co-fired ceramic product manufacturing process to obtain a full-page formed green ceramic body; processing a side cavity on the green ceramic body; two cavity opening tools are manufactured, a whole green ceramic body is fixed in the two cavity opening tools, the surfaces of the cavity opening tools are scraped through rubber scrapers, metal slurry is squeezed into side face cavities, redundant metal slurry is pumped away through a vacuum adsorption table, and the metal slurry is attached to the walls of the side face cavities; separating a single product to obtain an independent multilayer ceramic product green body; and sintering to obtain a multilayer ceramic product with metalized side cavity walls. According to the invention, the problems of deformation of a metallized cavity of a side cavity wall of a small-size multi-layer co-fired ceramic product, high operation difficulty and low production efficiency can be solved.

The invention discloses conductive silver paste for a co-fired ceramic inner electrode and a preparation method of the conductive silver paste. The conductive silver paste comprises the following components in percentage by mass: 80%-90% of silver particles, 0%-10% of an inorganic additive, 5%-20% of a carrier, 0.6%-0.9% of an inorganic additive, 0.3%-1% of an auxiliary agent, 0.2%-0.4% of an organic additive and 0.8%-5% of an organic solvent. The preparation method comprises the following steps: mixing raw materials, dispersing, adjusting and filtering. Conductive silver particles are prepared through a chemical synthesis method, and the silver powder particles are further stirred and sheared to be refined, so that the purity of the silver particles is higher, and the conductivity is improved; meanwhile, the dispersity and the stability of the conductive particles are improved by adding auxiliaries, and the fluidity and the viscosity of the slurry are adjusted by utilizing an organic solvent, so that the slurry can cover the surface of a ceramic body in a better fit manner, the situation that silver ions permeate and diffuse to the ceramic substrate in the co-firing process of the electric silver slurry and the ceramic substrate is avoided, and the insulativity of the ceramic substrate is improved.

The invention discloses a ceramic substrate, a low-temperature co-fired ceramic device and a preparation method of the low-temperature co-fired ceramic device, and belongs to the technical field of low-temperature co-fired ceramics. The ceramic substrate comprises a first ceramic dielectric layer and a first electrode layer; one side of the first ceramic dielectric layer is provided with a slotted hole, and the slotted hole is filled with a first auxiliary electrode; the first electrode layer is arranged on one side, provided with the slotted hole, of the first ceramic dielectric layer; the first electrode layer comprises a first electrode, and the first electrode is connected with the first auxiliary electrode. According to the embodiment of the invention, the adhesive force of the electrode in the ceramic substrate can be improved, and the reliability of a low-temperature co-fired ceramic device can be improved.

The invention discloses a metallization method for the side wall of a cavity of a low-temperature co-fired ceramic substrate. The metallization method comprises the following steps of: sequentially performing punching treatment on each layer of green ceramic chip according to a preset cavity outline; during lamination, the hole sites on the adjacent green ceramic chips are arranged in a staggered and overlapped manner; the holes are filled with metal slurry in a solid mode, and a blank plate with solid metal points is obtained after drying and leveling treatment; each layer of blank plate is cut according to the cavity contour in sequence; the outline of the cavity is a line connected with each solid metal point on the blank plate; and laminating and pressing the cut blank plates, and co-firing to obtain the ceramic substrate with the metalized cavity side wall. The round holes are designed in the contour lines of the cavities of the green ceramic chips, then the solid metal slurry is filled in the green ceramic chip stage, and the green ceramic chips are laminated and co-fired, so that metal interconnection in all the round holes in the contour area of the substrate is realized, after the cavities are formed, the filled metal slurry is immediately exposed, and metallization of the side walls of the cavities of the substrate is completed.

The invention provides an aerosol generating device and a coil assembly thereof, the coil assembly comprises a ceramic base body and a conductive heating body, the ceramic base body defines a heating cavity, and the heating cavity is used for accommodating an aerosol forming substrate; and the conductive heating body is arranged on the ceramic substrate, and is used for heating the aerosol forming substrate to generate aerosol. According to the coil assembly, the co-fired ceramic coil and the integrated design of the coil and the heating cavity are adopted, the distance between the coil and the cigarette is closer, meanwhile, a heating cavity base body is a ceramic base body, the heat conduction capacity is higher, heat generated by the coil can be better transmitted to a tobacco section, and effective utilization of the heat is facilitated.

The present invention discloses a low-temperature co-fired ceramic / glass composite material and its preparation method and application, belonging to the technical field of ceramic materials. The present invention uses aluminum oxide (Al2O3) as a ceramic phase, CaO-B2O3-SiO2 (CBS) and zinc-boron glass as a glass phase, and adds K2O, CuO, and Nb2O5. When the low-temperature co-fired ceramic / glass composite material is used to prepare microelectronic components, its firing temperature can be reduced to 800°C to 850°C, and the dielectric constant can be reduced to 7.0-8.5, and the dielectric loss can be reduced to 0.3×10 ‑3 ~0.7×10 ‑3 (1MHz).

The invention discloses a 3dB bridge which comprises a multi-layer dielectric body, and a first coupling line and a second coupling line are arranged on the two opposite sides of the multi-layer dielectric body respectively and are overlapped on the wide side of a coupling part. The first coupling line and the second coupling line are respectively divided into parallel finger-shaped conductor sections at the coupling part, and the adjacent finger sections correspond in a cross-layer staggered manner to form a multi-scale coupling channel of the same coupling part; corresponding input ends and output ends are respectively led out from the first coupling line and the second coupling line; and a parasitic resonance unit which is electromagnetically coupled with the finger section is arranged in the multilayer dielectric body at a distance d1 from the transverse edge of the coupling part. The 3dB bridge enables in-band coupling to be self-balanced along with frequency, a parasitic unit compensates a band edge in situ in a near field, the problem that single-scale coupling and boundary cannot be quantized is solved, wider fractional bandwidth, flatter amplitude and phase and improvement of band edge directivity and port isolation are achieved, repeatability and mass production consistency are ensured through d1, d2, T, k1 and k2 constraints, and the 3dB bridge adapts to co-fired ceramic packaging.

The invention relates to the technical field of ceramic materials, in particular to a high-thermal-expansion-coefficient low-temperature co-fired ceramic composite material, a preparation method thereof and an electronic component. The invention discloses a low-temperature co-fired ceramic composite material. The low-temperature co-fired ceramic composite material is prepared by mixing glass and ceramic, comprising the following components in percentage by mass: 30 to 50 percent of SiO2, 5 to 10 percent of CaO, 10 to 20 percent of Al2O3, 20 to 30 percent of ZrO2, 5 to 10 percent of B2O3, 1 to 2 percent of K2O and 1 to 2 percent of Na2O. The low-temperature co-fired ceramic composite material with the high thermal expansion coefficient is better matched with a PCB material, the dielectric constant of the low-temperature co-fired ceramic composite material with the high thermal expansion coefficient is smaller than 6.5, the dielectric loss is smaller than 0.002, the bending strength is larger than 150 MPa, welding spots and product deformation and cracking caused by thermal mismatch caused by thermal expansion and cold contraction in the welding process can be reduced, and the product quality is improved. And the problem of product failure is solved.

The application provides a low-temperature co-fired ceramic powder material and a preparation method and application thereof, and relates to the technical field of electronic ceramic materials.The low-temperature co-fired ceramic powder material provided by the application comprises the following raw material components in parts by weight: borosilicate glass powder 50-60 parts, quartz glass powder 30-40 parts, and powder additives 5-10 parts, wherein the powder additives comprise at least one of Al2O3, ZrO2, MgO and BaO.The low-temperature co-fired ceramic powder material prepared by compounding borosilicate glass powder, quartz glass powder and powder additives has a dielectric constant εr=3.8-4.5 after sintering, a low dielectric loss tan δ=0.001-0.0025, and a resistivity ρ=1.0-9.9*10 12 Ω*cm, the sintering temperature is in the range of 850-900 DEG C, and the density after sintering is good, and can be up to 99.8%.

According to the technical scheme, the manufacturing method of the aluminum nitride high-temperature co-fired ceramic tube shell comprises the steps that an upper part and a lower part of a green ceramic chip subjected to hole filling printing are laminated in a segmented mode, the upper part is the thickness of a boss, and the lower part is the thickness of a base; generating the appearance of the platform and a circle of blank outside the platform on the blank laminated on the upper part of the green ceramic chip, punching an electrostatic film, removing the electrostatic film in the middle of the platform, and carrying out secondary lamination and hot pressing on the base part of the blank of the green ceramic tape, the processed whole electrostatic film with the cavity, the platform part and the blank outside the platform on a lamination plate to obtain the green ceramic tape. And taking off the green body and the electrostatic film outside the platform from the laminated green ceramic block to obtain the green body of the product, and sintering the green body of the product to obtain the aluminum nitride high-temperature co-fired ceramic tube shell. According to the invention, the manufacturing of the isolated platform is realized by adopting a laminating method of combining the electrostatic film and the raw ceramic block, no connecting lappets need to be added, and the appearance of the ceramic is not influenced.

The method comprises the following steps: (1) preparing high-temperature inorganic binding phase glass powder: heating silicon dioxide, aluminum oxide, calcium oxide, titanium oxide and barium oxide to a melting temperature, quenching, completely cooling, and crushing to obtain high-temperature inorganic binding phase glass powder; the inorganic binding phase glass powder is obtained; (2) weighing a conductive phase, a sintering framework, a catalyst and inorganic binding phase glass powder, and mechanically mixing to obtain composite powder; (3) preparing an organic carrier: uniformly mixing the additive solution with a solvent to obtain the organic carrier; and (4) preparing the copper oxide-tungsten conductive paste: mixing the composite powder with an organic carrier, grinding, and defoaming to obtain the copper oxide-tungsten conductive paste adaptive to the medium-temperature co-fired ceramic. The blank in the field of medium-temperature co-fired ceramic conductive paste is filled, and the medium-temperature co-fired ceramic conductive paste has an obvious price advantage.

This invention relates to the field of glass-ceramic technology, specifically providing a low-temperature co-fired ceramic, its preparation method, and its application. The raw materials for the low-temperature co-fired ceramic include VSBBS glass frit and ceramic frit, with the total weight of the VSBBS glass frit and ceramic frit being 100%. The mass percentages of the VSBBS glass frit and ceramic frit are 20-40% and 60-80%, respectively. The raw materials for the VSBBS glass frit, by mass percentage, include 10-30 wt% vanadium oxide, 10-30 wt% antimony oxide, 10-30 wt% barium oxide, 10-20 wt% boron oxide, and 30-50 wt% silicon oxide, with the sum of all oxides being 100%. The LTCC material obtained by this invention achieves excellent millimeter-wave dielectric properties, with a relative permittivity between 4.8 and 6.8, a dielectric loss less than or equal to 0.001, and a flexural strength of 180-230 MPa.

The invention belongs to the technical field of precise functional ceramic parts, and particularly relates to multilayer ceramic for an electrostatic chuck and a preparation method of the multilayer ceramic. According to the preparation method of the multilayer ceramic, a ceramic biscuit is formed in a water-based gel tape casting mode, and then the compact aluminum oxide multilayer co-fired ceramic is prepared through the steps of cross-linking curing, lamination, degreasing, sintering and the like. According to the method, the shrinkage rate of the ceramic biscuit in the curing process is reduced by optimizing the components of the ceramic slurry, the abdicating space corresponding to the electrode structure is machined in advance, and the space for compensating the shrinkage of the ceramic in the sintering process is machined in the ceramic substrate in advance by adopting the laser stealth cutting process; the deformation problems of warping, bulging and the like in the multi-layer ceramic sintering process are solved, and then the electrostatic chuck which is high in flatness and uniform in electrode layer distribution is prepared.

The invention discloses a low-temperature co-fired ceramic three-dimensional packaging structure, which belongs to the technical field of semiconductors, and comprises a metal bottom plate, a ceramic bottom plate arranged at the center of the top of the metal bottom plate, a grouting opening formed in the peripheral section of the ceramic bottom plate, a ceramic middle clamping plate arranged at the top of the ceramic bottom plate, and a middle bracket arranged at the center of the top of the ceramic middle clamping plate. An embedded plate frame is arranged at one end of the middle bracket; according to the invention, the ceramic bottom plate is matched with the ceramic middle clamping plate and the ceramic top plate for linkage and mutual matching use, the slurry explosion grooves and the slurry overflow thin grooves are used for guiding ceramic slurry to be injected among the multiple groups of splicing plate bodies in a pressurized manner during a static pressure period, and areas which are easy to damage and have cavities among the multiple groups of splicing plate bodies are filled and reinforced; a static pressure process is matched with ceramic slurry to tightly adhere and fix a plurality of groups of plate bodies, so that holes among the plate bodies are effectively avoided, the connection strength among the plate bodies is improved, and the phenomena of cracks and internal damage caused by the influence of a use environment, temperature and other pressures are avoided.

The invention discloses a first-tearing and second-pressing laminating machine for flexible low-temperature co-fired ceramics. The first-tearing and second-pressing laminating machine comprises a feeding mechanism, a fine adjustment mechanism, a first visual positioning mechanism, a cutting mechanism, a liftable adjusting mechanism, a second visual positioning mechanism, a film tearing mechanism, a waste recycling box, a laminating mechanism and a discharging bin. Ceramic in the feeding bin is grabbed through a feeding mechanical arm and placed on a fine adjustment platform of the fine adjustment mechanism; the fine tuning platform is combined with the first visual positioning mechanism to perform visual positioning adjustment on the ceramic on the fine tuning platform; the cutting mechanism is used for trimming the upper ceramic layer of the ceramic on the fine adjustment platform and transferring the upper ceramic layer to a liftable adjusting platform of the liftable adjusting mechanism after trimming is completed; the liftable adjusting platform is combined with the second visual positioning mechanism to carry out secondary visual positioning adjustment on the ceramic on the liftable adjusting platform; and the laminating mechanism receives the ceramic on the lifting adjusting platform, PET film tearing is carried out through the film tearing mechanism, and then laminating operation is carried out. The device is high in automation degree, high in production efficiency, high in quality and low in labor cost.

The invention belongs to the technical field of low-temperature co-fired ceramics, and particularly relates to a preparation method of a low-temperature co-fired ceramic high-density green ceramic chip. The preparation method comprises the following steps: glass powder modification, ceramic powder modification, primary ball milling, secondary ball milling and tape casting. According to the technical scheme provided by the invention, two ionic or organic substances which can attract or combine with each other are adopted to modify the surfaces of the glass powder and the ceramic powder respectively, so that the problem of sedimentation after primary ball milling is avoided; the two kinds of inorganic powder are subjected to ball milling, mixing and dispersing, and the distance between the two kinds of powder in the slurry is shortened through the interaction between ions or groups on the surfaces of the powder, so that the affinity between the powder is improved, and the compactness of the green ceramic chip is improved.

This invention relates to the field of special ceramic product manufacturing technology, specifically to a method for preparing an airtight ceramic base, comprising: a co-fired ceramic substrate, wherein the co-fired ceramic substrate is provided with a dense support layer, an interconnected functional layer, and a cavity sealing layer sequentially from bottom to top; the dense support layer is a high-purity alumina dense ceramic layer with a thickness ≥0.2mm; the interconnected functional layer is an integral sintered layer composed of a multi-layered stacked alumina ceramic dielectric layer and an embedded tungsten metallized three-dimensional interconnected structure; the cavity sealing layer is an alumina ceramic layer with a concave cavity structure, and the edge of the concave cavity is provided with an annular stress buffer groove. The airtight ceramic base of this invention, through structural innovation and synergistic optimization of the manufacturing process, adopts a three-layer integral co-fired ceramic substrate structure of the same material, combined with a rounded corner annular stress buffer groove design at the cavity edge, solving the problems of sintering warping, interlayer delamination, and stress concentration cracking.

This application discloses a method for fabricating conductive lines on a multilayer co-fired ceramic substrate and the multilayer co-fired ceramic substrate itself, relating to the field of electronic ceramic multilayer co-fired manufacturing technology. The method for fabricating conductive lines on the multilayer co-fired ceramic substrate includes: providing a green ceramic film strip for multilayer stacking and co-firing; forming conductive patterns on the surface of the green ceramic film strip using nanoimprinting technology, aligning and stacking it with at least one other green ceramic film strip, and laminating it to form a stack; and performing adhesive removal and co-firing treatment on the stack to form embedded conductive lines within the stack. The fabrication method proposed in this application can fabricate conductive lines with linewidths and spacings less than 50 μm, achieving embedded forming of conductive lines in multilayer structures. It can be used in conjunction with via drilling / filling and stack alignment processes for precision packaging of three-dimensional integrated circuits such as high-density multilayer wiring, high-frequency and high-speed circuits, and power electronic integration.

The invention provides a low-temperature co-fired ceramic delay line. The low-temperature co-fired ceramic delay line comprises a ceramic substrate, a time delay structure, an input electrode, an output electrode and a grounding electrode, the time delay structure is packaged in the ceramic substrate, the time delay structure comprises grounding layers and a time delay unit, the grounding layers are arranged on the upper side and the lower side of the time delay unit, a complete shielding environment is formed, external electromagnetic interference can be reduced, and time delay stability is improved. And the time delay unit is responsible for introducing required signal delay to ensure that the signal can be propagated in a low-loss manner according to a predetermined path. The input electrode and the output electrode are responsible for signal input and output respectively, one end of the input electrode is connected to the input end of the time delay unit, and the other end of the input electrode extends to the outer side of the ceramic substrate so as to be electrically connected with an external circuit conveniently. One end of the output electrode is connected to the output end of the time delay unit, and the other end extends out of the ceramic substrate. One end of the grounding electrode is connected to the grounding layer, and the other end extends out of the ceramic substrate so as to be electrically connected with an external circuit.

The utility model belongs to the technical field of material science, and particularly relates to a low-temperature co-fired ceramic dielectric material forming performance testing device which comprises a workbench, a fixing plate is fixedly installed on the side face of one end of the workbench, a fixing support is fixedly installed on the side face of the fixing plate, and a supporting plate is fixedly installed on the side face of the fixing support. A motor is fixedly installed at the top of the supporting plate, the output end of the motor penetrates through the interior of the fixing support and is fixedly provided with a threaded rod, a nut is installed outside one end of the threaded rod in a threaded mode, a first moving block is fixedly installed outside the nut, and fixing rods are fixedly installed at the two ends of one side of the fixing support. The motor drives the threaded rod to rotate, the threaded rod drives the first moving block to move, the first moving block drives the second moving block, and the second moving block moves to drive the clamp to move, so that the effect of fixing the detected object is achieved, and the consistency and reliability of the test result of the detected object are effectively improved.

The invention provides an embedded fan-out packaging method and a packaging structure thereof, and the preparation method comprises the steps: S1, manufacturing a co-fired ceramic embedded substrate which is provided with a plurality of through cavities penetrating through the substrate, the thickness of the lower part of each through cavity is greater than the thickness of a chip, and the area of the upper part of each through cavity is greater than that of the lower part of each through cavity; s2, bonding the co-fired ceramic embedded substrate on the temporary bonding substrate by using a temporary bonding film; s3, the chip is attached into the through cavity, and the front face of the chip is tightly attached to the temporary bonding film; s4, filling glue is injected into the through cavity, and the height is larger than the height of the lower portion of the through cavity and smaller than the height of the upper portion of the through cavity; s5, the cover plate is placed on the upper portion of the through cavity, and the filling glue is extruded so that the gap between the cover plate and the through cavity can be filled with the filling glue; s6, carrying out de-bonding, so that the packaging body structure is separated from the temporary bonding film; s7, preparing single-layer or multi-layer fan-out rewiring on the lower surface of the packaging body structure; and S8, packaging components on the upper surface of the packaging body structure, and planting solder balls on the lower surface of the packaging body structure.

A copper powder having a surface treatment layer, the copper powder containing at least one organic acid salt from among organic acid salts containing Al and organic acid salts containing Ti.

According to the technical scheme, the aluminum oxide high-temperature co-fired ceramic with the double-layer cover plate comprises a ceramic substrate, an enclosure frame is welded to the upper surface of the ceramic substrate, the height of an internal partition wall of the enclosure frame is reduced, the height of an outer frame of the enclosure frame is increased, and a step table is formed. The shape of an internal partition wall of the enclosure frame can be designed in various shapes according to actual tube shell radio frequency requirements and internal component distribution, an outer frame of the enclosure frame is always kept in a regular shape, a lower-layer cover plate is bonded in the outer frame of the enclosure frame, and an upper-layer cover plate is welded to the upper surface of the outer frame of the enclosure frame in parallel in a sealing mode. According to the utility model, the original special-shaped cover plate can be divided into two parts through the stepped special-shaped enclosure frame, the lower-layer cover plate retains the special-shaped characteristic to be embedded into the partition wall and is fixed by conductive adhesive and the like, and the upper-layer cover plate is a cover plate with a regular appearance and can be packaged by adopting parallel seal welding, so that the cost of the parallel seal welding is lower than that of gold-tin welding; and the process difficulty is lower.

The invention relates to the technical field of transformers, and discloses a low-temperature co-fired ceramic planar transformer which comprises a base, an insulating cover plate is installed on the upper portion of the base, a lower magnetic core is arranged in the middle of the base, an upper magnetic core is arranged in the middle of the insulating cover plate, a substrate set is arranged on the upper portion of the base, and the substrate set is arranged on the outer ring of the lower magnetic core and the outer ring of the upper magnetic core in a sleeving mode. A differentiation assembly and a protection assembly are arranged in the insulating cover plate, and an installation assembly and a curing assembly are arranged in the base. A differentiation assembly is arranged on the side edge of the insulating cover plate, a first bevel gear is driven to rotate by screwing a first rotary knob, a push rod is driven to rotate and slide along a rail under transmission of a second bevel gear and a center rod, then a rubber ring is pushed to be clamped to the edge of a gap of a base plate set, the base plate set is differentiated, and connection is achieved through the flexible rubber ring; the overall flexibility of the substrate group is improved, chain damage caused by damage of a single substrate is avoided, the reliability of the device is improved, and the service life of the device is prolonged.

The utility model belongs to the technical field of mixing of low-temperature co-fired ceramic dielectric materials, and particularly relates to a mixing device of low-temperature co-fired ceramic dielectric materials, which comprises a mounting frame, a rectangular frame is fixedly mounted on the mounting frame, a screening box is mounted on the rectangular frame, a first feed port is arranged above the screening box, and a second feed port is arranged above the screening box. A first supporting frame is installed on the outer side face of the screening box, a first motor is installed on the first supporting frame, and the output end of the first motor is connected with a driving gear. The screening device is arranged in the smashing box to screen ceramic powder, the scraping rod piece is arranged in the stirring box, the bottom face in the stirring box is scraped through rotation of the arc-shaped rod piece, the overall yield of ceramic dielectric materials after mixing is improved, and the working efficiency is improved.

The embodiment of the invention provides a phased array system heat dissipation structure based on fan-out packaging and a working method. The heat dissipation structure comprises a fan-out packaged radio frequency chip and antenna array, a high-temperature co-fired ceramic substrate, a printed circuit board, a radio frequency feed network, a control and power supply network, a metal piece, a radio frequency interface and a power module. Wherein the fan-out packaged radio frequency chip and the antenna array are welded on the upper surface of the high-temperature co-fired ceramic substrate; the high-temperature co-fired ceramic substrate and the printed circuit board are respectively welded and fixed on the upper surface of the metal piece; the radio frequency feed network and the control and power supply network are embedded in the high-temperature co-fired ceramic substrate and the printed circuit board; the radio frequency interface and the power supply module penetrate through the metal piece and are welded to the lower surface of the printed circuit board.

The present invention discloses a semiconductor ceramic-based circuit board and a high-precision processing method thereof, specifically including: providing a substrate, on which a low-temperature co-fired ceramic raw material layer is preset; opening through holes in the low-temperature co-fired ceramic raw material layer and filling metal paste in the through holes; performing low-temperature co-firing on the low-temperature co-fired ceramic raw material layer and the metal paste by microwave, so that the low-temperature co-fired ceramic raw material layer is sintered into a co-fired ceramic layer, and metal columns formed by the metal paste are embedded in the co-fired ceramic layer; covering the column end faces of the metal columns with nickel powder, and melting and covering the nickel powder on the metal columns by laser to form a nickel layer. By microwave heating, the inside and outside of the low-temperature co-fired ceramic raw material layer are heated synchronously, improving the position accuracy and size accuracy of the through holes. By laser cladding, the nickel powder is melted and covered on the column end faces of the metal columns to form a nickel layer, which can prevent the metal columns from separating from the through holes; the position accuracy and size accuracy of the through holes can be maintained, and the stability of the structure can be maintained.

To provide a whole crystal phase low temperature co-fired ceramic powder and a manufacturing method and application thereof, for overcoming performance deterioration due to introduction of a glass phase to a low temperature co-fired ceramic.SOLUTION: A raw material composition of a low temperature co-fired ceramic powder comprises xRO yM2O3 zXO2, where R is at least one kind of Mg, Ca, Ba, Zn, Cu and Pb, M is at least one kind of B, Al, Co, In, Bi, Nd, Sm and La, X is at least one kind of Si, Ge, Sn, Ti, Zr and Hf, 0≤x≤85 wt.%, 15 wt.%≤y≤90 wt.%, 10 wt.%≤z≤85 wt.%, and x+y+z=1 are satisfied, the low temperature co-fired ceramic powder is obtained by high temperature melting, hardening treatment, and recrystallization treatment, a temperature of the high temperature melting is 1200°C-1600°C, and a temperature of the recrystallization treatment is 500°C-900°C.SELECTED DRAWING: Figure 3