870 results about "Co-fired ceramic" patented technology

A light emitting device comprises: a package (low temperature co-fired ceramic) having a plurality of recesses (cups) in which each recess houses at least one LED chip and at least one phosphor material applied as coating to the light emitting light surface of the LED chips, wherein the phosphor material coating is conformal in form. In another arrangement a light emitting device comprises: a planar substrate (metal core printed circuit board); a plurality of light emitting diode chips mounted on, and electrically connected to, the substrate; a conformal coating of at least one phosphor material on each light emitting diode chip; and a lens formed over each light emitting diode chip.

Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability. The package structure is composed of a beacon formed on a metal or non-metal substrate having high heat conductivity to mount a high power light-emitting diode chip, to increase heat release properties; a wiring portion provided on the same line as the diode to input and output power and signals; and a reflection cup having a cavity, which may be inserted into or attached to the heat spreader or the wiring substrate, including a low temperature co-fired ceramic substrate, a high temperature co-fired ceramic substrate, or a printed circuit board.

A hermetic multilayered ceramic semiconductor package for micromachined semiconductor devices. A low temperature co-fired ceramic assembly has a cavity and a top and bottom surface. Several vias extend between the top and bottom surfaces and several solder spheres are located on the top surface and are electrically connected to the vias. A micromachined semiconductor device abuts the bottom surface and covers the cavity such that a movable portion of the micromachined semiconductor device is unconstrained to move within the cavity. Solder is used to connect the vias to solder bumps on the semiconductor device. A seal ring is located between the micromachined semiconductor device and the ceramic assembly for hermetically sealing the micromachined semiconductor device.

A filter capacitor comprising a substrate of at least one layer of a low temperature co-fires ceramic (LTCC) tape supporting alternating active and ground electrode layers segregated by a dielectric layer is described. The substrate is preferably a laminate of three LTCC tapes pieces that are heated under pressure and at a relatively low temperature to become a laminate that maintains its shape and structure dimensions even after undergoing numerous sintering steps. Consequently, relatively thin active and ground electrode layers along with the intermediate dielectric layer can be laid down or deposited on the LTCC substrate by a screen-printing technique. A second laminate of LTCC tapes is positioned on top of the active/dielectric/ground layers to finish the capacitor. Consequently, a significant amount of space is saved in comparison to a comparably rated capacitor or, a capacitor of a higher rating can be provided in the same size as a conventional prior art capacitor.

A variable capacitor device using MEMS or micromachining techniques wherein thin-films of materials are deposited, patterned and etched to form movable micromechanical elements on the surface of a substrate composed of either semiconductor, glass, metal, or ceramic material. In one embodiment of the present invention to achieve higher frequency performance as well as other benefits, the substrate is comprised of Low-Temperature Co-Fired Ceramics (LTCC). The variable capacitor is an electrostatically actuated micromechanical device and if fabricated on a LTCC multi-layered substrate material has continuous electrical connections through the layers. The same LTCC substrate material can also be used to enclose the device by selectively removing a portion of the upper substrate so as to form a cavity. The two substrates are then bonded together to enclose and protect the variable capacitor. An integrated circuit can be incorporation onto the multi-level substrate structure to enable a electronic closed-loop controlled variable capacitor module. The integrated circuit is flip-chip bonded at the bottom of the substrate structure with appropriate electrical connections between the integrated circuit and the MEMS variable capacitor device. A variation of the present invention utilizes a zipper actuation method wherein the tuning ratio of the variable capacitor is increased to very high levels. Yet another variation of the present invention utilizes a differential gap between the top and bottom electrodes such that the actuation electrodes do not physically contact one another. Yet another implementation of the present invention uses an extra set of electrodes or mechanical mechanism so as to lock the value of the capacitor indefinitely. Yet another implementation uses shaped actuation electrodes so as to linearize the relationship between the applied actuation voltage and the resultant capacitance of the device.

An implantable medical device (IMD) and methods of fabricating the same are provided. An IMD can include a housing and a cofire ceramic module (CCM) coupled to the housing. The CCM can include an antenna cofire-integrated in the CCM. The antenna can include a plate composed of conductive material, and conductive antenna elements that are annular substrates having perimeters substantially coextensive with the perimeter of the plate. The antenna can also include interconnections. A first set of interconnections can be coupled between the plate and one of the conductive antenna elements, and a second set of interconnections can be coupled between the conductive antenna elements. The antenna can also include a feed line conductively coupled to the plate. In some embodiments, the feed line can be substantially serpentine-shaped to adjust impedance in the CCM.

A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together. The waveguide relocator panel and the beam control tiles are designed to route RF signals to and from a respective transceiver module of four transceiver modules and a quadrature array of antenna radiators matched to free space formed in the faceplate. Planar type metal spring gaskets are provided between the interfacing layers so as to provide and ensure interconnection between mutually facing waveguide ports and to prevent RF leakage from around the perimeter of the waveguide ports. Cooling of the various components is achieved by a pair of planar forced air heat sink members which are located on either side of the array of beam control tiles. DC power and control of the T/R cells is provided by a printed circuit wiring board assembly located adjacent to the array of beam controlled tiles with solderless DC connections being provided by an arrangement of “fuzz button” electrical connector elements.

The invention discloses a universal type automatic loading and unloading system of a bottom tool separation method based on a conveyor belt, and relates to the technical field of loading and unloading devices and high temperature co-fired ceramic processing devices. The universal type automatic loading and unloading system comprises a bottom tray separation mechanism, a locating and material taking mechanism, a tray bottom collection mechanism, trays, a sensor and a controller which are sequentially arranged on a rack, wherein the bottom tray separation mechanism comprises a three-station jacking device and a tray clamping device; the locating and material taking mechanism comprises a double-station jacking and locating device and a loading and unloading mechanical hand; the tray bottom collection mechanism comprises a double-station jacking and clamping device; and the bottom tray separation mechanism, the locating and material taking mechanism, the tray bottom collection mechanism and the sensor are connected with the controller. Through the adoption of the system, the continuity of the processing process and flexibility of loading and unloading can be improved, the loading and unloading system is a modularized standard single machine and can be matched with processing devices of products and raw ceramics of various types, the integration level is high, the loading and unloading location accuracy is high, the takt is compact, and the universality is high.

The invention discloses an LTCC (Low Temperature Co-fired Ceramic) lowpass filter which comprises an input end and an output end, wherein the input end is connected with input ends of the first pair of LC parallel harmonic oscillators (L2, C2), output ends of the first pair of LC parallel harmonic oscillators are connected with input ends of the second pair of LC parallel harmonic oscillators (L4, C4), output ends of the second pair of LC parallel harmonic oscillators are connected with input ends of the third pair of LC parallel harmonic oscillators (L6, C6), and output ends of the third pair of LC parallel harmonic oscillators are connected with the output end of the lowpass filter; parallel grounding capacitors C3 are arranged between connecting points of the first pair of LC parallel harmonic oscillators and the second pair of LC parallel harmonic oscillators and ground, parallel grounding capacitors C5 are arranged between connecting points of the second pair of LC parallel harmonic oscillators and the third pair of LC parallel harmonic oscillators and the ground, and parallel grounding capacitors C7 are arranged between connecting points of the third pair of LC parallel harmonic oscillators and the ground. The filter adopts a standard encapsulation structure, has the advantages of small volume, low cost, good frequency selecting property, good temperature stability and the like and is favorable to massive production.

The invention discloses a Ti-based microwave medium ceramics material by low-temperature sintering. The Ti-based microwave medium ceramics material takes rutile TiO2 as a main phase. The general formula of the prescription of the invention is that: (AxM2x)(NyTi1-y)1-3xO2, (BxM3x)(NyTi1-y)1-4xO2, (CxMx)(NyTi1-y)1-2xO2 or (1-m) TiO2-mBi2Ti4O11, wherein, the A is one of bivalent ions such as Zn<2+>, Cu<2+>, Ni<2+>, the B one of univalent ions such as Li<+>, the C one of trivalent ions such as Al<3+>, Fe<3+>, M is one of pentavalent ions such as Nb<5+>, Ta<5+>, Sb<5+>, N one of quadrivalent ions such as Zr< 4+ >, Sn< 4+ >, Mn< 4+ >; the X is more than or equal to 0 and less than or equal to 0.25, the Y more than or equal to 0 and less than or equal to 0.5, the m more than or equal to 0 and less than or equal to 0.15, the n is more than or equal to 0 and less than or equal to 2. The microwave medium ceramics material by low-temperature sintering has the advantages of high dielectric constant, low dielectric loss, wide covering range of temperature coefficient of resonant frequency, low sintering temperature, simple preparation technique and adjustable temperature coefficient of resonant frequency according to materials. The invention can be used for Low Temperature Co-fired Ceramics System (LTCC system) and used for producing microwave devices such as multi-media resonators, filters, etc.

In accordance with the invention a light source for an image projection system comprises one or more LEDs packaged for high temperature operation. Advantageously, the LED die are disposed on a package comprising a ceramic coated metal base including one or more underlying thermal connection pads, and underlying electrical connection pads, each LED die thermally coupled through the metal base to a thermal connection pad and electrically coupled to electrical connection pads. The LED can be mounted directly on the metal of the base or on a thin coating of electrical insulator on the metal. Arrays of LED die thus packaged are advantageously fabricated by the low temperature co-fired ceramic-on-metal technique (LTTC-M) and can be referred to as LTTC-M packaged arrays. The LEDs are advantageously mounted in an array of cavities having tapered sides to reflect light from the LEDs. The high temperature LED light sources can substitute for HID lamps in a variety of front and rear projection systems and displays. They are particularly useful for rear projection systems.

The invention discloses an LTCC-stacked microstrip patch antenna, pertains to the antenna technical field and relates to the LTCC (low temperature co-fired ceramic) technology, in particular to a low profile microstrip patch antenna applied to receiving radio. The microstrip patch antenna comprises three layers of LTCC substrates: the first layer of substrate is provided with a coaxial feeding hole, the upper surface thereof is a first radiation metal patch and the lower surface thereof is a reflection plate; the second layer of substrate is evenly provided with air holes; and the upper surface of the third layer of substrate is a second radiation metal patch. In addition, the microstrip patch antenna also comprises a coaxial feeding needle which is inserted into the coaxial feeding hole from the bottom to be connected with the first radiation metal patch on the first layer of substrate and be insulated with the reflection plate. The first, second and third layers of LTCC substrates form an integrity after passing through an LTCC stack and isostatic pressing technology from the bottom up and co-fire is carried out to the integrity at low temperature so as to form another integrity. The microstrip patch antenna can effectively widen the band width of a microstrip antenna, intensify the coupling between two radiation patches and improve the stability and reliability of the antenna.

The invention discloses a borosilicate glass-spherical alumina low temperature co-fired ceramic (LTCC) green tape and its preparation method. The green tape is composed of a glass-ceramic composite material and a casting medium. Specifically, the glass-ceramic composite material consists of borosilicate glass and spherical alumina. The casting medium consists of a mixed solvent, a monomer binder, a plasticizer and a dispersing agent. The low temperature co-fired ceramic green tape prepared in the invention has a level and smooth surface, a solid content up to 88-92wt%, and a firing shrinkage rate of 9-11%. The difference between the sintering shrinkage rate of each direction is small. And the green tape can achieve wiring co-firing with Au, Ag and other low melting point metals at 850DEG C. The raw material tape sintered ceramic body provided in the invention has excellent dielectric properties. Under the condition of less than 10GHz, the dielectric constant (epsilon r) of 7-8, the dielectric loss (Tan delta) is less than 2*10<-3>, and effectively solves the anisotropy problem of traditional LTCC green tape sintering shrinkage.

A semiconductor package comprising a low temperature co-fired ceramic substrate defining opposed top and bottom surfaces. The substrate comprises at least two stacked ceramic layers and electrically conductive patterns which extend between the layers and along the top surface of the substrate. Mounted to the top surface of the substrate and electrically connected to the conductive patterns is at least one semiconductor die. A plurality of leads extend at least partially about the substrate in spaced relation thereto. Each of the leads defines opposed top and bottom surfaces, the semiconductor die being electrically connected to at least one of the leads. A package body at least partially encapsulates the substrate, the semiconductor die and the leads such that at least a portion of the bottom surface of each of the leads is exposed in the package body.