Aluminum nitride/borosilicate glass low-temperature co-fired ceramic substrate material and preparation method thereof

A technology of low-temperature co-fired ceramics and borosilicate glass, which is applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of high cost and achieve the effects of low price, cost reduction and loss reduction

Active Publication Date: 2008-01-09
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the cost of LTCC substrates is higher than that of resin-based substrates. How to reduce costs, improve design automation and scale production is also a problem to be solved.

Method used

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  • Aluminum nitride/borosilicate glass low-temperature co-fired ceramic substrate material and preparation method thereof
  • Aluminum nitride/borosilicate glass low-temperature co-fired ceramic substrate material and preparation method thereof
  • Aluminum nitride/borosilicate glass low-temperature co-fired ceramic substrate material and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The present invention will be further described below in conjunction with examples. AlN / SiO of the present invention 2 -B 2 O 3 -ZnO-Al 2 O 3 -Li 2 O low-temperature co-fired ceramic substrate material formulations are shown in Table 1 and Table 2.

[0038] Table 1 Glass formula

[0039] Oxide name

SiO 2

B 2 O 3

ZnO

Al 2 O 3

Li 2 O 3

Mole percentage

12％

24％

54％

5％

5％

[0040] Table 2 Substrate material formula

[0041] Table 3 Performance parameters of AlN powder

[0042] Purity

Iron content

Total oxygen content

Average particle size

Specific surface area

Bulk Density

＞99.0％

<40ppm

＜0.8％

0.5μm

>10.2m 2 / g

0.13g / cm 3

Exterior color

Bulk density

Decomposition temperature

Crystal system

Thermal conductivity

Dielectric constant

Off-white

3.26g / cm 3

...

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Abstract

This invention relates to electronic baseplate by low-temperature co-sintering of aluminium nitride / borosilicate glass. This baseplate is composed of: AlN 30-70%; oxides 30-70%. Said oxides are then composed (by mol percentages) of: SiO2 8-12%, B203 18-24%, ZnO 45-60%, Al203 3-8%, Li20 3-8%. This inventive product has excellent comprehensive properties, its heat conductivity is increased from that of prior art product 2-5 W / m.K to 10W / m.K. It can be used in more greater power devices with excellent dielectric property. This invention has also advantages of: easily available raw materials, low cost, simple process.

Description

Technical field [0001] The invention belongs to the technical field of electronic substrate composite materials, and particularly provides an aluminum nitride / borosilicate glass low-temperature co-fired ceramic (LTCC) substrate material and a preparation method thereof. Background technique [0002] In the 21st century, the development momentum of the microelectronics industry has become more and more swift, and products are rapidly moving towards light, thin, short, small, low power consumption, and multi-functional. For example, terminal systems such as mobile phones, PDAs, MP3s, and notebook computers have more and more functions, smaller sizes, and higher and higher circuit assembly densities; great progress has also been made in RF integrated circuits, monolithic microwave integrated circuits Some passive components have been successfully integrated into ICs; other complete machines and circuit systems such as automotive electronics, aerospace electronics, and sensor circuit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/00C04B35/582H05K1/03
Inventor 赵宏生高廿子
Owner TSINGHUA UNIV
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