The invention discloses a composite aluminum
nitride aluminum-coated
ceramic substrate packaging module and a preparation method thereof, a composite aluminum
nitride aluminum-coated
ceramic substrate is composed of pattern surface aluminum, aluminum
nitride ceramic, intermediate layer aluminum, aluminum nitride ceramic and non-pattern surface aluminum, the thickness ratio of the pattern surface aluminum to the intermediate layer aluminum is 1 / 15-1 / 4, and the thickness ratio of the non-pattern surface aluminum to the intermediate layer aluminum is 1 / 15-1 / 4. The thickness ratio of the pattern surface aluminum to the non-pattern surface aluminum is 1 / 10-1 / 4, the thickness of the pattern surface aluminum is 0.1 mm-0. 8mm, and the thickness of the aluminum nitride ceramic is 0.6 mm-3mm; the non-graphic surface of the aluminum nitride aluminum-coated
composite ceramic substrate is connected with a radiator, the graphic surface of the aluminum nitride aluminum-coated
composite ceramic substrate is bonded with a
diode through a solder, and the
diode is electrically connected through a lead; the composite aluminum nitride aluminum-coated
ceramic substrate is formed at a time, the aluminum surface keeps the characteristic of high-purity aluminum, the ceramic-aluminum thickness relation between multiple
layers of the composite aluminum nitride aluminum-coated
ceramic substrate is reasonably matched, and the
toughness and rigidity of the whole material are improved; the
ceramic substrate does not need to be bonded with a bottom plate through
welding flux after one-time forming, interface
thermal resistance is not newly added, and the whole module is high in heat dissipation.