The invention relates to an amine curing agent, thermal
viscosity-reducing glue, a thermal
viscosity-reducing carrier membrane and a preparation method thereof, the amine curing agent comprises
cardanol,
isophorone diamine and a
furfural solution, the
cardanol is melted at the temperature of 50-60 DEG C, then the
isophorone diamine is added for reaction at the temperature of 60-70 DEG C, then the
furfural solution is added for
condensation reaction at the temperature of 75-90 DEG C, and the thermal
viscosity-reducing carrier membrane is obtained. And finally, cooling to
room temperature to obtain the amine curing agent. The thermal visbreaking carrier film prepared from the amine curing agent and the thermal visbreaking glue not only can provide stable and reliable
adhesive force at normal temperature and ensure the stability of
process operation, but also can be smoothly peeled off after high-temperature working sections such as cover film pressing and solder
resist ink baking, the surface of a PI film is kept clean, and the service life of the PI film is prolonged. The
manufacturing efficiency and reliability of the flexible circuit board are obviously improved; the thermal visbreaking carrier film has the advantages of high-temperature visbreaking, no
adhesive residue, good dimensional stability and the like.