The invention discloses polyimide with low dielectric properties, and a preparation method and an application thereof. The polyimide provided by the invention is prepared through an imidization method by using the raw materials of aromatic diamine comprising triphenylamine and with large side group comprising triphenylethylene/tetraphenylethylene, and various tetra-dianhydrides. The polyimide provided by the invention has ultra-low dielectric constant, relatively low dielectric loss, excellent solubility, relatively high glass transition temperature, relatively high thermal stability, excellent mechanical performances, excellent photo-luminescent performance, and the like. The synthesis method of the polyimide is simple and diverse, and is suitable for industrial productions. The polyimide provided by the invention can be used for preparing low dielectric materials, and can be widely applied in high-tech industry fields such as electronics, microelectronics, information, luminescent materials, aeronautics and astronautics, and specially very large scale integrated circuits.