334results about How to "Low dielectric properties" patented technology

The invention provides halogen-free resin composition, and a copper clad laminate and a printed circuit board applying the halogen-free resin composition. The halogen-free resin composition comprises, by weight, (A) 100 parts of epoxy resin, (B) 1 part -100 parts of benzoxazine resin, (C) 1part -100 parts of styrene maleic anhydride, (D) 0.5 part -30 parts of amine curing agents, and (E) 5-150 parts of halogen-free flame retardants. By means of the specified constituents and ration, the halogen-free resin composition achieves the purposes of low dielectric constant, low dielectric loss, high heat resistance, and high flame resistance, can be manufactured into semi-solidified rubber pieces or resin films, and then achieves the purposes of being applied to the copper clad laminate and the printed circuit board.

The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.

The invention provides a halogen-free resin composition which comprises (A) 100 parts of cyanate ester resin, (B) 5-50 parts of styrene maleic anhydride, (C), 5-100 parts of polyphenyl ether resin, (D) 5-100 parts of maleimide resin, (E) 10-150 parts of nitrogenous compound, and (F) 10-1000 parts of inorganic filler. As the composition comprises components in special proportion, the halogen-free resin composition is low in dielectric constant, low in dielectric loss, high in heat resistance and high in flame resistance. The halogen-free resin composition can be prepared as a semi-cured film or a resin film, so that the composition can be applied to a copper foil substrate and a printed circuit board.

The invention relates to an epoxy resin composition and a high-frequency circuit board manufactured thereby. The epoxy resin composition comprises the following solid components: (A) cyanate compound or prepolymer thereof, wherein the molecule of the cyanate compound contains at least two cyanato groups; (B) active ester; and (C) epoxy resin containing a naphthol structure; calculated in solid component in parts by weight, the total amount of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, and the component (B), i.e. active ester, is 10-70 parts by weight, and the amount of the component (C), i.e. epoxy resin containing naphthol structure, is 30-90 parts by weight, wherein the weight ratio of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, to the component (B), i.e. active ester, is (0.2-5):1. The high-frequency circuit board manufactured by using the epoxy resin composition of the invention comprises a plurality of layers of prepregs which are overlapped mutually, and copper foils which are compressed on the two sides respectively; and each of the plurality of layers of prepregs comprises a base material and the epoxy resin composition which is adhered to the base material through impregnation and drying.

The invention discloses a thermoset resin composition, comprising the following ingredients of: bifunctional groups or polyfunctional group epoxy resin, phenylethylene-maleic anhydride copolymer (SMA) as a curing agent, diallyl bisphenol A-like allylphenol as a co-curing agent and a toughening agent, low-bromine or high-bromine BPA-type epoxy resin or tetrabromobisphenol A (TBBPA or TBBA) as a fire retardant, a proper accelerator and a solvent. The inventive resin composition has, after being cured, relatively low dielectric property and superior thermal reliability and toughness, includes, in contrast to a cooper clad laminate manufactured by reinforcing materials such as glass fiber cloth, relatively low dielectric constant (called Dk for short) and electric loss tangent (called Df for short), high Tg, high thermal cracking temperature (called Td for short), excellent toughness and favorable PCB processibility, is quite suitable for manufacturing the cooper clad laminate for PCB and prepreg, and can also applied to general uses of the epoxy resin, such as molding plastics and the like, and to composite materials for construction, automobile and aviation.

The invention belongs to the technical field of copper clad laminates and particularly relates to a resin composition, prepreg using the resin composition and a laminate. The resin composition contains the ingredients in percentage by weight: 15-55% of amine modified bismaleimide (BMI), 10-45% of benzoxazine resin and 0-75% of epoxy resin. According to the resin composition, through further reaction of benzoxazine (BOZ) and amine modified bismaleimide (BMI), performance advantages of two kinds of high-performance resin, namely BMI and BOZ, are excellently exerted, so that the prepreg and the copper clad laminates, manufactured from the resin composition, have the properties of high Tg, relatively high peeling strength, relatively low CTE, relatively low water absorbing capacity, relatively low dielectric loss, relatively high elastic modulus high-temperature retention rate, relatively good resistance to hot and damp and the like, and reach a flame-retardant level UL94-V0.

The invention relates to a low-dielectric laser direct structuring composite material suitable for 5G communication. The composite material is composed of the following components in parts by weight:52 to 86 parts of base resin, 0 to 30 parts of glass fibers, 10 to 30 parts of a filling agent, 1 to 9 parts of a flame retardant, 4 to 15 parts of a toughening agent, 0.1 to 1 part of a lubricating agent, 0.2 to 1 part of an antioxidant and 10 to 30 parts of a laser sensitive additive. A preparation method of the composite material comprises the steps that a twin-screw extruder is used for processing, the melt extrusion temperature is 250-380 DEG C, and the screw rotating speed is 150-300 rpm/min. The composite material has low dielectric property, so that improvement of the transmission speed of 5G communication millimeter wave signals is facilitated, the signal delay is reduced, and the signal loss is reduced; the composite material has the LDS processing capacity, can be rapidly prepared in a small size and a large number, can be subjected to batch laser etching and chemical plating to form a metal connecting circuit, and is an optimal solution of a 5G plastic antenna oscillator material.

The present invention belongs to the technical field of a resin having low dielectric properties, and presents a vinylbenzyl-etherified-DOPO compound resin composition and a preparation method and application thereof. The composition includes a vinylbenzyl-etherified-DOPO compound resin and a vinyl-terminated polyphenylene ether resin. The DOPO resin is vinylbenzyl etherified in the present invention, thus obtaining a vinylbenzyl-etherified-DOPO compound resin having low dielectric properties, and there are no hydroxyl group on itself, no hydroxyl function group will be generated during the cross-linking reaction; and the vinylbenzyl-etherified-DOPO compound resin contains phosphorus atoms, and has flame retardancy. The prepared vinylbenzyl-etherified-DOPO compound resin and the hydroxyl-free, low dielectric vinyl-terminated polyphenylene ether resin are combined in the present invention, thus obtaining a resin composition having low dielectric constant and low dielectric loss tangent, which can achieve excellent dielectric properties and flame retardancy when applying to the metal laminates and printed circuit boards.

The invention discloses a method for continuously preparing an Si-B-N-O fiber by using a PCS fiber, which comprises the following steps of: after air curing treatment is carried out on the PCS fiber, firstly carrying out nitrogen treatment on a PCS curing fiber and then carrying out boronization treatment or firstly carrying out the boronization treatment and then carrying out the nitrogen treatment; then sintering the PCS curing fiber after the nitrogen treatment and the boronization treatment under the high temperature condition of 1200-1400 DEG C under the protection of high-purity N2 gas or argon atmosphere to prepare the Si-B-N-O fiber. Compared with an Si-N-O fiber, the prepared Si-B-N-O fiber has better temperature resistance, lower dielectric performance and simpler preparation process and is easy to realize industrialized batch preparation.

The invention discloses a resin composition which comprises the following solids by weight: (a) 100 parts of a bismaleimide resin prepolymer, (b) 5-80 parts of cyanate ester, (c) 0-50 parts of a flame retardant and (d) 0-65 parts of inorganic filler, wherein the bismaleimide resin prepolymer is obtained by carrying out reaction on an allyl compound and bismaleimide resin and the ratio of bismaleimide resin and allyl compound by weight is 100: (10-120). According to the resin composition disclosed by the invention, by adopting siloxane containing allyl at the tail end as a modifier of bismaleimide resin and limiting the content of siloxane in the modifier, unreacted siloxane resin is not generated in reaction, so that the advantages and characteristics of siloxane resin can be fully exerted and the interlaminar adhesive force at the high temperature is greatly improved. Moreover, the thermal expansion properties of the solids are optimized, so that the resin composition satisfies the requirements on high precision electronic substrate materials.

The invention discloses a piezoelectric ceramic material, the chemical formula of the material is as follows: Pb1.05-dSrdZrxTiyO3 + amol% La2O3 + bmol% M + cmol% SiO2, wherein, d is more than or equal to 0 and less than or equal to 0.03, x + y = 1, a is more than or equal to 0 and less than or equal to 5, b is more than or equal to 0 and less than or equal to 5, c is more than or equal to 0 and less than or equal to 1, M presents LiNbO3 or Nb2O5. The invention also discloses the preparation method of the piezoelectric ceramic material. Compared with the prior art, the advantages of the invention are as follows: replacement of doping in the PZT piezoelectric ceramic is conducted, and the preparation process which is suitable for the piezoelectric ceramic material is selected creatively, which leads the Curie point of the piezoelectric ceramic material to be greatly increased, the piezoelectric property and the dielectric property are excellent, under high temperature of 270 degrees C., the piezoelectric property and the dielectric property of the piezoelectric ceramic material is decreased very little, and the invention can be used for SMD piezoelectric ceramic buzzer.

The invention provides a high-thermal-conductivity low-dielectric-loss polyphenylene sulfide composite and a preparation method thereof. The composite comprises 100 parts of polyphenylene sulfide resin, 10 to 40 parts of glass fibers, 30 to 60 parts of boron nitride, 5 to 15 parts of a compatilizer, 0.8 to 3.0 parts of a coupling agent, 1.0 to 5.0 parts of a dispersant and 0.4 to 1.2 parts of an anti-oxidant. The preparation method comprises the following steps: mixing boron nitride with the coupling agent so as to obtain a first mixture, adding the dispersant into the first mixture and carrying out mixing so as to obtain a second mixture; and mixing the polyphenylene sulfide resin, the compatilizer and the anti-oxidant, adding the obtained mixture into a screw extruder from a main feed inlet, adding the second mixture into the screw extruder from a lateral feed inlet, adding the glass fibers into the screw extruder from a glass fiber feeding inlet, and carrying out extrusion granulation via the screw extruder so as to obtain the polyphenylene sulfide composite in the form of granules. The polyphenylene sulfide composite provided by the invention has the advantages of high heat conduction coefficient and low dielectric loss and is applicable to the field of electrocommunication.

The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.

Disclosed is a novel tetracarboxylic acid compound having excellent characteristics such as high transparency, low dielectric property, low water absorption, low thermal expansion, solvent solubility and etching characteristics, while exhibiting high heat resistance at the same time. This tetracarboxylic acid compound is useful as a raw material monomer for producing a polyesterimide or a polyamideimide. Specifically disclosed is a tetracarboxylic acid compound represented by the general formula (1) or (2) below.

In the formulae, A represents a divalent group; X¹, X² and X³ respectively represent a hydrogen atom or the like; R¹, R², R³ and R⁴ respectively represent a carboxyl group or an acid anhydride group; n represents 1 or 2; and ring B represents a cyclic group.

A method of restoring a low-k material is described, applied to a substrate with a low-k material thereon, wherein the substrate has been subject to a previous process that raised the k-value of the low-k material. The method includes performing a plasma treatment to the low-k material to decrease the k-value thereof.

The invention provides an epoxy resin composition, comprising (A) 100 parts by weight of the epoxy resin; (B) 20-100 parts by weight of a cyanate ester resin containing a polyphenylene oxide structure; (C) 10-50 parts by weight of a styrene-maleic anhydride (SMA) copolymer; (D) 5-50 parts by weight of a maleimide resins, and optionally at least one of the following components of (E) an inorganic filler, (F) a catalyst, (G) a phenolic resin, (H) a flame retardant and (I) an adhesion agent. The epoxy resin composition contains specific components and proportions to achieve low dielectric constant, low-dielectric loss, high glass-transition temperature and no halogen; the printed circuit board can be made into a half-cured film or a resin film, and further the object of applying the epoxy resin composition to copper foil substrates and printed circuit boards can be reached.

The invention discloses polyimide with low dielectric properties, and a preparation method and an application thereof. The polyimide provided by the invention is prepared through an imidization method by using the raw materials of aromatic diamine comprising triphenylamine and with large side group comprising triphenylethylene/tetraphenylethylene, and various tetra-dianhydrides. The polyimide provided by the invention has ultra-low dielectric constant, relatively low dielectric loss, excellent solubility, relatively high glass transition temperature, relatively high thermal stability, excellent mechanical performances, excellent photo-luminescent performance, and the like. The synthesis method of the polyimide is simple and diverse, and is suitable for industrial productions. The polyimide provided by the invention can be used for preparing low dielectric materials, and can be widely applied in high-tech industry fields such as electronics, microelectronics, information, luminescent materials, aeronautics and astronautics, and specially very large scale integrated circuits.

Provided is a phosphaphenanthrene-based compound represented by the following chemical structure:

The phosphaphenanthrene-based compound can be added in a resin composition and made into a prepreg or resin film. The prepreg or resin film made from such resin composition has low coefficient of thermal expansion, low dielectric constant and dissipation factor, and flame retardancy, thereby being suitable for copper-clad laminate or printed circuit board.