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Epoxy resin composition and high-frequency circuit board manufactured thereby

A technology of epoxy resin and circuit substrate, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of lowering the glass transition temperature of resin composition, reducing the crosslinking density of epoxy resin, etc., to achieve improved glass transition Relatively low temperature, high glass transition temperature, good heat and humidity resistance

Inactive Publication Date: 2012-06-20
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the reduction of the crosslink density of the epoxy resin, the glass transition temperature of the resin composition is greatly reduced.

Method used

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  • Epoxy resin composition and high-frequency circuit board manufactured thereby
  • Epoxy resin composition and high-frequency circuit board manufactured thereby
  • Epoxy resin composition and high-frequency circuit board manufactured thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Take a container, add 60 parts by weight of naphthol type novolac epoxy resin NC-7300L, then add 18 parts by weight of bisphenol A cyanate resin HF-10 and 22 parts by weight of active ester curing agent HPC-8000-65T , stir, add appropriate amount of accelerator zinc octoate and DMAP, and solvent toluene, continue to stir evenly to form a glue. Immerse the above glue with glass fiber cloth and control it to a suitable thickness, then dry it to remove the solvent to make a prepreg. Using several prepared prepregs to stack each other, press a piece of copper foil on each side of the prepreg, put it into a hot press machine and solidify to form the high-frequency circuit substrate. The physical data are shown in Table 1.

Embodiment 2～4

[0073] The manufacturing process is the same as in Example 1, and the formula composition and physical property data are as shown in Table 1.

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PUM

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Abstract

The invention relates to an epoxy resin composition and a high-frequency circuit board manufactured thereby. The epoxy resin composition comprises the following solid components: (A) cyanate compound or prepolymer thereof, wherein the molecule of the cyanate compound contains at least two cyanato groups; (B) active ester; and (C) epoxy resin containing a naphthol structure; calculated in solid component in parts by weight, the total amount of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, and the component (B), i.e. active ester, is 10-70 parts by weight, and the amount of the component (C), i.e. epoxy resin containing naphthol structure, is 30-90 parts by weight, wherein the weight ratio of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, to the component (B), i.e. active ester, is (0.2-5):1. The high-frequency circuit board manufactured by using the epoxy resin composition of the invention comprises a plurality of layers of prepregs which are overlapped mutually, and copper foils which are compressed on the two sides respectively; and each of the plurality of layers of prepregs comprises a base material and the epoxy resin composition which is adhered to the base material through impregnation and drying.

Description

technical field [0001] The invention relates to a resin composition, in particular to an epoxy resin composition and a high-frequency circuit substrate made using it. Background technique [0002] The application frequencies of traditional electronic products are mostly concentrated below 1GHz, and the DK / Df characteristics of traditional FR-4 materials are sufficient to meet their requirements. Even if it cannot be met, the requirements can be met by changing the circuit design. However, with the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and 3-6GHz will become the mainstream. Substrate materials will no longer play the role of mechanical support in the traditional sense, but will become PCB and electronic components together with electronic components. An important way for terminal manufacturers and designers to improve product performance. Because a high DK will slow down the sign...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08G59/32C08L63/00H05K1/03
Inventor 曾宪平
Owner GUANGDONG SHENGYI SCI TECH
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