Halogen-free Tg resin composite and presoaked material and laminated board made by adopting same

Abstract

The invention relates to a halogen-free Tg resin composite and a presoaked material and a laminated board made by adopting the composite. Counted by part by weight of organic solid matters, the halogen-free high-Tg resin composite contains the following components according to part by weight: (A) 10 to 50 parts by weight of cyanate resin; (B) 10 to 50 parts by weight of at least one compound withdihydro-benzoxazine ring; (C) 10 to 50 parts by weight of at least one kind of bismaleimides resin; (D) 10 to 50 parts by weight of at least one kind of poly-epoxy compound; and (E) 5 to 30 parts by weight of at least one kind phosphonium flame retardant. The halogen-free high-Tg resin composite has the performances of low water absorption, low CTE (coefficient of thermal expansion), high Tg, good dielectric property and the like, and the presoaked material and laminated board made by adopting the composite has the characteristics of high vitrification transition temperature, low CTE, low dielectric constant, low water absorption, high thermal resistance and the like, thus being application to multi-layer circuit boards.

Description

technical field [0001] The invention relates to a resin composition, in particular to a halogen-free high Tg (glass transition temperature) resin composition and a prepreg and a laminate made thereof. Background technique [0002] Polytriazine made from di- or multi-functional aromatic cyanate has high Tg, excellent dielectric properties and thermal expansion coefficient, and is widely used in HDI multilayer PCB and packaging substrates. At present, the mainstream BT CCL in the market is made of (bismaleimide-triazine resin), which is generally based on bromine-containing flame retardants. With the gradual deepening of environmental protection awareness, phosphorus-based flame retardants will replace traditional Bromine-based flame retardants, but phosphorus-based flame retardants are easier to absorb water, causing the board to burst easily. [0003] In addition, although only heating is required to solidify the above raw materials, a catalytically effective amount of a tr...

AI Technical Summary

Problems solved by technology

Although, Japanese Patent JP2004182851 has reported that cyanate ester, benzoxazine, and epoxy resin are blended to obtain a formula composition, but the selection of benzoxazine resin is easy to ring-open when heated, and a large number of hydroxyl groups will be generated, resulting in by-products reaction, affecting the ring-forming reaction of cyanate ester, which will eventually affect the performance of the board

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