Thermosetting resin composition and use

A resin composition, thermosetting technology, applied in layered products, metal layered products, circuit substrate materials, etc., can solve the problems of poor thermal stability, poor processability, high water absorption, and improve heat resistance and dielectric. Effects of performance, good PCB processability, high thermal reliability

Inactive Publication Date: 2009-07-15
ITEQ DONGGUAN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Epoxy resin has been widely used in various electronic insulating materials, mainly because it has good heat resistance, chemical resistance and good insulation and dielectric properties. Commonly used curing agents include amines, acid anhydrides and Phenolic or phenolic, especially in the application of copper clad laminates, dicyandiamide (amine) and phenolic resin (phenolic) are commonly used as curing agents for epoxy resins, which have good processability, heat resistance, and Chemical and insulating properties, but its dielectric properties cannot meet the requirements of high-frequency signal transmission integrity because of its high dielectric constant (Dielectric constant) and dielectric loss (Dissipation factor)
[0003] In the BE627887 patent, the application of styrene-maleic anhydride copolymer (SMA for short) as epoxy resin curing agent is described, but this epoxy resin composition has the following disadvantages after curing and crosslinking: glass transition temperature (Tg) Low, poor thermal stability and poor processability
However, since the allyl compound in this patent is an allyl ester such as triallyl cyanurate (abbreviated as TAC) or triallyl isocyanurate (abbreviated as TAIC), the water absorption rate of its molecular structure Higher, and there are more C-N groups in its molecular structure, which leads to the disadvantages of high water absorption, dielectric properties and thermal cracking temperature after the composition is cured.

Method used

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  • Thermosetting resin composition and use
  • Thermosetting resin composition and use
  • Thermosetting resin composition and use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5

[0043] When the acid anhydride equivalent and phenolic hydroxyl equivalent change compared with the epoxy equivalent, the Tg and other properties of the copper clad laminate produced by the above experimental method of the resin composition will change accordingly. The specific Tg changes are shown in the data in Table 1. When the equivalence ratio is 0.9:1.0-1.1:1, the corresponding Tg of the copper clad laminate is relatively the highest.

[0044] Table 1

[0045] Example number 1 2 3 4 5 Anhydride equivalent + phenolic hydroxyl equivalent 1.6 1.3 1.1 0.9 0.6 epoxy equivalent 1 1 1 1 1 Tg(DSC)(℃) 162 165 185 175 138

[0046] Note: The ratio of each component in the above table is calculated as solid.

Embodiment 6

[0047] Embodiment 6 (comparative example)

[0048] Configure the resin composition according to the following formula: first adopt 192g of butanone (abbreviated as MEK) solvent to dissolve 156g of SMA3000 and 40g of TBBA, then add 185g of BET-535A80 (solid content is 80%, 20% is acetone solvent) and 93.3 g of BET-400T60 (solid content is 60%, 40% is toluene solvent), then add 0.12g of 2-ethyl-4-methylimidazole (2E4Mz for short), stir for 2 hours and mix well, according to the above Implementation method Copper clad laminates were fabricated and tested for their physical and electrical properties. In this embodiment, the ratio of acid anhydride equivalents plus phenolic hydroxyl equivalents to epoxy equivalents is 1.1:1.

Embodiment 7

[0049] Embodiment 7 (comparative example)

[0050] The resin composition is configured according to the following formula: first adopt 200g of butanone solvent to dissolve 140g of SMA3000 and 36g of TBBA, then add 165g of BET-535A80 (solid content is 80%, 20% is acetone solvent), 86.7g of BET- 400T60 (solid content is 60%, 40% is toluene solvent) and 40g of TAC, then add 0.4g of tert-butyl peroxybenzoate and 0.12g of 2E4Mz, mix well after stirring for 2 hours, according to the implementation method described above Fabricate copper clad laminates and test their physical and electrical properties. In this embodiment, the ratio of acid anhydride equivalents plus phenolic hydroxyl equivalents to epoxy equivalents is 1.1:1.

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Abstract

The invention discloses a thermoset resin composition, comprising the following ingredients of: bifunctional groups or polyfunctional group epoxy resin, phenylethylene-maleic anhydride copolymer (SMA) as a curing agent, diallyl bisphenol A-like allylphenol as a co-curing agent and a toughening agent, low-bromine or high-bromine BPA-type epoxy resin or tetrabromobisphenol A (TBBPA or TBBA) as a fire retardant, a proper accelerator and a solvent. The inventive resin composition has, after being cured, relatively low dielectric property and superior thermal reliability and toughness, includes, in contrast to a cooper clad laminate manufactured by reinforcing materials such as glass fiber cloth, relatively low dielectric constant (called Dk for short) and electric loss tangent (called Df for short), high Tg, high thermal cracking temperature (called Td for short), excellent toughness and favorable PCB processibility, is quite suitable for manufacturing the cooper clad laminate for PCB and prepreg, and can also applied to general uses of the epoxy resin, such as molding plastics and the like, and to composite materials for construction, automobile and aviation.

Description

technical field [0001] The invention relates to a thermosetting resin composition, which is suitable for making copper-clad laminates and prepregs for PCBs, and is used in common uses of epoxy resins such as molding resins and composite materials for construction, automobiles and aviation. Background technique [0002] Epoxy resin has been widely used in various electronic insulating materials, mainly because it has good heat resistance, chemical resistance and good insulation and dielectric properties. Commonly used curing agents include amines, acid anhydrides and Phenolic or phenolic, especially in the application of copper clad laminates, dicyandiamide (amine) and phenolic resin (phenolic) are commonly used as curing agents for epoxy resins, which have good processability, heat resistance, and Chemical and insulating properties, but its dielectric properties cannot meet the requirements of high-frequency signal transmission integrity because of its high dielectric consta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L25/08C08K5/13H05K1/03B32B15/092
Inventor 贺育方张伦强
Owner ITEQ DONGGUAN
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