68 results about "Allyl compound" patented technology

The invention discloses an allyl pentafluorosulfenyl compound as well as a preparation method and application thereof, and belongs to the technical field of organic synthesis. The structural formula of the allyl pentafluorosulfenyl compound is as follows: # imgabs0 #. The preparation method comprises the following steps: by taking an allyl compound and a pentafluorothio source as raw materials, carrying out an allylpentafluorothio reaction in a solvent under the induction of visible light to obtain the allylpentafluorothio compound by a one-step method, so that the reaction time is extremely short, the conversion of a substrate can be completed within only 15 seconds, the reaction conditions are mild, and the yield is high. The reaction can be completed under sunlight, and the allyl pentafluorosulfenyl compound derivative drug molecule has biological activity and shows a certain anticancer effect.

The invention relates to a mud-resistant polycarboxylic acid water reducing agent and a preparation method thereof, and the mud-resistant polycarboxylic acid water reducing agent is prepared from the following raw materials in parts by weight: 90-260 parts of allyl-terminated polyether monomer; 20 to 32 parts of unsaturated acid monomer; 8-15 parts of an unsaturated ester monomer; 4-8 parts of a quaternary ammonium salt compound; 1.5 to 3.0 parts of an oxidizing agent; 0.2 to 0.4 part of a reducing agent; 0.8 to 1.5 parts of a chain transfer agent; and water; wherein the allyl-terminated polyether monomer is prepared from the following raw materials: unsaturated alcohol, an allyl compound and a basic catalyst. The polycarboxylate superplasticizer prepared by the method disclosed by the invention has the advantages of low mixing amount, high water reduction, good workability, low mixing amount sensitivity, excellent mud resistance, capability of remarkably improving the dispersion and adsorption performance of concrete, wide application range of mud content in sand and gravel materials and the like.

The invention belongs to the technical field of polymer composite materials, and particularly relates to a high-strength bismaleimide resin material and a preparation method thereof. The bismaleimide resin composition comprises the following components in parts by weight: 50-60 parts of bismaleimide resin, 40-50 parts of an allyl compound, 1-3 parts of modified graphene and 0.1-0.5 part of a dispersing filler, the dispersing filler is prepared from modified inorganic nanoparticles and modified tetrapod-like zinc oxide whiskers in a mass ratio of (0.1-1): 1. Wherein the tetrapod-like zinc oxide whiskers can promote the dispersion of the graphene with a large lamellar structure from the macroscopic aspect, so that the graphene is uniformly dispersed in a bismaleimide resin matrix, and the inorganic nanoparticles can play a role in lubrication and isolation, so that the agglomeration among graphene lamellas in a small range is prevented. By adding the graphene composite reinforcing filler, the rigidity of the bismaleimide resin material is improved, and the toughness of the composite material can be improved at the same time.

The present invention provides a phthalazinone - structured polymer - toughened bismaleimide resin, a preparation method thereof and an application thereof, which relate to the technical field of synthesis of polymer materials. The phthalazinone - structured polymer - toughened bismaleimide resin is mainly prepared from bismaleimide monomers, allyl compounds, phthalazinone - structured polymers, and optionally other thermoplastic resin toughening agents, optionally co - curing components and optionally curing agents. Among them, the phthalazinone - structured polymer has excellent heat - resistant performance and good solubility, and its heat resistance matches that of high - temperature - resistant bismaleimide resins. It can be used as a toughening agent to significantly improve the impact toughness of bismaleimide resins and their composites, and maintain the excellent heat - resistant performance of bismaleimide resins, so that bismaleimide resins can be applicable to more application scenarios.

The invention discloses a low-temperature curable bismaleimide resin-based composite material surface film and a preparation method thereof, relates to the field of bismaleimide resin composite material surface films, and aims at solving the problem that the curing temperature of an existing bismaleimide resin composite material surface film is too high. The surface film is composed of bismaleimide resin, an allyl compound, thermoplastic resin, a catalyst and a fluidity control agent. The preparation method comprises the following steps: adding the allyl compound into a reaction kettle, heating and stirring, adding the thermoplastic resin, cooling, adding the bismaleimide resin, continuously heating and stirring, and carrying out double-roller hot rolling film forming on the bismaleimide resin and a carrier for manufacturing an adhesive film through an adhesive film machine to prepare the low-temperature curable bismaleimide resin surface film.

The invention discloses a resin composition and application thereof. The resin composition comprises the following components in parts by solid weight: 20-100 parts of a modified maleimide prepolymer; 10 to 80 parts of epoxy resin; 5-60 parts of active ester; 5-50 parts of an elastomer; reactants of the modified maleimide prepolymer comprise an amine compound, an allyl compound and maleimide resin; in the modified bismaleimide prepolymer, the number average molecular weight is 1t; the mass ratio of the components of 1000 is 10%-40%. The maleimide resin is modified by adopting the amine compound and the allyl compound together, the active ester compound and the epoxy resin are matched, and the content of low-molecular-weight components in the modified maleimide prepolymer is controlled, so that the compatibility among the maleimide resin, the active ester and the epoxy resin is improved; and moreover, the heat resistance of a resin condensate is improved, and the dielectric property and the water absorption rate are reduced.

The invention discloses a preparation method of epoxy resin and a material for electronic and electrical appliances, and belongs to the technical field of epoxy resin. The preparation method of the epoxy resin comprises the following steps: 1) mixing and heating a bisphenol compound as shown in a formula 1, a Pd / COFs catalyst and allyl acetate under an alkaline condition, and reacting to obtain an allyl compound as shown in a formula 2; and 2) mixing the allyl compound as shown in the formula 2, a heteropolyacid / COFs catalyst, hydrogen peroxide and acetonitrile, and reacting to obtain the epoxy resin as shown in a formula 3. According to the preparation method, a Pd / COFs catalyst and a heteropolyacid / COFs catalyst are combined for use to sequentially catalyze and generate an allyl compound and epoxy resin, and the oxidation reaction activity under the catalysis of heteropolyacid / COFs is improved through acetonitrile peroxide generated by acetonitrile and hydrogen peroxide, so that a halogen-containing reagent does not need to be used in the preparation process of the epoxy resin; the content of halogen in epoxy resin impurities is low, and the yield of epoxy resin is high.

This application relates to the field of semiconductor technology, and particularly to an allyl compound and its preparation method, a bismaleimide resin composition, and its applications. An allyl compound has the structure shown in Formula I. When the compound with the above structure reacts with bismaleimide resin, it forms a larger porous structure within the bismaleimide material, increasing the internal free volume of the material. This significantly reduces the dielectric constant and dielectric loss of the bismaleimide material, enabling it to be used as a low-dielectric packaging substrate material in high-frequency, high-speed communication applications. Formula I.

The invention relates to the technical field of conductive silver adhesives, in particular to a high-shear-strength conductive silver adhesive and a preparation method thereof.The high-shear-strength conductive silver adhesive is prepared from, by weight, 40-70 parts of conductive silver powder, 10-30 parts of epoxy resin, 2-10 parts of modified liquid resin, 3-10 parts of reactive diluent and 4-8 parts of curing agent. The liquid resin is modified by introducing the silallyl compound containing Schiff base, and the proportion of each component is accurately regulated and controlled, so that the conductive silver adhesive with high shear strength and excellent conductivity is successfully prepared, and the conductive silver adhesive has a wide application prospect in the field of high-end electronic packaging.

The invention relates to the technical field of composite material preparation and curing molding, in particular to a preparation method of a carbon fiber bismaleimide resin composite material. The method comprises the following steps: curing a carbon fiber bismaleimide resin prepreg under vacuum and pressure conditions, wherein the carbon fiber bismaleimide resin prepreg is prepared from a resin system containing an allyl compound, bismaleimide resin and a thermoplastic toughening agent; the curing procedure comprises the following steps: (1) raising the temperature to 130-150 DEG C and keeping the temperature; (2) continuously raising the temperature to 180 + / -5 DEG C and keeping the temperature; (3) continuously raising the temperature to 200-220 DEG C and keeping the temperature to complete the curing reaction; and cooling and demolding. The structure prepared by the method has relatively good energy dissipation capability when bearing an impact load, so that the damage expansion trend of the material is effectively controlled, and a relatively small damage area after impact is shown.

The application discloses an allyl compound containing chiral monofluoromalonate diester and an asymmetric catalytic synthesis method and application thereof, the compound has the structure shown in the following formula, has potential biological activity and pharmacodynamic activity, provides strong technical support for development of new drugs, and has high practical value; the synthesis method is started from 1,3-diene and a nucleophilic reagent fluoromalonate diester as raw materials, and the chiral monofluoromalonate diester substituted allyl compound is efficiently synthesized through a chiral metal catalyst. The method has the following characteristics: the raw material is cheap and easy to obtain; no base needs to be added, the reaction condition is mild, and the operation is simple; the substrate has a wide application range, excellent enantioselectivity can be obtained, and good to excellent yield is achieved. The product prepared by the application is a useful fluorine-containing building block, and a variety of fluorine-containing compounds can be synthesized through simple chemical conversion.

The invention discloses a sulfur-containing gem-difluoroallyl compound as well as a preparation method and application thereof. The invention provides a preparation method of a compound as shown in a formula C. The preparation method comprises the following step: in a solvent, in the presence of alkali, carrying out gem-difluoroallylation reaction on a compound as shown in a formula A and a compound as shown in a formula B to obtain the compound as shown in the formula C. According to the method, the sulfydryl in the sulfydryl-containing compound can be mildly and efficiently gem-difluoroallylated, metal catalysis is not needed, the reaction can be performed in a water phase, the operation is simple, and the method is suitable for performing rapid fluoroalkylation modification and further functional modification on polypeptide, protein, complex bioactive molecules and the like; the method has very important application prospects in the fields of medicine, life science and the like.

This invention discloses a high-toughness, low-dielectric bismaleimide resin composition, a modified bismaleimide resin, its preparation method, and its applications. The bismaleimide resin composition comprises bismaleimide resin, an allyl compound, and a liquid rubber, wherein the liquid rubber contains end-capping groups capable of reacting with double bonds. This invention primarily addresses the problems of high dielectric constant, poor toughness, and poor interlaminar shear strength in existing bismaleimide resins. In this invention, the dielectric properties and toughness are improved by reacting the end-capping groups in the liquid rubber with the bismaleimide resin, while maintaining the mechanical properties and heat resistance essentially unchanged.

The application belongs to the technical field of compound preparation, and discloses a preparation method of (1'S, 2'S)-eugenol glycerol 3'-O-beta-D-glucopyranoside. The method is characterized in that: a phenolic hydroxyl group allyl compound protected by a benzyl group is subjected to O-glycosylation reaction with a D-glucopyranosyl donor protected by an acetyl group, so as to obtain an olefin type protected glycoside intermediate which retains a side chain carbon-carbon double bond; then, asymmetric dihydroxylation reaction is performed on the intermediate, so as to construct a target vicinal diol chiral structure; finally, the acetyl protecting group of the sugar hydroxyl group and the benzyl protecting group of the phenolic hydroxyl group are sequentially removed, so as to obtain the target compound. The preparation method of (1'S, 2'S)-eugenol glycerol 3'-O-beta-D-glucopyranoside is characterized in that: the glycoside bond is constructed before dihydroxylation, which is beneficial to reducing the competition reaction of multiple hydroxyl groups and realizing the preparation of the target compound.

A COFs nano / BD resin composite material and its preparation method and application, the method comprising: uniformly mixing COFs nano material and allyl compound under ultrasonic action, then adding bismaleimide and mechanically stirring at 135°C to 145°C to obtain a prepolymer of a transparent solution; and heating and curing the prepolymer at 140°C to 250°C to obtain a COFs nano / BD resin composite material. The pore size of the COFs nano material provided by the present invention is 0.5nm to 0.67nm. Compared with metal organic frameworks, the crystalline COFs based on covalent bond connection have better structural stability and smaller pore size, which can not only reduce the possibility of structural collapse of COFs during high temperature curing, but also provide BD resin with excellent mechanical strength and thermal stability, so that it can maintain its performance stability even in long-term use or harsh environment, and its smaller pores can reduce the absorption and scattering of electromagnetic waves by the material, while improving the material's screening ability for ions or molecules.

The present application relates to a kind of chiral monofluoro bis (aryl sulfonyl) methyl or (deuterated) monofluoromethyl substituted chiral allyl compound and its asymmetric catalytic synthesis method and application.The compound has potential biological activity and pharmacodynamic activity, and can provide strong technical support for fluorine-containing new drug research and development.The synthesis method is: under the condition of chiral catalyst, with 1,3-diene and fluorinated bis aryl sulfonyl methane as raw material, by asymmetric hydrogen monofluoroalkylation reaction or asymmetric hydrogen monofluoroalkylation reaction / reduction de-fouling base series reaction, high stereoselectivity synthesis the chiral monofluoro bis (phenylsulfonyl) methyl or (deuterated) monofluoromethyl substituted chiral allyl compound, and the specific reaction process is as shown in reaction formula (A).The raw material is cheap and easy to obtain;Reaction condition is mild, and operation is simple;Substrate structure is rich and varied, can obtain good to excellent yield and enantioselectivity etc., with wide application prospect.

The invention relates to the technical field of semiconductors, in particular to an allyl compound, a preparation method of the allyl compound, a bismaleimide resin composition and application of the bismaleimide resin composition. The allyl compound has a structure as shown in a formula I. After the compound with the structure reacts with bismaleimide resin, a larger loose structure can be formed in the bismaleimide material, so that the internal free volume of the material is increased, and the dielectric constant and dielectric loss of the bismaleimide material can be greatly reduced; and the bismaleimide material can be used as a low-dielectric packaging carrier plate material to be applied to the field of high-frequency and high-speed communication. And the formula I of the # imgabs0 # is shown in the specification.

The application provides a photosensitive resin composition, a resist ink, a resist laminated body and application thereof. The photosensitive resin composition comprises, in parts by weight, 50-70 parts of an alkali-soluble resin, 30-50 parts of a photopolymerizable monomer and 0.1-4.0 parts of a photoinitiator; wherein the photopolymerizable monomer comprises an allyl compound and a mercapto compound, and the mass content of the mercapto compound in the photopolymerizable monomer is 7wt%-22wt%. The application introduces the allyl compound and the mercapto compound into the photosensitive resin composition, the alkyl group in the allyl compound can add polymerize with the mercapto group in the mercapto compound, which helps to make the prepared photosensitive resin have relatively uniform crosslinking after exposure, and obtain a photosensitive resin with low polymerization shrinkage stress, which shows good adhesion in the bonding process of a copper substrate.

A method of manufacturing a semiconductor device includes: preparing a first circuit member having a first substrate, a first electrode, and a first insulating film; preparing a second circuit component, wherein the second circuit component is provided with a second substrate, a second electrode and a second insulating film; and bonding the first circuit member and the second circuit member such that the first insulating film and the second insulating film are bonded and the first electrode and the second electrode are bonded by heating and pressurizing the first circuit member and the second circuit member. At least one of the first substrate and the second substrate is a semiconductor substrate having a circuit surface. At least one of the first insulating film and the second insulating film is an organic insulating film containing a cured product of a curable resin composition containing a maleimide compound having a maleimide group and an allyl compound having an allyl group.

This invention relates to the field of organic chemical synthesis, specifically to a method for the stereodispersive synthesis of iodoallyl compounds, including E-type and Z-type iodoallyl compounds. This invention provides a novel stereodispersive method for the synthesis of iodoallyl compounds, which has broad substrate applicability and can prepare a variety of iodoallyl compounds. Furthermore, in the presence of a photocatalyst or a manganese catalyst and a base, high temperature and high pressure are not required; iodoallyl compounds can be prepared stereodispersively simply by visible light irradiation. In other words, the reaction conditions of this invention are mild and the operation is simple. The method also has broad substrate applicability and can prepare a variety of iodoallyl compounds. By using specific starting materials, which do not require any further treatment or modification and can be used directly in the reaction, the reaction steps are few and the process is simple, showing broad application prospects.

The application belongs to the technical field of polymer composite materials, and particularly relates to a high-strength bismaleimide resin material and a preparation method thereof. The bismaleimide resin material comprises the following components in parts by weight: bismaleimide resin 50-60 parts, allyl compound 40-50 parts, modified graphene 1-3 parts, and dispersed filler 0.1-0.5 parts. The dispersed filler is composed of modified inorganic nanoparticles and modified four-needle-shaped zinc oxide whiskers in a mass ratio of (0.1-1):1. The four-needle-shaped zinc oxide whiskers can promote the dispersion of graphene with a large lamellar structure from a macroscopic perspective, so that the graphene is uniformly dispersed in the bismaleimide resin matrix. The inorganic nanoparticles can play a lubricating and isolating role to prevent the agglomeration between graphene lamellar layers in a small range. The addition of the graphene composite reinforcing filler can improve the rigidity of the bismaleimide resin material and also improve the toughness of the composite material.

To provide a solid-supported ruthenium complex useful as a catalyst for producing allyl compounds, a method for producing the same, and a method for producing an allyl compound using the same.SOLUTION: The solid-supported ruthenium complex is represented by General Formula (1), and an allyl compound is produced using the solid-supported ruthenium complex as a catalyst.SELECTED DRAWING: None

The invention discloses a modified resin composition, a film increasing layer and a preparation method and application of the film increasing layer, and belongs to the technical field of composite materials. The modified resin composition comprises the following components, the adhesive comprises a modified allyl benzoxazine prepolymer, functional resin, a curing agent, a curing accelerator, an inorganic filler, an organic filler and an auxiliary agent. The modified allyl benzoxazine prepolymer is prepared from the following raw materials: an allyl compound and allyl benzoxazine resin; the allyl compound comprises a first allyl compound, and the first allyl compound is trimerization naphthalene diallyl ether. The resin composition provided by the invention has the advantages of low thermal expansion coefficient, low dielectric constant, low dielectric loss and low water absorption rate, can inhibit the warping of a layer-adding film, and meets the application requirements of the layer-adding film and a packaging substrate.

The invention provides a resin composition. The resin composition comprises epoxy resin, an active ester compound, free radical polymerization resin, an inorganic filling material and an accelerant. The radically polymerizable resin includes an olefin compound. The olefin compound comprises a methacrylic acid compound, a styrene compound, an allyl compound or a combination thereof.

The invention belongs to the technical field of polymer composite materials, and particularly relates to a modified environment-friendly bismaleimide resin material and a preparation method thereof. The resin material comprises the following components: bismaleimide resin, an allyl compound, and amino modified carbon nanotubes and amino modified tetrapod-like zinc oxide whiskers in a mass ratio of 1: (0.01-0.1). The amino-modified tetrapod-like zinc oxide whiskers and the amino-modified carbon nanotubes are compounded, and the tetrapod-like whisker structure can be mutually entangled with the carbon nanotubes with one-dimensional linear structures, so that the dispersion of the carbon nanotubes is promoted, and the problem that the carbon nanotubes with the one-dimensional linear structures are easy to agglomerate is solved. In addition, the amino-modified tetrapod-like crystal whisker shows better stress transfer and dissipation capacity than common one-dimensional crystal whiskers, the rigidity of the composite material is improved, the toughness of the composite material can be improved, and the amino-modified tetrapod-like crystal whisker is wide in application and can be used as a base material for non-metal additive materials.

To provide a resin composition capable of satisfying requirements for copper foil adhesion and film-forming properties while optimizing electrical performance of an epoxy resin system.SOLUTION: Provided is a resin composition including an epoxy resin, an active ester compound, a radical polymerizable resin, an inorganic filler material, and an accelerator, the radical polymerizable resin including an olefin compound, the olefin compound including a methacrylic compound, a styrene compound, an allyl compound, or a combination thereof.SELECTED DRAWING: None

The invention belongs to the field of composite materials, and particularly relates to a high-temperature-resistant bismaleimide resin for wet winding forming and a preparation method thereof, and the high-temperature-resistant bismaleimide resin comprises the following raw materials: a bismaleimide resin monomer, an epoxy resin monomer, a modifier, an ammonia curing agent, a diluent and a curing initiator. An allyl process modifier and an epoxy resin monomer are used as raw materials, an amine catalyst is selected, novel allyl phenoxy resin is synthesized to modify bismaleimide resin, BMI and an allyl compound are firstly subjected to diene addition to generate an intermediate, then the intermediate and double bonds of BMI are subjected to Diels-Adler reaction, a resin system with high crosslinking density is formed, and the bismaleimide resin with high crosslinking density is obtained. Meanwhile, a curing initiator is added to reduce the curing temperature of the modified BMI resin system, and a diluent is added to reduce the viscosity of the modified BMI resin system, so that the modified bismaleimide resin system which is good in toughness, low in viscosity and curing temperature and capable of keeping good heat resistance is obtained.

The invention discloses semi-cured modified bismaleimide varnished cloth for a voice coil framework and a preparation method of the semi-cured modified bismaleimide varnished cloth. The varnished cloth disclosed by the invention is obtained by dipping fiber cloth in a modified bismaleimide resin glue solution and then drying until the fiber cloth is semi-cured, the B-order resin content of the varnished cloth is not less than 25%, and the volatile matter content is not more than 1.5%; the modified bismaleimide resin glue solution is prepared by reacting a component A and a component B; the component A is a prepolymer solution with the solid content of 40-60%, which is obtained by reacting bismaleimide resin, an allyl compound and aromatic diamine as reactants in a polar aprotic solvent; the component B is a polyamide acid solution of which the viscosity is less than or equal to 4000 centipoises; and the use amount of the component B is 1-10wt% of the total weight of reactants in the component A by controlling the added polyamide acid. The varnished cloth has ketone solubility and can be directly used as a voice coil framework for winding, and copper wires can be bonded and fixed through acetone during winding.

The application discloses a resin composition and application thereof, and the resin composition comprises, in terms of solid weight, 20-100 parts of a modified maleimide prepolymer, 10-80 parts of an epoxy resin, 5-60 parts of an active ester and 5-50 parts of an elastomer; the reactants of the modified maleimide prepolymer comprise an amine compound, an allyl compound and a maleimide resin; and the mass percentage of components with a number average molecular weight less than 1000 in the modified maleimide prepolymer is 10-40%. The application modifies the maleimide resin by using the amine compound and the allyl compound together, and is matched with the active ester compound and the epoxy resin, and the content of the low-molecular-weight components in the modified maleimide prepolymer is controlled, so that the compatibility among the maleimide resin, the active ester and the epoxy resin is improved, the heat resistance of the resin cured product is improved, the dielectric property and the water absorption of the resin cured product are reduced.

The invention relates to the field of chemical synthesis, in particular to a palladium-catalyzed N-monoallylamine derivative synthesis method. According to the invention, (heterocyclic) aryl primary amine and secondary amine are used as allyl receptors, so that the use of highly toxic allylamine, allyl alcohol and halogenated allyl compounds with environmental pollution risks can be avoided, and diallylamine as an allyl source is not reported yet. The preparation method provided by the invention only needs a small amount of palladium catalyst, is simple and safe to operate, easily available in raw materials, few in reaction steps, mild in reaction conditions, wide in substrate expansion range and high in compound functional group tolerance, and the product yield can reach 97% or above. The high-efficiency synthesis method provided by the invention can generate monoallyl substituted secondary amine and tertiary amine derivatives with high chemical selectivity, not only can gram-grade monoallyl amine derivatives, but also can be smoothly applied to derivatization reaction of drugs on the market.