42 results about "Allyl compound" patented technology

The invention belongs to the technical field of polymer composite materials, and particularly relates to a high-strength bismaleimide resin material and a preparation method thereof. The bismaleimide resin composition comprises the following components in parts by weight: 50-60 parts of bismaleimide resin, 40-50 parts of an allyl compound, 1-3 parts of modified graphene and 0.1-0.5 part of a dispersing filler, the dispersing filler is prepared from modified inorganic nanoparticles and modified tetrapod-like zinc oxide whiskers in a mass ratio of (0.1-1): 1. Wherein the tetrapod-like zinc oxide whiskers can promote the dispersion of the graphene with a large lamellar structure from the macroscopic aspect, so that the graphene is uniformly dispersed in a bismaleimide resin matrix, and the inorganic nanoparticles can play a role in lubrication and isolation, so that the agglomeration among graphene lamellas in a small range is prevented. By adding the graphene composite reinforcing filler, the rigidity of the bismaleimide resin material is improved, and the toughness of the composite material can be improved at the same time.

The invention discloses a low-temperature curable bismaleimide resin-based composite material surface film and a preparation method thereof, relates to the field of bismaleimide resin composite material surface films, and aims at solving the problem that the curing temperature of an existing bismaleimide resin composite material surface film is too high. The surface film is composed of bismaleimide resin, an allyl compound, thermoplastic resin, a catalyst and a fluidity control agent. The preparation method comprises the following steps: adding the allyl compound into a reaction kettle, heating and stirring, adding the thermoplastic resin, cooling, adding the bismaleimide resin, continuously heating and stirring, and carrying out double-roller hot rolling film forming on the bismaleimide resin and a carrier for manufacturing an adhesive film through an adhesive film machine to prepare the low-temperature curable bismaleimide resin surface film.

This application relates to the field of semiconductor technology, and particularly to an allyl compound and its preparation method, a bismaleimide resin composition, and its applications. An allyl compound has the structure shown in Formula I. When the compound with the above structure reacts with bismaleimide resin, it forms a larger porous structure within the bismaleimide material, increasing the internal free volume of the material. This significantly reduces the dielectric constant and dielectric loss of the bismaleimide material, enabling it to be used as a low-dielectric packaging substrate material in high-frequency, high-speed communication applications. Formula I.

The invention relates to the technical field of conductive silver adhesives, in particular to a high-shear-strength conductive silver adhesive and a preparation method thereof.The high-shear-strength conductive silver adhesive is prepared from, by weight, 40-70 parts of conductive silver powder, 10-30 parts of epoxy resin, 2-10 parts of modified liquid resin, 3-10 parts of reactive diluent and 4-8 parts of curing agent. The liquid resin is modified by introducing the silallyl compound containing Schiff base, and the proportion of each component is accurately regulated and controlled, so that the conductive silver adhesive with high shear strength and excellent conductivity is successfully prepared, and the conductive silver adhesive has a wide application prospect in the field of high-end electronic packaging.

The invention relates to the technical field of composite material preparation and curing molding, in particular to a preparation method of a carbon fiber bismaleimide resin composite material. The method comprises the following steps: curing a carbon fiber bismaleimide resin prepreg under vacuum and pressure conditions, wherein the carbon fiber bismaleimide resin prepreg is prepared from a resin system containing an allyl compound, bismaleimide resin and a thermoplastic toughening agent; the curing procedure comprises the following steps: (1) raising the temperature to 130-150 DEG C and keeping the temperature; (2) continuously raising the temperature to 180 + / -5 DEG C and keeping the temperature; (3) continuously raising the temperature to 200-220 DEG C and keeping the temperature to complete the curing reaction; and cooling and demolding. The structure prepared by the method has relatively good energy dissipation capability when bearing an impact load, so that the damage expansion trend of the material is effectively controlled, and a relatively small damage area after impact is shown.

The application discloses an allyl compound containing chiral monofluoromalonate diester and an asymmetric catalytic synthesis method and application thereof, the compound has the structure shown in the following formula, has potential biological activity and pharmacodynamic activity, provides strong technical support for development of new drugs, and has high practical value; the synthesis method is started from 1,3-diene and a nucleophilic reagent fluoromalonate diester as raw materials, and the chiral monofluoromalonate diester substituted allyl compound is efficiently synthesized through a chiral metal catalyst. The method has the following characteristics: the raw material is cheap and easy to obtain; no base needs to be added, the reaction condition is mild, and the operation is simple; the substrate has a wide application range, excellent enantioselectivity can be obtained, and good to excellent yield is achieved. The product prepared by the application is a useful fluorine-containing building block, and a variety of fluorine-containing compounds can be synthesized through simple chemical conversion.

The invention discloses a sulfur-containing gem-difluoroallyl compound as well as a preparation method and application thereof. The invention provides a preparation method of a compound as shown in a formula C. The preparation method comprises the following step: in a solvent, in the presence of alkali, carrying out gem-difluoroallylation reaction on a compound as shown in a formula A and a compound as shown in a formula B to obtain the compound as shown in the formula C. According to the method, the sulfydryl in the sulfydryl-containing compound can be mildly and efficiently gem-difluoroallylated, metal catalysis is not needed, the reaction can be performed in a water phase, the operation is simple, and the method is suitable for performing rapid fluoroalkylation modification and further functional modification on polypeptide, protein, complex bioactive molecules and the like; the method has very important application prospects in the fields of medicine, life science and the like.

This invention discloses a high-toughness, low-dielectric bismaleimide resin composition, a modified bismaleimide resin, its preparation method, and its applications. The bismaleimide resin composition comprises bismaleimide resin, an allyl compound, and a liquid rubber, wherein the liquid rubber contains end-capping groups capable of reacting with double bonds. This invention primarily addresses the problems of high dielectric constant, poor toughness, and poor interlaminar shear strength in existing bismaleimide resins. In this invention, the dielectric properties and toughness are improved by reacting the end-capping groups in the liquid rubber with the bismaleimide resin, while maintaining the mechanical properties and heat resistance essentially unchanged.

The application belongs to the technical field of compound preparation, and discloses a preparation method of (1'S, 2'S)-eugenol glycerol 3'-O-beta-D-glucopyranoside. The method is characterized in that: a phenolic hydroxyl group allyl compound protected by a benzyl group is subjected to O-glycosylation reaction with a D-glucopyranosyl donor protected by an acetyl group, so as to obtain an olefin type protected glycoside intermediate which retains a side chain carbon-carbon double bond; then, asymmetric dihydroxylation reaction is performed on the intermediate, so as to construct a target vicinal diol chiral structure; finally, the acetyl protecting group of the sugar hydroxyl group and the benzyl protecting group of the phenolic hydroxyl group are sequentially removed, so as to obtain the target compound. The preparation method of (1'S, 2'S)-eugenol glycerol 3'-O-beta-D-glucopyranoside is characterized in that: the glycoside bond is constructed before dihydroxylation, which is beneficial to reducing the competition reaction of multiple hydroxyl groups and realizing the preparation of the target compound.

The present application relates to a kind of chiral monofluoro bis (aryl sulfonyl) methyl or (deuterated) monofluoromethyl substituted chiral allyl compound and its asymmetric catalytic synthesis method and application.The compound has potential biological activity and pharmacodynamic activity, and can provide strong technical support for fluorine-containing new drug research and development.The synthesis method is: under the condition of chiral catalyst, with 1,3-diene and fluorinated bis aryl sulfonyl methane as raw material, by asymmetric hydrogen monofluoroalkylation reaction or asymmetric hydrogen monofluoroalkylation reaction / reduction de-fouling base series reaction, high stereoselectivity synthesis the chiral monofluoro bis (phenylsulfonyl) methyl or (deuterated) monofluoromethyl substituted chiral allyl compound, and the specific reaction process is as shown in reaction formula (A).The raw material is cheap and easy to obtain;Reaction condition is mild, and operation is simple;Substrate structure is rich and varied, can obtain good to excellent yield and enantioselectivity etc., with wide application prospect.

The application provides a photosensitive resin composition, a resist ink, a resist laminated body and application thereof. The photosensitive resin composition comprises, in parts by weight, 50-70 parts of an alkali-soluble resin, 30-50 parts of a photopolymerizable monomer and 0.1-4.0 parts of a photoinitiator; wherein the photopolymerizable monomer comprises an allyl compound and a mercapto compound, and the mass content of the mercapto compound in the photopolymerizable monomer is 7wt%-22wt%. The application introduces the allyl compound and the mercapto compound into the photosensitive resin composition, the alkyl group in the allyl compound can add polymerize with the mercapto group in the mercapto compound, which helps to make the prepared photosensitive resin have relatively uniform crosslinking after exposure, and obtain a photosensitive resin with low polymerization shrinkage stress, which shows good adhesion in the bonding process of a copper substrate.

A method of manufacturing a semiconductor device includes: preparing a first circuit member having a first substrate, a first electrode, and a first insulating film; preparing a second circuit component, wherein the second circuit component is provided with a second substrate, a second electrode and a second insulating film; and bonding the first circuit member and the second circuit member such that the first insulating film and the second insulating film are bonded and the first electrode and the second electrode are bonded by heating and pressurizing the first circuit member and the second circuit member. At least one of the first substrate and the second substrate is a semiconductor substrate having a circuit surface. At least one of the first insulating film and the second insulating film is an organic insulating film containing a cured product of a curable resin composition containing a maleimide compound having a maleimide group and an allyl compound having an allyl group.

This invention relates to the field of organic chemical synthesis, specifically to a method for the stereodispersive synthesis of iodoallyl compounds, including E-type and Z-type iodoallyl compounds. This invention provides a novel stereodispersive method for the synthesis of iodoallyl compounds, which has broad substrate applicability and can prepare a variety of iodoallyl compounds. Furthermore, in the presence of a photocatalyst or a manganese catalyst and a base, high temperature and high pressure are not required; iodoallyl compounds can be prepared stereodispersively simply by visible light irradiation. In other words, the reaction conditions of this invention are mild and the operation is simple. The method also has broad substrate applicability and can prepare a variety of iodoallyl compounds. By using specific starting materials, which do not require any further treatment or modification and can be used directly in the reaction, the reaction steps are few and the process is simple, showing broad application prospects.

The application belongs to the technical field of polymer composite materials, and particularly relates to a high-strength bismaleimide resin material and a preparation method thereof. The bismaleimide resin material comprises the following components in parts by weight: bismaleimide resin 50-60 parts, allyl compound 40-50 parts, modified graphene 1-3 parts, and dispersed filler 0.1-0.5 parts. The dispersed filler is composed of modified inorganic nanoparticles and modified four-needle-shaped zinc oxide whiskers in a mass ratio of (0.1-1):1. The four-needle-shaped zinc oxide whiskers can promote the dispersion of graphene with a large lamellar structure from a macroscopic perspective, so that the graphene is uniformly dispersed in the bismaleimide resin matrix. The inorganic nanoparticles can play a lubricating and isolating role to prevent the agglomeration between graphene lamellar layers in a small range. The addition of the graphene composite reinforcing filler can improve the rigidity of the bismaleimide resin material and also improve the toughness of the composite material.

To provide a solid-supported ruthenium complex useful as a catalyst for producing allyl compounds, a method for producing the same, and a method for producing an allyl compound using the same.SOLUTION: The solid-supported ruthenium complex is represented by General Formula (1), and an allyl compound is produced using the solid-supported ruthenium complex as a catalyst.SELECTED DRAWING: None

The invention provides a resin composition. The resin composition comprises epoxy resin, an active ester compound, free radical polymerization resin, an inorganic filling material and an accelerant. The radically polymerizable resin includes an olefin compound. The olefin compound comprises a methacrylic acid compound, a styrene compound, an allyl compound or a combination thereof.

The invention belongs to the technical field of polymer composite materials, and particularly relates to a modified environment-friendly bismaleimide resin material and a preparation method thereof. The resin material comprises the following components: bismaleimide resin, an allyl compound, and amino modified carbon nanotubes and amino modified tetrapod-like zinc oxide whiskers in a mass ratio of 1: (0.01-0.1). The amino-modified tetrapod-like zinc oxide whiskers and the amino-modified carbon nanotubes are compounded, and the tetrapod-like whisker structure can be mutually entangled with the carbon nanotubes with one-dimensional linear structures, so that the dispersion of the carbon nanotubes is promoted, and the problem that the carbon nanotubes with the one-dimensional linear structures are easy to agglomerate is solved. In addition, the amino-modified tetrapod-like crystal whisker shows better stress transfer and dissipation capacity than common one-dimensional crystal whiskers, the rigidity of the composite material is improved, the toughness of the composite material can be improved, and the amino-modified tetrapod-like crystal whisker is wide in application and can be used as a base material for non-metal additive materials.

To provide a resin composition capable of satisfying requirements for copper foil adhesion and film-forming properties while optimizing electrical performance of an epoxy resin system.SOLUTION: Provided is a resin composition including an epoxy resin, an active ester compound, a radical polymerizable resin, an inorganic filler material, and an accelerator, the radical polymerizable resin including an olefin compound, the olefin compound including a methacrylic compound, a styrene compound, an allyl compound, or a combination thereof.SELECTED DRAWING: None

The invention belongs to the field of composite materials, and particularly relates to a high-temperature-resistant bismaleimide resin for wet winding forming and a preparation method thereof, and the high-temperature-resistant bismaleimide resin comprises the following raw materials: a bismaleimide resin monomer, an epoxy resin monomer, a modifier, an ammonia curing agent, a diluent and a curing initiator. An allyl process modifier and an epoxy resin monomer are used as raw materials, an amine catalyst is selected, novel allyl phenoxy resin is synthesized to modify bismaleimide resin, BMI and an allyl compound are firstly subjected to diene addition to generate an intermediate, then the intermediate and double bonds of BMI are subjected to Diels-Adler reaction, a resin system with high crosslinking density is formed, and the bismaleimide resin with high crosslinking density is obtained. Meanwhile, a curing initiator is added to reduce the curing temperature of the modified BMI resin system, and a diluent is added to reduce the viscosity of the modified BMI resin system, so that the modified bismaleimide resin system which is good in toughness, low in viscosity and curing temperature and capable of keeping good heat resistance is obtained.

The invention discloses semi-cured modified bismaleimide varnished cloth for a voice coil framework and a preparation method of the semi-cured modified bismaleimide varnished cloth. The varnished cloth disclosed by the invention is obtained by dipping fiber cloth in a modified bismaleimide resin glue solution and then drying until the fiber cloth is semi-cured, the B-order resin content of the varnished cloth is not less than 25%, and the volatile matter content is not more than 1.5%; the modified bismaleimide resin glue solution is prepared by reacting a component A and a component B; the component A is a prepolymer solution with the solid content of 40-60%, which is obtained by reacting bismaleimide resin, an allyl compound and aromatic diamine as reactants in a polar aprotic solvent; the component B is a polyamide acid solution of which the viscosity is less than or equal to 4000 centipoises; and the use amount of the component B is 1-10wt% of the total weight of reactants in the component A by controlling the added polyamide acid. The varnished cloth has ketone solubility and can be directly used as a voice coil framework for winding, and copper wires can be bonded and fixed through acetone during winding.

The application discloses a resin composition and application thereof, and the resin composition comprises, in terms of solid weight, 20-100 parts of a modified maleimide prepolymer, 10-80 parts of an epoxy resin, 5-60 parts of an active ester and 5-50 parts of an elastomer; the reactants of the modified maleimide prepolymer comprise an amine compound, an allyl compound and a maleimide resin; and the mass percentage of components with a number average molecular weight less than 1000 in the modified maleimide prepolymer is 10-40%. The application modifies the maleimide resin by using the amine compound and the allyl compound together, and is matched with the active ester compound and the epoxy resin, and the content of the low-molecular-weight components in the modified maleimide prepolymer is controlled, so that the compatibility among the maleimide resin, the active ester and the epoxy resin is improved, the heat resistance of the resin cured product is improved, the dielectric property and the water absorption of the resin cured product are reduced.

The invention discloses allyl modified lignin, a preparation method and application of the allyl modified lignin in enhanced rubber, the modified lignin is prepared by modifying lignin with an allyl-containing compound, and the preparation method comprises the following steps: dissolving lignin in a solvent, adding the allyl-containing compound and a catalyst, and continuously stirring for 0.5-1 hour; heating to gradually raise the temperature to the boiling point of the solvent, and carrying out reflux reaction for 2-8 hours; after the reaction is finished, performing reduced pressure distillation on reaction liquid to recover the solvent; and crushing the distilled and dried modified lignin until the particle size D97 is less than or equal to 150 microns. Lignin is modified through an allyl-containing compound, hydroxyl in the lignin is closed, and therefore the polarity of the lignin is reduced. Double bonds contained in the modified lignin can be bonded with olefin in rubber, so that the binding force between the lignin and the rubber is enhanced. Meanwhile, interaction among lignin molecules is reduced through blocking of hydroxyl, the agglomeration phenomenon of the lignin is effectively inhibited, and therefore the dispersity of the lignin in a rubber matrix is further improved.

The invention discloses a microcapsule type curing agent as well as a preparation method and application thereof, and belongs to the technical field of epoxy resin curing. The microcapsule type curing agent comprises a microcapsule shell and a microcapsule core, the microcapsule core is an imidazole curing agent, and the microcapsule shell is obtained by a thiol-ene click reaction of an allyl compound and a thiol compound. According to the present invention, the sulfydryl-alkene click reaction has characteristics of high selectivity and high efficiency, such that the allyl compound and the sulfydryl compound can rapidly form the cross-linked shell layer during the reaction so as to rapidly coat the imidazole curing agent so as to improve the coating rate; moreover, the allyl compound and the sulfhydryl compound react to form a compact three-dimensional network, so that the strength and compactness of the microcapsule shell are improved, and the dispersion stability of the curing agent in the epoxy resin and the final curing performance are improved.

The present disclosure relates to a novel thermosetting resin composition used for forming an insulating film applied to hybrid bonding.SOLUTION: A thermosetting resin composition for hybrid bonding, comprising a maleimide compound having a maleimide group represented by formula (I): and a reactive component other than the maleimide compound. The reactive component includes an allyl compound having an allyl group.SELECTED DRAWING: Figure 3

A resin composition includes an epoxy resin, an active ester compound, a free radical polymerizable resin, an inorganic filler material, and an accelerator. The free radical polymerizable resin includes an olefin compound. The olefin compound includes a methacrylic compound, a styrene compound, an allyl compound, or a combination thereof.

The invention relates to the technical field of high polymer materials, and particularly discloses a preparation method and application of high-temperature-resistant hot-melt bismaleimide resin. The resin system comprises a bismaleimide monomer, an allyl compound and a special norbornene reactive diluent. The diluent is prepared from norbornene dianhydride and aromatic diamine through a condensation reaction, and the diluent is crushed into micron-sized powder. In the preparation process, the diluent powder is mixed with bismaleimide resin and other components, and the resin meets the hot melting method prepreg preparation technological process. During heating and curing, the diluent powder is molten, so that the melt viscosity of a resin system is remarkably reduced, and the process operability is improved; then, an active end group in the diluent is copolymerized with bismaleimide resin to form a compact cross-linked network, so that small molecule volatile matters are eliminated, and the glass-transition temperature and the thermal decomposition temperature of a cured product are remarkably improved. The method is simple in process and suitable for manufacturing high-performance composite materials in the aerospace field.

This invention discloses a bismaleimide resin system, its preparation method, and its applications. The bismaleimide resin system comprises bismaleimide resin, an allyl compound, a polysulfone resin, a polyetheretherketone resin, and hydroxylated MXene. The polysulfone resin, polyetheretherketone resin, and hydroxylated MXene constitute a multi-level synergistic crack-resistant system of rigid particles and flexible toughening components. This invention, through the multi-level synergistic crack-resistant effect of the rigid hydroxylated MXene particles and the flexible toughening components of polysulfone and polyetheretherketone, imparts high toughness to the bismaleimide resin system while maintaining suitable viscosity, thus achieving excellent lay-up processability and impact resistance.

Provided are an allyl polymer that has excellent fluidity, a thermosetting resin composition that uses the allyl polymer, a cured product, and a molded article. The present invention relates to an allyl polymer that is obtained by polymerizing an allyl compound represented by formula (1) and an allyl compound represented by formula (2), the value of the amount (mol%) of constituent units based on the allyl compound represented by formula (1) / the amount (mol%) of constituent units based on the allyl compound represented by formula (2) being at least 0.5. (1) X-(COOCH2CH=CH2)n (in which n is an integer from 2 to 4, inclusive, and X is a n-valent aromatic hydrocarbon group that may include an alkyl group). (2) Y-(COOCH2CH=CH2)n (in which n is an integer from 2 to 4, inclusive, and Y is a n-valent alicyclic hydrocarbon group that may include an alkyl group).

The invention discloses a cyclic regeneration method of a catalyst for preparing a 3, 3-dialkoxy propyl compound, which comprises the following steps: reacting an allyl compound with nitrite under the action of the catalyst, adding a reducing agent into the reaction system after the reaction is finished, filtering, and continuously rectifying the filtrate to obtain the 3, 3-dialkoxy propyl compound. The filter residues are oxidized by an oxidizing agent under the action of acid to generate a catalyst, and the catalyst is a bivalent palladium catalyst or a mixture of the bivalent palladium catalyst and a bivalent copper catalyst. An oxidizing agent and a reducing agent are added into a reaction system, so that the conversion of deactivation and reactivation of the catalyst is realized, coordination ions of the catalyst are provided by acid, and the cyclic regeneration of the catalyst is realized under the action of the oxidizing agent.

The invention relates to the technical field of resin-based composite materials, in particular to halogen-free flame-retardant wave-transparent bismaleimide resin, prepreg and a preparation method thereof. The halogen-free flame-retardant wave-transparent bismaleimide resin comprises the following components in parts by weight: 100 parts of bismaleimide resin monomer; 30-60 parts of flame-retardant temperature-resistant epoxy resin; 70 to 130 parts of an allyl compound; 15-30 parts of a curing agent; 20 to 100 parts of a flame retardant; and 10-40 parts of a toughening agent. The halogen-free flame-retardant wave-transparent bismaleimide resin prepreg comprises halogen-free flame-retardant wave-transparent bismaleimide resin, and the mass ratio of the halogen-free flame-retardant wave-transparent bismaleimide resin is 30-60%. The halogen-free flame-retardant wave-transparent bismaleimide resin, the prepreg and the preparation method of the halogen-free flame-retardant wave-transparent bismaleimide resin and the prepreg aim at solving the problem that the bismaleimide resin is difficult to have good low dielectricity and high flame retardance at the same time.