Preparation method of copper clad plate

A copper-clad laminate and resin technology, which is applied in chemical instruments and methods, printed circuit manufacturing, lamination, etc., can solve the compatibility problem of improper ratio of bismaleimide resin and affect the high performance of bismaleimide resin. Heat resistance, unable to meet the problems of high-performance copper clad laminates, etc., to achieve good flame retardant effect, low dielectric loss, and low toxicity

Active Publication Date: 2010-02-17
SHENGYI TECH SUZHOU
View PDF0 Cites 30 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] (1) Improper ratio of phosphorus-containing resin to allyl-modified bismaleimide resin will cause compatibility problems;
[0009] (2) When the amount of phosphorus-containing resin is too large, it will affect the high heat resistance of the allyl-modified bismaleimide resin, such as Tg reduction , poor moisture resistance, etc., which also cannot meet the requirements of high-performance copper clad laminates

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of copper clad plate
  • Preparation method of copper clad plate
  • Preparation method of copper clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Take 100g of 4,4'-diphenylmethane bismaleimide and 50g of allyl bisphenol A, put them into a 500ml beaker, react at 130-150°C for 50min to obtain a modified bismaleimide resin, add an appropriate amount of acetone after cooling dissolve. After the modified double horse resin is completely dissolved, add 40g of phosphorus-containing epoxy resin (the selected phosphorus-containing epoxy resin is: KDP555MC80 (KUKDO) or SEN-250MC80 (SHIN-ATδC)), 10g of bisphenol A phenolic resin (hydroxyl Equivalent 120g / mol), 25g of phosphorus-containing phenolic resin (the grade of selected phosphorus-containing phenolic resin is XZ92741), 0.05g of 2-methyl-4-ethylimidazole, stir and mix evenly to obtain glue. Select a 300×300cm, flat and smooth E-glass fiber cloth, evenly coat the above glue, and bake it in an oven at 165°C for 10 minutes to make an adhesive sheet. Superimpose 5 adhesive sheets with burrs cut off, attach 35μ copper foil up and down, place them in a vacuum hot press and ...

Embodiment 2

[0051] Take 100g of 4,4'-diphenyl ether bismaleimide and 70g of allyl phenoxy resin (AE), put them into a 500ml beaker, and react at 130-150°C for 65min to obtain modified bismaleimide resin, after cooling Add appropriate amount of acetone to dissolve. After the modified double horse resin is completely dissolved, add 100g of phosphorus-containing epoxy resin (the grade of the selected phosphorus-containing epoxy resin is one of KDP550MC65 (KUKDO) or SEN-290MC65 (SHIN-ATδC)), 15g of bisphenol Type A benzoxazine resin (hydroxyl equivalent 120g / mol), 15g phosphorus-containing phenolic resin (the grade of selected phosphorus-containing phenolic resin is XQ82976), 0.10g 2-methyl-4-ethylimidazole, stir and mix evenly to obtain glue liquid. Select a 300×300cm, flat and smooth E-glass fiber cloth, evenly coat the above glue, and bake it in an oven at 165°C for 10 minutes to make an adhesive sheet. Superimpose 5 adhesive sheets with burrs cut off, attach 35μ copper foil up and down,...

Embodiment 3

[0053] Take 100g of 4,4-diphenylisopropyl bismaleimide and 40g of allylphenolic resin (AF), put them into a 500ml beaker, and react at 130-150°C for 42min to obtain modified bismaleimide resin, after cooling Add appropriate amount of acetone to dissolve. After the modified double horse resin is completely dissolved, add 55g phosphorus-containing epoxy resin (the grade of the selected phosphorus-containing epoxy resin is selected from: one of KEG-H5138 (KOREA KOLON) or BEP400A70 (Taiwan Changchun)), 40g Phenolic biphenylene type resin (hydroxyl equivalent 260g / mol), 20g phosphorus-containing phenolic resin (the grade of selected phosphorus-containing phenolic resin is XZ92741), 0.10g 2-methyl-4-ethylimidazole, stir and mix evenly to obtain glue liquid. Select a 300×300cm, flat and smooth E-glass fiber cloth, evenly coat the above glue, and bake it in an oven at 165°C for 10 minutes to make an adhesive sheet. Superimpose 5 adhesive sheets with burrs cut off, attach 35μ copper ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thermal decomposition temperatureaaaaaaaaaa
Login to view more

Abstract

The invention discloses a preparation method of copper clad plate and the method comprises the following steps: (1) adopting bismaleimide resin and allyl compound in a weight ratio of 100:40-100 to react at 110-160 DEG C for 10-120min and obtain prepolymer, cooling to room temperature after finishing the reaction, using acetone to prepare prepolymer solution; (2) adding 15-150 parts of epoxy resinwith phosphorous, 10-100 parts of compound curing agent and 0-5 parts of curing accelerator in the solution obtained in the step 1, stirring evenly to obtain a glue solution, selecting a flat E-glassfibic cloth, coating the glue solution evenly on the glassfibic cloth, then roasting to prepare B-stage prepreg; (3) cutting the B-stage prepreg to proper size according to the size of a pressing machine, overlying five prepregs while placing two high impact copper foils with the same size separately on the top and bottom of the prepregs, placing the prepregs with copper foils in a vacuum hot pressing machine to press and obtaining the copper clad plate. The obtained copper clad plate can meet the demand for halogen-free and flame resistance, the heat resistance and humidity resistance are excellent, and the low dielectric loss and pressing toughness are good.

Description

technical field [0001] The invention relates to a method for preparing a copper clad laminate. Background technique [0002] Due to the rapid development of the current electronic industry, electronic products are required to develop in the direction of light weight, thinner, high performance, high reliability and environmental protection, so higher requirements are also put forward for printed circuit boards and copper clad boards. The specific requirements of its products are high heat resistance, low thermal expansion coefficient, high humidity and heat resistance, environmental protection and flame retardancy, low dielectric constant and dielectric loss, and high elastic modulus. [0003] As a high-performance resin matrix, bismaleimide resin has the characteristics of high moisture / heat resistance, radiation resistance, low dielectric constant and dielectric loss, high modulus, etc., and has broad application prospects. However, due to the shortcomings of bismaleimide ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B32B37/10B32B15/08B32B15/20
Inventor 肖升高梁国正顾嫒娟黄荣辉谌香秀
Owner SHENGYI TECH SUZHOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap