The invention relates to high-temperature-resistant matrix resin for a high-Tg copper-clad plate and a preparation method of the high-temperature-resistant matrix resin. The matrix resin comprises epoxy resin, a polyimide resin liquid, tetrabromophthalic anhydride, DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide), a curing agent and an organic solvent whose mass ratio is 100:50:150: (12-25) : (5-30) : (50-100). The preparation method is as follows: after epoxy resin, DOPO and tetrabromophthalic anhydride are mixed and react, a component A is obtained; after aromatic diamine, aromatic quaternary amine, aromatic dianhydride and maleic anhydride completely react in a strong-polarity nonprotic organic solvent, an azeotropic dehydrating agent and a catalyst are added, and the polyimide resin liquid, namely, a component B is obtained after an azeotropic dehydration imidization reaction; the component A and the component B are mixed, and the curing agent and the organic solvent are added, and the mixture is uniformly mixed to obtain the high-temperature-resistant matrix resin. The product has excellent overall performance, is suitable for manufacturing an advanced composite material, is particularly suitable for manufacturing the high-Tg copper-clad plate and has a good market prospect.