The present invention discloses a one-component toughened thermal conductive
epoxy resin film and its preparation. It consists of the following components in weight percentage: 30-40% of
epoxy resin, 10-30% of modified toughened resin, 5-20% of
toughening agent, 1-10% of curing agent, 30-50% of thermal conductive filler, and 1-10% of thixotropic agent. Among them, the modification method of the modified toughened resin is to mix the resin, catalyst and strong base, heat them, then treat and dry the resin for standby. The percentage content of raw materials is 1-10% of
toughening resin, 0.1-1% of catalyst, 0.5-3% of strong base, and the rest is
solvent. The modification method of the thermal conductive filler is to mix the thermal conductive filler,
coupling agent and
organic acid, heat and react them, then wash and dry them for standby. The percentage content of raw materials is: 10-20% of thermal conductive filler, 1-5% of
organic acid, and 0.5-3% of
coupling agent, with the balance being
solvent. The present invention uses
epoxy resin and modified toughened resin as the
composite matrix to prepare a room-temperature storage, tough and thermal conductive epoxy resin, meeting the actual application requirements in terms of
thermal conductivity, adhesion, etc.