Aiming at the problems existing in the present cooling and
radiation protection technologies of electronic products, the invention provides an SMD (surface mounted device) with cooling and
electromagnetic wave absorption functions, which is applied to
electronic equipment. The SMD comprises a decoration layer, a cooling and
electromagnetic wave absorption layer for cooling and
electromagnetic wave absorption and a mounting layer, wherein the cooling and electromagnetic
wave absorption layer is arranged between the decoration layer and the mounting layer. The SMD further comprises a protective stripping layer which is arranged below the mounting layer and used for protecting the adhesiveness of the mounting layer, and the stripping layer is taken off before the SMD is used, and then the SMD is mounted at a position needing cooling and electromagnetic
wave absorption. Furthermore, the cooling and electromagnetic
wave absorption layer is of a structure consisting of more than two
layers, including a cooling layer and an electromagnetic wave
absorption layer which are independent from each other; accordingly, the cooling and electromagnetic wave
absorption layer can be a single-layer structure and is made of a material with cooling and cooling and electromagnetic wave absorption functions. The invention also provides the preparation and application methods of the SMD. The SMD with cooling and electromagnetic wave absorption functions is applied to a shell of
electronic equipment, and the shell of the
electronic equipment includes but is not limited to a
mobile phone shell, a network card, a panel
personal computer shell hot spot, a netbook shell hot spot, notebook computer shell hot spot, game equipment and other
consumer mobile equipment can improve
cooling effect, reduce temperature and weaken electromagnetic wave
radiation.