A composition for thermosetting bond is provided to improve: adhesiveness between butadiene-acrylonitrile copolymer and the substrate; compatibility with an epoxy resin; moisture resistance, chemical resistance, reliability, solder resistance, burr properties and bending properties, thereby being suitably used to an adhesive tape for electronic parts; and interfacial adhesiveness between a substrate film and the adhesive agent, thereby improving bending resistance and reliability at high temperature. The composition is suitably used to a flexible printed circuit board. The composition for thermosetting bond comprises: (1) a butadiene-acrylonitrile copolymer which contains a carboxyl polyamide aminocarbonyl group (A) and a polysiloxane aminocarbonyl group (B), and is represented by the formula 1, wherein A=(100-B), wherein each A and B is a molar ratio ranged from 1-99; each k, m and n is a molar ratio, k=1, m=3-200, and n=0.2-100; R1 and R2 are alkyl groups of C1-C20, respectively; and O, P and Q are integers between 1-20; and (2) an epoxy resin. The butadiene-acrylonitrile copolymer has a weight average molecular weight of 10000-200000, wherein the acrylonitrile unit is 2-40wt%. The composition comprises the epoxy resin with the amount of 10-900pts.wt, based on 100pts.wt of the butadiene-acrylonitrile copolymer.