1074 results about "Silicone tape" patented technology

The invention relates to a protective film uncovering process based on corner lifting and rolling cooperation type screen display glass. The protective film uncovering process comprises the following steps: S1, corner lifting; s2, tearing off; and S3, collecting the film. On one hand, through cooperation of the film tearing clamping jaw and the rolling wheel, step-by-step peeling with the rolling position and the peeling position aligned is kept, meanwhile, the angle between the connecting section and the screen display glass is gradually increased on the basis that the connecting section is turned inwards under the condition that the adhesion section is not stressed, the success rate of forming an inwards-turned peeling angle is greatly increased, and the production efficiency is improved. The probability that the film-tearing adhesive tape is separated from the protective film or the corner of the protective film is torn is reduced; on the other hand, the complete tearing rate of the protective film is increased based on the relative movement of the glass and the film tearing clamping jaw, the tearing risk of the protective film is reduced, more labor-saving and faster diagonal tearing is achieved, meanwhile, based on pulling formed by the film collecting clamping jaw and the film tearing clamping jaw and airflow blowing cooperation formed by the film collecting clamping jaw and the film tearing clamping jaw, the completeness of film collecting is improved, and the production efficiency is improved. And the problem that the film tearing adhesive tape is adhered to the film tearing clamping jaw is solved, so that the continuity of peeling off the protective film is improved.

The invention relates to the technical field of adhesive tapes, and particularly discloses a UV (ultraviolet) visbreaking anti-acid adhesive tape for thinning flexible glass and a preparation process of the UV visbreaking anti-acid adhesive tape. A UV viscosity-reducing acid-resistant adhesive tape for thinning flexible glass comprises a base material layer, a pressure-sensitive adhesive layer and a release film layer which are stacked in sequence, and the pressure-sensitive adhesive layer is prepared from the following raw materials: 85-120 parts by mass of an acrylate copolymer, 3-5 parts by mass of a cross-linking agent, 1.5-2.5 parts by mass of a photoinitiator, 2-5 parts by mass of an acid-resistant nano filler and 0.2-0.4 part by mass of an amine catalyst; the acrylate copolymer is prepared from the following raw materials in parts by mass: 20-30 parts of an imidazolinyl-containing monomer, 15-25 parts of a large-steric-hindrance alkyl-containing monomer, 45-55 parts of a flexible monomer and 5-10 parts of a carboxyl-containing monomer. The UV visbreaking acid-resistant agent prepared by the invention has relatively good acid resistance and reliable UV visbreaking and high initial bonding balance.

The utility model relates to a sticky ball enveloping machine in the field of enveloping machines, which comprises a machine body, a sticky film adhesive tape clamp, a clamping component and a rotating component are arranged on the machine body, a ball pressing roller is arranged at one end of a support frame far away from the sticky film adhesive tape clamp, and the ball pressing roller is connected with the support frame through a first lifting cylinder. The supporting frame is further provided with a cutter used for cutting off the adhesive film, a recycling hopper used for recycling adhesive tape release paper is arranged below the adhesive film adhesive tape clamp, the rotating assembly is arranged on the machine body through a sliding assembly, and the rotating assembly can move left and right on the machine body through the sliding assembly to the position above any clamping assembly. An electric sliding rail used for controlling the rotating assembly to move left and right is arranged in front of the sliding assembly, a sliding table of the electric sliding rail is connected with the sliding assembly, the feeding groove and the receiving groove are formed in the two ends of the three clamping assemblies correspondingly, and the control panel is connected with the machine body through the supporting column. The product quality is ensured and the production cost is reduced.

A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH / g or more.

A sticky tape that can be heated and separated in a short time and can effectively prevent thermal damage to an adherend is provided. The sticky tape separable by heating, includes: an intermediate layer A containing a heating element and an adhesive agent; an adhesive agent layer B1 disposed on one surface side of the intermediate layer A and containing an adhesive agent; and an adhesive agent layer B2 disposed on the other surface side of the intermediate layer A and containing an adhesive agent. At least one of the adhesive agent layer B1 and the adhesive agent layer B2 is a heat-insulating layer C further having heat-insulating properties, or a heat-insulating layer C with heat-insulating properties is further provided at least one of between the intermediate layer A and the adhesive agent layer B1 and between the intermediate layer A and the adhesive agent layer B2.

The invention relates to the technical field of semiconductor wafer processing, and particularly discloses an adhesive tape for semiconductor wafer thinning and a preparation process thereof. The adhesive tape for semiconductor wafer thinning comprises a base material layer and a bonding layer arranged on the surface of the base material layer, the base material layer is made of polyolefin, and the bonding layer is a modified acrylic acid adhesive layer; the modified acrylic acid adhesive layer is prepared from the following raw materials in parts by weight: 60 to 70 parts of 2-ethylhexyl acrylate, 15 to 25 parts of butyl acrylate, 5 to 10 parts of methyl methacrylate, 2 to 5 parts of hydroxyethyl acrylate, 0.5 to 2 parts of glycidyl methacrylate, 1 to 3 parts of a modifier, 0.8 to 1.2 parts of an isocyanate cross-linking agent, 0.3 to 0.8 part of an epoxy cross-linking agent and 0.3 to 0.8 part of azodiisobutyronitrile. According to the adhesive tape for semiconductor wafer thinning, the fixing and protecting effects on the wafer are improved.

The invention discloses a wear-resistant environment-friendly PET base material adhesive tape and a preparation method thereof, and belongs to the technical field of adhesive tapes, raw materials comprise a PET adhesive tape film and an EB curing modified adhesive, the surface of the modified PET adhesive tape film subjected to corona treatment is coated with the EB curing modified adhesive, then electron beam radiation curing is carried out, the absorbed dose of electron beams is 38-42 kGy, and the EB curing modified adhesive is prepared. And then cooling, rolling and curing to obtain the wear-resistant environment-friendly PET base material adhesive tape. The modified PET adhesive tape film is prepared from the following raw materials: PET resin and modified polyolefin elastomer master batch; the EB curing modified adhesive is prepared from the following raw materials: butyl acrylate, 2-ethylhexyl acrylate, tripropylene glycol diacrylate, acrylate resin, urethane acrylate and starch modified core-shell microsphere powder. According to the mode, a modification process is added in the preparation process of the PET adhesive tape film and the adhesive, and finally the environment-friendly PET base material adhesive tape with excellent comprehensive performance is prepared.

The invention discloses a polyester film for a blue adhesive tape, which is used for binding and packaging a battery of a new energy electric vehicle. The polyester film is prepared from 70-85 parts by weight of high-viscosity polyethylene glycol terephthalate, 5-12 parts by weight of thermoplastic polyurethane, 2-4 parts by weight of siloxane resin powder, 1-3 parts by weight of melamine cyanurate, 2-5 parts by weight of organic modified montmorillonite, 1-3 parts by weight of a coupling agent and 1-3 parts by weight of a coupling agent. 1-3 parts by weight of aromatic polyimide micro powder and 0.3-0.5 part by weight of ethylene glycol monostearate. The invention also discloses a preparation method of the polyester film. The polyester film for the blue adhesive tape is excellent in dielectric strength, flexibility, puncture resistance and flame retardance, the characteristics directly correspond to strict requirements of automobile lithium battery shell packaging, and comprehensive guarantee is provided for safety, reliability and environmental adaptability.

The invention provides an adhesive tape and a double-glass structure product. The adhesive tape comprises a release film layer, a pressure-sensitive adhesive layer and a base material layer which are sequentially stacked, the pressure-sensitive adhesive layer comprises a flaky magnetic filler; the flaky magnetic filler comprises a first-direction flaky magnetic filler and a second-direction flaky magnetic filler, an acute angle between the normal direction of the first-direction flaky magnetic filler and the winding axis direction of the adhesive tape is 0-45 degrees, and the first-direction flaky magnetic filler accounts for 50-100% of the weight of the flaky magnetic filler. By adding the flaky magnetic filler into the pressure-sensitive adhesive layer and adjusting the orientation of the flaky magnetic filler in the pressure-sensitive adhesive layer, the transverse and longitudinal water resistance of the adhesive tape is remarkably improved, the weather resistance and bonding strength of the adhesive tape are considered, and when the adhesive tape is applied to objects with water resistance requirements on edges or adhesive tape bonding parts, such as photovoltaic modules, laminated glass and the like, the adhesive tape has excellent water resistance. Effective protection can be provided, and the service life of assemblies is effectively prolonged.

The invention relates to the field of degradable adhesive tapes, in particular to a PVA degradable adhesive tape for carton packaging and a preparation method and application of the PVA degradable adhesive tape. The PVA degradable adhesive tape for carton packaging comprises a base material film layer and a pressure-sensitive bonding layer on the surface of the base material film layer, the base material film layer is prepared from the following raw materials in parts by mass: 60 to 80 parts of PVA (Polyvinyl Alcohol), 35 to 50 parts of auxiliary resin, 5 to 12 parts of toughening waterproof complexing agent, 10 to 15 parts of plasticizer, 3 to 5 parts of compatilizer, 0.3 to 0.6 part of antioxidant and 3 to 6 parts of reinforcing filler. The PVA degradable adhesive tape prepared by the invention not only has excellent degradability, but also can give consideration to the properties such as moisture resistance, water resistance, cohesiveness, mechanical properties, aging resistance, corrosion resistance and the like in the application process, so that the problems of obvious performance defects and performance balance contradiction existing in the existing PVA adhesive tape are solved; the application quality and the service life of the adhesive tape are greatly improved.

The invention discloses an adhesive tape with high stripping stability and a preparation process thereof. The adhesive tape comprises a PET (Polyethylene Terephthalate) base material subjected to corona treatment, an acrylic acid pressure-sensitive adhesive layer, a release layer and an antistatic liquid coating. The acrylic pressure-sensitive adhesive layer is composed of acrylate monomers, saturated polyester resin, bisphenol F, bisphenol A epoxy resin and amino resin. The preparation process comprises the steps of corona pretreatment of the polyethylene glycol terephthalate base material, coating of the antistatic liquid, coating of the pressure-sensitive adhesive, compounding of the release layer and curing treatment. The stripping force change rate of the adhesive tape after damp-heat aging and low-temperature aging is smaller than 5% and is far lower than the industrial standard, and the adhesive tape has excellent stripping stability, antistatic property and weather resistance and is suitable for the fields of electronic product protection, automobile paint spraying shielding and the like.

The application relates to an automatic film splicing device for coating production and belongs to the technical field of film splicing devices. The device comprises a rack, an operation platform arranged on the rack, a cutter mechanism arranged above the operation platform, upper and lower adsorption tape mechanisms arranged above and below the operation platform table respectively, and a station conversion mechanism for driving the upper adsorption tape mechanism to move between a film splicing preparation station and a tape sticking station. After the old and new film materials are cut by the cutter mechanism, the upper adsorption tape mechanism is driven by the station conversion mechanism to move from the film splicing preparation station to the tape sticking station, and the upper and lower adsorption tape mechanisms respectively stick the upper and lower tapes to complete the automatic butt joint of the old and new film rolls. The application realizes automatic positioning, pressing, cutting and double-side tape sticking of the old and new film materials, improves the film splicing efficiency and quality, eliminates the safety hazards of manual knife holding operation and improves the operation safety.

The invention belongs to the technical field of preparation of molecular materials and adhesive tapes, and discloses a degradable mylar adhesive tape and a preparation method thereof, the degradable mylar adhesive tape comprises a degradable base material layer and a degradable adhesive layer; the degradable base material layer is prepared from the following raw materials in parts by mass: 25-35 parts of poly (butylene succinate) (PBS), 20-30 parts of polylactic acid (PLA), 10-15 parts of polycaprolactone (PCL), 8-12 parts of modified bamboo fiber powder, 3-5 parts of a compatibilizer and 0.5-1 part of an antioxidant; the degradable adhesive layer is prepared from the following raw materials in parts by mass: 40 to 50 parts of a modified starch-based adhesive, 15 to 25 parts of poly (butylene adipate-co-terephthalate) (PBAT), 10 to 15 parts of polyhydroxyalkanoate (PHA), 5 to 8 parts of sodium alginate-chitosan composite gel, 5 to 8 parts of an epoxypropane modifier, 1 to 2 parts of a cross-linking agent and 0.3 to 0.5 part of a de-foaming agent; by optimizing the raw material composition and the preparation process of the base material and the adhesive, the full-life-cycle degradability of the adhesive tape is realized, and meanwhile, excellent mechanical properties, insulativity and temperature resistance are ensured.

The application discloses a heat-conducting adhesive tape and a preparation method thereof, and particularly relates to the field of heat-conducting adhesive tapes. The heat-conducting adhesive tape comprises a tape, the tape comprises an adhesive layer and release layers one and two respectively compounded on two sides of the adhesive layer, the release layer two is provided with a plurality of groups of tear zones, the tear zone is composed of a lap portion one and a lap portion two formed at opposite ends of the release layer two, the lap portion one is lapped on the lap portion two, and the adhesive layer comprises a base material and an adhesive agent coated on two sides of the base material. The lap portion one and the lap portion two are formed to be lapped with each other, so that when the tape is pasted on an LED lamp panel, the middle part can be pasted first, and then the two ends are pasted gradually from the middle part. Since the influence of tape rebound force on both sides of the LED lamp panel is independent and the rebound force is reduced, the bending deformation of the LED lamp panel can be greatly reduced by the method, and the LED lamp panel is not easy to fall off due to deformation after being pasted on a base plate.

The manufacturing process of the conventional tape is complicated, which leads to energy waste and an increase in manufacturing cost.SOLUTION: The present invention discloses an apparatus and a method for manufacturing a tape. The equipment for manufacturing the tape includes a base film forming section, an adhesive film forming section, a co-extrusion section, and a stretching section. The base film-forming portion thermally melts the substrate to form a base film. The adhesive film forming portion thermally melts the adhesive material to form a pressure sensitive adhesive film. The co-extrusion section is respectively connected to the base film forming section and the adhesive film forming section, and the base film and the pressure sensitive adhesive film enter the co-extrusion section to perform a co-extrusion manufacturing process, thereby obtaining a co-extruded film having the base film and the pressure sensitive adhesive film. The stretching section performs a stretching process on the co-extruded film.SELECTED DRAWING: Figure 1

To provide an adhesive tape for processing an electronic component capable of stably holding a substrate to be processed.SOLUTION: An adhesive tape 10 for processing electronic components includes a base material 11, a mesh layer 12 having a plurality of openings O1, and an adhesive layer 2 disposed on a first surface S1 of the base material 11. The base material has a sea-island structure having a region X that can be cut by water-jet laser processing from the surface on the adhesive layer side of the adhesive tape for processing electronic components and a region Y that cannot be cut by the water-jet laser processing in a plan view as viewed from the S1 of the second surface side opposite to the S2 of the first surface of the base material, in which the region X is an island and the region Y is a sea.SELECTED DRAWING: Figure 1

The invention discloses an impact-resistant acrylic foam tape and a preparation method thereof. The acrylic foam tape comprises a first release film layer, a first pressure-sensitive adhesive layer, a first foam layer, a second foam layer, a third foam layer, a base material layer, a second pressure-sensitive adhesive layer and a second release film layer which are sequentially stacked. According to the impact-resistant acrylic foam tape and the preparation method thereof provided by the invention, a laminated structure of the first foam layer, the second foam layer and the third foam layer is adopted to replace single-layer foam in the prior art, and the foam buffer layer is sequentially divided into a'hard-soft-hard 'or'hard-soft' multi-layer structure from top to bottom. When the foam adhesive tape is impacted in the vertical direction, the foam adhesive tape can be converted and decomposed into stress diffusion in multiple directions by the first foam layer, then energy consumption is carried out through mutual friction among the fillers, and then a bonding material is fully protected through the buffering effect of the second foam layer and the third foam layer.

The invention relates to the technical field of sealing adhesive tape processing, in particular to a flame-retardant heat-conducting sealing adhesive tape and a preparation method thereof.The flame-retardant heat-conducting sealing adhesive tape comprises a release layer, an adhesive layer and a base material layer; the adhesive layer is prepared from the following raw materials in parts by weight: 15-25 parts of organic silicon modified acrylic resin, 10-20 parts of epoxy modified acrylic resin, 90-100 parts of heat-conducting filler, 5-12 parts of a flame retardant, 10-15 parts of a dispersing agent and 1-3 parts of a curing agent; the heat-conducting filler comprises aluminum oxide with hydroxyl on the surface; according to the formula, the adhesive tape has good heat-conducting property, excellent bonding strength, flexibility and storage stability under the condition of ultrahigh filling of 90-100 parts, and the bottleneck of performance degradation caused by poor compatibility and dramatic viscosity increase of a traditional high-filling system is broken through; and the requirements of efficient heat dissipation and long-term reliable sealing of the power battery module are met.

The invention discloses an adhesive tape for battery insulation and a compounding process thereof, and relates to the technical field of battery insulation. The adhesive tape for battery insulation is prepared by taking a polyimide film as a base film and coating an adhesive, the adhesive is prepared from the following raw materials in parts by weight: 70 to 90 parts of polyacrylate emulsion, 6 to 12 parts of isocyanate curing agent, 4 to 8 parts of terpene resin, 10 to 18 parts of modified aluminum hydroxide, 5 to 9 parts of modified aluminum oxide, 7 to 14 parts of nano montmorillonite, 0.8 to 2.5 parts of antioxidant 168, 0.5 to 2 parts of ultraviolet light absorber UV-327, 2.5 to 5 parts of silane coupling agent KH-570, 31 to 48 parts of propylene glycol methyl ether acetate and 3 to 6 parts of glycerol. The adhesive tape for battery insulation is matched with modified aluminum hydroxide and aluminum oxide to synergistically improve the performance. The product has excellent insulativity, heat resistance and stability, the processing process is controllable, and strict use requirements in the field of batteries are met.

The utility model relates to the field of packaging, in particular to a circumferential labeling mechanism which comprises a mold roll fixing plate, and an adhesive tape can be installed on the mold roll fixing plate. The guide assembly is arranged on the mold roll fixing plate to form a mold tape guide route to pull out and keep the adhesive tape; the displacement assembly is connected with the mold roll fixing plate so as to enable the adhesive tape head in front of the guide assembly to abut against a product, and adhesive tape bonding is completed; and the cutting-off assembly is arranged adjacent to the guiding assembly and used for cutting off the adhesive tape after packaging. According to the utility model, through the cooperative work of all the components, the functions of automatic tape bonding, automatic feeding and automatic breaking can be realized, and the automatic bonding work can be completed by matching with other equipment.

The functional film comprises a composite adhesive tape layer and a buffer structure. The composite adhesive tape layer comprises a first sub-layer, a second sub-layer and a third sub-layer which are arranged in a stacked mode. The buffer structure is positioned on one side of the composite adhesive tape layer along the thickness direction of the composite adhesive tape layer, or is positioned in the composite adhesive tape layer, or is positioned between the first sub-layer and the second sub-layer, or is positioned between the second sub-layer and the third sub-layer.

The invention discloses an environment-friendly wide-temperature-range adhesive tape with a high-toughness structure and a preparation method of the environment-friendly wide-temperature-range adhesive tape, and belongs to the technical field of high-performance composite materials. The core-shell particles with the soft core-hard shell structure are added, the core layer is composed of the elastic polymer with the glass transition temperature lower than-20 DEG C, the shell layer is the rigid polymer with the glass transition temperature higher than 60 DEG C, and the wide temperature range self-adaption of the high-toughness structure adhesive tape to summer and winter environments is achieved through the synergistic effect of temperature-sensitive characteristics. In a summer high-temperature environment, the rigid shell layer plays a microscopic scaffold effect and a physical cross-linking strengthening effect and inhibits flowing permeation of a sizing material to micropores of the release paper. And in a low-temperature scene in winter, the elastomer of the core layer still maintains high elasticity, can absorb and dissipate impact energy, serves as a microscopic pressure head, enhances mechanical interlocking and Van der Waals' force effects, and rapidly establishes sufficient initial adhesive force. And the contradictory problems of constructability and reliability of difficult paper uncovering in summer and poor adhesion in winter of the structural adhesive tape are integrally solved.

This invention relates to the field of tape winding machine technology, specifically disclosing a fully automatic winding device for silicone pressure-sensitive tape after slitting. The device includes a frame, a disc rotatably mounted on one side of the upper end of the frame, and at least four winding shafts rotatably mounted on one side of the disc. A paper tube trough is located on one side of the suspended end of the winding shaft, and a guide cylinder aligned with the rear winding shaft is located at the lower end of the paper tube trough. A first cylinder is mounted on the guide cylinder to push the paper tube into the winding shaft. A paper tube slitting and calibration mechanism is located behind the winding shaft, acting on the paper tube on the winding shaft. The fully automatic winding device for silicone pressure-sensitive tape after slitting disclosed in this invention realizes the entire process of automatic winding, cutting, residual material winding, unloading, paper tube assembly, paper tube slitting, and post-slitting paper tube position calibration and adjustment during the tape slitting and winding process. The entire device has a high degree of automation, effectively improves work efficiency, and has excellent performance.

A purpose of the present invention is to provide a pressure-sensitive adhesive composition which has a satisfactory pot life and can exhibit excellent adhesive force. Another purpose is to provide a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition. Still another purpose is to provide a method for producing a pressure-sensitive adhesive tape using the pressure-sensitive adhesive composition. This pressure-sensitive adhesive composition comprises an alkyl (meth)acrylate in which the alkyl group has 4-20 carbon atoms, a (meth)acrylic copolymer, and one or more crosslinking agents, wherein the (meth)acrylic copolymer includes a constituent unit derived from a monomer containing an active-hydrogen-containing functional group and the crosslinking agents include a crosslinking agent (a), which is a monomer having both a functional group that reacts with the active-hydrogen-containing functional group contained in the (meth)acrylic copolymer and a functional group including a carbon-carbon unsaturated double bond. The pressure-sensitive adhesive composition contains no solvent, or the pressure-sensitive adhesive composition contains a solvent and the content of the solvent in the pressure-sensitive adhesive composition is 10 mass%.

The invention relates to the technical field of adhesive tape label pasting equipment, and provides an adhesive tape label attaching mechanism which comprises a base, an elastic buffer assembly and an attaching compression roller assembly. In the attaching operation process, the attaching mechanical arm can be connected with the elastic buffering assembly. The elastic buffer assembly is connected with the base. The elastic buffering assembly can generate elastic force between the attaching mechanical arm and the base. The attaching compression roller assembly is connected with the base and used for attaching an adhesive tape label. In the working process, the attaching mechanical arm is connected with the elastic buffering assembly, and the elastic buffering assembly drives the attaching pressing roller assembly to move through the base so as to conduct attaching operation of the adhesive tape label. Through the structural arrangement, no matter whether the attaching surface is a plane or a curved surface, the attaching compression roller assembly can be always attached to the attaching surface under the action of the elastic buffer assembly. Therefore, in the pasting process of the curved-surface adhesive tape label, manual operation is not needed, the stability of the pasting quality of the adhesive tape label can be improved, and the pasting efficiency can also be improved.

To provide a tape dispensing device that allows users to easily create twist ties in their preferred colors and patterns. [Solution] A tape dispensing device 1 comprising at least one tape roll support portion 20 that rotatably supports a roll body R on which adhesive tape T is wound in a roll shape, and a core material guide portion 30 capable of guiding a linear core material W, wherein the tape dispensing device 1 further comprises a junction portion C where the adhesive tape T pulled out from the roll body R and the core material W guided by the core material guide portion 30 meet, and a covering guide portion G that guides the adhesive tape T so that the core material W is covered by the adhesive tape T.

The invention provides an operation method for reducing the surface dark damage of a silicon wafer, and the method comprises the steps: guaranteeing the cleanness of a working environment, and controlling the temperature and humidity; checking the adhesive tape and the attaching equipment; mounting an adhesive tape roll on an adhesive tape supply shaft of the attaching equipment, and controlling the adhesive tape to be stably conveyed at a preset speed and in a preset direction through a driving mechanism of the equipment; the adhesive tape is flatly pressed on the back face of the silicon wafer through a pressing tool of the attaching equipment, after attaching is completed, a cutting tool is used for cutting, redundant adhesive tape on the surface of the silicon wafer is removed, and the attaching quality of the adhesive tape is checked; the attached old adhesive tape is removed every preset time interval, the steps are repeated, and a new adhesive tape is attached again; the cut silicon wafer is placed on the bearing table of the attaching equipment, and the position precision and stability of the silicon wafer are guaranteed through the positioning mechanism. According to the operation method, the problems of surface indentation or edge damage and the like possibly caused by a traditional operation method for reducing the surface dark damage of the silicon wafer are solved, and the position precision and stability of the silicon wafer in the attaching process are ensured.

The invention relates to the technical field of pressure-sensitive adhesives, in particular to an impact-resistant substrate-adhesive-free protective adhesive tape and a preparation method thereof. The adhesive comprises a mixed solvent, a hard monomer, a soft monomer, a functional monomer, an initiator, tackifying resin and a curing agent, and the mass ratio of the hard monomer to the soft monomer is 4: 6; the adhesive tape prepared by the invention has better anti-buffering and energy-absorbing effects, also has certain flexibility, namely compression performance, and cannot cause physical damage to a used part due to over-rigidity of the adhesive tape so as to face large-amplitude impact influence or small-amplitude long-time impact influence in a use scene.

The utility model relates to a multi-station adhesive tape machine with an adhesive tape self-adaptive adjusting function, and belongs to the technical field of multi-station adhesive tape machines. The multi-station adhesive tape machine with the adhesive tape self-adaptive adjusting function comprises a bottom plate, a workbench is installed at the top end of the bottom plate, a cutting machine body is installed at one end of the top of the bottom plate, and an adjusting mechanism is arranged at the top end of the bottom plate; a fixing plate on one side of the cutting machine body can move towards the two ends on a bottom plate through a sliding block at the bottom end, the sliding block is matched with a compression spring through first telescopic rods at the two ends, tension generated when adhesive tape passes through a first rotating rod is applied to the fixing plate, one of the first telescopic rods and the first spring is extruded, and the adhesive tape is fixed. The extruded first spring generates tension to support the adhesive tape to a certain degree, the tension of the adhesive tape is adjusted, the second rotating rods are arranged at the upper end and the lower end of the fixing plate, automatic adjustment can be conducted according to the tension of the adhesive tape, and the stability of the device is improved.