83results about How to "Prevent cracking" patented technology

A stack package and a method for manufacturing the same. The stack package includes first and second semiconductor chips placed such that surfaces thereof, on which bonding pads are formed, face each other; a plurality of through-silicon vias formed in the first and second semiconductor chips; and a plurality of redistribution layers formed on the surfaces of the first and second semiconductor chips to connect the through-silicon vias to the corresponding bonding pad, wherein the redistribution layers of the first and second semiconductor chips contact each other. By forming the stack package in this manner, it is possible to prevent pick-up error and cracks from forming during the manufacturing process, and therefore the stack package can be reliable formed.

A dicing and die bonding tape, comprising a substrate 1, a pressure sensitive adhesive layer (A) 2 superimposed on the substrate 1, a substrate 3 superimposed on the pressure sensitive adhesive layer (A) 2, a pressure sensitive adhesive layer (B) 4 superimposed on the substrate 3, and an adhesive layer 5 super imposed on the pressure sensitive adhesive layer (B) 4, said dicing and die bonding tape having an adhesion strength between the pressure sensitive adhesive layer (A) 2 and a dicing flame of 0.6 N/25 mm or larger, and an adhesion strength between the pressure sensitive adhesive layer (B) 4 and the adhesive layer 5 of from 0.05 to 0.5 N/25 mm.

A method for laser drilling and laser cutting of semiconductor material or glass in pulsed regime permits, for a given laser power, a rate of material cutting which is substantially higher than the rate obtained using conventional laser cutting. The hole or cut produced by the laser-induced removal of material has a reproducible shape, the drilling or cutting does not produce material debris or spatter deposition around the crater or cut, and the cracking of the crater or cut walls is prevented. The method includes utilization of a unique physical model representing all main physical processes taking place during laser-assisted material deposition, a corresponding mathematical model consisting of equations describing the relevant physical processes, and a computer code used for numerical calculations of the parameters of interest according to the mathematical model.

There is provided a method for manufacturing a vertically structured LED capable of performing a chip separation process with ease. In the method, a light-emitting structure is formed on a growth substrate having a plurality of device regions and at least one device isolation region, wherein the light-emitting structure has an n-type clad layer, an active layer and a p-type clad layer which are disposed on the growth substrate in sequence. A p-electrode is formed on the light-emitting structure. Thereafter, a first plating layer is formed on the p-electrode such that it connects the plurality of device isolation regions. A pattern of a second plating layer is formed on the first plating layer of the device region. The growth substrate is removed, and an n-electrode is then formed on the n-type clad layer.

An electronic control apparatus includes a circuit board with a circuit element mounted thereon, a heatsink for dissipating heat from the circuit board placed thereon, an external terminal having a first end electrically connected to the circuit board and a second end connectable to an external device, a molding resin for covering the circuit board and the first end of the external terminal. The second end of the external terminal is exposed outside the molding resin. The heatsink is at least partially covered with the molding resin. At least one of covered surfaces of the circuit board and the heatsink is at least partially roughened to have a predetermined surface roughness, which allows the circuit board and the heatsink to be tightly attached to the molding resin.

The invention provides an installation management method, a server and a terminal for an application program. The installation management method includes: receiving installation request sent by the terminal when a user installs the application program on the terminal, acquiring user identification of the user and application program identification of the application program, judging whether the relationship between the user identification and the application program identification meets a first predetermined condition and acquiring a first judgment result, acquiring installation history recorded information of the application program when the first judgment result indicates that the relationship between the user identification and the application program identification meets the first predetermined condition, judging whether the installation history recorded information meets a second predetermined condition and acquiring a second judgment result, sending feedback information which is used for indicating that the terminal is allowed to be installed with the application program when the second judgment result indicates that the installation history recorded information meets the second predetermined condition so as to enable the terminal to be installed with the application program according to the feedback information. By means of the installation management method, the server and the terminal for the application program, an anti-piracy mechanism can be effectively prevented from being broken, thereby having high reliability.

An electrical connector for electrically connecting to a circuit board. In one embodiment, the electrical connector includes: an insulating body, having at least one grounding terminal slot and a plurality of signal terminal slots, at least one grounding terminal, made of a flexible conductive material and accommodated in the grounding terminal slot, and including a first base and a first soldering portion accommodated in the grounding terminal slot in a suspended manner, a plurality of signal terminals, and a plurality of solder balls, at least one of which is disposed on the first soldering portion.

A logon system for an electronic device is provided. The system includes an electronic device and a touch display. The touch display is connected to the electronic device for functioning as an input/output device of the electronic device. For a logon to the electronic device, the electronic device displays a keypad having multiple keys on the touch display, and an arrangement of the keys is determined by the electronic device in random, so that a user can log on the electronic device by touching the keys displayed on the touch display.

A peeling tap adhering method for adhering a peeling tape (4) to a surface protection film (11) adhered to the front surface of a wafer (20), comprises the steps of: supporting the wafer on a table (31) under the condition that the surface protection film is directed upward; adhering the peeling tape onto the surface protection film by pressing the peeling tape onto the surface protection film when a peeling tape adhering means (46) is lowered; detecting the pressure between the surface protection film of the wafer and the peeling tape adhering means; and stopping the peeling tape adhering means from lowering in the case where a pressure detection value (P) is not less than a predetermined value (P0). Due to the foregoing, it is possible to prevent the wafer from being cracked. Further, it is possible to prevent the peeling tape and the dicing tape from adhering to each other. When the distance (L) between the surface protection film of the wafer and the peeling tape adhering means becomes a value not more than a predetermined value (L0), the peeling tape sticking means may be stopped from lowering.

A positive electrode for a secondary battery wherein the electrode includes a collector and a positive electrode active material layer which is stacked upon the collector, and which includes a positive electrode active material, a conductive agent, and a binder; the binder includes a first polymer and a second polymer; the first polymer is a fluorine-containing polymer; the second polymer includes a polymerized moiety having a nitrile group, a polymerized moiety having a hydrophilic group, a polymerized (meth)acrylic acid ester moiety, and a straight-chain polymerized alkylene moiety having a carbon number of at least 4; the proportion of the first polymer and the second polymer in the binder, expressed as a mass ratio, is in the range of 95:5 to 5:95.

The present invention relates to a control method of frequency conversion air conditioner capable of reducing vibration produced by low-speed operation of air conditioner. It is characterized by that when the temperature difference of the set temperature set by user and indoor temperature is less than rated temperature, at the same time of utilizing a certain operation frequency to operated compressor it can output energy efficiency compensation rate according to the operation frequency of compressor rotation interval load, and can utilize first operation frequency produced by changing rotation interval energy efficiency according to the energy efficiency compensation rate to operate compressor.

A process for separating IC dies from a wafer substrate. In one embodiment, complete separation channels are initially cut through the wafer between dies along one axis. Next, partial separation channels are cut into the wafer along an intersecting axis, leaving wafer material connecting adjacent dies. In another embodiment, partial separation channels are cut into the wafer along one axis, after which complete separation channels are cut through the wafer along the intersecting axis. In still another embodiment, partial separation channels are cut along both axes.

A flexible organic light emitting diode (OLED) display according to an exemplary embodiment includes: a substrate; an organic light emitting diode (OLED) layer provided on the substrate; and a thin film encapsulation layer provided on the OLED layer. The thin film encapsulation layer includes a plurality of laminated inorganic layers, at least one inorganic layer of the plurality of inorganic layers includes a plurality of inorganic layer patterns that are disposed to be spaced apart from each other on a plane, and an organic layer is formed between the plurality of inorganic layer patterns.

A rigid-flexible substrate includes a plurality of rigid portions, and a flexible portion connecting the plurality of rigid portions and including a portion of a first resin sheet including at least one layer of a thermoplastic resin sheet, the rigid portions including a portion of the first resin sheet other than the flexible portion, and a second resin sheet including a plurality of thermoplastic resin sheets laminated on one surface or both surfaces of the portion of the first resin sheet other than the flexible portion, and a tapered portion is provided at an end edge of the second resin sheet on a side close to the flexible portion, and a thickness of the tapered portion in a direction in which the second resin sheet is laminated decreases toward the flexible portion and is substantially 0 at a position in contact with the flexible portion.

The embodiment of the invention provides a method and device for wireless access authentication, which relate to the field of wireless communication and can be used for preventing a secret key from being broken. The method comprises the following steps: the frequency of consecutive failures in access of first user equipment to gateway device is counted and recorded after that feature characters of the first user equipment are not prestored in the gateway device and the first user equipment fails to use a secret key for the first time to try to access the gateway device are judged; if the frequency is larger than a pre-arranged first threshold value, a new secret key can be generated, and WiFi access authentication is performed on user equipment of the gateway device of which the feature characters are prestored through the new secret key; and the embodiment of the invention is used for wireless access authentication.

The purpose of the present invention is to inhibit deterioration in the external appearance of a sound suppressor, even when used in cold areas. This sound-suppressor-equipped pneumatic tire includes: a pneumatic tire provided with a tread section; and a sponge-like sound suppressor which is affixed to a tire inner cavity-side surface of the tread section, and which extends in the peripheral direction of the tire. In the sound suppressor, a plurality of slits are formed in an exposed surface which faces the tire inner cavity.

The invention discloses a vehicle node certificate updating method based on a Vehicle to X (V2X) network. A vehicle node applies for an updated certificate from a PKI (Public Key Infrastructure) system via a roadside node; the PKI system sends part of private keys to the vehicle node; the vehicle node generates a new public key and a new private key using the part of private keys and part of private keys generated per se, generates a certificate using the new private key, and sends the certificate to the PKI system; the PKI system verifies the validity and the accuracy of the certificate; and after the certificate passes the verification, the PKI system updates the certificate of the vehicle node using the public key generated by the vehicle node, and issues the updated certificate to the whole network. The updated certificate, the new public key and the new private key are all generated using part of private keys of the PKI system and part of private keys of the vehicle node, and only the vehicle node has node private keys, so the information issued by the vehicle node can be effectively prevented from being decrypted by the PKI system, and the security and the non-repudiation of communication of the vehicle node in the V2X network are guaranteed.

A resin wound component is configured such that a ring-shaped resin portion is integrally formed with an outer circumference of a ring-shaped metal member by a film gate. The resin portion includes a ring-shaped surrounding portion for surrounding axial end surfaces of outer circumferential edges of the ring-shaped metal member. At this time, the thickness of a ring-shaped surrounding portion on the gate side is configured to be larger than that of a ring-shaped surrounding portion on an opposite side to the gate.

A semiconductor device which prevents a crack from occurring on a pad region is provided. The semiconductor device includes a lower pad, an upper pad which is formed above the lower pad, an insulation layer which is formed between the lower pad and the upper pad, a via net for electrically connecting the lower pad and the upper pad in the insulation layer, the via net having a net shape in which a unit grid is connected with its adjacent unit grids to form a net structure, and at least one via hole for electrically connecting the lower pad and the upper pad in the unit grid of the via net.

A method for manufacturing a gallium nitride (GaN)-based single crystalline substrate includes the steps of (a) forming a GaN-based single crystalline bulk on an upper surface of a growth substrate; (b) forming grooves through the growth substrate so that the growth substrate is patterned and divided into several units by the grooves, each of the grooves having a designated width; and (c) separating the GaN-based single crystalline bulk from the growth substrate by irradiating a laser beam on a lower surface of the growth substrate.

A member 6 with concave portions used to manufacture a member with convex portions is disclosed. Each of the member with concave portions and the member with convex portions has two major surfaces, and a plurality of convex portions are formed on one of the two major surfaces of the member with convex portions. The member 6 with concave portions includes: a first region 67 provided on one of the two major surfaces of the member 6 with concave portions, a plurality of first concave portions 61 being formed in the first region 67 and used to form the plurality of convex portions of the member with convex portions; and a second region 68 provided on the one major surface of the member 6 with concave portions, the second region 68 being located adjacent to the first region 67, a plurality of second concave portions 62 being formed in the second region 68. In this case, the density d₂ of the plurality of second concave portions 62 in the second region 68 is smaller than the density d₁ of the plurality of first concave portions 61 in the first region 67.

A member 6 with concave portions used to manufacture a member with convex portions is disclosed. Each of the member 6 with concave portions and the member with convex portions has two major surfaces, and a plurality of convex portions are formed on one of the two major surfaces of the member with convex portions. The member 6 with concave portions includes: a first region 67 provided on one of the two major surfaces of the member 6 with concave portions, a plurality of first concave portions 61 being formed in the first region 67 and used to form the plurality of convex portions of the member with convex portions; and a second region 68 provided on the one major surface of the member with concave portions, the second region 68 being located adjacent to the first region 67, a plurality of second concave portions 62 being formed in the second region 68 as dummies.

A stator includes an annular stator core, a stator coil and a resin adhesive. The stator coil is comprised of a plurality of electric wires. The electric wires are partially received in slots of the stator core so that the stator coil has a pair of coil end parts protruding outside the slots respectively from opposite axial end faces of the stator core. The resin adhesive is filled in the slots of the stator core and/or applied to the coil end parts of the stator coil. Moreover, each of the electric wires includes an electric conductor and an insulating coat that covers an outer surface of the electric conductor. The insulating coat is two-layer structured to include an inner coat and an outer coat. The adhesion strength of the outer coat to the resin adhesive is lower than the adhesion strength of the inner coat to the resin adhesive.

There is provided an electromagnetic wave shield employing water-dispersed polyurethane. The electromagnetic wave shield comprises a plastic layer; a water-dispersed polyurethane primer layer formed on the plastic layer; and a metal deposited layer formed on the water-dispersed polyurethane primer layer. The electromagnetic wave shield has excellent surface property of a deposited metal and good durability through providing peeling resistance for a metal deposited layer by water-dispersed polyurethane.

The present invention relates to a chassis frame assembly structure for an electrical vehicle, wherein welding assembly units are formed by attachment and welding at respective portions in each of which channel-shaped frames made of aluminum and each configured to have a hollow structure are coupled. The chassis frame assembly structure includes a plurality of fastening holes formed at proper interval close to the welding assembly unit of the chassis frames; reinforcement members each configured to have a channel shape, surround the periphery of the welding assembly unit of the chassis frame, and have a plurality of assembly holes, corresponding to the respective fastening holes, formed at proper intervals in one face of the reinforcement member; and fastening members assembled with the assembly holes and the fastening holes, wherein the reinforcement member is positioned at the outside of the chassis frame.

A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The stress-relaxation layer of a first semiconductor chip is thicker than the stress-relaxation layer of a second semiconductor chip having a distance from a center thereof to an external terminal positioned at an outermost end portion thereof smaller than that of the first semiconductor chip.

The invention discloses a processing technology of a fan. The processing technology of the fan includes the following steps that a fresh palm leaf is taken, soaked in clear water, heated in a steam cooker, soaked in soaking liquid, dried at low temperature after water is drained away and edged. The fan processed through the processing technology is light, capable of producing strong wind, not prone to cracking and high in practicability. Raw materials are wide in source, and environmental pollution is not caused.

A stick-type ignition coil have a central core, a cylindrical member, primary spool, primary coil, secondary spool, secondary coil, outer core and a resin insulator. The two longitudinal end corners and faces of the core are covered by respective buffer members. The inner circumferential corners of the outer core is supported by ring members. Some of the members disposed radially inside and other members disposed radially outside of the inside members are held slidably to each other in the ignition coil. The spools are made of resin containing a rubber in excess of 5 weight percent and reinforcing materials. The resin insulator contains a flexible material.

The invention discloses a screen lock based data protection method. The method includes: acquiring a screen lock type which a user selects to screen-lock a smart device; storing the acquired screen lock type in a preset storage area of the smart device; in case of an unlocking operation, judging whether the current screen lock type of the smart device is consistent to the screen lock type stored in the preset storage area; if not, shielding the locking operation. In addition, the invention further discloses a screen lock based data protection device. The screen lock based data protection method and device has the advantages that after a file in which a screen lock password is stored is forcibly deleted or replaced with another file and the screen lock type of the smart device is altered or deleted, the corresponding unlocking operation is shielded, the smart device is effectively avoided being cracked, and data safety is protected.

The invention provides a verification code data processing method. The method comprises the following steps: sending a verification code request for a user to a server; receiving first verification code data generated by the server in response to the verification code request; according to the first verification code data, drawing a dial on a page and displaying a verification hint, wherein the dial indicates a first parameter, and the verification hint is corresponding to a second parameter; in response to verification code input operation of the user, determining a first parameter or a second parameter at present; in response to verification code submit operation of the user, generating second verification code data according to the determined first parameter or the second parameter, andsubmitting the second verification code data to the server to enable the server to carry out verification processing according to the first verification code data and the second verification code data and obtain a verification result; and receiving the verification result from the server and displaying the verification result. The invention also provides a corresponding device. According to the scheme, decoding of the verification code can be prevented, and meanwhile, efficiency is improved.