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252results about How to "Avoid coating" patented technology

Fastener apparatus for roofing and steel building construction

InactiveUS20060002784A1Reduce frictionEnabling rustWashersNutsScrew threadRidge
A fastener apparatus includes a frusto-hemispherical head portion having a flat top surface, a curved outer surface, a base portion, and a peripheral edge, with the flat top surface bearing a tool fitting. A downwardly-depending lip portion extends from the head peripheral edge and defines an annular recess in the base, the annular recess having a flat upper surface. The lip has a curved outer edge, a curved lower edge, and an inner edge having a curved lower portion and a vertical upper portion terminating in the annular recess flat upper surface. A shank portion is connected to the base and bears screw threads and a tip. An annular gasket portion is carried on the shank, and has a first uncompressed position contained radially within the annular recess, and a second compressed position extending radially beyond the lip outer edge. As the fastener is installed in a workpiece, the gasket expands to contact the lip inner edge and extend beneath the curved lower edge to form a seal between the fastener head and the workpiece. The fastener may include locking teeth terminating in the head base, adapted to resist loosening of the fastener from the workpiece. The curved outer surface of the fastener may include asymmetric ridges adapted to mechanically engage moving snow or ice to resist loosening of the fastener from the workpiece. The fastener head preferably has a width to height ratio of between 3:1 to 5:1.
Owner:DREAM WEAVER

Fastener apparatus for roofing and steel building construction

InactiveUS7329077B2Reduce frictionReduce wind buffetingWashersNutsScrew threadRidge
A fastener apparatus includes a frusto-hemispherical head portion having a flat top surface, a curved outer surface, a base portion, and a peripheral edge, with the flat top surface bearing a tool fitting. A downwardly-depending lip portion extends from the head peripheral edge and defines an annular recess in the base, the annular recess having a flat upper surface. The lip has a curved outer edge, a curved lower edge, and an inner edge having a curved lower portion and a vertical upper portion terminating in the annular recess flat upper surface. A shank portion is connected to the base and bears screw threads and a tip. An annular gasket portion is carried on the shank, and has a first uncompressed position contained radially within the annular recess, and a second compressed position extending radially beyond the lip outer edge. As the fastener is installed in a workpiece, the gasket expands to contact the lip inner edge and extend beneath the curved lower edge to form a seal between the fastener head and the workpiece. The fastener may include locking teeth terminating in the head base, adapted to resist loosening of the fastener from the workpiece. The curved outer surface of the fastener may include asymmetric ridges adapted to mechanically engage moving snow or ice to resist loosening of the fastener from the workpiece. The fastener head preferably has a width to height ratio of between 3:1 to 5:1.
Owner:DREAM WEAVER

Rectangular cathodic arc source and method of steering an arc spot

The invention provides an arc coating apparatus having a steering magnetic field source comprising steering conductors disposed along the short sides of a rectangular target behind the target, and a magnetic focusing system disposed along the long sides of the target in front of the target which confines the flow of plasma between magnetic fields generated on opposite long sides of the target. The plasma focusing system can be used to deflect the plasma flow off of the working axis of the cathode. Each steering conductor can be controlled independently. In a further embodiment, electrically independent steering conductors are disposed along opposite long sides of the cathode plate, and by selectively varying a current through one conductor, the path of the arc spot shifts to widen an erosion corridor. The invention also provides a plurality of internal anodes, and optionally a surrounding anode for deflecting the plasma flow and preserving a high ionization level of the plasma. The invention also provides a shield at floating potential, restricting the cathode spot from migrating into selected regions of the target evaporation surface outside of the desired erosion zone. The shield may be positioned immediately above the region of the target surface in the vicinity of the anode, protecting the anode from deposition of cathodic evaporate and providing better distribution of cathodic evaporate over the substrates to be coated. The invention further provides correcting magnets adjacent to the short sides of the target, to move the arc spot between the long sides.
Owner:G&H TECH LLC

Pattern electroplating method for microstrip circuit

The invention discloses a pattern electroplating method for a microstrip circuit, wherein the pattern electroplating method belongs to the technical field of a microwave millimeter wave film mixed integrated circuit. According to the pattern electroplating method, in the microstrip circuit with relatively large number of isolated conductor patterns, an original method of combining substrate front-surface pattern electroplating and back ground-surface integral electroplating is changed to a double-surface pattern electroplating process so that a medium layer at a cutting channel position is exposed to outside, thereby effectively preventing film layer falling in cutting the microstrip circuit, improving cutting quality and yield rate of the microstrip circuit, and settling a problem of film layer warpage and falling caused by stress influence to an electroplating functional layer of the microstrip circuit in a loading process and a discharging process of the electroplating protecting layer on the cutting channel in manufacture according to an existing process. According to the pattern electroplating method, electroplating deposition of the functional layer is only performed on the conductor pattern areas on the front surface and the back surface of an array circuit, thereby preventing plating of noble metals such as gold on other areas such as cutting channels and process edges outside the array pattern, reducing electroplating area and saving cost.
Owner:THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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