The invention relates to the technical field of circuit board resistance
welding processing, and discloses a circuit board ultrathin resistance
welding layer process based on a micro-nano technology, which comprises the following steps: S1, cleaning a circuit board to ensure that the surface is free of oil
stain, dust and other pollutants so as to ensure good
adhesive force between a resistance
welding layer and a substrate; and S2,
coating the cleaned and dried circuit board with a
solder mask layer by using a
coating machine. The circuit board ultra-thin
solder mask layer process based on the micro-nano technology can effectively solve the problems that in the prior art, when
solder mask layer ink printing is conducted on the surface of a circuit board, due to the fact that an effective fixing means is lacked, the circuit board is in a
free state, the circuit board generates slight displacement when printing equipment runs, and the printing efficiency is poor. The problems that solder
mask ink is difficult to be accurately attached to a preset position due to the fact that the solder
mask ink is difficult to be accurately attached to the preset position, design elements such as a bonding pad and a circuit deviate, the
manufacturing quality of a circuit board is affected badly, the defective rate and production cost of products are increased, and production efficiency is reduced are solved.