86results about "Polishing compositions" patented technology

A pressure sensitive adhesive electrolyte (PSAE) was prepared by polymerizing in two steps, e.g., (a) UV syrup preparation and (b) curing by UV web polymerization or UV polymerization of a mixture comprising at least the following components: • 4 – 86 wt % of acrylate monomer (a1) from the group of the (meth)acrylic esters having 4 – 44 carbon atoms and containing at least one oxygen atom, • 0.5 – 50 wt % of acrylate monomer (a2) from the group of the (meth)acrylic esters or amides having 4 – 25 carbon atoms and containing at least one nitrogen atom, • 0.005 – 10 wt % of at least one initiator, wherein the at least one initiator is preferably a thermal initiator and / or a photoinitiator, especially preferably at least one photoinitiator, • 0 – 35 wt % of conducting salt, • 2 – 60 wt % of ionic liquid, wherein the ionic liquid is preferably a room temperature ionic liquid (RTIL), • optionally further additives like plasticizer, antioxidant, tackifier, chain transfer agent, filler, corrosion inhibitor, oxygen scavenger, additional monomers, as for example 0 to 50 wt %, wherein optionally one or more of the components are added at least proportionally, as for example completely, only during or after the polymerization. With such PSAE conductivities according to the invention an ionic conductivity by test B of more than 10-6 S / cm up to at least 10-3 S / cm, can be achieved and the PSAE is suitable for applications like electrochromic cells / dimming foils and PSA with electrically debonding function. Especially, with such PSAE conductivities according to the invention, an ionic conductivity by test B of more than 10-8 S / cm up to at least 10-3 S / cm and peel adhesion by test A up to around 9 N / cm can be achieved.

A method comprises planarizing a substrate material with a functionalized chemical planarization pad. The functionalized chemical planarization pad includes a plurality of functional groups bonded to a material of the pad. The functional groups are configured to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups. The pad is regenerated by applying a regeneration solution configured to break bonds between the functional groups and substrate material bonded to the functional groups to form removed material. The removed material is complexed in a dissolved complexing agent to form dissolved material in an effluent phase.

The invention relates to the field of solar cell manufacturing, and particularly discloses a polishing additive for solving the black core problem in the BC cell pre-rough polishing process and a use method of the polishing additive. 0.1-5% of a defoaming agent; 0.1 to 0.5 percent of pH (Potential of Hydrogen) regulator; and the balance of deionized water. According to the method, the accelerant, the defoaming agent and the pH regulator in a specific ratio are combined, so that the oxidation reaction on the surface of the silicon wafer is more uniform and controllable; the accelerant accelerates formation and dissolution of a surface oxide layer, and generation of black cores is effectively avoided; the synergistic effect of the defoaming agent ensures that bubbles generated by the reaction can be quickly desorbed, the problem of uneven local corrosion caused by bubble retention is prevented, the surface of the polished silicon wafer is completely free of black nuclei, and ideal surface conditions are provided for subsequent processes.

To provide a flattening agent for organic film formation from which a composition for organic film formation having high flattening characteristics is given, a composition for organic film formation containing the flattening agent, an organic film formation method using the composition, and a pattern formation method.SOLUTION: A flattening agent for organic film formation is composed of an aromatic-containing compound having a molecular weight represented by the molecular formula of 200-500, wherein the flattering agent for organic film formation is blended with a composition containing a resin for organic film formation and a solvent having complex viscosity of 1.0 Pa s or more in a temperature range of 175°C or higher, and thereby the complex viscosity of the composition becomes less than 1.0 Pa s in the temperature range of 175°C or higher.SELECTED DRAWING: Figure 2

The invention discloses a monocrystalline silicon wafer alkali polishing additive and a preparation method and application thereof, and the alkali polishing additive comprises the following components by mass content: 0.5-4% of a reaction accelerator, 2-5% of a corrosion and scale inhibitor, 1.5-3% of a chelating agent, 1-3% of a pH regulator, 1-5% of a surfactant, 3-10% of a cosolvent and the balance of water according to the total mass of 100%. The alkali polishing additive is obvious in performance gain, good in etching selectivity and small in silicon wafer weight loss; the back polishing effect can be improved, the reflectivity of the silicon wafer is high, and the photoelectric conversion efficiency of a photovoltaic cell is improved; the anti-crystallization performance is excellent, and the environment is protected.

A pad for performing abrasive-free chemical planarization of a polycrystalline silicon (polysilicon) surface, the pad comprising a polymer layer incorporating a functional group reactive with polysilicon to remove silicon from the polysilicon surface.

Compositions and methods that impart a hydrophobic finish to surfaces, such as, for example, automotive surfaces. The compositions comprise an amino functional silicone emulsion, an amphoteric surfactant, and, a non-ionic surfactant.

The invention discloses easy-to-polish leather maintenance cream which comprises the following components: deionized water, a modified palm wax emulsion, an environment-friendly penetrant, a resin emulsion, metal complex dye water, a synthetic grease emulsion and an additive, the preparation method comprises the following steps: weighing deionized water, and adding the penetrant, the synthetic grease emulsion and the modified resin emulsion; adding the modified palm wax emulsion to be uniformly mixed; adding metal complex dye water; adding an additive; packaging; wherein the modified palm wax emulsion is prepared by the following steps: adding concentrated sulfuric acid and palm wax, melting the palm wax, and adding a hydrogen peroxide solution for complete oxidation; heating and re-melting, adding water, continuously stirring, and standing; repeating the washing step; adding zinc oxide, heating and melting; and adding high-molecular polyethylene glycol, slowly cooling to normal temperature after the reaction is finished, and filtering to obtain the modified palm wax emulsion. After the easy-to-polish leather product maintenance paste is used, a layer of compact wax film can be formed on the surface layer of a leather product, so that the maintained leather product has excellent polishing performance.

The invention relates to a silicon material high-flatness CMP (chemical mechanical polishing) processing mode, which belongs to the technical field of semiconductors, and comprises the following operation steps of: 1, before a CMP mechanical polishing process, optimizing the structure and the material of polishing cloth, and manufacturing the polishing cloth by using a material with better elasticity and wear resistance, so that the stability and the durability of the polishing cloth in the polishing process can be improved; and secondly, in the CMP mechanical polishing process, polishing parameters are adjusted to improve flatness, increase polishing pressure and improve the material removal rate, but the polishing rotating speed and time need to be adjusted at the same time so as to prevent the surface roughness from being increased. And thirdly, the formula of the polishing solution is optimized, the chemical reaction rate and the material removal rate in the polishing process are adjusted, and therefore higher flatness is achieved. The structure, the material, the mechanical action and the chemical action of the polishing cloth are deeply analyzed, and a new perspective is provided for understanding physical and chemical mechanisms in the polishing process.

A method using silicon dioxide improves the cathodic anticorrosion effect of ground coats, preferably of a zinc primer, based on epoxy-functional polymers and at least one metal particle.

The invention relates to the technical field of chemical engineering and equipment, and discloses a continuous feeding reaction device for lignin photodegradation, which comprises a reaction tube, an LED light source array and a transducer arranged outside the reaction tube, and a rotating shaft arranged inside the reaction tube and driven by a rotation driving mechanism. A composite scraping mechanism is mounted on the rotating shaft and is used for forcibly scraping reaction liquid on the inner wall of the reaction tube to form a thin film. The transducer is used for generating an ultrasonic standing wave field to drive photocatalyst particles to form a high-density array; the LED light source array works in a pulse mode, and the triggering time of light pulses of the LED light source array is matched with the time when the density of the catalyst array reaches a peak value. Through the synergistic effect of dynamic film scraping self-cleaning, the sound field tissue catalyst and pulsed light synchronous irradiation, the problems of light shielding, easy blockage and slow mass transfer in a high-viscosity dark multiphase system are solved, and the reaction efficiency and stability are improved.

The invention discloses a small tower footing monocrystalline silicon alkali polishing additive and a use method thereof, and belongs to the technical field of alkali polishing, the small tower footing monocrystalline silicon alkali polishing additive comprises the following raw materials by weight: 0.3-2% of a polishing agent, 0.5-2% of a corrosion and scale inhibitor, 0.5-1% of a defoaming agent, 0.1-0.5% of a surfactant, 0.1-0.5% of a eutectic solvent, and the balance of deionized water. The small-tower-footing monocrystalline silicon alkali polishing additive provided by the invention can effectively protect a non-polished surface and control the reaction rate of a polished surface in a silicon wafer polishing process, ensures that a uniform small-size tower footing structure is formed after alkali polishing, improves the contact effect of back slurry, improves a filling factor and improves the performance of a battery piece.

The invention discloses a green and environment-friendly processing method of low-emission rice, relates to the technical field of rice processing, and solves the problems of large emission of dust and wastewater, high energy consumption and low resource utilization rate in traditional processing. The method comprises the steps of raw grain pretreatment and purification, graded low-temperature grinding, biodegradable additive polishing, by-product resource recycling, tail gas multi-stage purification, wastewater treatment circulation and process regulation and control in combination with a multi-parameter optimization model. Results show that dust emission, wastewater reuse rate and unit energy consumption are reduced, byproduct utilization rate is increased, no chemical additive is left, rice safety is guaranteed, and the method is suitable for large-scale green processing.

According to one embodiment, the polishing pad can reduce noise and vibration in a specific frequency range. Therefore, the polishing pad has excellent sound absorption characteristics because the maximum sound absorption coefficient thereof measured at a frequency of 500 Hz to 4,000 Hz according to Equation 1 satisfies 0.1 or more. Accordingly, the present invention has an excellent polishing rate because it can minimize energy loss due to thermal energy or vibration energy in a CMP polishing process.

The invention provides an alkaline polishing and etching additive for monocrystalline silicon of a photovoltaic solar cell and application of the alkaline polishing and etching additive. The alkaline polishing and etching additive comprises the following components: chitosan, inorganic base, quercetin, resveratrol, tannic acid, inositol hexaphosphate and water. The alkaline polishing etching additive can effectively improve the etching uniformity, a layer of compact hydrophobic film is formed on the surface of the etched and polished silicon wafer, secondary pollution is avoided, the pickling process is not needed, and the yield and efficiency of solar cells can be improved.

The application discloses a kind of high etching rate and high flatness silicon wafer chemical polishing liquid and application, the silicon wafer chemical polishing liquid is by following mass percentage raw materials: 20-60% nitric acid, 3-15% hydrofluoric acid, 1-20% sulfuric acid, 5-30% phosphoric acid, 0.01-5% additive, the rest is water;Wherein additive is by rate stabilizer and flow regulator composition.The silicon wafer chemical polishing liquid prepared by the application can be chemically polished to silicon wafer below 35 DEG C, eliminate the residual stress and damage layer generated after polishing, reduce the risk of broken piece, and after chemical polishing treatment, the surface of silicon wafer is mirror surface, roughness (Ra) is less than 1nm, TTV is less than 0.2 μm.

The present invention relates to a polishing composition and its use. Specifically, it relates to a highly efficient, stable, and high-precision polishing composition. The polishing composition comprises an acid, an oxidizing agent, and water, wherein the acid is selected from inorganic acids and the oxidizing agent is selected from inorganic oxidizing agents, and the pH value of the polishing composition is 1 or less. The polishing composition of the present invention is suitable for polishing medical devices, particularly for polishing medical devices requiring a relatively large removal rate. When used for polishing, the composition has the advantages of high polishing precision, simple and convenient operation, and low cost. Furthermore, the polished product has relatively good mechanical properties, surface properties, and biological safety.

Disclosed are a polyurethane for use in a polishing layer, and a polishing layer and a polishing pad using the same, the polyurethane including a terminal group represented by the following formula (I): R-(OX)n- (I) wherein R represents a monovalent hydrocarbon group having 1 to 30 carbon atoms that may be substituted with a heteroatom or may be interrupted by a heteroatom, X represents an alkylene group having 2 to 4 carbon atoms, 90 to 100% of the alkylene group being an ethylene group, and n represents a number from 8 to 120.

Provided are a polishing composition and application thereof. Particularly, an efficient, stable, and high-precision polishing composition is related. The polishing composition includes an acid, an oxidizing agent, and water, where the acid is selected from inorganic acids, the oxidizing agent is selected from inorganic oxidizing agents, and a pH value of the polishing composition is ≤ 1. The polishing composition provided by the present invention is suitable for the polishing of medical devices, especially for the polishing of medical devices with a relatively large removal amount. The polishing composition is applied to polishing with the advantages of high polishing precision, simple and convenient operations, and low costs. Meanwhile, a polished product has good mechanical properties, surface properties, and biosafety.

Disclosed in the present invention is a solar photovoltaic silicon wafer polishing liquid additive, comprising a reaction promoter, a corrosion and scale inhibitor, a surfactant, a calcium salt and deionized water; the amount of the reaction promoter is 3-5%, the amount of the corrosion and scale inhibitor is 1-2%, the amount of the surfactant is 0.2-0.4%, the amount of the calcium salt is 0.15-0.25%, and the balance is deionized water. The calcium salt can cooperate with the corrosion and scale inhibitor to significantly reduce the corrosion rate of alkali on silicon dioxide, protect a PN junction on a front side of a battery from being destroyed during an etching process, and promote a polishing effect of alkali on a silicon wafer. It is green and environmentally friendly, not only reducing the use of HF, but also improving battery conversion efficiency, significantly reducing wastewater and waste gas treatment costs and the material costs of battery production, and achieving the goal of reducing environmental pollution while improving efficiency and reducing costs.

The invention belongs to the field of semiconductors, and particularly discloses a method for improving the surface quality of a gallium arsenide wafer. According to the method, the specific polishing solution is adopted for chemically and mechanically polishing the gallium arsenide, chemical and mechanical actions in the polishing process are matched with each other, the wafer falling rate in the gallium arsenide polishing process is increased, the wafer surface roughness is reduced, and the polishing quality is improved. And the surface of the polished gallium arsenide wafer is free of obvious corrosion pits, obvious lines, polishing solution residues, scratches and other defects, and the purpose of improving the overall quality of the surface of the gallium arsenide wafer is achieved.

To provide a floor coating whitening restoration agent that can simply repair and restore the coating whitened from alcohol adhesion back to its original condition.SOLUTION: A floor coating whitening restoration agent comprises (A component) 50 wt.%-90 wt.% of an alcohol and (B component) 10 wt.%-50 wt.% of one or more selected from ethylene glycol monoalkyl ether, methoxy butanol, diethylene glycol monoalkyl ether, diethylene glycol diethyl ether, triethylene glycol dialkyl ether, propyleneglycol alkyl ether, and dipropyleneglycol alkyl ether.SELECTED DRAWING: None

The invention relates to the use of silicon dioxide to improve the cathodic corrosion protection of primer coatings, preferably a zinc primer, based on epoxy-functional polymers and at least one metal particle.

A method comprises planarizing a substrate material with a functionalized chemical planarization pad. The functionalized chemical planarization pad includes a plurality of functional groups bonded to a material of the pad. The functional groups are configured to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups. The pad is regenerated by applying a regeneration solution configured to break bonds between the functional groups and substrate material bonded to the functional groups to form removed material. The removed material is complexed in a dissolved complexing agent to form dissolved material in an effluent phase.

This application relates to the field of automotive care chemicals, specifically disclosing a stain-removing automotive wax and its preparation method. The stain-removing automotive wax comprises the following raw materials in parts by weight: 14-18 parts of anti-fouling component, 18-23 parts of stain-removing gel, 9-11 parts of composite wax, 13-15 parts of emulsion, 10-13 parts of composite oil, 3-5 parts of emulsifier, 8-10 parts of thickener, and 5-8 parts of water; the anti-fouling component comprises fluoropropyl methylpolysiloxane-modified acrylate and titanium dioxide-modified mica powder in a mass ratio of 1:0.2-0.3. This application improves the stain-removing and anti-fouling performance of the automotive stain-removing wax, extending the service life and aesthetics of the automotive paint surface.

A pad for abrasive-free chemical planarization of a substrate includes a polymer layer configured to contact the substrate during abrasive-free chemical planarization. The polymer layer includes a plurality of reactive units covalently bonded within a polymer chain. Each reaction unit includes a functional group including one or more of a complexing agent or a hydrolytic agent for abrasive-free chemical planarization.

This invention belongs to the field of leather auxiliaries, specifically relating to a leather-specific polishing composite wax emulsion and its preparation method. The leather-specific polishing composite wax emulsion comprises the following raw materials in parts by weight: 20-25 parts intermediate wax emulsion, 30-35 parts synthetic emulsified oil, 3-6 parts organosilicon hand-feel agent, 3-7 parts oxidized polyethylene wax emulsion, 3-7 parts silicone-modified polyurethane emulsion, 0.2-0.4 parts preservative, and 20-30 parts water. This emulsion has a clear luster, a delicate, non-plastic feel, good polishing resistance, and can cover minor leather imperfections, solving the problems of existing products sticking to the polishing roller and easily scratching the leather blank, exhibiting excellent overall performance.

The polishing pad according to an embodiment can reduce noise and vibration in a specific frequency range. Accordingly, the polishing pad has excellent sound absorption characteristics since the maximum sound absorption coefficient satisfies 0.1 or more as measured at a frequency of 500 Hz to 4,000 Hz according to Equation 1. Thus, since it can minimize energy loss caused by heat energy or vibration energy in a CMP polishing process, it has an excellent polishing rate.

The chemical liquid storage includes a container and a chemical liquid, wherein the chemical liquid contains at least one of Fe, Al, Cr, and Ni, a content of the specific metal component in the chemical liquid with respect to a total mass of the chemical liquid is equal to or smaller than 100 mass ppt, at least a portion of a liquid contact portion of the container is formed of glass containing sodium atoms, and provided that B represents a content of sodium atoms in a bulk region with respect to a total mass of the bulk region, and A represents a content of sodium atoms in a surface region with respect to a total mass of the surface region, a content mass ratio of A to B represented by A / B is higher than 0.10 and less than 1.0 in at least a portion of the liquid contact portion.