664results about "Abrasive surface conditioning devices" patented technology

The invention relates to the technical field of semiconductor manufacturing, and provides wafer thinning equipment and a wafer thinning process. The wafer thinning equipment comprises a plurality of grinding discs, a functional assembly and a slicking assembly; two functional assemblies are correspondingly arranged on the grinding face of each grinding disc, and two grinding areas are formed between the two functional assemblies. The functional assembly is used for cleaning the grinding area and spraying grinding fluid; the slicking assembly penetrates through the grinding areas of the multiple grinding discs and is used for dispersing grinding fluid. The functional assembly is arranged corresponding to the grinding disc, the grinding fluid in the grinding area of the grinding disc can be cleaned, and the grinding fluid is sprayed again, so that wafer grinding particles can be cleaned, and the purity of the grinding fluid is ensured; and meanwhile, by arranging the slicking assembly, the grinding fluid can be uniformly dispersed before the grinding fluid is in contact with the wafer, so that local aggregation of the grinding fluid is avoided, the stress concentration problem is prevented, the wafer cannot be scratched, and the grinding precision is guaranteed.

The invention relates to the technical field of semiconductor manufacturing, in particular to a photo-assisted catalytic diamond chemical mechanical polishing device, which solves the problems of low photocatalytic efficiency and low processing efficiency in the prior art, and comprises a bracket, a rotating platform and a working turntable for loading diamond wafers are arranged on the bracket, and an annular baffle plate is arranged on the outer side of the rotating platform. The rotating platform and the annular baffle are matched to form a containing groove, an annular polishing pad and a middle ultraviolet light source are arranged on the rotating platform, the middle ultraviolet light source is located in the center of the annular polishing pad, a side edge ultraviolet light source is arranged on the inner side of the annular baffle, and the annular polishing pad and the middle ultraviolet light source both correspond to the working rotary table in position; the containing groove is filled with polishing liquid, and the annular polishing pad, the side edge ultraviolet light sources and the middle ultraviolet light source are all immersed in the polishing liquid. The device has the beneficial effects that the design that the middle ultraviolet light source and the side ultraviolet light sources cooperatively irradiate is adopted, and the promoting effect of photocatalysis on the chemical reaction on the surface of the diamond is enhanced.

The invention discloses a steel structure butt welding adjusting device which comprises a supporting plate and supporting rods fixed to the four corners of the bottom of the supporting plate. A grinding part is arranged in the butt joint mechanism, in the butt joint process of the two steel structure bodies, the grinding part can make contact with the steel structure bodies along with continuous movement of a driving part, the grinding part comprises a coarse grinding plate, a fine grinding plate and a polishing plate, in the grinding process, a sliding plate slides on the top of a supporting plate along with a mounting plate driven by the driving part to move, and the grinding plate is in contact with the grinding part. The rough grinding plate firstly makes contact with the rotating steel structure main body and conducts comprehensive rough grinding on the end face of the steel structure main body through rotation of the steel structure main body, and due to the fact that a second gear at the bottom of a lead screw is meshed with a second rack at the bottom of a mounting shell, the lead screw can rotate, and therefore when a grinding piece moves to a certain degree, the grinding piece can rotate. And the rough grinding plate, the fine grinding plate and the polishing plate can sequentially treat the steel structure body and then move downwards into the second mounting frame.

The invention discloses a sampling needle outer wall self-adaptive polishing method and system, a product and a medium, and relates to the field of edge calculation. The method comprises the following steps: acquiring force and vibration signals to calculate an energy dissipation index; judging a cutting edge area, a sound window area or a transition area according to the index gradient; in the cutting edge area, a force signal is stabilized by controlling the feeding speed, and the rotating speed of a main shaft is adjusted, so that the kurtosis value tends to be minimum; in the sound window area, the feeding speed is controlled to stabilize the kurtosis target value; and in the transition area, the feeding rotation speed is synchronously adjusted according to the relative position, so that the force and the kurtosis track the dynamically changing target. By implementing the technical scheme provided by the invention, the polishing precision of the sampling needle is improved.

An integrated cleaning and liquid supply device and online cleaning method for polyurethane polishing pads are disclosed. The device includes a base, a rotating seat, a swing arm, an independent liquid supply pipeline system and cleaning pipeline, a high-pressure nozzle array, and a positioning sensor assembly. During the polishing stage, polishing liquid is dripped through the liquid supply outlet. During the cleaning stage, the swing arm moves centripetally to a preset position aligned with the center of the polishing pad. The positioning sensor triggers a high-pressure pump, causing pure water to be sprayed as an atomized jet along the diameter of the pad surface through the high-pressure nozzle array. Simultaneously, the polishing pad rotates at a low speed, utilizing the synergistic effect of centrifugal force and high-pressure water flow to thoroughly remove residual contaminants within the micropores of the polyurethane. This invention integrates liquid supply and deep cleaning functions into the same motion mechanism, eliminating the need for machine shutdown or manual intervention. It offers advantages such as non-contact, non-destructive, thorough cleaning, and high automation, extending the life of the polishing pad and improving the stability of the CMP process.

The utility model discloses an automatic trimming module for a grinding wheel of a grinding machine, which relates to the technical field of grinding machines, has the advantage of automatically trimming the grinding wheel on the grinding machine, and is characterized in that the automatic trimming module comprises a working table, a vertical plate is vertically arranged at the top end of the working table, and a grinding assembly for grinding a workpiece is arranged on the vertical plate; the top end of the workbench is horizontally and slidably connected with a machining base used for containing a workpiece through a moving part, and two diamond grinding bowls used for grinding a grinding wheel in the grinding assembly are arranged on the portion, on one side of the machining base, of the workbench.

To provide a conditioning method of a polishing tool which enables reduction of time for conditioning of the polishing tool, and to provide a substrate processing method and a substrate processing device.SOLUTION: A conditioning method of a polishing tool 89 includes: a substrate rotation step in which a silicon dummy substrate DW having a major surface in a non-mirror state is held in a horizontal attitude and rotated around a vertical axis AX5; and a conditioning performing step in which the polishing tool 89 having a resin body in which abrasive grains are dispersed is placed in contact with the major surface of the rotating dummy substrate DW to perform conditioning of the polishing tool 89.SELECTED DRAWING: Figure 6

Information processing device that includes: an information acquisition unit that acquires reliability degradation factor state information in a chemical mechanical polishing process of a substrate performed by a substrate processing device, the reliability degradation factor state information including at least one of wear state information indicating a wear state of components of the substrate processing device and processing state information indicating a processing state during polishing; and a state prediction unit that predicts reliability information of a polishing endpoint detection function for the reliability degradation factor state information by inputting the reliability degradation factor state information acquired by the information acquisition unit into a learning model that has been trained through machine learning to learn a correlation between the reliability degradation factor state information and reliability information of the polishing endpoint detection function that indicates reliability of an endpoint detection function that detects that the chemical mechanical polishing process has reached an endpoint.

The invention relates to the technical field of repairing devices, and discloses a diamond grinding wheel repairing device which comprises a bottom plate table, repairing tables are symmetrically arranged above the bottom plate table, a driving sliding column is fixedly installed above the bottom plate table, a lifting support is slidably connected to the inner wall of the driving sliding column, and a control box is fixedly connected to the top of the lifting support. A manipulator is fixedly connected to the lower portion of the control box, a diamond pen is fixedly connected to the lower portion of the manipulator, a clamping and overturning assembly is arranged on the surface of each repairing table, an inclined assembly is arranged at the bottom of each repairing table, and the inclined assemblies can drive one ends of the two repairing tables to incline downwards. The driving device can drive the ends, close to each other, of the two repairing tables to incline downwards to form an inverted V shape, an inclined face is provided for scrap cleaning, scraps generated by polishing and repairing the surfaces of the repairing tables smoothly fall off along the inclined face, and the working environment is kept clean.

The invention relates to the technical field of grinding devices, in particular to a cylindrical injection molding part grinding device which comprises a grinding platform and a lower grinding disc installed at the top of the grinding platform, an upper grinding disc is installed at the top of the lower grinding disc, a cleaning structure is arranged at the top of the grinding platform, and a plurality of positioning plates for supporting workpieces are installed at the top of the lower grinding disc. By adopting the composite design of the slidable and rotatable cleaning cylinder, the peripheral cleaning brush and the internal negative pressure cavity, the cleaning brush is made of a flexible wear-resistant material, can rotate and slide along with the cleaning cylinder, goes deep into microcosmic lines and blind areas of a grinding disc, and mechanically peels off stubborn grinding dust, and meanwhile, the dust suction pump works to form negative pressure in the cleaning cylinder, so that the cleaning effect is improved. Scraped abrasive dust and grinding liquid are sucked synchronously through the peripheral dust suction holes, secondary attachment of the abrasive dust is avoided, the cleaning efficiency is improved, the secondary scratch rate of workpieces is reduced, the grinding and cleaning procedures are automatic, and all-region dead-corner-free cleaning of the abrasive dust is achieved.

An abrasive tool for a floor grinder, wherein the tool extends along a wear direction (D) from a grinding surface (G) to a mounting surface (M), wherein the abrasive tool comprises at least two sections (410, 420, 430) separated by a surface (P) transversal to the wear direction (D), where the at least two sections comprise respective abrasive materials associated with different grit sizes, where the section located closer to the grinding surface (G) is associated with a larger grit size compared to the section located closer to the mounting surface (M).

An apparatus for synchronous laser-conformal and mechanical dressing of a forming surface of a diamond grinding tool, relating to the field of grinding tool dressing. The apparatus comprises Y-direction, X-direction, and Z-direction motion platforms configured to slide relative to one another. A laser head rotation shaft is vertically slidably arranged on the Z-direction motion platform, and a laser head is mounted on the laser head rotation shaft. A grinding tool rotation shaft is arranged on the Y-direction motion platform, a diamond grinding tool is arranged on the grinding tool rotation shaft, and a mechanical dressing mechanism is arranged on the Y-direction motion platform. The dressing method comprises: mounting the diamond grinding tool on the grinding tool rotation shaft, and adjusting the initial angle and position of the laser head; fine-tuning the relative position between the laser head and a forming surface of the diamond grinding tool and performing laser dressing; after the diamond grinding tool has rotated half a revolution, adjusting the position of a mechanical dressing wheel to begin mechanical dressing; and dressing the two sides of the forming surface of the diamond grinding tool respectively by means of mechanical dressing and laser dressing. The present invention achieves uniform removal and effective compensation for a concave-surface profile by laser, thereby improving the dressing accuracy and dressing efficiency of concave-surface diamond grinding tools.

The present invention relates to diamond abrasive grains and a manufacturing method thereof, and provides tetradecahedral diamond abrasive grains with uniform size and shape. The manufacturing method of diamond abrasive grains according to the present invention allows for shape control and minimizes impurities and crystal defects, thereby manufacturing diamond abrasive grains for ultra-precision grinding in chemical mechanical planarization (CMP) processes.

The present technology relates to an information processing apparatus capable of more easily determining a maintenance time by using event data. The information processing apparatus includes a state estimation unit that estimates a state of an abrasive stone by using event data provided from an event sensor that outputs a temporal change in an electric signal obtained by photoelectrically converting a light signal as the event data, and outputs a result of the estimation. The present technology can be applied to, for example, an information processing system that notifies a maintenance time of an abrasive stone of a machine tool, and the like.

The chemical mechanical polishing system includes a first polishing station including a first platen supporting a first polishing pad; a transfer station receiving a substrate from a robot; a carrier head movable along a predetermined path from the polishing station to the transfer station; a gas flow regulator having an inlet for a carrier gas; a liquid flow regulator having an input for a cleaning fluid; and a jet cleaner fluid jet cleaner positioned along the predetermined path. The fluid jet cleaner includes an atomizer nozzle including an input port connected to the gas flow regulator; an injection port connected to the liquid flow regulator; and an output port positioned to spray a cleaning fluid accompanied by the carrier gas onto a substrate held by the carrier head when the carrier head is positioned above the fluid jet cleaner.

The utility model relates to abrasive wheel dressing technical field, specifically speaking, it is a kind of abrasive wheel dressing device. It includes abrasive wheel frame, the inside of abrasive wheel frame is provided with speed regulating motor, the speed regulating motor is fixedly connected with abrasive wheel frame, the top of abrasive wheel frame is provided with dressing abrasive wheel, the middle part of dressing abrasive wheel is provided with the main shaft of vertical downward arrangement, the dressing abrasive wheel is fixedly connected with main shaft, the lower end surface of main shaft and the upper end surface of speed regulating motor output shaft are provided with shaft coupling;Dressing abrasive wheel upper wall surface is provided with the abrasive wheel pressing plate for pressing dressing abrasive wheel. The problem that sand wheel needs to be disassembled and repaired again and needs to be counterweighted is solved.

This invention discloses a precision grinding device for the end face of an external cylindrical grinding machine. The invention relates to the field of machining technology and includes a main body shell. A clamping component is fixedly connected to the top of the outer surface of the main body shell. A fixed seat is slidably connected to the end of the top of the main body shell away from the clamping component. A grinding component is slidably connected to the middle of the top of the main body shell. This invention, by setting a dressing mechanism and adjusting a rotary knob, fixes the pin to the middle of the tube, preventing vibration during grinding. When the outer surface of the grinding block is uneven and needs to be dressed, the fixing pin is rotated to disengage from the fixing hole, thereby adjusting the height of the diamond grinding tool according to different thicknesses of the grinding wheel. Simultaneously, a brush is used to sweep away the waste chips generated during dressing.

To provide an electroplated tool capable of making machining efficiency and tool life compatible with each other even under a high load machining condition.SOLUTION: An electroplated article includes a base metal 10 having a surface 10S to be fixed, and a superabrasive layer 20 formed on the surface 10S to be fixed, wherein the superabrasive layer 20 includes plating 24 and a plurality of superabrasive grains 22 fixed on the surface 10S to be fixed by the plating 24. In the electroplated tool, the super-abrasive grains 22 have a shape of any one of a truncated octahedron, a hexa-octahedron, and an octahedron, 50% or more of the super-abrasive grains 22 are fixed in a state where an edge portion E which is a corner or a ridge line protrudes toward a working surface, and a ratio of an occupied area of the super-abrasive grains 22 in the super-abrasive grain layer 20 when viewed from the working surface side exceeds 80%.SELECTED DRAWING: Figure 2

This invention discloses an integrated CNC grinding and polishing device for profile surface processing, relating to the field of profile grinding. It primarily addresses the problem of converting the horizontal linear motion of a workpiece into a continuous attitude transition motion from horizontal to vertical, enabling continuous grinding of different angles and areas of the workpiece. This invention utilizes an automatic attitude transition component to convert the workpiece's horizontal movement within the grinding gap into a gradual approach towards a vertical position. During this attitude transition, the workpiece's position within the grinding gap is automatically and dynamically adjusted. Specifically, this involves converting horizontal linear displacement into deflection until the workpiece reaches the desired surface for processing. This process enables continuous grinding of profiles at different angles and in different areas, meeting the grinding requirements of irregularly shaped profiles and complex surfaces, and improving grinding adaptability.

To provide a polishing pad and a method of preparing a semiconductor device which minimize the occurrence of defects and scratches during a chemical mechanical planarization (CMP) process while keeping physical properties and performance of the polishing pad excellent.SOLUTION: In a semiconductor device preparation step, a polishing pad 100 is such that the particle size of debris obtained during conditioning and the zeta potential of a debris solution are adjusted to specific ranges. As a result, it is possible to minimize the occurrence of defects and scratches during a CMP process by reducing the size of debris while keeping physical properties and performance of the polishing pad excellent.SELECTED DRAWING: Figure 1

To provide a method and a process for forming and monitoring voids of a dresser and a polishing pad for a CMP process.SOLUTION: The dresser includes a substrate, a sheet-like body disposed on one surface of the substrate, and a modular polishing unit disposed on the sheet-like body, wherein the modular polishing unit is provided with a plurality of single units, the plurality of single units are disposed on the sheet-like body at intervals, each single unit has a convex portion, and the convex portions have different heights. The polishing pad is polished by the convex portion of each single unit of the dresser to form a polishing pad groove in which a zoned common height and a common surface are carved on the polishing pad, and a lateral shape of the polishing pad groove is formed by the auxiliary convex portion of each single unit. To effectively hold a polishing liquid, to effectively control the occurrence of thermal expansion due to the heat of a dresser and a polishing pad, to improve the influence of the defect of surface texture or the like, and to effectively reduce the cost of the whole CMP process.SELECTED DRAWING: Figure 1

The utility model belongs to the technical field of diamond pens, and relates to a diamond pen trimmer base with a cooling function, which comprises a base, a sliding plate is slidably arranged at the top of the base, a supporting frame is slidably arranged at the top of the sliding plate, the sliding direction of the sliding plate is perpendicular to that of the supporting frame, and the supporting frame is U-shaped. The supporting frame is composed of a bottom plate at the bottom and two side plates at the top, a fixing shaft is fixedly connected to the top between the two side plates of the supporting frame, a worm gear fixedly sleeves the middle of the fixing shaft, an arc-shaped rotating plate is rotationally connected to the top between the two side plates of the supporting frame, a worm is rotationally arranged on one side of the rotating plate, the worm is meshed with the worm gear, and the worm is meshed with the worm gear. And a diamond pen is fixedly mounted on the rotating plate. The diamond pen has the advantages that the third motor is started to enable the worm to rotate, the worm rotates around the worm gear while rotating, the rotating plate rotates around the worm gear, the angle of the diamond pen is adjusted, the diamond pen does not need to be disassembled and assembled many times, and use is more convenient.

To provide technique enabling suppression of such a problem that clogging occurs in a flow passage caused by polishing liquid remaining in the flow passage, and enabling detection of the occurrence of clogging if the clogging occurs in the flow passage.SOLUTION: A polishing apparatus 1 comprises a control device 90. The control device 90 performs: a washing processing in which, when the number of substrates Wf polished by a polishing machine 10 reaches a predetermined number, washing liquid is caused to flow through a flow passage 70a, and then a polishing liquid is caused to flow through the flow passage 70a; and a clogging detection process in which, when the washing liquid flows through the flow passage, the occurrence of clogging in the flow passage is detected based on pressure or flow volume of the washing liquid detected by a sensor 60, 61.SELECTED DRAWING: Figure 1

The invention discloses a diamond grinding tool femtosecond laser trimming device and a trimming method thereof.The diamond grinding tool femtosecond laser trimming device comprises a sealing box, an adjusting ring is rotationally clamped on the sealing box and controlled through an electric motor, a plurality of pairs of air holes are formed in the adjusting ring, each pair of air holes comprises an air inlet and an air outlet, and the air inlet is communicated with the air outlet; a hose is arranged in each air hole in a penetrating mode, all the hoses are controlled through a comprehensive discharging and sucking controller, the comprehensive discharging and sucking controller is connected to a computer display and control system, and a trimming assembly is arranged in the sealing box. According to the device, the air blowing pipe and the air suction pipe are arranged to pass through air holes in the side of the transparent sealing box and are aligned with the femtosecond laser spot position to blow out inert gas, and therefore the influence that gas microparticles formed in the finishing process return to cover the diamond curved surface is avoided; therefore, pits and convex points caused by non-uniform energy absorption in the finishing process are avoided, and the finishing efficiency and the surface quality of the diamond grinding tool are improved.

The present invention relates to a cyber-physical system for optimizing a simulation model for chemical mechanical polishing based on actual measurement data of chemical mechanical polishing. The chemical mechanical polishing system includes a polishing apparatus (1) for polishing the workpiece (W) and an arithmetic system (47). The arithmetic system (47) includes a simulation model including at least a physical model configured to output an estimated polishing physical quantity including an estimated polishing rate of the workpiece (W). The arithmetic system (47) is configured to: input polishing conditions for the workpiece (W) into the simulation model; output the estimated polishing physical quantity of the workpiece (W) from the simulation model; and determine model parameters of the simulation model that bring the estimated polishing physical quantity closer to a measured polishing physical quantity of the workpiece (W).

The invention discloses a composite worm grinding wheel and a dressing method thereof.The composite worm grinding wheel is composed of a surface micro-structured grinding wheel body and a fine grinding wheel body which are axially connected into a whole, the surface micro-structured grinding wheel body adopts ultrasonic vibration to assist a single-point diamond pen in dressing, and a large number of separated-continuous oblique curve micro grooves are dressed in the tooth side face; cutting force, heat production and the temperature of a contact area are reduced by reducing the contact layer, the effective blade grinding number of the grinding wheel during grinding is increased, and the problems of blockage of the grinding wheel and thermal damage to the surface of a workpiece are effectively solved; a fine grinding working face is formed on the outer side tooth face of the fine grinding wheel, and the problem that the surface roughness is large is solved by using grinding materials with the large particle size number. The device integrates the functions of rough grinding and accurate grinding, machining is completed through one-time clamping, repeated clamping and positioning errors are reduced, materials are efficiently removed, chip removal and heat dissipation are improved, the machining precision and size consistency are improved, and the contradiction that efficiency, heat dissipation and surface quality are difficult to consider in the generating grinding process is solved.

The invention discloses a grinding wheel angle adjusting and follow-up finishing device for a thread grinding machine, and belongs to the technical field of thread machining. The device comprises a base, an arc-shaped groove is formed in the top of the base, and a rotating base is rotationally mounted on the inner wall of the arc-shaped groove; a mounting frame is fixedly connected to the top of the rotating base, and a trimming assembly and a driving assembly are arranged at the top of one side of the mounting frame; a grinding wheel motor is fixedly mounted at the bottom of one side of the mounting frame, the output end of the grinding wheel motor is fixedly connected with a transmission shaft, and a grinding wheel is mounted in the middle of the transmission shaft; the grinding wheel spindle and the dressing spindle are integrated on one set of mechanism, the dressing spindle is adjusted along with the spindle angle adjustment, so that the dressing movement mechanism and the grinding wheel spindle are always kept at the same phase, the grinding wheel is quickly and synchronously dressed, meanwhile, the situation that interference is easily generated with other mechanisms is greatly improved, and the requirement for a larger lead angle is met.

The utility model relates to the technical field of vertical circular truncated cone surface grinding machines, in particular to a high-precision vertical circular truncated cone surface grinding machine which comprises a diamond dresser and a roughness detection probe which are installed on the two sides of a protective shell respectively. And a power mechanism for driving the diamond dresser and the roughness detection probe to be close to or away from the edge end of the grinding wheel at the same time is arranged on the protective shell, and a precision detection mechanism for monitoring the grinding precision of a workpiece in real time is arranged on the grinding machine body. The bidirectional motor drives the lead screw to rotate, so that the diamond dresser at the bottoms of the two threaded connecting rods is driven to make contact with the grinding face of the grinding wheel, the rotating grinding face of the grinding wheel is dressed through the diamond dresser, and the surface smoothness of the dressed grinding wheel is detected in cooperation with the roughness detection probe. And a supporting point is provided for the diamond dresser through the T-shaped stable sliding block, and the diamond dresser is prevented from shaking in the dressing process.

The invention belongs to the technical field of grinding wheel dressing tools, and particularly discloses a PCD dressing rolling wheel for a worm grinding wheel, the PCD dressing rolling wheel comprises a rolling wheel base body and a plurality of PCD blades, the outer circumferential surface of the rolling wheel base body is provided with a plurality of uniformly distributed mounting grooves, and the PCD blades are welded in the corresponding mounting grooves respectively. The cutting edge of each PCD blade is higher than the outer circumferential surface of the roller base body, and the width of the mounting groove is larger than the thickness of the PCD blade, so that a chip groove is formed between the PCD blade and at least one side groove wall of the mounting groove. The PCD blade is used for trimming the worm grinding wheel, the mounting groove is matched, the service life of the trimming roller is prolonged, and the trimming stability and consistency of the worm grinding wheel are improved. The invention further discloses a preparation method of the PCD dressing roller for the worm grinding wheel.