1082results about How to "Improve polishing efficiency" patented technology

The invention relates to the technical field of aluminum pipe polishing, and discloses aluminum pipe fitting inner wall polishing equipment which comprises a placing part, the placing part comprises a sliding rail base, the upper surface of the sliding rail base is slidably connected with a sliding seat through a sliding groove, and the sliding seat is connected with a placing plate through an elastic piece arranged on the upper surface of the sliding seat; the upper surface of the placing plate is fixedly connected with an electric push rod through a support, the output end of the electric push rod is fixedly connected with a clamping plate and a polishing part which are attached to the outer surface of the circumference of the external aluminum pipe, the polishing part comprises a rack, and the upper surface of the sliding rail base is fixedly connected with the lower surface of the rack through a machine base. The aluminum pipe fitting inner wall polishing equipment can effectively solve the problems that in the prior art, a traditional mechanical polishing method is generally low in efficiency, equipment adopted for rough polishing and equipment adopted for fine polishing are different, an aluminum pipe subjected to rough polishing needs to be transferred and positioned for the second time, a large amount of manpower and material resources are wasted, and automatic production is not facilitated.

The invention relates to a wafer polishing method and apparatus, a data processing apparatus, a program, and a storage medium. The polishing method comprises the following steps: loading a wafer to be polished; reading in a first polishing formula, and carrying out primary polishing on the wafer according to the first polishing formula; wafer parameters of all the partitions of the wafer are detected, whether the wafer parameters of all the partitions of the wafer reach the standard or not is judged, if yes, the wafer is unloaded, if not, a second polishing formula is obtained through the dynamic adjustment model according to the wafer parameters, and secondary polishing is conducted on the partitions, not reaching the standard, of the wafer based on the second polishing formula. And then returning to detect the wafer parameters of the partitions of the wafer again until the wafer parameters of all the partitions of the wafer are judged to reach the standard, and unloading the polished wafer. According to the method, the reworking function of multi-zone automatic triggering and time-pressure automatic combined adjustment can be achieved in the wafer polishing process, repeated treatment on the whole wafer is avoided, and material consumption and cost are reduced.

The invention relates to the technical field of lens polishing, in particular to a polishing device for optical lens production. Comprising a workbench, the workbench is provided with two driving arms which are distributed up and down, and the driving arms are fixedly connected with polishing discs; and the rotating disc is rotationally connected to the workbench, the rotating disc is slidably connected with a plurality of clamping rods distributed in the circumferential direction, a second motor is installed on the workbench, and the rotating disc and an output shaft of the second motor are in transmission through a second transmission piece. According to the lens polishing device, lenses of different sizes are clamped through the clamping rods distributed in the circumferential direction, the existing mode that the lenses are fixed through glue is changed, the two polishing discs are used for polishing the upper sides and the lower sides of the lenses at the same time, the lens polishing efficiency is improved, and meanwhile the phenomenon that after one face of each lens is polished, glue residues exist on the other face is avoided; therefore, the precision of the lens in use is influenced.

The invention relates to the technical field of diamond precision machining, and provides a polishing solution for diamond and a diamond chemical mechanical polishing method. The polishing solution for the diamond is formed by mixing and uniformly stirring deionized water, diamond micro-powder, iron powder, a catalyst and a dispersing agent; the grinding aid comprises the following components in percentage by weight: 50%-68% of deionized water, 10%-40% of diamond micro powder, 10%-35% of iron powder, 2%-5% of a catalyst and 0.1%-0.5% of a dispersing agent. By adding the iron powder into the polishing solution, the iron powder can reduce the activation energy of diamond graphitization and catalyze the diamond surface, and the catalytic action aggravates the conversion from diamond to graphite, so that the diamond surface becomes very soft, and carbon atoms on the diamond surface are easier to separate. And the polishing and removing process of the diamond material is accelerated through the catalysis effect of the iron powder, so that ideal surface quality and precision can be achieved in a short time during diamond polishing.

The invention discloses an ultrasonic cavitation magneto-rheological chemical mechanical polishing device which comprises an operation table. A polishing groove is formed in the top of the operation table and used for containing magneto-rheological polishing liquid. A clamping driving mechanism is arranged in the polishing groove and used for clamping a workpiece to be polished and driving the workpiece to rotate. An ultrasonic transducer is arranged at the position, located above the clamping driving mechanism, in the polishing groove; the ultrasonic transducer comprises a rear cover plate, a piezoelectric ceramic piece and a front cover plate which are arranged in sequence; the rear cover plate and the front cover plate are locked through a pre-tightening bolt; the front cover plate is made of a magnetic material and faces the clamping driving mechanism; the clamping driving mechanism and the ultrasonic transducer are electrically connected with the controller. Correspondingly, the invention further provides an efficient GaN polishing method, the ultrasonic cavitation magneto-rheological chemical mechanical polishing device is used for polishing GaN, the material removal efficiency is high, the stress defect on the GaN surface can be avoided, and the polishing quality is good.

The invention discloses a non-contact polishing device based on a structured surface polishing tool. The non-contact polishing device comprises a working platform, a workpiece clamping driving assembly and a polishing solution pressurizing assembly are correspondingly arranged on the working platform; the polishing solution pressurizing assembly comprises a structured surface polishing tool correspondingly arranged below the workpiece clamp. The structured surface polishing tool is of a groove-shaped structure, the bottom of the structured surface polishing tool is in a conical surface shape with the outer portion higher than the inner portion, and shifting rods distributed in a radial shape are arranged on the conical surface in groups. During working, polishing liquid in the structured surface polishing tool can be dispersed towards the edge of the polishing tool driving device under the synergistic effect of centrifugal force and the shifting rod, and the pressure of the polishing liquid acting on the surface of a workpiece to be machined is increased. In the machining process, the polishing solution forms a continuous flow field on the surface of the workpiece, then the force rheological polishing solution generates shear stress on the surface of the workpiece to be machined, the material on the surface of the workpiece is evenly removed, the pressure, acting on the surface of the workpiece, of the force rheological polishing solution is improved through the structured surface polishing tool, and the polishing efficiency is improved.

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to an ultraviolet light catalysis assisted gallium nitride wafer polishing method which comprises the following steps: S1, fixing a ground and flushed gallium nitride wafer on a clamp of a polishing machine; s2, the sealed cabin of the polishing machine is vacuumized until the vacuum degree reaches a set vacuum degree threshold value, and then the sealed cabin is filled with oxygen until the pressure value of the oxygen in the sealed cabin reaches a set pressure threshold value; s3, an ultraviolet lamp and a heater are turned on, the ultraviolet lamp irradiates the polishing solution, the heater heats the polishing solution to a set temperature and keeps the temperature constant, and then the polishing machine is started to polish the gallium nitride wafer; and S4, cleaning the polished gallium nitride wafer. According to the method, the oxidation rate is increased, and the polishing efficiency of the gallium nitride wafer is further improved.

The invention discloses a preparation method of a spherical cerium-based abrasive material with high hardness and high Ce < 3 + > content. The method comprises the following steps: 1, carrying out hydrothermal reaction on cerium salt and aluminum salt in an ethylene glycol solution to generate a cerium-based abrasive precursor; 2, firing the cerium-based abrasive precursor to obtain a cerium oxide spherical abrasive doped with aluminum oxide; and 3, reducing the cerium oxide spherical abrasive by sodium borohydride to obtain the spherical cerium-based abrasive with high hardness and high Ce < 3 + > content. According to the method, aluminum ions are doped into the cerium oxide spherical abrasive through a one-step hydration method, the hardness of the abrasive is improved, meanwhile, a large amount of Ce < 4 + > is efficiently and rapidly reduced into Ce < 3 + > ions through an in-situ reduction method, and the polishing efficiency of the abrasive is improved. The cerium-based abrasive synthesized by the method is uniform in granularity, good in morphology, high in hardness and high in Ce < 3 + > content, and the polishing rate of silicon carbide can be remarkably increased and the surface roughness can be remarkably reduced when the cerium-based abrasive is prepared into a silicon carbide polishing solution; and the preparation method is simple, good in repeatability, green and environment-friendly, and beneficial to industrial production.

The invention relates to the technical field of polishing solutions, in particular to an efficient and environment-friendly chemical polishing solution and a preparation method thereof. The chemical polishing solution comprises the following raw materials in percentage by weight: 5%-8% of a nano metal abrasive, 2%-4% of a silicon oxide abrasive, 2%-10% of an oxidizing agent, 1%-5% of a complexing agent, 0.05%-0.5% of a corrosion inhibitor and the balance of deionized water. The chemical polishing solution further comprises a pH regulator, and the pH of the chemical polishing solution is regulated to 7.5-8.5 by adopting the pH regulator. The chemical polishing solution disclosed by the invention adopts environment-friendly raw materials, shows a good polishing effect when being used for precision machining of the monocrystalline silicon wafer, and is high in material removal efficiency, and the polished silicon wafer is smooth in surface and free of damage.

The invention provides a flexible braided electrode and an electrochemical polishing method for a complex inner channel, and belongs to the technical field of electrochemical machining. The flexible braided electrode is formed by mutually braiding a plurality of flexible conductive wires and a plurality of flexible insulating wires according to a certain interval, the diameter of the insulating wires is larger than that of the conductive wires, and steps with a certain height are naturally formed between the insulating wires and the conductive wires, so that short-circuit burn caused by contact between the conductive metal wires and an inner channel can be avoided, mass transfer can be enhanced, and product discharge can be accelerated; the flexible woven electrode is of a hollow net-shaped cylindrical structure, internal and external compound flushing can be achieved, and the flushing effect is improved. During polishing, the flexible braided electrode can be bent and deformed in a bent inner channel in a self-adaptive manner, internal and external compound flushing is performed by utilizing the internal and external through characteristic, and electrochemical polishing of the complex inner channel is realized by combining rotation and reciprocating motion of the electrode. The invention provides the flexible braided electrode with ingenious conception, and the flexible braided electrode is supplemented with an innovative process method, so that high-efficiency and high-quality finishing of a complex inner channel can be realized.

The invention relates to a wooden bead polishing device, and belongs to the field of furniture processing. The wooden bead polishing device comprises an outer groove, an inner groove, a first driving mechanism used for driving the inner groove to rotate, a second driving mechanism used for driving an elastic ring to move repeatedly in the radial direction of the inner groove, a megasonic vibration generating device and a polishing medium. According to the wooden bead polishing device, the polishing effect on wooden beads can be remarkably improved under the multiple effects of rotating centrifugal force, vibration force generated by high-frequency vibration, magnetic force, radial acting force caused by elastic force and the like. The polishing mode that stirring is conducted through a stirring paddle is not adopted, the wooden beads do not need to be raised and thrown down during polishing, damage to the wooden beads is small, the polishing effect is good, and the polishing efficiency is high.

The utility model belongs to the technical field of automobile flange shaft machining, and particularly relates to a polishing device for automobile flange shaft machining, which comprises a machining table, a support is connected to the surface of the top of the machining table, first bearings are arranged on the surfaces of the two sides in the support, and a one-way screw is connected between the two first bearings. One end of the one-way screw extends into the support to be connected with the output end of the first motor, and one end of the one-way screw is connected with a moving block in a penetrating mode. According to the automobile flange shaft polishing device, the clamping mechanism and the movable polishing main machine are matched with each other, so that an operator fixes the two ends of an automobile flange shaft on the clamping mechanism, and the automobile flange shaft can be automatically polished by adjusting the position of the polishing main machine and rotating the clamping mechanism; and secondly, by adjusting the position of a clamping block and the position of a vertical block on the clamping mechanism, the clamping mechanism fixes the automobile flange shafts of different sizes, the polishing device is matched with the automobile flange shafts of more sizes, and therefore the adaptability of the polishing device is improved.

The utility model relates to the technical field of polishing and grinding, and particularly discloses a laminated stainless steel plate polishing and grinding device which is characterized in that after the bottom surface is polished and ground, two electric push cylinders are started to pull a lifting frame to slide upwards, when an ascending gear meets a rack at the side end of a turning panel, a fixed frame is driven to rotate, and in the process, the fixed frame is driven to rotate; when the lifting frame rotates by 180 degrees, the electric push cylinder starts to push the lifting frame downwards, in the process, the push rod can generate thrust on the inclined face of the guide groove in the downward sliding process, the turning panel is promoted to slide towards the side face, and then the turning panel is pushed to move downwards. The rack at the side end of the overturning plate avoids the gear, the rack at the side end of the overturning plate is meshed with the gear, overturning is completed, the effect of automatically overturning and improving the polishing efficiency is achieved, the motor drives the vibration rod to generate vibration to clean the surface of the polishing belt, and the effect of prolonging the service life of the polishing belt is achieved.

The invention provides a modified epoxy-cerium oxide polishing solution and a preparation method thereof, and the modified epoxy-cerium oxide polishing solution is mainly prepared from the following raw materials by mass: 0.2-0.5% of a modified cerium oxide abrasive; 0.02%-0.35% of a stabilizer; 0.25%-0.4% of ammonia water; 99.08%-99.2% of deionized water; wherein the modified cerium oxide abrasive is formed by mixing cerium oxide and epoxy carboxylic acid according to the mass ratio of (20: 1)-(200: 1). According to the epoxy-cerium oxide polishing solution, a grinding material can be more uniformly dispersed in the solution, so that the uniformity of suspension liquid is improved; and under the condition of ensuring the removal rate, the suspension property (D50) of the compound can be kept for 2 months.

The invention relates to the technical field of polishing equipment, and particularly discloses a grooved drum shaft roller polishing machine which comprises a polishing barrel, two partition plates are fixedly installed in the polishing barrel and symmetrically distributed at the two ends of the polishing barrel, and adjusting cavities are formed between the two partition plates and the polishing barrel; the rack is arranged outside the polishing barrel, the polishing barrel can rotate in the rack, a transverse shaft is fixedly mounted on the rack, a mounting seat is fixedly connected to the transverse shaft, and the mounting seat is located in the adjusting cavity; according to the groove drum shaft roller polishing machine, the clamping piece is driven to move through the pushing mechanism and the driving mechanism, then the groove drum shaft can rotate relative to the polishing barrel in the polishing process, meanwhile, the groove drum shaft can do up-and-down reciprocating motion and left-and-right reciprocating motion, and the contact collision strength of grinding materials and the groove drum shaft is effectively improved; and the groove drum shaft is polished more efficiently and uniformly, and the polishing effect on the groove drum shaft is improved.

The invention provides a phosphonic acid ligand modified cerium oxide polishing solution and a preparation method thereof. The polishing solution is mainly prepared by mixing water and phosphonic acid ligand modified cerium oxide according to a mass ratio of (94: 5)-(92: 7). According to the polishing solution, through modification of the phosphoric acid ligand, the chemical and physical properties of the cerium oxide abrasive are optimized, and the reactivity and the removal rate in the chemical mechanical polishing process can be improved, so that the polishing efficiency is effectively improved; a stable surface modification layer is formed through interaction with the surfaces of cerium oxide particles, so that the aggregation tendency among the particles is reduced, the grinding material can be more uniformly dispersed in a solution, and the uniformity of suspension liquid is improved; hydrophilic groups are arranged on the surface, so that the solubility of the particles in a solution is improved, and the settling velocity of the particles is reduced, thereby prolonging the stabilization time of a suspension.

The optical element polishing device comprises a polishing box, an L-shaped support and a motor are installed in the polishing box, a polishing table is installed on the side portion of the L-shaped support, a suction cup is rotatably installed in the polishing table, a suction cup rotating shaft is in butt joint with a motor shaft, and the top of the suction cup is used for installing an optical element. And a lifting electric polishing head is movably mounted at the upper end of the L-shaped bracket. The driving assembly is designed, through intelligent control of a temperature sensor and a U-shaped electromagnetic block, the function that the polishing head automatically and gradually moves towards the center of the optical element along with lowering of the liquid level of cooling liquid is achieved, therefore, the all-directional and uniform polishing effect is ensured, the polishing precision and consistency are improved through the design, and compared with electric driving, the polishing efficiency is greatly improved. Manual intervention is reduced, the structure principle is simple, and the machining efficiency is improved.

The embodiment of the invention provides a polishing mechanism, a polishing module, a polishing method, a processor and a storage medium. The polishing mechanism comprises a supporting body, at least two long-strip-shaped through holes evenly distributed in the circumferential direction are formed in the supporting body, and the axis of each long-strip-shaped through hole penetrates through the center of the supporting body. The at least two polishing heads are movably arranged in the long-strip-shaped through holes in a one-to-one correspondence mode; the first driving mechanism is arranged on the supporting body, electrically connected with the polishing heads and used for driving the polishing heads to rotate and move in a reciprocating mode along the long-strip-shaped through holes at the same time. According to the polishing device, all the polishing heads reciprocate along the long-strip-shaped through holes, so that the polishing heads can reciprocate in the radial direction of the polishing pad in the polishing operation process, namely in the radial direction of the annular groove used for containing the polishing solution, all the polishing heads can make full contact with the polishing solution, and the more efficient polishing effect is achieved; especially for wafers made of third-generation semiconductor materials, the polishing efficiency is remarkably improved through the polishing mode.

The invention discloses an alkali polishing additive for rapid polishing of monocrystalline silicon and a use method of the alkali polishing additive, and relates to the technical field of monocrystalline silicon etching, and the alkali polishing additive comprises the following components: a reaction accelerator, a corrosion and scale inhibitor, a PH regulator, a defoaming agent, 1, 3-bis (2-hydroxyethyl)-2-imidazolinone, 2, 5-furandimethanol, quinoline yellow, sodium glycyrrhizinate, melamine, hydroxypropyl chitosan and deionized water. The additive is good in alkali polishing effect under low weight loss, high in efficiency, good in stability, good in polished surface appearance and obvious in gain effect on the light conversion efficiency of the solar cell.

The utility model discloses a polishing structure for preparing an anti-aging wear-resistant outdoor plastic-wood floor, belongs to the field of polishing structures for preparing outdoor plastic-wood floors, and aims to solve the problem that only one surface of a floor can be polished and ground by using a polishing roller in a floor treatment process, so that the floor cannot be polished and ground. The problems that two faces of a floor can be polished only after the floor is turned over manually, operation is tedious, the polishing efficiency becomes low, and practicability is not high are solved. According to the outdoor plastic-wood floor machining device, an outdoor plastic-wood floor is placed in the machining cavity and is made to be close to the clamping plate, then the movable clamping block slides, then the position of the movable clamping block is fixed through the bolt, and the outdoor plastic-wood floor can be clamped through cooperation of the clamping plate and the movable clamping block; the polishing mechanism can be used for polishing and grinding the outdoor plastic-wood floor, then the overturning motor drives the rotating shaft to rotate, the floor is driven to be overturned, manual overturning operation is reduced, time is saved, and therefore the polishing efficiency can be effectively improved.

The invention discloses a telescope lens polishing detection system and method, and belongs to the technical field of astronomical metrology, and the method comprises the following steps: placing a telescope lens on a polishing die holder, and adjusting the working state of a polishing mechanism to an initial polishing state; starting a polishing mechanism to polish the surface of the telescope lens, detecting the polishing condition of the telescope lens in real time through a polishing sensor, and generating corresponding polishing detection data; the polishing detection data are processed, whether the polishing effect of the telescope lens meets a preset standard or not is judged, if the polishing effect meets the preset standard, polishing is stopped, and if the polishing effect does not meet the preset standard, polishing control parameters in the polishing process are adjusted; and the telescope lens which stops polishing is cleaned and dried, and the polished telescope lens is obtained. According to the invention, the polishing process of the telescope lens can be monitored in real time and accurately controlled, and the lens polishing quality and the production efficiency are effectively improved.

The utility model relates to the technical field of polishing devices, in particular to a metal casting two-face polishing device which comprises a base. The positioning assembly is used for positioning the plate-shaped metal casting; the polishing assembly comprises a mounting plate fixedly arranged on the upper surface of the base, a lifting plate is slidably arranged on the side face of the mounting plate, two symmetrical moving plates are slidably arranged on the side face of the lifting plate, polishing motors are slidably arranged on the opposite faces of the two moving plates, and polishing discs are fixedly arranged at the output ends of the polishing motors. The polishing assembly is arranged, the fourth motor can be started to achieve the purposes that the polishing disc in rotation moves transversely and the surfaces of the two sides of the plate-shaped metal casting are polished transversely, and then the second motor is started to drive the polishing motor and the polishing disc to move downwards to the next area for transverse polishing. Therefore, the device can achieve the purpose of polishing the two faces of the plate-shaped metal casting at the same time, and the polishing efficiency is effectively improved.

The invention provides an electromagnetic vibration cavitation assisted chemical mechanical polishing device and method.The device comprises a polishing disc, a mounting frame, a polishing main shaft and a mounting disc, the polishing main shaft is mounted on the mounting frame and comprises a connecting shaft, a hollow rotating shaft, a stator sleeve and a vertical floating mechanism, and the vertical floating mechanism is connected between the connecting shaft and the hollow rotating shaft; the vertical floating mechanism vibrates in a reciprocating mode in the vertical direction while driving the hollow rotating shaft to rotate, a liquid inlet used for introducing polishing liquid is formed in the outer side of the stator sleeve, the mounting disc is connected to the bottom of the hollow rotating shaft, a workpiece is clamped by the bottom of the mounting disc, and the lower surface of the workpiece is evenly coated with an agent injected through the liquid inlet. Polishing liquid enters the position between the workpiece and the polishing disc to form a liquid film, and when the mounting disc and the polishing disc rotate relatively, the polishing uniformity of the workpiece can be improved. And by arranging the vertical floating mechanism, the workpiece can axially vibrate relative to the polishing disc while the mounting disc and the polishing disc rotate relatively, and the polishing efficiency is improved.

The utility model discloses a polishing device for an automobile steering gear yoke forge piece, which relates to the technical field of polishing devices and comprises a box body, clamping components are arranged on the left side and the right side of the upper surface of the box body, a medium barrel is arranged between the upper surface of the box body and the two clamping components, a polishing barrel is arranged in the medium barrel, and a partition plate is fixedly connected to the middle of the interior of the box body. A first motor is fixedly installed on the bottom face in the box body, the output end of the first motor penetrates through the bottom face of the partition plate and is fixedly connected with a rotating disc, at least four magnets are fixedly connected to the top face of the rotating disc, a cover closing assembly is arranged on the rear side of the upper surface of the box body, and a cooling fan is fixedly installed on the rear side wall of the box body. A plurality of heat dissipation grooves are formed in the left and right side walls of the box body. The polishing device has the advantages that the cover closing assembly enables the barrel cover to seal the polishing barrel, the polishing safety is improved, the clamping assembly clamps the medium barrel, the stability of the polishing barrel can be kept, and the continuity and consistency of polishing operation are ensured.

The utility model discloses a polishing device for fastener production and processing, which comprises a mounting frame, and a displacement support is fixedly connected in the mounting frame. According to the polishing device for fastener production and machining, the mounting frame, the displacement support, the lifting groove, the clamping frames, the polishing disc, the lifting plate and the connecting rod are matched with one another, the displacement motor rotates to drive the two-way threaded rod to rotate, the clamping frames are driven to be close to one another, the left clamping frame and the right clamping frame clamp fasteners, and the polishing effect is achieved. The lifting air cylinder pushes the grinding disc to descend to polish the surface of the clamped fastener, when single-face polishing is completed, the clamping motor rotates, the pushing air cylinder pushes the clamping frame to ascend, movement obstruction caused when the fastener rotates is avoided, the fastener is turned over, polishing of the other face is completed, the fastener does not need to be frequently disassembled and re-clamped, and the work efficiency is improved. And time and labor are saved, and the polishing efficiency is greatly improved.

The invention discloses multi-dimensional sensor variable-diameter inner and outer wall polishing equipment and method.The multi-dimensional sensor variable-diameter inner and outer wall polishing equipment comprises a supporting assembly, a press-fit limiting assembly and a polishing assembly, the supporting assembly comprises a supporting base and a fixing plate, the fixing plate is arranged on the supporting base, the press-fit limiting assembly is arranged on the fixing plate, and the polishing assembly is arranged on the supporting base; the pressing limiting assembly is used for pressing and fixing a sensor to be polished and comprises a positioning plate, an adjusting screw rod, a clamping plate block and a pressing plate, the positioning plate is arranged on the fixing plate block, the adjusting screw rod is in threaded connection with the positioning plate, the clamping plate block is movably arranged on the fixing plate block, the pressing plate is arranged on the clamping plate block, and the adjusting screw rod is in threaded connection with the pressing plate. And the polishing assembly is arranged on the fixed plate. Therefore, the polishing component with the variable spacing is adopted to polish the sensor, polishing is conducted according to the inner walls with different hole diameters in the sensor in the polishing process, then the polishing device is suitable for various inner diameters, the replacement frequency of the polishing component is reduced, and the polishing efficiency is improved.

The present invention discloses a semiconductor wafer polishing device and a polishing method, comprising: a placement mechanism for placing a plurality of wafers; an upward throwing mechanism and a downward throwing mechanism for polishing both sides of the wafer and rotating independently of each other; and a measuring mechanism for measuring the distance between different positions of the lower end surface of the upward throwing mechanism and the corresponding positions of the upper end surface of the downward throwing mechanism; wherein the placement mechanism is built into the upper end surface of the downward throwing mechanism and is driven to rotate by the downward throwing mechanism; the upward throwing mechanism and the downward throwing mechanism can adjust the distance between each other to adjust the deformation amount of the lower end surface of the upward throwing mechanism and the deformation amount of the upper end surface of the downward throwing mechanism. The present invention can not only accurately guarantee the geometric parameters of the wafer, but also save polishing time. The polishing time for adjusting the deformation amount of a single wafer is increased by about 96%, with high polishing efficiency and high control accuracy.

The invention relates to the technical field of machining, in particular to a polishing device based on magnetorheological and a polishing method based on the polishing device.The polishing device comprises a supporting rotary disc, a laser heating module, a magnetorheological fluid supply assembly and a sleeve structure movably arranged above the supporting rotary disc. A mounting cavity used for containing a workpiece is defined by the supporting rotary disc and the sleeve structure, the inner wall of the sleeve structure is used for forming a magnetorheological fluid channel with the to-be-polished surface of the workpiece, and the sleeve structure is provided with a magnetic module to form a magnetic field. The magnetorheological fluid supply assembly is used for supplying magnetorheological fluid to the magnetorheological fluid channel so that the magnetorheological fluid can polish the to-be-polished surface of the workpiece under the action of a magnetic field, and the laser heating module is arranged on one side of the preset mounting cavity and used for heating the to-be-polished surface of the workpiece before polishing. The to-be-polished surface of the workpiece is heated and softened before magneto-rheological machining, so that materials on the surface of the workpiece are easier to remove, and the polishing efficiency is improved.

The utility model discloses a steel roller surface polishing device which comprises a supporting frame. The steel roller to be polished is composed of a roller shaft and a roller cylinder; and the two steel roller fixing mechanisms are used for clamping and fixing a steel roller to be polished, and each steel roller fixing mechanism comprises an electric cylinder fixedly connected to the side face of the supporting frame. Firstly, a steel roller to be polished is placed between the two steel roller fixing mechanisms, then the electric cylinder drives the clamping base to be close to the steel roller to be polished, a roller shaft is clamped and fixed, then the adjusting bolt is rotated by rotating the hand wheel, and the polishing roller at the bottom of the grinding wheel frame is driven to be close to the steel roller to be polished under the action of threads of the threaded sleeve. And meanwhile, the servo motor is started, so that the rubber roller can be driven to rotate, the roller can be driven to rotate in the circumferential direction under the friction action between the rubber roller and the roller, the steel roller to be polished can be polished and ground in all directions, and the polishing efficiency of the steel roller to be polished is improved.

The invention discloses a metal material electrolytic polishing solution, a preparation method and an EBSD sample preparation method, the electrolytic polishing solution comprises the following components in percentage by volume: 15-30% of acid substance containing sulfuric acid and hydrochloric acid, 60-80% of alcohol substance containing methanol and ethanol, and the balance of water, and the volume percentage of the acid substance is 15-30%, and the volume percentage of the alcohol substance is 60-80%. And the balance of water. The electrolytic polishing solution is easy to prepare, low in cost, easy to store, capable of being repeatedly used for a long time, suitable for preparation of EBSD samples of various metal materials, capable of achieving rapid electrolytic polishing at the room temperature without parameter debugging, high in sample preparation efficiency and test repeatability and high in calibration rate.