163 results about "Abrasive agent" patented technology

The invention provides a multi-station diamond grinding numerical control machine tool, and relates to the technical field of diamond grinding, the multi-station diamond grinding numerical control machine tool comprises a vertical plate, the surface of the vertical plate is fixedly connected with a bottom table, a working table, a top table, an air pump, a diamond detector and a wiping block in sequence from bottom to top, and the multi-station diamond grinding numerical control machine tool further comprises a plurality of linear sliding tables arranged between the top table and the working table in an annular array; dD direct-drive multi-axis mechanical arms are installed on the sliding table surfaces of the linear sliding tables, rotary grinding discs are arranged on the surfaces of the workbenches, liquid supply pipes are arranged above the rotary grinding discs, liquid outlet adjusting pieces are arranged in the liquid supply pipes, air return cylinders are arranged on the surfaces of the liquid supply pipes, and first restraint rings and second restraint rings are arranged on the surfaces of the workbenches. A filtering piece is arranged on the surface of the top table; according to the diamond grinding device, the air wall is formed above the rotary grinding disc, dust generated in the diamond grinding process and splashing grinding fluid or grinding agents can be effectively limited in one area, and therefore the device can be cleaned conveniently, and by-products can be collected and treated conveniently.

The invention discloses an environmentally friendly cement grinding aid and a preparation method thereof. The cement grinding aid is prepared by polymerizing a modified monomer, a reinforcing monomer and acrylic acid. The cement grinding aid can be adsorbed on the surface of a material, shield active points generated by grinding through charge repulsion, prevent fracture surface recombination, and form a lubricating film on the surface, thereby reducing the friction between the materials. The cement grinding aid can penetrate into the gaps of the materials, weaken the healing effect generated by molecular forces, promote crack expansion, and thus make the materials easier to be crushed. The cement grinding aid molecules contain a large number of silicon-oxygen bonds, so that the cement grinding aid has high surface activity and dispersibility, can well reduce the surface free energy of the material, thereby improving the dispersion effect and accelerating crack expansion. The hyperbranched structure can improve the fluidity of cement and improve the early strength and final strength of cement.

Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto a porous pad, contacting the substrate with the porous pad while moving the porous pad and substrate relative to one another such that higher portions of the substrate contact the porous pad and lower portions of the substrate do not contact the porous pad, and removing material from the higher portions of the substrate via contact with the porous pad to reduce a height of the higher portions of the substrate relative to the lower portions of the substrate.

Devices, systems, and methods for a bottom hole assembly to form perforations are provided. An abrasive jet perforating tool is configured to couple to a downhole conveyance that is extendable from a terranean surface, through a wellbore, and to a subterranean formation. The abrasive jet perforating tool is configured to inject abrasive particles along a radial direction to create perforations in the subterranean formation. A hydraulically actuated subassembly is attached to the abrasive jet perforating tool and configured to move the abrasive jet perforating tool towards or away from the subterranean formation along the radial direction.

A CMP slurry composition for polishing tungsten and a method of polishing tungsten using the composition, the composition includes a solvent, the solvent comprising a polar solvent or a nonpolar solvent; an abrasive agent; and a corrosion inhibitor, wherein the corrosion inhibitor includes a polyaminosilane having a weight average molecular weight of 500 g / mol to 5,000 g / mol, or a salt thereof.

The invention relates to the technical field of mechanical seals, in particular to a mechanical seal repairing method. According to the repairing method of the mechanical seal, the hard coatings are formed on the abraded end faces of the moving ring and the static ring through the nanometer hard coating paste, the diamond grinding agent and the wool grinding head are used for conducting coarse grinding, fine grinding and mirror grinding on the solidified hard coatings, so that the hard coatings and the original surface form a uniform and flat surface, and the surface smoothness is smaller than or equal to 0.3 micrometer. After being installed, the repaired moving ring and the repaired static ring can resist the pressure of 0.2 MPa through pressure testing, so that the service life of the mechanical seal is greatly prolonged, the production cost of an enterprise is reduced, and the running loss is reduced.

The present invention provides a chemical mechanical polishing composition comprising: (a) a titanium oxide abrasive; (b) an oxidizing agent; and (c) water, wherein the chemical mechanical polishing composition has a pH of about 7 or less. The invention also provides a method for chemical mechanical polishing of a substrate, in particular a substrate comprising a boron-doped polycrystalline silicon layer on a surface of the substrate, using the composition.

The application discloses a long-time high-speed tungsten chemical mechanical polishing liquid and application thereof. The tungsten chemical mechanical polishing liquid comprises the following components in mass percentage: 0.1-5% of abrasive, 0.5-5% of oxidant, 0.001-0.05% of tungsten catalyst, 0.01-0.05% of stabilizer, 0.005-0.05% of surface quality improver, 0.001-0.003% of oxidase, and the balance is deionized water. The tungsten chemical mechanical polishing liquid has the characteristics of long-time high speed and good surface quality.

The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive, (b) a buffering agent, and (c) water, wherein the polishing composition has a pH of about 1 to about 7 and the silica abrasive has a zeta potential of about −10 mV to about −50 mV in the polishing composition. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising silicon carbide and / or silicon nitride, using said composition.

A method of producing a polished object comprising: a double-sided polishing step in which an object to be polished is subjected to double-sided polishing using a double-sided polishing agent containing first abrasive grains having an average primary particle diameter of 40 nm or more and a nitrogen-containing, water-soluble polymer, so that a double-sided polished object is obtained; and a one-side polishing step in which the double-sided polished object is subjected to one-side polishing using a one-side polishing agent containing second abrasive grains having an average primary particle diameter of 40 nm or less and a water-soluble polymer, wherein a ratio of an average primary particle diameter (A) of the first abrasive grains with respect to an average primary particle diameter (B) of the second abrasive grains (A) / (B) is more than 1 and 2.5 or less, and wherein the concentration of the water-soluble polymer in the single-side polishing agent is higher than that of the nitrogen-containing water-soluble polymer in the double-side polishing agent.

The invention discloses high-coercivity samarium-iron-nitrogen magnetic powder and a preparation method thereof. The high-coercivity samarium-iron-nitrogen magnetic powder has anisotropy, and the particle size of the magnetic powder is micron-sized. The preparation method of the high-coercivity samarium-iron-nitrogen magnetic powder comprises the following steps: preparing an organic combined grinding agent containing a solvent, a surfactant and a coupling agent in proportion, and mixing the organic combined grinding agent with samarium-iron-nitrogen raw material powder to obtain a mixed material; grinding the mixed material to obtain ground slurry; and carrying out ultrasonic dispersion on the grinding slurry, and carrying out particle screening and drying to obtain the high-coercivity samarium-iron-nitrogen magnetic powder. The obtained micron magnetic powder has the obviously improved coercive force level, and the coercive force level can be equivalent to the coercive force level of submicron samarium-iron-nitrogen magnetic powder; requirements on preparation equipment are low, and the process is simple.

The application discloses a cleaning method of a cauldron for preparing aluminum trihydride, which comprises the following steps: (1) under an inert gas atmosphere, adding a polyhalogenated hydrocarbon solvent and an inorganic salt abrasive into the cauldron, and stirring intensively to grind off the wall-bonding substances in the cauldron; (2) emptying the cauldron, and slowly feeding a buffer solution into the cauldron through a bottom pipe in a vacuum-extraction mode, so that the buffer solution is immersed into the cauldron from the bottom of the cauldron; and (3) sequentially using dilute alkali, dilute acid and water to completely immerse the wall-bonding layer, and then washing the cauldron with water. The method can safely and effectively remove the wall-bonding substances on the cauldron.

A CMP slurry composition for patterned tungsten wafers and a method of polishing patterned tungsten wafers using the same, the CMP slurry composition includes a solvent; an abrasive; and a non-dendrimeric poly(amidoamine).

The invention relates to a self-stopping polishing composition and a method. A chemical mechanical polishing composition for polishing a substrate having a silica material, comprising, consisting of, or consisting essentially of: a liquid carrier; cubic ceria abrasive particles dispersed in the liquid carrier; a self-stopping agent; and a cationic polymer.

The invention discloses a deep-cavity small-structure part manufacturing and machining method, and belongs to the technical field of machining. Comprising turning, polishing and cleaning; for a structure with an arc surface in a deep cavity of the part, a tool for turning is a tool with a front angle of 5-15 degrees; polishing is conducted after turning, rough polishing, semi-fine polishing and fine polishing are sequentially adopted for polishing, and cleaning is conducted after each time of polishing; in the polishing step, a polishing rod with cloth fixed at the front end is adopted, an abrasive is sprayed on the cloth, and the polishing rod and the center of the part are staggered and rotate oppositely for polishing; according to the invention, turning-polishing-cleaning full-closed-loop manufacturing is realized; the precision of a deep-cavity small-structure part is improved, the problem of sealing failure of an aerospace / medical valve body under the extreme working condition (-80 DEG C) is solved, and the one-time delivery inspection percent of pass is improved to be larger than or equal to 98%.

To provide a detergent composition and a cleaning body capable of effectively removing all cleaning objects such as oil stains and water stains.SOLUTION: A detergent composition contains at least a particulate abrasive and a powdery cleaning agent, and in addition thereto, includes a known surfactant, etc. added thereto appropriately. The particulate abrasive is composed of one or more of mineral-derived substances, shells of scallops, etc., egg shells of chickens, etc., and seed shells of plants such as peach seeds, while the powdery cleaning agent is composed of one or more of citric acid, tartaric acid, oxalic acid, citric acid, etc. The detergent composition is composed of the abrasive consisting of a component that dissolves in water and exhibits alkaline properties and the cleaning agent consisting of a component that dissolves in water and exhibits acidity.SELECTED DRAWING: Figure 2

Provided are: an independently spherical porous spherical silica having a reduced alkali metal content, high particle hardness, and a reduced number of fragmented particles; and a method for producing the porous spherical silica. A porous spherical silica having a volume-based cumulative 50% particle diameter (D50) of 2 [mu] m to 200 [mu] m, a ratio (D10 / D90) of a cumulative 10% particle diameter (D10) to a cumulative 90% particle diameter (D90) of 0.3 or more, a pore volume of 0.5 ml / g to 8 ml / g, a mode of a pore radius of 5 nm to 50 nm, and a specific surface area of 50 m2 / g to 400 m2 / g, the arithmetic mean value of the'test force at the time of confirmation of sample breakage 'determined according to the method specified in JIS Z8844 is 1.0 * 101 mN to 2.0 * 101 N (inclusive), the number of particles having a circularity of 0.7 or less is 20 or less, and the alkali metal content is 50 ppm or less.

The invention provides a method of chemically mechanically polishing a substrate, especially a substrate comprising boron-doped polysilicon, comprising contacting the substrate with a chemical-mechanical polishing composition comprising an abrasive selected from α-alumina, silica, and a combination thereof, ferric ion, an organic acid, or a combination thereof, and water. The invention also provides a chemical-mechanical polishing composition comprising α-alumina, a nitrogen-containing compound selected from a zwitterionic homopolymer at, a monomeric ammonium salt, and a combination thereof, an organic acid, and water. The invention further provides a chemical-mechanical polishing composition comprising silica, an organic acid, ferric ion, and water.

This invention provides a chemical mechanical polishing composition comprising: (a) a silica abrasive, (b) a surfactant, (c) an iron cation, (d) optionally a ligand, and (e) water, wherein the silica abrasive has a negative zeta potential in the chemical mechanical polishing composition. This invention also provides a method for chemically mechanically polishing a substrate, particularly a substrate comprising a carbon-based film, using the said composition.

Provided is an analytical method for measuring porosity in a weld cross-section, which is capable of suppressing variations in measurement results and obtaining quality results at a higher level. An analysis method for measuring porosity in a weld cross-section includes: an analysis TP manufacturing step of manufacturing an analysis TP (test piece) by subjecting a weld cross-section exposed by cutting a welded portion of a workpiece welded with a non-ferrous material to resin filling, and then polishing the weld cross-section with a polishing agent; an image input step in which a weld cross-section image obtained by capturing an image of a weld cross-section in the analysis TP is input to the analysis program; a pre-processing step for generating a mask image of the weld seam in the weld seam cross-sectional image using pre-acquired seam shape learning data; a post-processing step for generating a processed image in which the weld cross-section image and the mask image are superimposed and a portion that is not a weld is cut off; and a porosity measurement step for measuring the porosity of the weld seam on the basis of the processed image, the learning data being a combination of a plurality of weld seam cross-sectional images obtained by polishing the weld seam cross-section with a plurality of polishing agents and the resolution of the weld seam cross-sectional images.

This invention discloses a tooth grinding machine for wide-width band saw blade processing, including limiting plates and a workpiece processing mechanism. A saw blade body portion is inserted between two limiting plates, and each limiting plate has an inclined hole on its side. The inclined hole faces opposite directions to the tooth grooves on the saw blade body. The bottom end of the limiting plate extends into the material collection hopper. The advantages of this invention are: during the feeding process, the abrasive is also driven to rotate by the processing actuator, which can fully fill the gap formed between the annular surface in the middle of the processing actuator and the inner wall of the tooth groove, thus achieving the effect of abrasive grinding the inner wall of the tooth groove. The abrasive is fed in a state of simultaneous movement and rotation, resulting in a finer and smoother grinding surface; it fully utilizes the abrasive, reducing the number of times it needs to be added; and it can automatically adjust and position the tooth grooves on the saw blade body, allowing for rapid adjustment to the grinding state.

A slurry composition, a polishing method and an integrated circuit are provided. The slurry composition includes a slurry and at least one cationic surfactant having at least one nitrogen atom in the molecule. The slurry includes at least one liquid carrier, at least one abrasive and at least one pH adjusting agent, and has a pH of less than 7.0. The polishing method includes using the slurry composition with the cationic surfactant to polish a conductive layer. The integrated circuit comprises a block layer comprising the cationic surfactant between a sidewall of the conductive plug and an interlayer dielectric layer.

A chemical mechanical polishing (“CMP”) slurry is designed and configured for reducing polishing pad wear rate. The CMP slurry includes at least one oxidizer, a primary abrasive, a solvent, and a secondary abrasive. The secondary abrasive is a mixture of chemicals that yield a stable suspension of the CMP slurry. The CMP slurry for reducing polishing pad wear rate is designed and configured to provide a pad wear rate of less than 2.0% at a 1-hour polishing time, and / or a pad wear rate of less than 10.0% at a 4-hour polishing time.

The invention provides a chemical mechanical polishing solution for metal and metal nitride substrates comprising: a solvent; at least one abrasive with a Mohs hardness of at least 8; and at least one soluble metal oxide anion wherein the metal is selected from vanadium, niobium, tantalum, chromium, molybdenum and tungsten.

The application discloses a high-speed tungsten plug chemical mechanical polishing solution and application thereof. The tungsten plug chemical mechanical polishing solution comprises the following components in mass percentage: 2-20% of abrasive, 0.5-5% of oxidant, 0.01-0.5% of tungsten catalyst, 0.01-0.05% of rate accelerator, and the balance is deionized water. The tungsten plug chemical mechanical polishing solution has the characteristics of fast polishing rate, good surface quality and excellent stability.

The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive, (b) a polymer comprising a sulfonic acid monomeric unit, and (c) water, wherein the polishing composition has a pH of about 1 to about 7 and the silica abrasive has a zeta potential of about -10 mV to about -50 mV in the polishing composition. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising silicon carbide, using said composition.

The invention provides a water-based anticorrosive paint for color steel tile roof renovation, which is characterized by comprising the following components in parts by mass: 60-80 parts of base paint and 16-24 parts of high-reflection additive filler, the high-reflection additive filler is prepared by the following steps: S1, crushing mixed aluminum powder and titanium dioxide, and uniformly dispersing the crushed mixed aluminum powder and titanium dioxide into a dispersing agent to obtain a mixture A; s2, sequentially adding a grinding aid and triethanolamine into the mixture A, and stirring at 25-28 DEG C for 1-3 hours to obtain the high-reflection additive filler. According to the water-based anticorrosive paint for color steel tile roof renovation, the high-reflection additive filler is introduced, and the mixed aluminum powder and titanium dioxide used in the preparation process of the high-reflection additive filler both have high refractivity and high light activity and can effectively absorb, reflect and scatter ultraviolet rays. The reflection effects of the mixed aluminum powder and the titanium dioxide are mutually superposed, so that the coating has higher reflectivity, the temperature of the surface of an object is more effectively reduced, and heat transfer to the interior of the object is reduced.

Disclosed are a polishing slurry and a method of manufacturing a semiconductor device using the same, the polishing slurry including a first histidine derivative including an abrasive, an oxidizing agent, and a substituted or unsubstituted cyclic imide group.

The utility model relates to the technical field of optical component processing, in particular to a grinding machine with a cleaning function, which comprises a box body, a processing area and a medium backflow area are respectively arranged in the box body, a partition plate is arranged between the processing area and the medium backflow area, and the partition plate is welded on the inner wall of the box body. And a grinding base is installed at the top of the partition plate through bolts, a vacuum suction cup is arranged above the grinding base, and the vacuum suction cup is connected to the top wall of the machining area through a first air cylinder at the top of the vacuum suction cup and bolts. According to the improved grinding machine, the structure of the partition plate plays a role in guiding backflow of media, the grinding agent backflow groove and the water tank can recycle different media respectively, the recycling rate is increased, the transmission structure of the grinding agent backflow groove effectively reduces the possibility of cross mixing of grinding agents and water molecules, and the cleaning structure of the telescopic structure is prevented from making direct contact with a grinding area. And the purity of subsequent water molecules can be kept, and then the workpiece surface cleaning effect is improved.

A method for manufacturing a display device may include providing a support layer and a display panel on a digitizer. The display panel may include a folding region that is folded with reference to a folding axis extending in a first direction. The providing of the support layer may include forming an opening penetrating the preliminary support layer by providing a laser or an abrasive agent to one surface of the preliminary support layer. A first width of the opening on the one surface in a second direction and a second width of the opening on another surface in a second direction may be different from each other, and the second direction is perpendicular to the first direction.