82 results about "Abrasive agent" patented technology

Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto a porous pad, contacting the substrate with the porous pad while moving the porous pad and substrate relative to one another such that higher portions of the substrate contact the porous pad and lower portions of the substrate do not contact the porous pad, and removing material from the higher portions of the substrate via contact with the porous pad to reduce a height of the higher portions of the substrate relative to the lower portions of the substrate.

Devices, systems, and methods for a bottom hole assembly to form perforations are provided. An abrasive jet perforating tool is configured to couple to a downhole conveyance that is extendable from a terranean surface, through a wellbore, and to a subterranean formation. The abrasive jet perforating tool is configured to inject abrasive particles along a radial direction to create perforations in the subterranean formation. A hydraulically actuated subassembly is attached to the abrasive jet perforating tool and configured to move the abrasive jet perforating tool towards or away from the subterranean formation along the radial direction.

The invention relates to the technical field of mechanical seals, in particular to a mechanical seal repairing method. According to the repairing method of the mechanical seal, the hard coatings are formed on the abraded end faces of the moving ring and the static ring through the nanometer hard coating paste, the diamond grinding agent and the wool grinding head are used for conducting coarse grinding, fine grinding and mirror grinding on the solidified hard coatings, so that the hard coatings and the original surface form a uniform and flat surface, and the surface smoothness is smaller than or equal to 0.3 micrometer. After being installed, the repaired moving ring and the repaired static ring can resist the pressure of 0.2 MPa through pressure testing, so that the service life of the mechanical seal is greatly prolonged, the production cost of an enterprise is reduced, and the running loss is reduced.

The present invention provides a chemical mechanical polishing composition comprising: (a) a titanium oxide abrasive; (b) an oxidizing agent; and (c) water, wherein the chemical mechanical polishing composition has a pH of about 7 or less. The invention also provides a method for chemical mechanical polishing of a substrate, in particular a substrate comprising a boron-doped polycrystalline silicon layer on a surface of the substrate, using the composition.

The application discloses a long-time high-speed tungsten chemical mechanical polishing liquid and application thereof. The tungsten chemical mechanical polishing liquid comprises the following components in mass percentage: 0.1-5% of abrasive, 0.5-5% of oxidant, 0.001-0.05% of tungsten catalyst, 0.01-0.05% of stabilizer, 0.005-0.05% of surface quality improver, 0.001-0.003% of oxidase, and the balance is deionized water. The tungsten chemical mechanical polishing liquid has the characteristics of long-time high speed and good surface quality.

The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive, (b) a buffering agent, and (c) water, wherein the polishing composition has a pH of about 1 to about 7 and the silica abrasive has a zeta potential of about −10 mV to about −50 mV in the polishing composition. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising silicon carbide and / or silicon nitride, using said composition.

The application discloses a cleaning method of a cauldron for preparing aluminum trihydride, which comprises the following steps: (1) under an inert gas atmosphere, adding a polyhalogenated hydrocarbon solvent and an inorganic salt abrasive into the cauldron, and stirring intensively to grind off the wall-bonding substances in the cauldron; (2) emptying the cauldron, and slowly feeding a buffer solution into the cauldron through a bottom pipe in a vacuum-extraction mode, so that the buffer solution is immersed into the cauldron from the bottom of the cauldron; and (3) sequentially using dilute alkali, dilute acid and water to completely immerse the wall-bonding layer, and then washing the cauldron with water. The method can safely and effectively remove the wall-bonding substances on the cauldron.

A CMP slurry composition for patterned tungsten wafers and a method of polishing patterned tungsten wafers using the same, the CMP slurry composition includes a solvent; an abrasive; and a non-dendrimeric poly(amidoamine).

The invention discloses a deep-cavity small-structure part manufacturing and machining method, and belongs to the technical field of machining. Comprising turning, polishing and cleaning; for a structure with an arc surface in a deep cavity of the part, a tool for turning is a tool with a front angle of 5-15 degrees; polishing is conducted after turning, rough polishing, semi-fine polishing and fine polishing are sequentially adopted for polishing, and cleaning is conducted after each time of polishing; in the polishing step, a polishing rod with cloth fixed at the front end is adopted, an abrasive is sprayed on the cloth, and the polishing rod and the center of the part are staggered and rotate oppositely for polishing; according to the invention, turning-polishing-cleaning full-closed-loop manufacturing is realized; the precision of a deep-cavity small-structure part is improved, the problem of sealing failure of an aerospace / medical valve body under the extreme working condition (-80 DEG C) is solved, and the one-time delivery inspection percent of pass is improved to be larger than or equal to 98%.

Provided are: an independently spherical porous spherical silica having a reduced alkali metal content, high particle hardness, and a reduced number of fragmented particles; and a method for producing the porous spherical silica. A porous spherical silica having a volume-based cumulative 50% particle diameter (D50) of 2 [mu] m to 200 [mu] m, a ratio (D10 / D90) of a cumulative 10% particle diameter (D10) to a cumulative 90% particle diameter (D90) of 0.3 or more, a pore volume of 0.5 ml / g to 8 ml / g, a mode of a pore radius of 5 nm to 50 nm, and a specific surface area of 50 m2 / g to 400 m2 / g, the arithmetic mean value of the'test force at the time of confirmation of sample breakage 'determined according to the method specified in JIS Z8844 is 1.0 * 101 mN to 2.0 * 101 N (inclusive), the number of particles having a circularity of 0.7 or less is 20 or less, and the alkali metal content is 50 ppm or less.

The invention provides a method of chemically mechanically polishing a substrate, especially a substrate comprising boron-doped polysilicon, comprising contacting the substrate with a chemical-mechanical polishing composition comprising an abrasive selected from α-alumina, silica, and a combination thereof, ferric ion, an organic acid, or a combination thereof, and water. The invention also provides a chemical-mechanical polishing composition comprising α-alumina, a nitrogen-containing compound selected from a zwitterionic homopolymer at, a monomeric ammonium salt, and a combination thereof, an organic acid, and water. The invention further provides a chemical-mechanical polishing composition comprising silica, an organic acid, ferric ion, and water.

This invention provides a chemical mechanical polishing composition comprising: (a) a silica abrasive, (b) a surfactant, (c) an iron cation, (d) optionally a ligand, and (e) water, wherein the silica abrasive has a negative zeta potential in the chemical mechanical polishing composition. This invention also provides a method for chemically mechanically polishing a substrate, particularly a substrate comprising a carbon-based film, using the said composition.

Provided is an analytical method for measuring porosity in a weld cross-section, which is capable of suppressing variations in measurement results and obtaining quality results at a higher level. An analysis method for measuring porosity in a weld cross-section includes: an analysis TP manufacturing step of manufacturing an analysis TP (test piece) by subjecting a weld cross-section exposed by cutting a welded portion of a workpiece welded with a non-ferrous material to resin filling, and then polishing the weld cross-section with a polishing agent; an image input step in which a weld cross-section image obtained by capturing an image of a weld cross-section in the analysis TP is input to the analysis program; a pre-processing step for generating a mask image of the weld seam in the weld seam cross-sectional image using pre-acquired seam shape learning data; a post-processing step for generating a processed image in which the weld cross-section image and the mask image are superimposed and a portion that is not a weld is cut off; and a porosity measurement step for measuring the porosity of the weld seam on the basis of the processed image, the learning data being a combination of a plurality of weld seam cross-sectional images obtained by polishing the weld seam cross-section with a plurality of polishing agents and the resolution of the weld seam cross-sectional images.

This invention discloses a tooth grinding machine for wide-width band saw blade processing, including limiting plates and a workpiece processing mechanism. A saw blade body portion is inserted between two limiting plates, and each limiting plate has an inclined hole on its side. The inclined hole faces opposite directions to the tooth grooves on the saw blade body. The bottom end of the limiting plate extends into the material collection hopper. The advantages of this invention are: during the feeding process, the abrasive is also driven to rotate by the processing actuator, which can fully fill the gap formed between the annular surface in the middle of the processing actuator and the inner wall of the tooth groove, thus achieving the effect of abrasive grinding the inner wall of the tooth groove. The abrasive is fed in a state of simultaneous movement and rotation, resulting in a finer and smoother grinding surface; it fully utilizes the abrasive, reducing the number of times it needs to be added; and it can automatically adjust and position the tooth grooves on the saw blade body, allowing for rapid adjustment to the grinding state.

A chemical mechanical polishing (“CMP”) slurry is designed and configured for reducing polishing pad wear rate. The CMP slurry includes at least one oxidizer, a primary abrasive, a solvent, and a secondary abrasive. The secondary abrasive is a mixture of chemicals that yield a stable suspension of the CMP slurry. The CMP slurry for reducing polishing pad wear rate is designed and configured to provide a pad wear rate of less than 2.0% at a 1-hour polishing time, and / or a pad wear rate of less than 10.0% at a 4-hour polishing time.

The invention provides a chemical mechanical polishing solution for metal and metal nitride substrates comprising: a solvent; at least one abrasive with a Mohs hardness of at least 8; and at least one soluble metal oxide anion wherein the metal is selected from vanadium, niobium, tantalum, chromium, molybdenum and tungsten.

The application discloses a high-speed tungsten plug chemical mechanical polishing solution and application thereof. The tungsten plug chemical mechanical polishing solution comprises the following components in mass percentage: 2-20% of abrasive, 0.5-5% of oxidant, 0.01-0.5% of tungsten catalyst, 0.01-0.05% of rate accelerator, and the balance is deionized water. The tungsten plug chemical mechanical polishing solution has the characteristics of fast polishing rate, good surface quality and excellent stability.

The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive, (b) a polymer comprising a sulfonic acid monomeric unit, and (c) water, wherein the polishing composition has a pH of about 1 to about 7 and the silica abrasive has a zeta potential of about -10 mV to about -50 mV in the polishing composition. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising silicon carbide, using said composition.

Disclosed are a polishing slurry and a method of manufacturing a semiconductor device using the same, the polishing slurry including a first histidine derivative including an abrasive, an oxidizing agent, and a substituted or unsubstituted cyclic imide group.

A method for manufacturing a display device may include providing a support layer and a display panel on a digitizer. The display panel may include a folding region that is folded with reference to a folding axis extending in a first direction. The providing of the support layer may include forming an opening penetrating the preliminary support layer by providing a laser or an abrasive agent to one surface of the preliminary support layer. A first width of the opening on the one surface in a second direction and a second width of the opening on another surface in a second direction may be different from each other, and the second direction is perpendicular to the first direction.

The application relates to the technical field of grinding processing, and discloses a grinding processing method and system based on surface eccentricity of a grinding workpiece, a terminal and a medium.The grinding processing method based on surface eccentricity of a grinding workpiece comprises the following steps: acquiring the appearance information of a grinding workpiece under different grinding agents; processing the appearance information to obtain surface eccentricity information of the grinding workpiece; obtaining correlation information affecting the surface eccentricity of the grinding workpiece according to the surface eccentricity information, wherein the correlation information is the relationship between the hardness of the workpiece and the hardness of the abrasive particles of the grinding agent; and determining the target grinding agent corresponding to the target workpiece according to the correlation information, so as to adopt the target grinding agent to perform grinding processing on the target workpiece. The application can adjust the matching relationship between the hardness of the abrasive particles and the hardness of the workpiece based on the hardness relationship, realize the adjustment of the surface eccentricity parameter of the target workpiece, and further improve the grinding effect of the workpiece.

Aspects of the invention are directed to oral care compositions and, particularly, oral care compositions providing a whitening effect. In accordance with an aspect of the invention, provided is an oral care composition having a whitening agent comprising a peroxide source; an abrasive comprising a silica abrasive; and a solvent system.

The invention provides a chemical mechanical polishing composition comprising: (a) an abrasive selected from ceria abrasive, zirconia abrasive, and combinations thereof; (b) a self-stoppage agent selected from compounds of Formula (I); (c) optionally, a non-ionic polymer; (d) a cationic monomeric compound; and (e) water, wherein the pH of the polishing composition is from about 5.5 to about 8. The invention also provides a method of chemically mechanically polishing a substrate, especially a substrate comprising silicon oxide and optionally polysilicon, using the composition.

The invention belongs to the field of cosmetics, particularly relates to the field of A61K8 / 03, and more particularly relates to multi-effect nursing toothpaste with cream texture and a preparation method thereof. The multi-effect nursing toothpaste with the cream texture is prepared from the following raw materials: a phase A, a phase B and a phase C, wherein the mass ratio of the phase A to the phase B to the phase C is (20-50): (30-50): (0.0001-1); wherein the phase A comprises water and a humectant, and the phase B comprises a thickening agent, a foaming agent, an aromatic, an antibacterial agent, a sweetening agent, an antioxidant, a friction agent and functional inorganic salt; the thickening agent comprises super micro-crosslinked polyquaternium-22, and the molecular weight of the thickening agent is greater than 1000000; the functional inorganic salt at least comprises sodium monofluorophosphate; the C phase includes a colorant. The multi-effect nursing toothpaste with the cream texture, provided by the invention, not only can realize the technical effects of rapid sterilization and long-acting bacteriostasis, but also can repair enamel, improve gingival bleeding and relieve tooth sensitivity, and has more effects and higher cost performance compared with similar products in the market.

Synthesis of guanidinium-based polymers is disclosed. Chemical Mechanical Planarization (CMP) slurries comprise abrasives; activator; oxidizing agent; additive comprising guanidinium-based polymers; and water. The use of the synthesized guanidinium-based polymers in the CMP slurries reduces dishing and erosion in highly selective tungsten slurries.

The invention discloses an automobile windshield washer fluid capable of removing an oil film based on a nanometer grinding composite technology and a preparation method of the automobile windshield washer fluid. The preparation method comprises the following steps: S1, stirring and dispersing a water-phase thickening agent and an inorganic gel into part of deionized water, and fully hydrating to form a uniform basic gel solution which is marked as a water phase A; s2, performing high-shear pre-dispersion on a nano-scale or micron-scale grinding agent and a part of alcohol antifreezing agent to form uniform slurry, and then adding the slurry, a nonionic surfactant and a glycol ether solvent into the water phase A together to obtain an active phase B; s3, adding the remaining antifreezing agent and deionized water into the active phase B, adjusting the pH value to 7.0-8.5, and fixing the volume to obtain the automobile windshield washer fluid with the oil film removed. According to the automobile windshield washer fluid capable of removing the oil film, cleaning can be rapidly and thoroughly achieved through the chemical-physical-solvent triple synergistic effect, and the cleaning efficiency is far higher than that of common windshield washer fluid; meanwhile, the functions of cleaning, oil film removal, freezing prevention, fog prevention and maintenance are integrated, and diversified requirements can be met.

A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water-based liquid carrier, abrasive particles dispersed in the liquid carrier, an iron-containing accelerator, and a cationic polymer having an amino acid monomer. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above-described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Provided is a polishing agent which maintains the polishing speed of a silicon oxide film, achieves a high selectivity between the silicon oxide film and a barrier film, and has excellent storage stability. The polishing agent includes abrasive grains, an anionic polymer, an acidic compound selected from a phosphoric acid compound and an organic acid compound, and water, the anionic polymer being a copolymer including a hydrophobic monomer and an anionic monomer, the anionic polymer having an acid value of 20-400 mgKOH / g, the hydrophobic monomer having a partition coefficient of 0-4, and the anionic monomer having a partition coefficient of 0-4. The anionic monomer contains at least one selected from the group consisting of unsaturated monocarboxylic acids and salts thereof, and when the acidic compound having the highest molar concentration among the acidic compounds is defined as a first acidic compound, the pKa of the first acidic compound and the pH of the polishing agent satisfy the relationship represented by formula (1). | pKa-pH | < = 1.5 (1)

The present invention relates to an automated system (100) and an automated method (300) for controlled surface removal of defects on cast metal anodes (110) prior to electrorefining, including anodes of copper, nickel, lead, or other electrochemically refinable metals. The system comprises a detection system (130), a surface removal head (140), a surface removal module or tool (141), a relative displacement system (150), a control unit (170), and optionally, a collection or extraction system (160). The control unit (170) obtains surface information from the anode, determines a surface conditioning zone (120), commands general surface removal, and subsequently determines localized zones with surface defects or residual contaminants (121) for selective surface removal.The surface removal module or tool (141) may comprise a mechanical tool, an abrasive tool, a pressure water nozzle, a very high pressure water nozzle, or a combination thereof, including cleaning with water without added abrasive. In one embodiment, the system integrates milling or conditioning of upper lugs (112) to prepare electrical contact surfaces prior to electrorefining.

A non-aqueous non-oily tooth powder containing bioactive glass, comprising, in weight percentage, the following raw materials: abrasive agent: 40%-95%; bioactive glass: 0.3%-50%; foaming agent: 1%-10%; fragrance: 0%-10%; and pigment: 0%-5%. The tooth powder contains neither water nor an oily carrier, and thus not only maintains a high concentration of the abrasive agent to provide strong cleaning and decontamination capabilities, but also does not affect the performance of the bioactive glass, enabling the tooth powder to have good efficacy in occluding dentinal tubules and repairing tooth enamel. The method for preparing the tooth powder is simple and convenient, requiring only the mixing of the various raw materials in dry powder form.