The invention provides a method for 
polishing one or more 
layers of a multi-layer substrate that includes a first 
metal layer and a second layer comprising (i) contacting the first 
metal layer with a 
polishing system comprising a liquid carrier, at least one 
oxidizing agent, at least one 
polishing additive that increases the rate at which the 
system polishes at least one layer of the substrate, wherein the polishing additive is selected from the group consisting of pyrophosphates, condensed phosphates, phosphonic acids and salts thereof, amines, amino alcohols, amides, imines, imino acids, nitriles, nitros, thiols thioesters, thioethers, carbothiolic acids, carbothionic acids, thiocarboxylic acids, thiosalicylic acids, and mixtures thereof, and a polishing pad and / or an 
abrasive, and (ii) polishing the first 
metal layer with the 
system until at least a portion of the first metal layer is removed from the substrate.