The invention provides a method for
polishing one or more
layers of a multi-layer substrate that includes a first
metal layer and a second layer comprising (i) contacting the first
metal layer with a
polishing system comprising a liquid carrier, at least one
oxidizing agent, at least one
polishing additive that increases the rate at which the
system polishes at least one layer of the substrate, wherein the polishing additive is selected from the group consisting of pyrophosphates, condensed phosphates, phosphonic acids and salts thereof, amines, amino alcohols, amides, imines, imino acids, nitriles, nitros, thiols thioesters, thioethers, carbothiolic acids, carbothionic acids, thiocarboxylic acids, thiosalicylic acids, and mixtures thereof, and a polishing pad and / or an
abrasive, and (ii) polishing the first
metal layer with the
system until at least a portion of the first metal layer is removed from the substrate.