Method for grinding soft crisp functional crystal

A grinding and functional technology, applied in machine tools, metal processing equipment, grinding/polishing equipment, etc. suitable for grinding workpiece planes, which can solve the residual stress of plastic deformation, micro-scratch, surface soft and brittle functional crystal embedding, etc. problem to avoid scratches

Inactive Publication Date: 2009-03-04
DALIAN UNIV OF TECH
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Problems solved by technology

[0003] The purpose of the present invention is to provide a soft and brittle functional crystal grinding method to solve surface/subsurface damage problems such as surface abrasive embedding, micro scratches, pits, chipping, plastic deformation and residual str

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  • Method for grinding soft crisp functional crystal

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[0011] The specific embodiments of the present invention will be described in detail below in conjunction with the technical solutions and accompanying drawings.

[0012] Adopt VG401MKII end face ultra-precision grinding machine. with Cd 0.96 Zn 0.04 Te(110) is used as a soft and brittle functional crystal sample, the sample size is 10mm×10mm×1.5mm, and the infrared light transmittance is >60%. The workpiece is fixed with a vacuum ceramic suction cup, and the diameter of the small hole of the vacuum suction cup is 0.2mm. First, use #3000 diamond grinding wheel for rough grinding, the grinding wheel spindle speed is 2000r / min, the grinding feed rate is 15μm / min, the workpiece speed is 200r / min, the flow rate of deionized water is 300ml / min, and the duration is 10min. Subsurface damaged layer. Then carry out precision grinding, the grinding wheel spindle speed is 1500r / min, the grinding feed speed is 5μm / min, the workpiece speed is 150r / min, the deionized water flow rate is ...

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Abstract

A soft brittle functional crystal grinding and machining method belongs to the technical field of soft brittle functional crystal machining, and particularly relates to a soft brittle functional crystal ultra-precision grinding and machining method for a semiconductor and a photoelectric crystal. The method is characterized in that a micro-powder diamond segmental variable speed feed and a soft abrasion grinding wheel chemical mechanical grinding method are adopted to machine the soft brittle function crystal. During the crude grinding period and the accurate grinding period, the feeding speed of the grinding wheel is firstly high and then low. A grinding fluid is de-ionized water. A soft abrasive agent grinding wheel is adopted to conduct the chemical mechanical grinding. The soft abrasive agent is a macromolecule polymer or waterproof resin. A filler is NaHCO3 or a refined naphthalene foaming agent. The chemical and mechanical grinding fluid is adopted as a reaction fluid and a cooling fluid. The grinding fluid mainly contains lactic acid, acetic acid and de-ionized water. The pH value of the grinding fluid is 2-4. The invention has the advantages of high grinding and machining efficiency, low machining cost and high surface precision. In addition, no surface/sub-surface damage is caused to the surface of a workpiece, such as small scratches, embedment of free abrasive agent, plastic deformation, residual stress, and the like.

Description

technical field [0001] The invention belongs to the technical field of processing soft and brittle functional crystals, in particular to a grinding method for soft and brittle crystals of semiconductors and photoelectric crystals. Background technique [0002] With the rapid development of semiconductor and optoelectronic technology, the emerging soft and brittle functional crystals put forward more and more stringent requirements for processing accuracy and surface quality. The soft and brittle functional crystal processing surface cannot have free abrasives embedded, and has very high surface integrity and processing quality. Surface and sub-surface damage such as micro-scratches, micro-cracks, edge chipping, pits, plastic deformation, residual stress, etc. must not exist on the surface, and the surface roughness is also required to reach the nanometer level, which requires the processed surface to be ultra-smooth and non-damaging. . At present, the traditional grinding-...

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Application Information

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IPC IPC(8): B24B7/20B24D3/32B24D9/00C09G1/04
Inventor 张振宇郭东明高航康仁科金洙吉
Owner DALIAN UNIV OF TECH
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