Anionic abrasive particles treated with positively charged polyelectrolytes for cmp

A polyelectrolyte, electropositive technology for use in the field of polishing compositions

Inactive Publication Date: 2005-06-22
CMC MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In fact, many problems can occur in semiconductor manufacturing if the process steps are not done on a sufficiently planarized wafer surface

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] This embodiment illustrates a method for manufacturing the polyelectrolyte-coated abrasive particles exhibiting colloidal stability according to the present invention.

[0034] The poly(dimethylamine-co-epichlorohydrin-co-ethylenediamine) solution (50% by weight, MW~75,000) was dissolved in deionized water, and the pH was adjusted with concentrated sulfuric acid until the silica was added. The pH is 4.5. The mixture was then blended at a speed of 20,000 rpm. During the blending, a suspension of colloidal silica particles (50% by weight, 120 nm, Zeta (ζ) potential at pH 4.5 from -15 to -20 mV) was slowly added to the mixture over a period of 6 minutes. in. This mixture was blended for an additional minute to produce a final composition containing 12% by weight silica and 2.5% by weight polyelectrolyte. The average particle diameter of the obtained polyelectrolyte-coated silica particles was 132 nm. The zeta (ζ) potential measured at pH 4.5 is +28 mV.

[0035] The polyelectro...

Embodiment 2

[0038] This example shows that the abrasive particles coated with polyelectrolyte will not agglomerate over time.

[0039] 0.625% by weight of polyethylenimine was dissolved in deionized water at pH 7, and the resulting solution was used to treat the fumed silica dispersion (5% by weight, the zeta potential of pH 7 was -20 mV, 156 nm ). High shear is applied to the mixture for about 20 minutes to produce a colloidal stable composition with a zeta (ζ) potential of +15 millivolts at pH 7. The average particle size of the obtained abrasive composition was 158 nm. After 27 days, the average particle size was 167 nm.

[0040] This example proves that the abrasive particles coated with the positively charged polyelectrolyte are highly stable.

Embodiment 3

[0042] This example demonstrates that abrasive particles with a positive zeta (ζ) potential can convert charges when contacted with a charge reversing agent, and are covered with a positively charged polyelectrolyte to produce a stable dispersion of abrasive particles coated with polyelectrolyte.

[0043] A fumed alumina dispersion (3% by weight, zeta potential = +30 to +40 mV at pH 6) was mixed with tartaric acid (1.25% by weight). The zeta (ζ) potential of the obtained abrasive particle dispersion at pH 7 was -15 millivolts, so it was proved that an abrasive having a positive zeta (ζ) potential can switch charges by contacting the abrasive with a charge reversing agent.

[0044] Similarly, the same type of baking alumina dispersion (3% by weight, pH 6 Zeta (ζ) potential = +) was treated with an aqueous solution containing tartaric acid (100 ppm) and polyethylenimine (0.125% by weight). 30 to +40 millivolts) and apply high shear for 20 minutes. The stability of the obtained polye...

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Abstract

The invention provides chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 or more, wherein the abrasive comprises particles that are electrostatically associated with the positively charged polyelectrolyte.

Description

Technical field [0001] The present invention relates to a polishing composition containing a polyelectrolyte-coated abrasive, and a method of use thereof in chemical mechanical polishing (CMP). Background technique [0002] Combinations and methods for planarizing or polishing the surface of a substrate are well known in the art. The polishing composition (also known as polishing slurry) typically contains an abrasive substance in an aqueous solution and can be applied to the surface by contacting the surface with a polishing pad saturated with the polishing composition. Typical abrasive materials include silicon dioxide, cerium oxide, aluminum oxide, zirconium oxide, and tin oxide. For example, US Patent No. 5,527,423 describes a method for chemically mechanical polishing a metal layer by contacting the surface with a polishing slurry, wherein the polishing slurry contains high-purity fine metal oxide particles in a water-soluble medium. Alternatively, the abrasive substance is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04C09G1/02C09K3/14H01L21/304
CPCB24B37/044B24B37/046C09G1/02C09K3/1436C09K3/1454C09K3/14
Inventor 艾萨克·K·彻里安菲利普·W·卡特杰弗里·P·张伯伦凯文·J·莫根伯格戴维·W·博尔德里奇
Owner CMC MATERIALS INC
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