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460results about How to "Reduce size" patented technology

A method and device for constructing a cross-platform software operating environment

Disclosed are a method and an apparatus for constructing a cross-platform software running environment. The method comprises: establishing an entrance of a cross-platform software running environment with a binary boot file; starting a decompression module, and executing a decompression operation on a core compilation and interpretation and graphics environment module; executing a decompression operation on a cross-platform visual software installation module; invoking the decompression module, and executing a decompression operation on a platform independent module and a multi-platform sharing module; executing a decompression operation on an extended compilation and interpretation and graphics environment module; and setting an environment variable of software installation package running according to difference among different system platforms, starting a visual software installation package interface, and executing visual installation of a cross-platform software installation package according to the visual software installation package interface. In the present invention, the use of a cross-platform software installation package facilitates reduction of the size of the software installation package and reduction of the capacity demand for a device storage module.
Owner:ZTE CORP

Symbolic analysis of electrical circuits for application in telecommunications

InactiveUS20050027491A1Reduce sizeEasy to interpretAmplifier modifications to reduce noise influenceDigital computer detailsTelecommunication applicationLoading coil
Analysis of an electrical circuit is performed using a computer program product (60) and a method. In accordance with the program and the method, a electrical circuit analyzer generates an admittance matrix for an electrical circuit which is being analyzed. The admittance matrix includes symbolic expressions rather than numerical expressions for at least some components of the electrical circuit. The electrical circuit analyzer linearly and algebraically solves an equation system including the admittance matrix for analyzing at least a part of the electrical circuit. The electrical circuit analyzer uses symbolic computation to solve the equation system including the admittance matrix for analyzing at least a part of the electrical circuit. The equation system including the admittance matrix can be solved in various types of analyses, including (1) determining a transfer function between specified nodes of the electrical circuit; and (2) optimizing a component of the electrical circuit. The electrical circuit analyzer sets up the admittance matrix Y by following a set of “rules”. Special rules are provided for certain telecommunications components, such as multi-winded transformers, loading coils, line-drivers, analogue cables, and filters. Inclusion of these special rules for telecommunications components enables the electrical circuit analyzer to be more applicable to telecommunications circuits than conventional analyzers. In accordance with a block/subcircuit matrix approach, an overall circuit is divided into plural subcircuits. In such case, the admittance matrix can comprise separate admittance blocks for each of plural subcircuits. Connectivity blocks which represent connectivity between the plural subcircuits are situated on a cross diagonal of the admittance matrix. The admittance matrix can then be conveniently utilized for analyzing at least a part of the electrical circuit. Advantages of this approach include recursively reducing the size of the matrices including the admittance matrix as subcircuits are added to the admittance matrix.
Owner:TELEFON AB LM ERICSSON (PUBL)

Electronic device and production method thereof

An object is to provide an electronic device of a multilayer structure with high density and high reliability that can be reduced in size while incorporating an electronic component therein, and further provide a production method for easily producing such an electronic device. An electronic device of the present invention includes wiring layers and electrically insulating layers stacked on a core board and establishes predetermined electrical conduction between the wiring layers through upper-lower side conducting vias provided in the electrically insulating layers. An electronic component incorporating layer formed by directly forming on a lower layer an insulating resin layer having a cutout portion for receiving an electronic component therein and upper-lower side conducting vias and by incorporating the electronic component in the cutout portion is provided at least between one of the wiring layers and one of the electrically insulating layers and/or between the core board and the electrically insulating layer. At least the uppermost-layer electronic component incorporating layer of electronic component incorporating layers has a metal frame body surrounding the electronic component and the upper-lower side conducting vias, and a metal cap having a flange portion fixed to the metal frame body of the uppermost-layer electronic component incorporating layer is provided.
Owner:DAI NIPPON PRINTING CO LTD
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