This utility model relates to the field of installation structure technology and discloses a
mobile phone back heat dissipation fin installation structure, including a heat-conducting back plate, heat dissipation fins fixedly installed on the top of the heat-conducting back plate, a magnetic installation mechanism inside the heat-conducting back plate, and limiting mechanisms on both the front and back of the heat-conducting back plate. This
mobile phone back heat dissipation fin installation structure, through the positioning of the positioning blocks and the tightening of the mounting bolts, allows the installation of curved pads on the front and back of the heat-conducting back plate. The combination of the curved pads and friction rubber pads limits the position of the heat-conducting back plate, preventing it from sliding up and down when playing games on a horizontal screen. The high-elasticity
silicone rubber and the wavy texture increase friction with the phone frame, while the single-sided
adhesive silicone pad, a combination of a flexible
silicone substrate and a pressure-sensitive
adhesive layer, separates fingers from the curved pads to prevent discomfort, improving user comfort.