High-precision compound polishing solution and preparation method thereof

Abstract

The invention provides a high-precision compound polishing solution. The high-precision compound polishing solution is prepared from components in percentage by weight as follows: 0.1%-50% of an abrasive, 0.01%-20% of a dispersant, 0.01%-15% of a suspending agent, 0.1%-5% of a corrosion inhibitor and the balance of a deionized water solvent. The polishing solution mainly adopts mechanical removal and can realize high-speed polishing of base materials; the preparation method has the advantages that the production efficiency is high, the continuity is high, the cost is low, the product fineness is high and the like and has no requirement for the particle size distribution and uniformity of raw materials for the abrasive, the selection range of the raw materials for the abrasive is broadened, and all powder materials meeting the average particle size requirement can be applied.

Description

technical field [0001] The invention relates to the technical field of ultra-precision polishing, in particular to a high-precision composite polishing liquid and a preparation method thereof. Background technique [0002] Different from the traditional pure mechanical or pure chemical polishing method, chemical mechanical polishing (CMP) avoids the surface damage caused by pure mechanical polishing and the slow polishing speed caused by pure chemical polishing through the comprehensive action of chemical and mechanical , surface flatness and poor polishing consistency, so it is widely used in ultra-precision polishing of integrated circuits (IC), ultra-large-scale integrated circuits (ULSI), computer hard disks and optical glass surfaces. In recent years, it has gradually been applied to mobile phones and tablets. The surface of metal parts such as shells and frames of electronic products is finely polished. [0003] Polishing fluid is one of the key elements of CMP, and t...

AI Technical Summary

Problems solved by technology

Abrasives with different properties in the composite polishing liquid can have different effects on the workpiece, which is equivalent to polishing the same workpiece with a single polishing liquid containing abrasives with different properties, thus greatly improving the polishing efficiency. Due to the micro-nano There is a serious agglomeration phenomenon in the high-grade abrasive itself. How to ensure that the multi-component abrasive is evenly dispersed in the polishing liquid is the difficulty in obtaining a high-quality composite polishing liquid. It is necessary to ensure the uniform dispersion of the abrasive particles and ensure The uniform dispersion of each abrasive component is difficult to achieve by using the stirring dispersion used in the above patent

[0005] At present, the polishing liquid used in high-precision polishing has higher and higher requirements on the particle size, shape and particle size distribution uniformity of the abrasive powder. The smaller the abrasive particle size, the narrower the particle size distribution and the better the uniformity, the better To achieve global planarization and even mirror effect on the surface of the workpiece, due to the increasingly high performance requirements for abrasive powder, it is necessary to purchase high-quality powder materials, which not only increases the purchase cost of abrasives, but also limits the abrasives. The procurement channels of raw materials need to be further improved