High-precision compound polishing solution and preparation method thereof

A compound polishing and high-precision technology, applied in the field of ultra-precision polishing, can solve the problems of limited procurement channels of abrasive raw materials, increase the cost of abrasive procurement, etc., and achieve the effects of low cost, high yield and strong continuity

Inactive Publication Date: 2017-03-08
惠州市米特仑科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Abrasives with different properties in the composite polishing liquid can have different effects on the workpiece, which is equivalent to polishing the same workpiece with a single polishing liquid containing abrasives with different properties, thus greatly improving the polishing efficiency. Due to the micro-nano There is a serious agglomeration phenomenon in the high-grade abrasive itself. How to ensure that the multi-component abrasive is evenly dispersed in the polishing liquid is the difficulty in obtaining a high-quality composite polishing liquid. It is necessary to ensure the uniform dispersion of the abrasive particles and ensure The uniform dispersion of each abrasive component is difficult to achieve by using the stirr...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Silicon oxide (D 10 =2um,D 50 =3um,D 90 =10um), alumina (D 10 =1.8um, D 50 =3um,D 90 =7um) was mixed into grinding agent according to the ratio of 1:1 by mass percentage, and added to the sand mill with deionized water according to the mass ratio of 0.5:1, after stirring evenly, the grinding medium was 0.2mm zirconia ball, 7000r / min Grinding and dispersing at a rotational speed for 2 hours, the particle size distribution of the slurry obtained is D 10 =1.5um, D 50 =2.6um, D 90 =3.5um, add a dispersant made of sodium hexametaphosphate and sodium lauryl sulfate, the amount of dispersant added is 1% of the mass of the abrasive; put the ground and dispersed slurry into a high-speed mixer, and the speed is 800r / min, first add the suspending agent made of hydroxypropyl methylcellulose and xanthan gum at a mass ratio of 1:0.5 according to the mass of the abrasive, and then add borate and mercapto based on 2% of the mass of the abrasive The corrosion inhibitor made of ...

Embodiment 2

[0034] Cerium oxide (D 10 = 0.8um, D 50 = 1um, D 90 =12um), alumina (D 10 =0.6um, D 50 = 1um, D 90 =3um), zirconia (D 10 =0.5um, D 50 = 1um, D 90 =6um) was mixed into an abrasive at a ratio of 1:1:1 by mass percentage, and added to a sand mill with deionized water at a mass ratio of 0.2:1. After stirring evenly, the grinding medium was 0.2mm zirconia balls, Grinding and dispersing at 7500r / min for 3 hours, the particle size distribution of the slurry obtained is D 10 =0.5um, D 50 = 0.8um, D 90=1.2um, add a dispersant made of sodium tripolyphosphate, sodium hexametaphosphate and triethylhexylphosphoric acid, the amount of dispersant added is 2% of the mass of the abrasive; add the ground and dispersed slurry into a high-speed mixer , the rotating speed is 1000r / min, first add the suspending agent made of hydroxyethyl cellulose, xanthan gum and soybean protein glue according to the mass ratio of 1:0.8 according to 3% of the mass of the abrasive, and then add the suspen...

Embodiment 3

[0036] Magnesium oxide (D 10 =0.2um, D 50 =0.5um, D 90 =2um), titanium oxide (D 10 = 0.18um, D 50 =0.5um, D 90 =3um) was mixed into an abrasive at a ratio of 1:1 by mass percentage, and added to a sand mill with deionized water at a mass ratio of 0.6:1. After stirring evenly, the grinding medium was 0.2mm zirconia balls, 8000r / Grinding and dispersing at min speed for 2.5 hours, the particle size distribution of the obtained polishing liquid slurry is D 10 =0.16um, D 50 = 0.3um, D 90 =0.5um, add a dispersant made of sodium pyrophosphate, methyl amyl alcohol and fatty acid polyethylene glycol ester, the amount of dispersant added is 0.5% of the quality of the grinding agent; add the slurry that has been ground and dispersed into a high-speed mixer, The rotating speed is 1000r / min, first add the suspending agent made of methyl cellulose, hydroxypropyl methylcellulose and xanthan gum at a mass ratio of 1:1 according to the mass of the abrasive at 6%, and then add 4% of the...

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PUM

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Abstract

The invention provides a high-precision compound polishing solution. The high-precision compound polishing solution is prepared from components in percentage by weight as follows: 0.1%-50% of an abrasive, 0.01%-20% of a dispersant, 0.01%-15% of a suspending agent, 0.1%-5% of a corrosion inhibitor and the balance of a deionized water solvent. The polishing solution mainly adopts mechanical removal and can realize high-speed polishing of base materials; the preparation method has the advantages that the production efficiency is high, the continuity is high, the cost is low, the product fineness is high and the like and has no requirement for the particle size distribution and uniformity of raw materials for the abrasive, the selection range of the raw materials for the abrasive is broadened, and all powder materials meeting the average particle size requirement can be applied.

Description

technical field [0001] The invention relates to the technical field of ultra-precision polishing, in particular to a high-precision composite polishing liquid and a preparation method thereof. Background technique [0002] Different from the traditional pure mechanical or pure chemical polishing method, chemical mechanical polishing (CMP) avoids the surface damage caused by pure mechanical polishing and the slow polishing speed caused by pure chemical polishing through the comprehensive action of chemical and mechanical , surface flatness and poor polishing consistency, so it is widely used in ultra-precision polishing of integrated circuits (IC), ultra-large-scale integrated circuits (ULSI), computer hard disks and optical glass surfaces. In recent years, it has gradually been applied to mobile phones and tablets. The surface of metal parts such as shells and frames of electronic products is finely polished. [0003] Polishing fluid is one of the key elements of CMP, and t...

Claims

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Application Information

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IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 阳震陈彬
Owner 惠州市米特仑科技有限公司
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