1123results about How to "High chemical activity" patented technology

The invention provides a method for manufacturing a circuit board layer-adding structure. Manufacture of a fine circuit with the width smaller than 50 micrometers is achieved, use of insulation materials with high cost is avoided, so that the process cost of a substrate is reduced, and therefore cost of the substrate is reduced. The method comprises the following steps that (1) an inner-layer circuit is manufactured; (2) copper foil and prepreg are pressed and solidified; (3) laser drilling is conducted; (4) smear removal is conducted; (5) surface copper is removed; (6) plasma activating treatment is conducted on the surface of a circuit board; (7) electroless copper plating is conducted; (8) photoetching is conducted; (9) electroplating is conducted; (10) membrane stripping is conducted; (11) flash etching is conduced. According to the method, generally-used medium material PP is adopted; through the improvement of the SAP technical method, the chemical activity of the surface of the PP is improved, electroless copper plating is directly conducted on the surface of the PP, the binding force of an electroless copper plating layer is improved, so that the SAP machining requirements of the fine circuit are satisfied, and meanwhile the technical cost of the substrate is reduced to a great extent.