The application discloses an intermediate
processing liquid for an
electroless nickel immersion gold (ENIG)
production line and a chemical gold preparation method. The intermediate
processing liquid is applied between the
electroless nickel plating and immersion gold processes, and comprises (a) a pH buffer and a
metal ion complexing agent: a total concentration of 50-150 g / L; (b) an adsorptive
corrosion inhibitor: a concentration of 0.5-5.0 g / L; (c) a low-foam non-ionic surfactant: a concentration of 0.01-10 g / L; (d) an auxiliary
antioxidant: a concentration of 0.5-30 g / L; (e) a dissolving agent: a concentration of 1-50 ml / L; (f) a pH
regulator: an appropriate amount, which is added to maintain the pH value of the intermediate
processing liquid at 4.0-6.5; and (g) deionized water: a balance, so that the concentrations of the above components reach the set target values; and the intermediate processing liquid has a design use temperature of 20-45 DEG C. The intermediate processing liquid removes residual
nickel ions on the board surface and in micropores through strong complex cleaning, and blocks the
pollution to the subsequent gold tank; meanwhile, the
preferential adsorption of the
corrosion inhibitor molecules at the
nickel layer grain boundaries forms a controllable molecular-level protective film, effectively adjusts the immersion gold replacement reaction
kinetics, and prevents the occurrence of
intergranular corrosion (black plate).