The invention relates to the technical field of
high polymer materials, and discloses a temperature latent curing agent and a preparation method thereof.The curing agent is prepared from a
polyamine compound and a polythiol compound through a
proton transfer reaction at the temperature of 15-30 DEG C. In the reaction, the
molar ratio of active amine
hydrogen to
thiol groups is 1: (0.9-1.1), and a stable
ion pair structure is formed. The invention also discloses a single-component
epoxy curing
system containing the curing agent,
epoxy resin and a
dielectric constant jump additive. The
system is endowed with excellent storage stability by utilizing an
ion pair structure; meanwhile, after heating, the compatibility of the
dielectric constant jump additive and the
epoxy resin is changed, and the
dielectric constant of the
system is triggered to rise, so that
ion pair constraint is weakened, and the curing agent is dissociated and rapidly cured at a
moderate temperature. According to the technology, the contradiction between latency and curing conditions is solved, and a cured product has good thermal and mechanical properties.