This application provides a purification device, relating to the field of
wafer manufacturing equipment technology, comprising: a feeding hopper, a dust removal platform, and a dust removal chamber arranged sequentially. The dust removal platform is connected to a
conveyor belt. A
robotic arm is installed between the feeding hopper and the dust removal platform. The
robotic arm transfers products from the feeding hopper to the dust removal platform. The
conveyor belt transports the dust removal platform and products to the bottom of the dust removal chamber. The dust removal chamber is equipped with an ultrasonic dust removal head and a
dust collector for creating a positive and negative pressure closed-loop
airflow environment within the dust removal chamber to remove dust from the products. The feeding hopper receives products from the previous production process, the
robotic arm transfers the products from the feeding hopper to the dust removal platform, and then the
conveyor belt transports the dust removal platform and products to the bottom of the dust removal chamber. The positive and negative pressure closed-loop
airflow environment within the dust removal chamber, combined with ultrasonic non-contact dust removal, effectively cleans dust and other
foreign matter from the products, enhancing cleaning efficiency and improving product yield.