7138results about "Detergent mixture composition preparation" patented technology

Surfactant systems, using microfibrous cellulose to suspend particulates therein, are described. Methods of making these systems are also described.

The use to e of tetrafluoropropenes, particularly (HFO-1234) in a variety of applications, including refrigeration equipment, is disclosed. These materials are generally useful as refrigerants for heating and cooling, as blowing agents, as aerosol propellants, as solvent composition, and as fire extinguishing and suppressing agents.

The present invention relates to dilute fluoride solutions and methods for cleaning plasma etch residue from semiconductor substrates including such dilute solutions. The compositions and methods according to the invention can advantageously provide both cleaning efficiency and material compatibility.

The invention provides aqueous alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions typically contain (a) one or more metal ion-free bases at sufficient amounts to produce a pH of about 10-13 and one or more bath stabilizing agents having at least one pKa in the range of 10-13 to maintain this pH during use; (b) optionally, about 0.01% to about 5% by weight (expressed as % SiO2) of a water-soluble metal ion-free silicate; (c) optionally, about 0.01% to about 10% by weight of one or more chelating agents; (d) optionally, about 0.01% to about 80% by weight of one or more water-soluble organic co-solvents; and (e) optionally, about 0.01% to about 1% by weight of a water-soluble surfactant.

A composition for removal of chemical residues from metal or dielectric surfaces or for chemical mechanical polishing of a copper or aluminum surface is an aqueous solution with a pH between about 3.5 and about 7. The composition contains a monofunctional, difunctional or trifunctional organic acid and a buffering amount of a quaternary amine, ammonium hydroxide, hydroxylamine, hydroxylamine salt, hydrazine or hydrazine salt base. A method in accordance with the invention for removal of chemical residues from a metal or dielectric surface comprises contacting the metal or dielectric surface with the above composition for a time sufficient to remove the chemical residues. A method in accordance with the invention for chemical mechanical polishing of a copper or aluminum surface comprises applying the above composition to the copper or aluminum surface, and polishing the surface in the presence of the composition.

Alkaline aqueous cleaning compositions and processes for cleaning post-chemical mechanical polishing (CMP) residue, post-etch residue and/or contaminants from a microelectronic device having said residue and contaminants thereon. The alkaline aqueous cleaning compositions include amine, passivating agent, and water. The composition achieves highly efficacious cleaning of the residue and contaminant material from the microelectronic device while simultaneously passivating the metal interconnect material.

Etching solutions are disclosed for etching low-k dielectric layers on substrates, said solutions including effective proportions of an oxidant for oxidizing a low-k dielectric layer and effective proportions of an oxide etchant for removing oxides. It is possible to easily remove a low-k dielectric layer using such etching solutions by a single-stage treatment process.

The invention relates to a method for the removal of residues and contaminants from metal or dielectric surfaces and to a method for chemical mechanical polishing of a copper or aluminum surface. The methods of the invention include using an aqueous amidoxime complex agent. Optionally, the pH of the solution can be adjusted with an acid or base. The method includes applying the above composition to the copper or aluminum surface and polishing the surface in the presence of the composition.

A warewashing composition includes a cleaning agent having a detersive amount of a surfactant, an alkaline source in an amount effective to provide a use composition having a pH of at least about 8 when the use composition is measured at a solids concentration of about 0.5 wt %, and a corrosion inhibitor in an amount sufficient for reducing corrosion of glass when the warewashing composition is combined with water of dilution at a dilution ratio of at least about 20:1 water of dilution to detergent composition o form a use composition. The corrosion inhibitor includes a salt of calcium, magnesium, or a mixture of calcium and magnesium. The salt has a water solubility of less than about 0.5 wt % in water at about 20° C. and atmospheric pressure so that the salt precipitates to form a protective layer on a substrate in contact with the use composition.

Disclosed herein are blowing agents comprising fluorocarbons and/or hydrofluorocarbons useful in foamable compositions. Also disclosed are methods for forming a foam comprising the aforementioned blowing agents.

A stripping composition and a method of using the stripping composition to remove cured resins such as elastomeric silicone adhesive deposits from ceramic and metal surfaces of electronic modules to provide reworkability options in assembly processes including diagnostic parts, parts replacement and recovery of substrates from test vehicles is provided. The stripping compositions comprise a base preferably an organic base such as a quaternary ammonium hydroxide, a surfactant and a high boiling environmentally and chemically safe solvent such as di- or tri-propylene glycol alkyl ether. In another stripping composition, the base is used in combination with a mixture of N-alkyl pyrrolidone components, preferably an N-alkyl pyrrolidone and a N-cycloalkyl pyrrolidone. The stripping compositions are used to contact an electronic module having a cured resin such as a silicone adhesive residue deposit on the module surface to dissolve, remove or strip the deposit.

The present invention relates to an aqueous cleaning composition used to remove unwanted organic and inorganic residues and contaminants from a substrate such as, for example, a semiconductor substrate. The cleaning composition comprises from about 0.01% to about 40% by weight of a salt selected from a guanidinium salt, an acetamidinium salt, a formamidinium salt, and mixtures thereof; water; and optionally a water soluble organic solvent. Compositions according to the present invention are free of an oxidizer and abrasive particles and are capable of removing residues from a substrate and, particularly, a substrate having silicon-containing BARC and/or photoresist residue.

A system and process are provided for recovering and/or cleaning residual or waste petroleum products such as sludge accumulated within a storage tank or upon process equipment surfaces, or from inorganic materials such as sand or clay, and the like. The system and process include a negatively charged aqueous-based dispersion fluid, which is contacted with the petroleum product under controlled relatively high pressure and high shear conditions for fluidizing hydrocarbon molecules and for preventing such molecules from adherence to process equipment surfaces, or contaminants such as sand or clay. Additional mechanical separation as by subjecting the mixed petroleum product and dispersion fluid slurry to sonic vibration may also be employed. The thus-fluidized slurry of petroleum products, dispersion fluid, and inorganic materials can be separated by conventional techniques, as by settling and/or flotation, for further individual processing and/or re-use.