17 results about "Electroless deposition" patented technology

This invention relates to a metal-organic coordination catalyst, its preparation method, and its application. The preparation method includes the following steps: pretreatment of nickel foam; dissolving ferric nitrate nonahydrate and nickel nitrate hexahydrate in deionized water to obtain an electrolyte; chemically depositing an intermediate catalyst in the electrolyte; and preparing the catalyst using a solvothermal method, wherein the mixed solution is prepared by dissolving 2,5-dihydroxyterephthalic acid in deionized water, anhydrous ethanol, and N,N-dimethylformamide (DMF), and the intermediate catalyst is completely immersed in the mixed solution to obtain the catalyst. This invention combines electrochemical deposition and a solvothermal method to synthesize a catalyst with a unique rod-like morphology. The samples achieved 100, 500, and 1000 mA / cm². 2 It requires only 264, 296 and 308 mV overpotentials at current densities, respectively, and can maintain stability for 1000 hours at a current density of 1000 mA / cm2; at the same time, it has high production efficiency, low cost, and is suitable for large-scale industrial production.

An assembly (1) with at least one electrical feedthrough (2) comprises a body (10) with an opening (12) through which an electrical conductor (16) is held in electrical insulation from the body by a fixing material (14) which closes the opening. The surface of the conductor not covered by the material is wholly provided with a first coating (20), the surface of the conductor covered by the material is free of the first coating; the surface of the body not covered by the material is free of the first coating, optionally provided with a second coating different from the first coating. Alternatively, the surface of the body not covered by the material is wholly provided with the first coating, the surface of the body covered by the material is free of the first coating; the surface of the conductor not covered by the material is free of the first coating, optionally provided with a second coating (30) different from the first coating. The first coating has one or more layers, at least the outermost layer being a layer of electroless deposition of the first coating material.

This invention relates to the field of copper-based catalyst preparation, and discloses a self-supporting copper-based electrode, its preparation method, and its applications. The method for preparing a self-supporting copper-based electrode includes: placing a carbon-based support in an electrolyte containing copper salt, and performing constant-current electrochemical deposition under the induction of hypochlorous acid. The self-supporting copper-based electrode prepared by this method exhibits excellent electrocatalytic performance while also possessing the advantage of simple processing.

A method of producing an aperture plate for a nebuliser is described. A substrate (2) is patterned with a resist (5, 6) and a metal (10) is applied by electroless deposition so that the resist forms a desired aperture pattern. The substrate (2) has an array of domes (2(b)) to provide aperture plates (16) with domes (101) and flanges (102) without need for application of mechanical force pressing after deposition. The substrate is shaped for simultaneous manufacture of a plurality of aperture plates in which the resist pattern provides a deposition region for each aperture plate. By using electroless plating the aperture plate accuracy is excellent, especially for defining apertures having a diameter in the rang of only less than 10 μm, and having improved corrosion and fracture resistance for high frequency nebulizer operation.

This invention provides a method for protecting the surface of aluminum alloys, aluminum alloy workpieces, and their applications, relating to the fields of aluminum alloy surface modification and laser protection technology. The method includes: preparation of microstructures on the aluminum alloy surface, anodic oxidation growth array, electrochemical deposition of ultraviolet absorbing particles, and sealing treatment. The dual three-dimensional structure formed by the microstructure substrate and the anodic oxidation array increases the laser contact area and extends the laser reflection path. The bismuth-doped tin oxide composite absorbing particles achieve highly efficient absorption of ultraviolet laser light, with absorption rates exceeding 95%, and significant stray light suppression.

The present application relates to an unpolarized electrochemical structural color pixel. According to embodiments of the present application, the unpolarized structural color pixel can dynamically express vivid and diverse colors without depending on specific polarization (that is, under non-polarizer conditions) by integration of an electrochemical deposition-dissolution technique of a metal and a nanohole metasurface of a dielectric layer.

This invention discloses a method for determining the thickness of electrochemically deposited gold, silver, and palladium noble metal capping layers, comprising the following steps: 1) preparing standard samples by electrochemically depositing nickel of different thicknesses onto a pure copper substrate, followed by gold, silver, and palladium plating; 2) testing the capping layer thickness of the standard samples using scanning electron microscopy (SEM) backscattered electron imaging technology; 3) testing the intensity of X-ray characteristic spectral lines of different capping layer thicknesses using SEM energy dispersive spectroscopy (EDS) technology, and determining optimized test conditions; constructing a surface capping layer thickness calibration curve based on SEM EDS technology; 4) detecting the electrochemically deposited capping layer thickness of different types of samples. This method can accurately determine the thickness of bonding lines or thin films of noble metal capping layers prepared by electrochemical deposition processes in the integrated circuit field, filling the technical gap of rapid measurement for such products. The detection process is convenient and fast, and the detection results are accurate and consistent.

An electrochemical-deposition printhead assembly includes a substrate made of an insulating material and including openings that extend from a top surface to a bottom surface of the substrate. The electrochemical-deposition printhead assembly also includes deposition anodes that include conductive material that fills the openings. The electrochemical-deposition printhead assembly additionally includes a backplane that is coupled to the substrate. The backplane includes a grid control circuit, which includes an array of row traces, an array of column traces, a row driver circuit, electrically coupled to the row traces, and a column driver circuit, electrically coupled to the column traces. The backplane also includes a power distribution circuit and deposition-control circuits aligned with a deposition grid. Each one of the deposition-control circuits is electrically coupled to the power distribution circuit, an associated one of the row traces, and an associated one of the column traces.

The application discloses a low-cost ex vivo brain-machine interface chip batch preparation method and device, and belongs to the field of biosensors and micro-nano manufacturing technology.The method comprises sequentially performing cleaning, photolithography, sputtering of a metal layer, stripping, deposition of an insulating layer, overlaying, etching to expose electrode sites and pads, and preparing 3D electrodes through second overlaying and electrochemical deposition, and finally separating multiple independent microelectrode arrays through scribing or laser cutting.The aluminum wire pressure welding technology is adopted to connect the microelectrode pads and the adapter plate, the aluminum wire is embedded with high-temperature-resistant insulating glue, and cell culture rings are adhered.The application realizes batch preparation of multiple specifications of microelectrode arrays on a single substrate, has strong process compatibility, low cost and high efficiency, is convenient for microscopic observation and 3D electrode integration, and is suitable for ex vivo neuron network detection and organoid electrophysiology and electrochemical research.

The application relates to an electronic cigarette core based on an electrochemical deposition capillary structure and a preparation method thereof, and belongs to the technical field of electronic cigarettes. The electronic cigarette core comprises a base body, an electrochemical deposition capillary layer, a heating assembly and an electrode. The base body is a high-temperature-resistant insulating base body, the outer surface of the base body is covered with the electrochemical deposition capillary layer, the heating assembly is embedded in the electrochemical deposition capillary layer or attached to the outer surface of the electrochemical deposition capillary layer, the electrode is electrically connected with the heating assembly, and the electrode extends to the outside of the base body for connecting a power supply device of the electronic cigarette. The bonding strength of the electrochemical deposition capillary layer and the base body is greater than or equal to 15 MPa, the electrochemical deposition capillary layer is a uniform porous structure, the porosity is 30% to 80%, the capillary pore size is 1 mu m to 10 mu m, and the capillary layer thickness is 5 mu m to 50 mu m. The application has the advantages of smooth liquid guiding, uniform atomization, simple structure, long service life and high safety.

This invention relates to the fields of electrocatalytic materials and industrial electrochemistry, and discloses a composite coated titanium anode with an intermediate layer, its preparation method, and its application. The preparation method includes: titanium substrate pretreatment, electrochemical deposition of a gold intermediate layer, preparation of a manganese-doped iridium dioxide active coating solution, thermal decomposition coating, and repeated sintering steps. This invention utilizes a dual synergistic strategy of a gold intermediate layer and manganese-doped IrO2 to achieve dense coverage of the gold intermediate layer and in-situ growth of the manganese-doped IrO2 active layer in the same thermal decomposition process. The gold intermediate layer not only acts as a conductive and passivation-resistant barrier but also stabilizes high-valence manganese by inducing lattice strain. Manganese doping precisely regulates the electronic structure of Ir sites, significantly enhancing intrinsic activity. The anode prepared by this invention exhibits excellent performance in PEM electrolysis and copper plating tests. The preparation process of this invention is simple, cost-controllable, and compatible with existing production lines, and can be widely applied in PEM water electrolysis, electrolytic copper foil, and other electronic electroplating fields.

The application relates to the technical field of server heat dissipation, and particularly discloses a copper-graphene composite material with a micro-nano structure and a preparation method thereof. The copper-graphene composite material with the micro-nano structure is prepared by the following method: according to a preset pattern, a three-dimensional microstructure with a convex microcolumn array is formed on the surface of a copper foil by adopting laser-induced etching or a template-assisted electrochemical deposition method; then, the copper foil is immersed in a pre-impregnation solution containing a mercaptan compound, a phosphonic acid compound, an organic selenium compound, a promoter and a fluorine-containing ionic liquid; after plasma activation treatment, a continuous graphene layer is grown by CVD; and after annealing, the copper-graphene composite material is obtained. The composite material breaks the problem of limited anisotropy of a traditional planar composite material, the proportion of the thermal conductivities in the vertical and horizontal directions can be actively regulated by designing the geometric morphology of the three-dimensional copper microstructure, the customization of the heat flow path can be realized, and the composite material can be adapted to the chip hotspot distribution and the structure of a heat dissipator.

An immunosensor device is disclosed for rapid detection of circulating biomarkers associated with thrombosis, including C-reactive protein (CRP), calprotectin, soluble platelet selectin (sP-selectin), and D-dimer. The immunosensors were fabricated using fiber-laser engraving of carbon nanotubes and CO2-laser cutting of microfluidic channels and features, along with the electrochemical deposition of gold nanoparticles to conjugate with biomarker-specific aptamers and antibody. Using unsupervised clustering based on 4-biomarker concentrations, thrombotic events were predicted in 49 of 53 patients. The 4-biomarker combination yielded an area under the receiver operating characteristic curve (AUC) of 0.95, demonstrating high sensitivity and specificity for acute thrombosis prediction compared to the AUC values for individual biomarker: CRP (0.773), calprotectin (0.711), sP-selectin (0.683), and D-dimer (0.739). The immunosensor device with unsupervised clustering provides accurate and efficient methods for predicting thrombosis, guiding personalized medicine.

This invention provides a system and method for preparing hydroxyapatite by ion exchange membrane-assisted electrochemical deposition. A magnesium alloy substrate with a micro-arc oxidation coating is placed in a buffer zone for at least one round of electrochemical deposition. Each round of electrochemical deposition includes the following steps: opening the channel between the anion region and the buffer zone; simultaneously connecting the magnesium alloy substrate to the positive electrode of a pulsed power supply placed in the buffer zone; connecting the platinum electrode in the anion region to the negative electrode of the pulsed power supply for a first electrodeposition; subsequently closing the channel between the cation region and the buffer zone and opening the channel between the cation region and the buffer zone; connecting the magnesium alloy substrate to the negative electrode of the pulsed power supply; and connecting the platinum electrode in the cation region to the positive electrode of the pulsed power supply for a second electrodeposition. Through stepwise ion migration control and electric field focusing technology, preferential nucleation and C-axis preferential growth of hydroxyapatite at the bottom of MAO micropores are achieved.

The application belongs to the field of electronic material manufacturing and surface treatment, and relates to a method for electroless copper plating on a glass substrate surface and an electroless copper plating solution, the method comprising the following steps: preparing a zinc-based sol; growing a composite metal oxide layer on the surface of the glass substrate by dip-coating and heat treatment using the zinc-based sol; performing silanization treatment on the glass substrate with the metal oxide layer under vacuum and heating conditions to form a silane molecule layer with active functional groups on the surface of the metal oxide layer; immersing the glass substrate after the silanization treatment into a palladium-containing activation solution for surface activation; immersing the activated glass substrate into a solution containing a reducing agent for reduction treatment, so that the palladium is reduced and deposited on the surface of the substrate to form a catalytic center; and placing the glass substrate after the reduction treatment into an electroless copper plating solution for electroless deposition, so as to obtain a glass substrate with a copper layer deposited on the surface. The copper layer has high adhesion, strong uniformity, simple process, low cost and good plating solution stability.

The present disclosure provides a composite conductive film, a preparation method and application thereof, wherein the composite conductive film comprises: a metal microfiltration membrane substrate; a lead dioxide layer on the surface of the substrate by electrochemical deposition; and a transition metal oxide loaded on the lead dioxide layer, wherein the transition metal oxide is a microspherical skeleton structure, and the transition metal comprises any one of ruthenium, iridium, tin and nickel.

This invention discloses a method for preparing self-supporting nanofilms by electrochemical deposition at the gas-liquid interface. Addressing the problems of complex processes and high costs associated with existing technologies, this method proposes an interface-guided electrodeposition strategy. First, in a precursor electrolyte containing metal ions and surfactants at concentrations above the critical micelle concentration, a "heating-cooling" pretreatment induces the self-assembly of the gas-liquid interface into an ordered multilayer structure. Subsequently, an electric field is applied under the guidance of this structure, causing the metal ions to be reduced in situ at the gas-liquid interface, thereby spontaneously and continuously growing large-area, self-supporting ultrathin metal nanofilms. This method requires no template or sacrificial layer, and the process is simple and the conditions are mild. By adjusting parameters such as deposition voltage and temperature, the film thickness, morphology, transmittance, and conductivity can be precisely controlled. The resulting films are easily transferred to various substrates and show promising applications in flexible electronics, transparent electrodes, sensors, and catalysis.