91results about How to "Few process steps" patented technology

A copper damascene structure formed by direct patterning of a low-dielectric constant material is disclosed. The copper damascene structure includes a tungsten nitride barrier layer formed by atomic layer deposition using sequential deposition reactions. Copper is selectively deposited by a CVD process and/or by an electroless deposition technique.

A full color fiber plasma display device includes two glass plates sandwiched around a top fiber array and a bottom fiber array. The top and bottom fiber arrays are substantially orthogonal and define a structure of the display, with the top fiber array disposed on a side facing towards a viewer. The top fiber array includes identical top fibers, each top fiber including two sustain electrodes located near a surface of the top fiber on a side facing away from the viewer. A thin dielectric layer separates the sustain electrodes from the plasma channel formed by a bottom fiber array. The bottom fiber array includes three alternating bottom fibers, each bottom fiber including a pair of barrier ribs that define the plasma channel, an address electrode located near a surface of the plasma channel, and a phosphor layer coating on the surface of the plasma channel, wherein a luminescent color of the phosphor coating in each of the three alternating bottom fibers represents a subpixel color of the plasma display. Each subpixel is formed by a crossing of one top fiber and one corresponding bottom fiber. The plasma display is hermetically sealed with a glass frit. The sustain and address electrodes are brought out through the glass frit for direct connection to a drive control system.

An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

A method for forming an integrated circuit interconnect pad is described. In one embodiment a method of forming an integrated circuit comprises screen printing a conductive paste onto a terminal metalization pad and curing the conductive paste in an inert or reducing atmosphere at an elevated temperature to form an under-bump metalization layer of an interconnect pad. The elevated temperature is below a melting temperature of the terminal metalization pad.

A printable component structure includes a chiplet having a semiconductor structure with a top side and a bottom side, one or more top electrical contacts on the top side of the semiconductor structure, and one or more bottom electrical contacts on the bottom side of the semiconductor structure. One or more electrically conductive spikes are in electrical contact with the one or more top electrical contacts. Each spike protrudes from the top side of the semiconductor structure or a layer in contact with the top side of the semiconductor structure.

A process for forming a multilayer film includes coating a polymeric substrate film with a liquid fluoropolymer coating. The liquid fluoropolymer coating includes a fluoropolymer, solvent, a compatible cross-linkable adhesive polymer, and a cross-linking agent. The process further includes cross-linking the compatible cross-linkable adhesive polymer to form a cross-linked polymer network in the fluoropolymer coating, removing the solvent from the fluoropolymer coating, and adhering the fluoropolymer coating to the polymeric substrate film. A liquid fluoropolymer coating composition includes a fluoropolymer selected from homopolymers and copolymers of vinyl fluoride and homopolymers and copolymers of vinylidene fluoride, solvent, a compatible cross-linkable adhesive polymer, and a cross-linking agent. A fluoropolymer coated film includes a polymeric substrate film and a fluoropolymer coating on the polymeric substrate film. The fluoropolymer coating includes a fluoropolymer and a compatible cross-linked adhesive polymer.

The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, and 1700. The assembly 400 uses no solder. Components 406 or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.

A method of making an elongate reinforcing structure, such as a shear web, for a wind turbine blade is described. The reinforcing structure comprises a longitudinally-extending web and a longitudinally-extending flange. The flange extends along a longitudinal edge of the web and is arranged transversely to the web. The method involves providing a flange structure comprising a flange portion, and a projecting portion that extends along the length of the flange portion and projects transversely from a surface of the flange portion. The projecting portion is bonded between laminate layers of the web. The flange structure is preferably a pultruded component having a T-shaped cross-section. The method allows a simple, inexpensive and reconfigurable mould tool to be used. In preferred embodiments the mould tool has a flat surface without sidewalls.

Patterned thin film layers (12) are applied to a substrate (10) surface by masking selective areas of a substrate surface, e.g., with a printed pattern (11) of a material such as an oil, and vapor-depositing thin film material. The masking material is subsequently removed.

The invention relates to a process of recovering arabinose and optionally other monosaccharides from vegetable fiber rich in heteropolymeric arabinose, such as gum arabic. Said other monosaccharides are typically selected from galactose and rhamnose. The process of the invention comprises controlled hydrolysis of the arabinose-rich vegetable fiber and fractionation of the hydrolysis product to obtain a fraction enriched in arabinose and optionally other product fractions followed by crystallization of arabinose. The invention also relates to a novel method of crystallizing arabinose from biomass-derived material. Furthermore, the invention relates to novel crystalline L-arabinose.

An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from first and second wires which connect a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a third and fourth wires which connect a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a third conductor between the pins. The third conductor may include one or more bonding wires and the I/O pins are preferably ones which are adjacent one another. However, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. In another embodiment, connection between the first and second I/O pins is established by making the I/O pins have a unitary construction. In another embodiment, connection between the first and second I/O pins is established by a metallization layer located either on the surface of the package substrate or within this substrate. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

The invention discloses fermented kiwi fruit vinegar and a brewing method thereof. The method is characterized by comprising the following steps: pulping fresh kiwi fruit, adding water and sugar, and adjusting sugar concentration; adding citric acid to adjust pH, and inoculating fruit wine yeast/saccharomyces cerevisiae and acetic acid bacteria/fruit vinegar bacteria; firstly, fermenting at a low temperature for a certain period of time, heating and fermenting, and terminating fermentation when the acetic acid content is constant; and filtering and removing solid matters, canning and sterilizing to obtain a kiwi fruit vinegar product, wherein the acidity of the kiwi fruit vinegar product is 3.5-5.5g/100ml on the basis of total acid; the kiwi fruit vinegar product contains 48-60g/L of vitamin C. The fermented kiwi fruit vinegar has fruity fragrance and vinegar fragrance, is auburnish yellow in color and luster, clear and transparent. According to the fermented kiwi fruit vinegar, alcoholic fermentation and acetic fermentation are simultaneously carried out by a one-step process; the total fermentation time is shortened; the volatilized alcohol and acetic acid return back to liquid; all pulp resources in the kiwi fruit are fully utilized; specific nutritional ingredients of the kiwi fruit are fully reserved; and the fermented kiwi fruit vinegar has the aroma of the fruit vinegar, and is strong in fruit fragrance and stable in quality.

A process for preparing a cyclic organosilane using a solvent that promotes ring-closure reactions between an organosilane compound and a dihalo organic compound is disclosed. The ring-closure reactions may form a 4-, 5- or 6-member cyclic organosilane. The process involves a mixture including a dihalo organic compound, an organosilane having at least two functional groups, a solvent and magnesium (Mg). The two functional groups in the organosilane may include halogen, alkoxy or a combination thereof. In the presence of Mg, a Grignard intermediate is formed from the dihalo organic compound in the mixture. The solvent favors intra-molecular or self-coupling reactions of the Grignard intermediate. The intra-molecular or self-coupling reaction promotes ring-closure reaction of the Grignard intermediate to form the cyclic organosilane.

The invention relates to a method for forming breakage holes in a printed circuit board. The method comprises the following steps of printing protective printing ink on a circuit graph of an objective cross-band veneer; performing normal pressing-fit and drilling procedures; and thoroughly peeling the protective printing ink before chemical copper deposition by using an organic solvent so as to prevent hole walls printed with the protective printing ink from being deposited with chemical copper and electroplating copper in a subsequent hole metalizing process. Activating agents absorbed on the surface of the protective printing ink can be removed together with the protective printing ink, and the organic solvent cannot damage resin and activating agents on glass fibers, so that a chemical copper layer serving as an electroplating seed layer is deposited on hole walls of whole perforated holes expect for a cavity; and the chemical copper cannot be deposited on the surface of a material positioned on the cavity because the activating agents are not adhered to the surface of the material, and a conductive layer cannot be formed. The method for forming the breakage holes in the printed circuit board is simple in manufacturing procedure and low in cost; requirements on materials are low; batch production is realized easily; and a plating resisting effect can reach 100%.

The invention discloses a high-stability environment-friendly carbon nanotube water dispersing liquid and a preparation method thereof. The method comprises the steps: according to the mass parts, mixing 1-5 parts of carbon nanotubes, 0.5-20 parts of lignosulfonate and 0.1-5 parts of deionized water; and carrying out grinding treatment, adding water to dilute, adjusting the pH to 6-8, adding a stabilizer, and carrying out ultrasonic dispersion to obtain the stably dispersed carbon nanotube water dispersing liquid. The stabilizer is one or more of triton X-100, sodium dodecyl sulfate, sodium dodecyl benzene sulfonate, dodecyl sulfobetain and sodium methyl palmitate sulfonate. The high-stability environment-friendly carbon nanotube water dispersing liquid has the advantages of good dispersion effect of carbon nanotubes, high stability, high concentration, short technological process and preparation period, environmental friendliness and good compatibility with water-based resin.

The invention discloses a port state recognition method, device and system. The port state recognition method includes acquiring a TCP-SYN data package constructed in advance, wherein the TCP-SYN data package comprises a first MAC address and a service port parameter, the first MAC address is the MAC address of a recognized server, and the service port parameter of the parameter that a service port of the recognized server corresponds to; transmitting the TCP-SYN data package to a server that the first MAC address corresponds to, wherein the server that the first MAC address corresponds to returns a response package after receiving the TCP-SYN data package, and the response package comprises information used for reflecting the state of the service port that the service port parameter corresponds to; receiving the response package returned by the server that the first MAC address corresponds to; analyzing the returned response package to obtain the state of the service port that the service port parameter corresponds to. The method, device and system solves the problem that the application service recognition efficiency is low and achieves the effect of improving the application service recognition efficiency.

Liquid electrographic toners are derived from organosols incorporating amphipathic copolymeric binder particles that include polymerizable, crystallizable compounds chemically incorporated into the dispersed portion of the copolymer. The invention further provides organosols that include amphipathic copolymeric binder particles that include a dispersed (D) portion and a solvated (S) portion, wherein the D portion has a high glass transition temperature, and at least one polymerizable, crystallizable compound is chemically incorporated into the D portion, the S portion, or both the D and S portion of the copolymer. Methods of making and electrographically printing liquid toners derived from these organosols are also described. The invention is particularly suited for preparing liquid toners for electrophotographic printing.

A light-erasable embedded memory device and a method for manufacturing the same are provided in the present invention. The light-erasable embedded memory device includes a substrate with a memory region and a core circuit region, a floating gate on the memory region of the substrate, at least one light-absorbing film above the floating gate, wherein at least one light-absorbing film is provided with dummy via holes overlapping the floating gate, and a dielectric layer on the light-absorbing film and filling up the dummy via holes.

Systems and methods are provided for an on-chip decoupling device and method. One aspect of the present subject matter is a capacitor. One embodiment of the capacitor includes a substrate, a high K dielectric layer doped with nano crystals disposed on the substrate, and a top plate layer disposed on the high K dielectric layer. According to one embodiment, the high K dielectric layer includes Al₂O₃. According to other embodiments, the nano crystals include gold nano crystals and silicon nano crystals. One capacitor embodiment includes a MIS (metal-insulator-silicon) capacitor fabricated on silicon substrate, and another capacitor embodiment includes a MIM (metal-insulator-metal) capacitor fabricated between the interconnect layers above silicon substrate. The structure of the capacitor is useful for reducing a resonance impedance and a resonance frequency for an integrated circuit chip. Other aspects are provided herein.

The invention relates to the technical field of automobile control methods, in particular to an oil -saving system based on a road scene and a driving intention and a control method. The system comprises a road scene recognition module, a fuel saving condition judgment module, a speed control method acquisition module, a driving intention recognition module, a power demand recognition module and a control module. The speed control method of the vehicle is obtained according to the road condition and the front vehicle condition, the driving intention of a vehicle driver is recognized, if the driving intention belongs to the set intention, the power demand of the vehicle is obtained in combination with the speed control method and the driving intention, and the power assembly is controlled according to the power demand to enable the engine to operate in the economic area. The control method is extremely simple, the power assembly of the vehicle is controlled in combination with the road scene and the driving intention, and the oil saving effect of the power assembly of the vehicle is improved.

The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

An oil immersed stereo wound-core amorphous alloy transformer, comprising an iron core, a high-low voltage winding, leads and a tank. The core comprises three single frames made of amorphous alloy strips by winding and are identical in structure, and the single frames have a rectangular shape; the vertical sides of every two adjacent frames fit together fixedly to form a core pillar, and the horizontal sides of the single frame form iron yokes; the cross sections of the core pillars have an approximately circular or polygonal shape; the transformer further comprises a clamp, comprising a quasi-triangular upper and lower clamp, and posts, the lower clamp is provide with three food pads; the iron yokes in the lower portion of the iron core are located on the foot pads, and the high-low voltage winding is wound on the core pillars;

A process for the production of fatty acid esters from any soapstock generated in the alkali refining process of soybean, sunflower, rice, corn, coconut, palm kernel, rapeseed or cotton oils, which soapstock comprises water, about 0.1-2.0%, fatty derivatives, including glycerides, neutralizing and splitting the soaps with strong acids, followed by enzymatic esterification using a lipase enzyme, with an alkanol, at 15-to-70° C., followed by agitating the resulting mixture for three-to-five days, then separating the crude ester phase from the mixture, neutralizing the residual acid value with a base, and distilling off and recovering the esters, and obtaining a residue containing sterols, wherein the fatty acid esters thus produced may be used as biodiesel fuel.

A method for fabricating a field effect transistor, in which, after the etching of the gate electrode, the removal of the etching mask is omitted since the etching mask serves as a gate dielectric. The etching mask or the dielectric has a self-assembled monolayer of an organic compound.