An integrated
semiconductor photodetector and its fabrication method are disclosed, relating to the field of integrated
photodetector technology. This invention addresses the problems of existing detectors, such as limited functionality, insufficient
responsivity, low integration, and difficulty in achieving synergistic
miniaturization and high
performance improvement. The method involves depositing a Cr conductive layer on the front side of a
superlens substrate, uniformly
coating the conductive layer surface with
photoresist, pre-baking to prepare a dot-matrix
mask pattern, developing and fixing followed by Ni deposition, and then stripping to obtain the Ni dot-matrix
mask. ICP
etching is used to remove the surface conductive layer, and a
nanopillar array
superlens structure is then fabricated. A
photodetector layer is transferred to the back side of the substrate. Positive
photoresist is spin-coated onto the
substrate surface, pre-baking to prepare a source / drain
electrode pattern, developing and fixing followed by
sequential deposition of an adhesion layer
metal and an
electrode body
metal layer. The
metal layer in the non-
electrode region is then stripped to obtain the metal electrode in contact with the photodetector layer, completing the
detector fabrication. This invention can be applied to
polarization imaging, space
remote sensing, airborne detection, and
optical communication.