The application belongs to the technical field of
compound semiconductor material
crystal protection, and discloses a back surface protection method for a CdZnTe / CdTe
wafer. The method aims to solve the problem that the back surface of the brittle
semiconductor wafer is easily in contact with equipment during the front surface pixelization process, which causes scratches and further affects the performance of the
detector. The method comprises the following steps: pasting a layer of debondable protective
adhesive film on the back surface of the
wafer; then performing processes such as front surface photoetching and
electrode deposition; after the processes are completed, the debonding property of the
adhesive film is activated by heating,
ultraviolet irradiation or energization, so that the
adhesive force of the adhesive film is greatly reduced or disappears; finally, the adhesive film is peeled off, and the back surface of the wafer is cleaned. The protective adhesive film can be pyrolytic, UV debondable or electrochemical, can stably adhere and provide physical isolation during the process, and can be removed cleanly and with
low stress after the process. The method can effectively prevent the back surface of the wafer from being scratched, avoid the residual of the adhesive, and help improve the production yield and
electrical performance consistency of the final device.