The invention discloses a copper alloy material. The copper alloy material comprises, by weight percent, 5.01 wt%-15.0 wt% of Zn, 0.1 wt%-3.0 wt% of Ni, 0.1 wt%-2.0 wt% of Sn, 0.01 wt%-0.5 wt% of Si,0.01 wt%-0.25 wt% of P, 0 wt%-0.2 wt% of Mg, 0 wt%-0.3 wt% of Fe, and the balance Cu and inevitable impurities. The copper alloy material is low in cost, and the problem about multi-waste utilizationcan be solved. The yield strength of the copper alloy material is larger than or equal to 600 MPa, the electric conductivity is larger than or equal to 30% IACS, the bending machining performance is excellent (the value R/t in the GW direction is smaller than or equal to 1, and the value R/t in the BW direction is smaller than or equal to 2), the stress relaxation resisting performance is excellent (heat preservation is conducted for 1,000 hours at the temperature of 150 DEG C, and residual stress is larger than or equal to 70%), the copper alloy material can be machined into bar wires, platestrips and other products, and the requirements of connectors, relays, switches, sockets, lead frames and other multiple industries for the copper alloy material are met.