The invention discloses a method for preparing a copper-tungsten contact material by discharge plasmas. The method comprises the following steps: 1, pouring tungsten powder into a graphite die, placing the graphite die into a plasma sintering furnace, performing vacuumizing and boosting, connecting the sintering furnace with pulse direct current, heating to 1,320 DEG C to 1,480 DEG C, preserving the heat for 2.5 to 5 min, and naturally cooling the graphite die in the furnace to obtain tungsten framework; 2, polishing a copper block, performing ultrasonic cleaning the copper block until the copper block is cleaned, irradiating and scanning the copper block with laser at the speed of 10 to 500 mm/s, and performing plasma treatment to obtain an infiltrating copper block for later use; 3, putting the tungsten framework into a graphite boat, placing the infiltrating copper block on the tungsten framework, filling the space around the copper block with alundum powder, putting the tungsten framework into a high-temperature sintering furnace with protective gas atmosphere, heating to 1,300 DEG C to 1,400 DEG C, and preserving the heat for 2 to 3 hours to obtain a copper-tungsten sintered body; and 4, performing vacuumizing hot pressing on the copper-tungsten sintered body under conditions that the pressure is 50 to 100 MPa and the temperature is 800 DEG C to 850 DEG C, and cooling to room temperature to obtain the copper-tungsten contact material.