14 results about "Copper–tungsten" patented technology

The invention discloses a method for evaluating the ablation resistance of a graphene-enhanced copper-tungsten contact based on a cellular automaton, and the method comprises the steps: obtaining a graphene-enhanced copper-tungsten alloy cellular automaton model with different mass fractions and different cellular sizes through a Poisson disk sampling method, introducing the dependence characteristics of each material on the temperature, and carrying out the evaluation of the ablation resistance of the graphene-enhanced copper-tungsten contact. Setting boundary conditions and evolution rules, inputting arc heat and obtaining a model ablation result, and evaluating the modified material through loss, heat distribution, ablation rate and maximum erosion heat. Based on design schemes of different proportions of simulation selection, ablation characteristic experimental research is performed on copper-tungsten contact and graphene enhanced copper-tungsten contact samples. According to the method, anti-ablation characteristic prediction and aided design of the graphene reinforced copper-tungsten alloy electrical contact material can be realized, and a reference can be provided for promoting design and manufacturing of a high-performance electrical contact of a high-voltage circuit breaker.

The invention belongs to the technical field of alloy materials, and particularly relates to a high-conductivity ablation-resistant graphene copper-tungsten compact composite material and a preparation method and application thereof. According to the preparation method of the high-conductivity ablation-resistant graphene-copper-tungsten compact composite material, graphene, copper and tungsten are combined through in-situ reaction, interface bonding among graphene, copper and tungsten is high, graphene is not prone to agglomeration in a matrix, the reinforcement phase effect of graphene can be effectively achieved, and the ablation resistance of the graphene-copper-tungsten compact composite material is improved. The graphene copper-tungsten alloy with high compactness, high conductivity and ablation resistance is obtained by matching with subsequent spark plasma sintering, hot extrusion and other hot processing technologies, and the performance requirements of the fields of high-voltage electric appliance switches, electrical contacts, electrode materials and the like on materials can be met; according to the preparation method, the mixing technology and the preparation technology of the graphene copper-tungsten alloy composite powder are improved, the high-performance graphene copper-tungsten alloy material can be provided, and the technical problem that in the prior art, the high-performance graphene copper-tungsten alloy is difficult to prepare is solved.

The utility model relates to the technical field of copper-tungsten contacts, and discloses a copper-tungsten contact processing polishing device with a water-cooling cooling mechanism, which comprises a workbench, a water-cooling cooling mechanism, a polishing mechanism, a water-cooling cooling mechanism and a water-cooling cooling mechanism, and is characterized in that the top of the workbench is provided with a rectangular transmission port; and the filtering part is arranged at the top of the workbench. A workpiece is placed on the top of a placing plate, then the workpiece is machined under the action of a polishing machine body, cooling liquid for cooling the workpiece and chippings fall down through the placing plate, then the cooling liquid is filtered under the action of a filter plate, and then a sliding block is controlled to slide along the track of an adaptive opening. The purpose of scraping and cleaning impurities on the upper surface of a filter plate under the action of a scraper is achieved, an electric valve is controlled to rotate and open, so that the purpose of conveying the impurities into a dust collection box is achieved, and in the sliding process of a sliding block, blocking cloth and an expansion roller stretch out and draw back automatically, so that the purpose of blocking an adaptive opening is achieved.

The present application relates to chip packaging material technical field, specifically, it relates to high temperature resistant laser chip packaging material, it includes the following raw materials: aluminum nitride ceramic powder, copper tungsten alloy powder, modified hexagonal boron nitride binder, in the present application, modified hexagonal boron nitride is as interface phase, the compatibility and binding force of silane on its surface and phosphate group with aluminum nitride ceramic and copper tungsten alloy powder are enhanced, its lamellar structure can effectively lubricate, relax internal stress in the sintering process, so as to improve the thermal shock resistance and structural density of the packaging body, prevent crack propagation, in addition, the zinc spinel / aluminum nitride gradient functional thin layer prepared by sol-gel method effectively releases thermal stress and improves interface bonding strength, inhibits the harmful interdiffusion of elements at high temperature, so as to ensure higher thermal conductivity while improving the high temperature resistant stability and long-term service reliability of the material.

The invention provides a preparation method of an electroplating copper tungsten wire for a cold drawing process, which comprises the following steps: placing a tungsten wire in an alkaline cleaning solution for ultrasonic cleaning, washing after cleaning, then placing a copper plate with the mass purity not lower than 99.95% as an anode and the tungsten wire as a cathode in an electroplating solution for electroplating, and controlling the current density to be 1.6-2.2 A / dm < 2 > in the electroplating process, the temperature is kept at 20-30 DEG C, the electroplating time is 68 min, and the electroplating liquid is stirred at the rotating speed of 250-300 r / min; and finally, after electroplating is finished, the tungsten wire is placed in flowing deionized water with the electrical resistivity not lower than 15 M omega cm to be washed clean, after low-temperature drying, the electroplated copper tungsten wire is obtained, and the average thickness of an electroplated copper layer on the surface of the tungsten wire is 0.75-1.25 microns. The uniform, compact and firmly combined copper plating layer is formed before cold drawing of the tungsten filament, and is matched with specific cold drawing process parameters for use, so that the filament breakage rate of the small-diameter tungsten filament is remarkably reduced, the surface quality and the production efficiency are improved, and the method is suitable for industrial continuous preparation of the high-performance tungsten filament.

The application discloses a high-softening-point rare earth copper tungsten alloy and a preparation method thereof, and relates to the technical field of alloy materials.The method is characterized by the following steps: doping cerium oxide and zirconium into tungsten phases and copper phases respectively, mixing, and sintering through a sectional hot isostatic pressing process, so that the problems of element segregation caused by the difference in specific gravity are effectively improved, the dispersibility of each phase is obviously improved, the pinning effect of the rare earth oxide on the tungsten phase and the diffusion-promoting effect of the zirconium on the copper phase boundary are enhanced, the tungsten grain growth is effectively inhibited, the interface bonding strength of the copper phase and the tungsten phase is improved, the softening point temperature of the copper tungsten alloy is obviously improved, the segregation problem of the copper phase in the densification process is obviously improved, the copper grains are refined, and the densification of the copper phase is obviously improved.The preparation method has the advantages of simple process, stable and controllable product performance, and is suitable for large-scale production of the high-softening-point rare earth copper tungsten alloy.

According to the copper-tungsten carbide electric contact material and the preparation method thereof, a nano titanium carbide transition layer capable of forming strong metallurgical bonding with WC and Cu is generated on the surface of tungsten carbide particles in situ through a collaborative process of ball milling coating and reduction diffusion reaction. According to the gradient interface structure, loads can be efficiently transmitted, WC particles are effectively prevented from being peeled off from a base body under electric arc impact, the electric arc ablation resistance of the material is improved by 70% or above compared with a traditional CuWC material, and the service life of a contact is greatly prolonged.

The invention relates to the technical field of conductors, in particular to a graphene copper-tungsten composite material, a preparation method thereof and a conductive element. The preparation method comprises the following steps: S1, providing tungsten powder; s2, the surface of the tungsten powder is coated with a copper layer, and copper-tungsten composite powder with tungsten coated with copper is obtained; s3, the surface of the copper-tungsten composite powder is coated with a graphene layer, and graphene copper-tungsten composite powder is obtained; s4, the graphene copper-tungsten composite powder is mixed with induction copper powder, an organic adhesive and an activating agent, and mixed powder is obtained; s5, the mixed powder is subjected to cold press molding, and a green body is obtained; s6, degumming the green body to obtain a precursor; and S7, the precursor and a copper sheet are stacked and then subjected to infiltration, and the graphene copper-tungsten composite material is obtained. According to the technical scheme, under the condition that the tungsten content is not increased, the fusion welding resistance, the electric conductivity, the heat conduction performance and the mechanical performance of the graphene copper-tungsten composite material are improved, and the comprehensive performance of the prepared graphene copper-tungsten composite material is high.

The utility model relates to the technical field of on-load tap-changers, in particular to a contact device with a copper-tungsten block, which comprises a base disc, the base disc is provided with a moving contact structure and a static contact structure which are used for controlling the on-off of a circuit, the moving contact structure is rotatably connected to the base disc, the static contact structure is slidably provided with a common contact and a copper-tungsten contact, and the common contact is rotatably connected to the base disc. A plurality of common contacts are vertically stacked, the copper-tungsten contact abuts against the common contact at the lowest layer, the copper-tungsten contact protrudes out of the common contact by a width L, a conducting plate surface is arranged on the moving contact structure, and when the conducting plate surface on the moving contact structure swings to be close to the static contact structure, the protruding copper-tungsten contact preferentially makes contact with the conducting plate surface and is conducted with the conducting plate surface; when the circuit is disconnected, the common contact is separated from the conducting plate surface firstly, and the copper-tungsten contact is finally separated from the conducting plate surface, so that the electric arc is mainly concentrated on the copper-tungsten contact, the ablation and damage of the electric arc to the common contact are reduced, and the service life of the tap switch is further prolonged.

The invention belongs to the field of circuit breaker contact material design, and particularly relates to a schlieren analysis method for an ablation resistance enhancement mechanism of a graphene modified copper-tungsten contact. Comprising the following steps: S1, establishing a schlieren system calibration curve, carrying out a contact arc ablation schlieren observation experiment to obtain a schlieren image, and carrying out noise reduction processing on the schlieren image; s2, the transient temperature of a contact arc gap airflow column is calculated through a formula; s3, establishing a dynamic cooling rate model to dynamically fit the temperature data to obtain the cooling rate of the contact arc gap surface layer temperature; and S4, analyzing the enhancement mechanism of graphene doping modification on the ablation resistance of the copper-tungsten contact. According to the method, by comparing and analyzing the surface temperature and the cooling rate of the arc gap of the contact after ablation, the enhancement mechanism of graphene doping modification on the ablation resistance of the copper-tungsten contact is disclosed from the perspective of transient experimental phenomena, and a direct technical basis can be provided for optimizing the doping proportion and the preparation process of the graphene modified copper-tungsten contact material; and reference is provided for research and development of high-performance ablation-resistant contact materials.

The invention discloses a CuW contact component and a preparation method thereof, and belongs to the technical field of contact manufacturing, by adding rare earth elements and nano TiC into alloy mixed powder, the wettability of CuW can be improved, W grains are refined, a Cu phase is uniformly filled along a W framework, local aggregation or segregation is avoided, metallurgical bonding is promoted, and the interface strength and stripping resistance of a contact are improved. The problems that a traditional copper-tungsten alloy material is uneven in copper phase distribution, weak in interface bonding, insufficient in density, high in porosity and the like are solved. Besides, in the preparation process, the rare earth oxide can improve the high-temperature stability of a Cu phase, TiC enhances the aggregation effect of a W framework, flowing and evaporation of a Cu liquid phase are reduced, and uniform distribution of the Cu phase also avoids the problem of splashing aggravation caused by local copper enrichment; the problems that in the prior art, a CuW alloy material is prone to corrosion pits, cracks, copper phase evaporation, splashing, contact resistance drifting and the like in the long-term use process are solved.

The invention relates to the technical field of preparation of copper-tungsten moving arc contact blanks, in particular to a method for preparing a copper-tungsten moving arc contact blank through 3D printing. According to the scheme, the electron beam 3D printing technology is adopted, and the copper tail with the gradient transition layer and the fiber reinforced structure is printed on the tungsten head base body layer by layer, specifically, the tungsten head is prepared through the vehicle matching technology, and then in the vacuum environment, the copper tail containing the gradient transition layer and the fiber reinforced phase is sequentially printed through the electron beam cladding technology; and finally, carrying out hot isostatic pressing treatment to obtain a compact copper-tungsten moving arc contact blank. According to the scheme, near-net forming of the material is achieved, the feeding weight of the copper tail is remarkably reduced to about 0.3 kg from 0.82 kg in the prior art, and the material utilization rate is greatly increased; the prepared contact is excellent in key performance, the tensile strength of the bonding surface can reach 300 MPa or above, the electric conductivity exceeds 79 IACS, and the problem that the interface of a dissimilar material is prone to failure is effectively solved.

The invention relates to the technical field of copper-tungsten-copper-chromium alloy, in particular to a method for enhancing the strength of a copper-tungsten-copper-chromium alloy infiltration bonding surface through second-phase nickel, which comprises the following steps: S1, proportioning: proportioning a copper-chromium alloy bar and a framework material according to the mass ratio of (11-12): 36; wherein the framework material comprises tungsten powder and nickel powder in a mass ratio of 100: (0.1-0.5); s2, ball milling; s3, preparing a tungsten-nickel composite framework; s4, infiltration is carried out; by precisely adding the second-phase nickel and regulating the content of the second-phase nickel, on one hand, the strength of the infiltration bonding surface of the copper-tungsten alloy and the copper-chromium alloy is remarkably improved, and the technical problem that the strength of the bonding surface is insufficient in an existing infiltration process is solved; and on the other hand, the segregation phenomenon of the chromium element at the infiltration bonding surface is effectively inhibited, microdefects caused by segregation are reduced, then the quality stability and reliability of the copper-tungsten-copper-chromium alloy are improved, and the risk of cracking of the bonding surface is reduced.

The invention relates to power equipment, in particular to a three-station parallel load switch blade, a machining method and a switch, the three-station parallel load switch blade comprises a conductive section and an anti-ablation section, the conductive section is made of T2Y copper, the anti-ablation section is made of CuW70 copper-tungsten alloy, the conductive section and the anti-ablation section are formed through forging and pressing, and the conductive section is made of T2Y copper. One end of the conductive section is used for being connected with a switch contact, the anti-ablation section wraps the other end of the conductive section and is connected with the conductive section, the anti-ablation section is used for being connected with a switch static contact and a switch grounding static contact seat, one end, connected with the switch contact, of the conductive section is provided with a first connecting hole, and the other end of the conductive section is provided with a second connecting hole. And the conductive section is connected with the switch contact through a first rivet penetrating through the first connecting hole. According to the invention, both conductivity and ablation resistance can be considered, and the mechanical reliability is relatively high.