Copper-tungsten composite material with microscopic oriented structure and preparation method thereof

A composite material and a microscopic technology, applied in the field of copper-tungsten composite material with a microscopic directional structure and its preparation, can solve the problems affecting the use effect and life, the inconsistency of the microstructure and performance, and the reduction of the plasticity and toughness of the composite material. Excellent electrical and thermal conductivity, improve utilization efficiency and use effect, improve plasticity and toughness

Active Publication Date: 2018-12-07
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the microstructure and properties of the currently prepared copper-tungsten composite materials are obviously inconsistent with their actual use requirements.
In addition, since the uniform and isotropic microstructure cannot introduce effective plasticizing and toughening mechanisms in the material

Method used

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  • Copper-tungsten composite material with microscopic oriented structure and preparation method thereof
  • Copper-tungsten composite material with microscopic oriented structure and preparation method thereof
  • Copper-tungsten composite material with microscopic oriented structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The raw materials used in this example mainly include tungsten powder (average particle diameter 500nm), copper powder (average particle diameter 50nm), deionized water, hydroxypropyl methylcellulose powder (average particle diameter 180μm), polyacrylic acid and infiltration Using pure copper block, the specific preparation process is as follows:

[0041] (A) Slurry preparation: Take 228g of deionized water and add it to a 500ml plastic jar, add 419g of tungsten powder and 33.2g of copper powder to the jar in turn, and use a glass rod to stir at a speed of 80rpm for 5min to make the tungsten Powder and copper powder are evenly dispersed in water. Place the jar in a constant temperature water bath at 70°C, keep it warm for 30 minutes, slowly add 3.4g of hydroxypropyl methylcellulose powder into the jar, and stir until the powder is evenly dispersed in the slurry. Take out the jar from the constant temperature water bath, and after the slurry is cooled, add 2.3 g of poly...

Embodiment 2

[0048] The raw materials used in this example are the same as those in Example 1, and the difference between the specific preparation process and Example 1 is that the mass of deionized water added in the slurry preparation process is 145.6g, the mass of tungsten powder is 404g, copper The quality of powder is 32.8g, the quality of hydroxypropyl methylcellulose powder is 7.3g, the quality of polyacrylic acid is 2.2g, all the other operations are identical with embodiment 1.

[0049] Copper-tungsten composite materials with micro-oriented lamellar structure can be prepared through the above-mentioned process, and its micro-structure can be seen in Figure 4 . Depend on Figure 4It can be seen that the volume fraction of tungsten in the composite material is 41%, and the corresponding mass fraction is 60%. After testing, the hardness of the composite material along the lamellar direction is 1.97GPa, the hardness perpendicular to the lamellar direction is 1.85GPa, the compressi...

Embodiment 3

[0051] The raw materials used in this example are the same as in Example 1, and the specific preparation process differs from Example 1 in that the mass of deionized water added in the slurry preparation process is 121.5g, the mass of tungsten powder is 450g, copper The quality of powder is 36.4g, the quality of hydroxypropyl methylcellulose powder is 7.9g, the quality of polyacrylic acid is 2.4g, all the other operations are identical with embodiment 1.

[0052] A copper-tungsten composite material with a microscopically oriented lamellar structure can be prepared through the above-mentioned process. The volume fraction of tungsten in the composite material is 46%, and the corresponding mass fraction is 65%. After testing, the hardness of the composite material along the sheet direction is 2.15GPa, the hardness perpendicular to the sheet direction is 2.07GPa, the compressive strength along the sheet direction at room temperature is 630MPa, the electrical conductivity is 50% IA...

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Abstract

The invention discloses a copper-tungsten composite material with a microscopic oriented structure and a preparation method thereof. The composite material is prepared from tungsten and copper of massfraction being 30-97%. The microscopic oriented structure shows that tungsten and copper are arranged in a lamellar pattern along a specific direction at intervals. The copper-tungsten composite material with the microscopic oriented structure is prepared by the technical process of slurry preparing, freeze casting, vacuum freeze drying, organic matter removing, sintering and skeleton infiltrining, and the tungsten content of the material can be controlled by compressing a billet body or a skeleton along the direction vertical to a lamella. The composite material has the mechanical and functional properties of anisotropy and particularly has the characteristics of high strength, high hardness, good electrical and thermal conductivity and good resistance to arc ablation and resistance to electrical shock along the lamella direction. The composite material is expected to be used as an electrical contact material so as to significantly improve the using effect, prolong the service life,reduce component quality and reduce energy consumption.

Description

technical field [0001] The invention relates to the field of copper-tungsten composite materials, in particular to a copper-tungsten composite material with a microscopic orientation structure mainly used as an electric contact material and a preparation method thereof. Background technique [0002] Electrical contacts are crucial contact elements in load switches, circuit breakers, and instruments. They are mainly responsible for the connection and disconnection of circuits and the tasks of load current. Their performance directly affects the quality and service life of electrical instruments. In particular, power systems such as (ultra) high-voltage transmission can provide the foundation and power for the development of my country's economy and society, while the comprehensive performance and reliability of electrical contacts directly affect the normal and efficient operation of the entire power system, so it is important to protect the country's energy Security matters. ...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C27/04C22C1/08B22F3/11
CPCB22F3/1103C22C9/00C22C27/04
Inventor 刘增乾谈国旗张哲峰
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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