Preparation method of CuW (Copper Tungsten) and CuCr (Copper Chromium) integrated material used for high voltage electric contact

A monolithic material and high-voltage technology, applied in circuits, electric switches, electrical components, etc., can solve problems such as insufficient bonding strength and fracture of the bonding surface, and achieve the effects of low preparation cost, improved interface bonding strength, and simple operation process

Active Publication Date: 2012-10-31
XIAN UNIV OF TECH
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  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing CuW and CuCr monolithic materials for high-voltage electrical contacts, which solves the problem that the existing monolithic materials are prone to fracture along the joint surface due to insufficient bonding strength

Method used

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  • Preparation method of CuW (Copper Tungsten) and CuCr (Copper Chromium) integrated material used for high voltage electric contact

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preparation example Construction

[0031] The invention provides a method for preparing CuW and CuCr monolithic materials used for high-voltage electrical contacts, such as figure 1 The flow shown is implemented in the following steps:

[0032] Step 1, prepare copper alloy foil strip

[0033] The commercial CuCr alloy ingot with a mass percentage of Cr of 10% is machined to remove various defects and cleaned; it is placed in the induction heating furnace of the rapid solidification device, and argon is used as the protective atmosphere, and remelted at 1150~1250 °C After heat preservation for 40min, the copper alloy foil strip was prepared by the rapid solidification single roll stripping method, and its thickness was 40-60 μm;

[0034] Step 2, processing the CuW bonding surface

[0035] According to the product size of the overall electrical contact, a commercial CuW alloy with a suitable length is selected, and the mass percentage of Cu is 10-30%. After machining the pre-bonded end of the machine, put the ...

Embodiment 1

[0047] Firstly, the copper alloy foil strip is prepared, and the commercial CuCr alloy ingot with a Cr content (mass percentage) of 10% is machined to remove various defects, and placed in the induction heating furnace of the rapid solidification device, with argon as the protective atmosphere. After remelting at 1150°C for 40 minutes, the copper alloy foil strip was prepared by the rapid solidification single-roll stripping method, and its thickness was 40 μm.

[0048] Then process the CuW bonding surface. After machining the pre-bonded end of the machine, put the fresh end into the nitric acid solution with a volume concentration of 30%. The fresh end is immersed in the solution to a depth of 1mm, and the soaking time in the solution for 3 hours. Take out the CuW alloy whose end has been corroded into a porous structure, first wash the corroded end with clean water, then put it into an ultrasonic oscillator filled with distilled water for cleaning for 30~40min, and then put ...

Embodiment 2

[0053] Firstly, the copper alloy foil strip is prepared, and the commercial CuCr alloy ingot with a Cr content (mass percentage) of 10% is machined to remove various defects, and placed in the induction heating furnace of the rapid solidification device, with argon as the protective atmosphere. After remelting at 1200°C for 40 minutes, the copper alloy foil strip was prepared by the rapid solidification single-roll stripping method, and its thickness was 45 μm.

[0054] Then process the CuW bonding surface. After machining the pre-bonded end of the lathe, put the fresh end into the nitric acid solution with a volume concentration of 25%. The fresh end is immersed in the solution to a depth of 2mm. for 3.5 hours. Take out the CuW alloy whose end has been corroded into a porous structure, first wash the corroded end with clean water, then put it into an ultrasonic oscillator filled with distilled water for cleaning for 30~40min, and then put it into a container filled with absol...

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Abstract

The invention discloses a preparation method of a CuW (Copper Tungsten) and CuCr (Copper Chromium) integrated material used for high voltage electric contact. The method comprises the following steps: firstly, a high copper alloy foil strip is prepared by using a rapid solidification melt-spinning method; subsequently the de-coppering treatment is carried out on a CuW pre-combining plane by using an acid dissolving method; a porous W-framework is obtained on the combining plane; the overall sintering infiltration is carried out on the CuW, the alloy foil stripe and the CuCr alloy inside a reducing atmosphere furnace so as to obtain the CuW and CuCr integrated material; and subsequently the solid solution aging treatment is carried out on the material. As the Cr element inside the alloy foil stripe is filled and infiltrated into the porous framework during the infiltration process and is formed into W-Cr solid solution with the W, the metallurgical bonding is realized between the framework and a substrate copper phase; and the boundary bonding strength of the integrated material is improved.

Description

technical field [0001] The invention belongs to the technical field of connection preparation of heterogeneous materials, and relates to a method for preparing CuW and CuCr integral materials used for high-voltage electric contacts. Background technique [0002] The self-supporting high-voltage integral electrical contact is connected by the CuW contact finger part that is resistant to arc burning and the CuCr part that provides elasticity. The CuW / CuCr integral material combines the performance advantages of these two heterogeneous materials and is widely used in high-voltage circuit breakers. electrical contacts in the device. With the development of high-voltage switches in the direction of ultra-high voltage, large capacity, and miniaturization, the CuW / CuCr integral arc contacts in the arc extinguishing chamber are subjected to greater thermal and mechanical loads during use, and the service environment is even harsher. The core component-CuW / CuCr overall material inte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H11/04H01H69/00
Inventor 梁淑华杨晓红肖鹏邹军涛王献辉
Owner XIAN UNIV OF TECH
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