8133 results about "Grinding process" patented technology

A wafer level packaging method includes the following steps. A first wafer is bonded over a second wafer. A first grinding process on the first wafer is performed, to remove an upper chamfered edge of the first wafer and reduce a thickness of the first wafer. A trimming process is performed on the first wafer, to remove a lower chamfered edge of the first wafer to form a trimmed first wafer. A second grinding process is performed on the trimmed first wafer, to reduce a thickness of the trimmed first wafer.

Compositions having antimicrobial activity contain particles comprising at least one inorganic copper salt; and at least one functionalizing agent in contact with the particles, the functionalizing agent stabilizing the particle in a carrier such that an antimicrobially effective amount of ions are released into the environment of a microbe. The average size of the particles ranges from about 1000 nm to about 3 nm. Preferred copper salts include copper iodide, copper bromide and copper chloride, most preferred being copper iodide. Preferred functionalizing agents comprise materials with a molecular weight of 60 or above, which include amino acids, other acidic materials, thiols, hydrophilic polymers, emulsions of hydrophobic polymers and surfactants. The functionalized particles are preferably made by a grinding process.

The invention relates to a positive-negative floatation technology for cellophane, which comprises the following steps: subjecting siliceous-calcareous collophane ore to breaking and grinding process to dissociate ore monomer; adding water to it get ore pulp with concentration of 20 -50%; Leading the mixture to agitated tank; adding modifying agent sodium silicate and positive collector agent to ore pulp; processing the mixture in positive floating system to get foamed product; adding negative floatation agent inorganic acid and collector agent to the foamed product in negative flotation agitated tank; processing the mixture in negative floating system with carbonate vein mineral negative flotation to get foamed product as negative flotation debris and product in tank as clean ore. The invention can simplify process, deduce cost and recycle the water.

A substrate-planarizing device and method of using the device comprising a substrate storage stage outside a room, and on a base inside the room, a multi-joint transfer robot, a temporary alignment platform, a movable transfer pad, a grinding process stage in which substrate holders that compose three stages of a substrate loading/unloading stage, a rough grinding stage, a finish grinding stage are arranged in a concentric pattern on the first index rotary table, and a polishing process stage that has a substrate holder table composing a substrate loading/unloading/finish polishing stage as well as a substrate holder table composing a rough polishing stage arranged in a concentric pattern on the second index rotary table.

The invention discloses a constant pressure automatic grinding method based on fuzzy adaptive force control. The grinding method comprises the following steps: detecting the contact force of a grinding head and a workpiece in a real-time manner to feed back force signals; changing an analog voltage value output by a controller according to a preset control algorithm, thereby controlling the output torque of an x-axis servomotor to control the contact force. The invention further provides a grinding device for realizing the grinding method. The grinding device comprises an industrial control main engine, a workbench, motion mechanisms, one-dimensional sensing equipment, a position sensor for acquiring the position coordinate of the workpiece, grinding equipment and workpiece clamping equipment. The grinding device can be used for detecting the normal grinding force in a grinding process based on an intelligent force control technology, and feeding back detection results; through the processing of the controller, driving signals are generated for continuous adjustment of the output torque of a driver, so that the normal grinding force can be controlled in a real-time manner and the constant pressure grinding can be realized.

The invention discloses a method for preparing a transmission electron microscope sample. The method comprises the following steps of: providing a sample with length, width and thickness, wherein at least one elongation structure or multi-layer stack structure along the thickness direction is formed in a region to be observed of the sample; marking the region to be observed of the sample; grinding the sample along a direction which is perpendicular to the elongation direction of the elongation structure or the stacking direction of the stack structure until the mark is exposed; forming a concave pit on the two sides of the region to be observed on a grinding surface respectively; thinning the sample part of the marked region along the concave pit to a specific thickness; and separating and taking the thinned sample part at the region to be observed out. By the method, the preparation efficiency and the observation effect are improved, a protective cover is further assembled on the surface of the sample during the preparation, the sample is prevented from being damaged during the grinding, and the problem that the sample at the region to be observed can easily fall off and bounce out after the preparation is finished is also prevented.

The invention discloses a method for preparing a polymer/graphene composite material, which comprises: firstly, uniformly dispersing graphite powder in a polymer liquid medium, and grinding and stripping the graphite by using grinding balls to obtain polymer/graphene suspension; and secondly, obtaining the polymer/graphene composite material by adopting a method of adding a precipitator into the polymer/graphene suspension to precipitate the polymer and graphene from the solution, or a method of directly initiating the polymerization of a polymer monomer or a method of curing a prepolymer of the polymer. The method is a new in-situ graphene preparation and compounding method. Once generated, the graphene is enveloped and isolated by polymer molecules or the prepolymer monomer, so the self-agglomeration of the graphene is prevented effectively. In addition, the mechanical grinding in the polymer liquid medium ensures the full mixing of the filler and the polymer, so that the graphene can disperse in a polymer substrate more effectively. And the mechanical ball grinding process makes scale expansion and the realization of industrial production easier.

The invention relates to a silver coated nickel powder conductive adhesive. The silver coated nickel powder conductive adhesive comprises, by mass, 40-90% of a conductive filler, 5-45% of a resin, 0.5-20% of a curing agent, 0-50% of a solvent and 0.1-20.0% of an assistant, and the conductive filler comprises at least one of micro-silver coated nickel powder and nano-silver coated nickel powder. The silver coated nickel powder conductive adhesive has the advantages of excellent conductivity, low cost, no lead, no halogens and the like. The invention also discloses a preparation method of the silver coated nickel powder conductive adhesive. The method is characterized in that the curing agent is added in a dispersion process after grinding, so the conductivity, the cementability, the viscosity and the like can be effectively regulated, and the untoward influences of the interaction of all components of the conductive adhesive in the dispersion and grinding processes to the storage, application and stability of the conductive adhesive are avoided.

The invention discloses a traditional Chinese medicine smashing and grinding integrated machine. The traditional Chinese medicine smashing and grinding integrated machine comprises a shell, support legs, a feed port, smashing blades, stirring blades, a screen plate, a grinding hammer and a grinding barrel. The upper surface of the shell is fixedly connected with a double-shaft motor. The extension end of a lower shaft of the double-shaft motor is fixedly connected with a smashing shaft. The smashing blades are fixedly connected to the smashing shaft. The screen plate is arranged below the stirring blades. The right side of the shell is provided with a driving shaft. The lower end of the smashing shaft is fixedly connected with the grinding hammer. The interior of the shell is slidably connected with the grinding barrel. Chinese medicinal materials to be processed are fed into the feed port and are smashed through the smashing blades and smashing edges and stirred through the stirring blades in the smashing process, and the Chinese medicinal materials are smashed more thoroughly. In the smashing process, the screen plate moves left and right to enable the smashed Chinese medicinal materials to pass through the screen plate more easily. The processing efficiency is improved. The grinding barrel is vibrated up and down in the grinding process, the grinding efficiency is improved, the Chinese medicinal materials are smashed and ground synchronously, and the processing efficiency is greatly improved.

The invention relates to a cutter damage and abrasion state detecting method, which comprises the following steps that 1, vibration signals in the cutter cutting and grinding processes are measured; 2, the vibration signals are subjected to mode filtering calculation; 3, time-frequency wavelets of the vibration signals are subjected to classification sorting and feature extractions; and 4, the time-frequency wavelets are subjected to classification, collection and signal separation processing, various kinds of time-frequency wavelets are subjected to signal reconstruction, the kurtosis index (Cq) and the peak index (Ip) of various kinds of signals are then counted, the cutter damage and abrasion state and the machine tool operation state are detected under the dynamic distribution condition of a Cq-Iq plane according to various kinds of separation signal index parameters, and the identification detection and the quantitative early warning and forecast of the cutter damage and abrasion state are realized. Through single monitoring equipment, the detection of the cutter damage and abrasion state is realized, the signal identification stability is good, the mechanical processing production safety is ensured, the precision of processing parts is improved, and the production rate and the utilization rate of a machine tool are improved.

The invention discloses a method for setting a tool through sparkle identification and an automatic system for grinding processing. The method and the system achieve the intelligent automatic control for the whole grinding process and accurately and reliably solve the problem of automatic tool setting, the problem of dimension compensation caused by the abrasion of a grinding wheel, and the problems of on-line dimension measurement and motion servo control in the grinding process. The method organically combines a vision technique, a PLC technique and a motion control technique, and provides a solution for solving the problems of tool setting, on-line dimension measurement and grinding wheel wear compensation by using the vision technique, and the problem of motion servo control by using the PLC technique and the motion control technique. The method makes use of the vision technique to automatically identify the operating condition contacted with a workpiece, and switch the operating condition to a grinding processing state instantly so as to solve the problem of automatic tool setting, thus the method can combine a plurality of mature correlation techniques to construct the automatic system which integrates detection and motion control. The method and the automatic system achieve the accurately automatic tool setting, solve the problems of the wear measurement and compensation of the grinding wheel, and open up a novel approach for fully automatic and intelligent control in the grinding process.

The invention relates to a mechanical machining system used for conducting machining on blade surfaces, and aims at proving an automatic grinding polishing system which is high in machining accuracy, high in flexibility and low in cost. The automatic grinding polishing system comprises a feeding and blanking rotary table, a robot, a blade grinding mechanism, a polisher, a scanner and a software control system, wherein the feeding and blanking rotary table comprises a base, a rotating platform is movably installed on the base and provided with multiple workpiece installing clamping positions, a mechanical arm of the robot is provided with a rapid replacing clamping tool used for clamping a workpiece, the blade grinding mechanism is used for conducting the grinding process, the polisher is used for conducting the polishing process, the scanner is used for scanning the workpieces before or after being machined to obtain coordinate data of the workpieces, and the software control system comprises an off-line programming module, an online calibrating module and a robot controller.

The invention relates to the technical field of control on production equipment, and particularly relates to an intelligent control system for a vertical mill based on a fuzzy PID (proportion integration differentiation) algorithm. The intelligent control system comprises the vertical mill, a dust remover and a feeding device, wherein the feeding device comprises an unloader, a bucket elevator and a storage bin; and the intelligent control system is characterized in that an air inlet in the bottom of the vertical mill is connected with a fan via a pipeline, a cold-air device and a hot-air stove are arranged on the pipeline between the air inlet and the fan, a cold-air adjusting valve and a hot-air adjusting valve are respectively arranged on the cold-air device and the hot-air stove, a vertical mill material layer PID controller is arranged on the feeding device, and an in-mill pressure difference fuzzy PID controller is arranged on the cold-air adjusting valve. According to the intelligent control system disclosed by the invention, mathematical models of the change of the vertical mill material layer thickness and an in-mill pressure difference along with parameters of a feeding amount, a mill inlet hot-air temperature and the like can be established only by inputting and outputting data without analyzing the complex grinding process of the vertical mill; and the intelligent control system is simple in process, high in adaptability, fast in the dynamic response time of a controller algorithm, high in robustness, high in control accuracy, and good in market prospect.

The invention discloses a fresh grinding process for a nutritious drink. The nutritious drink is prepared by boiling and pulping raw materials in turn. In the process, the method for boiling and pulping the materials in turn is adopted, so residue is not needed to be separated, and the method is convenient to operate; meanwhile, protein and dietary fiber of the raw materials are maintained, and the nutritious drink contains rich nutrition and meets health requirements of modern people.

Systems and methods for scribing a semiconductor wafer with reduced or no damage or debris to or on individual integrated circuits caused by the scribing process. The semiconductor wafer is scribed from a back side thereof. In one embodiment, the back side of the wafer is scribed following a back side grinding process but prior to removal of back side grinding tape. Thus, debris generated from the scribing process is prevented from being deposited on a top surface of the wafer. To determine the location of dicing lanes or streets relative to the back side of the wafer, the top side of the wafer is illuminated with a light configured to pass through the grinding tape and the wafer. The light is detected from the back side of the wafer, and the streets are mapped relative to the back side. The back side of the wafer is then cut with a saw or laser.

Organic bonded abrasive tools, having controlled microstructures, comprise a relatively low volume percentage of abrasive grain and a relatively low hardness grade, but are characterized by the excellent mechanical strength and efficient grinding performance of much harder grade, lower porosity tools, especially in versatile grinding processes, such as centerless grinding. A method for centerless grinding with these tools is provided. Methods for making the abrasive tools utilizing agglomerated abrasive grain are described.

A device for single abrasive grain grinding experiments under the assistance of ultrasonic vibration comprises a super precision machine tool, a tool setting system, an ultrasonic vibration system, a force measurement system, a high-speed camera shooting system and a data processing system. A method for the single abrasive grain grinding experiments under the assistance of ultrasonic vibration comprises the steps of installing a workpiece in an air floatation spindle clamp of the super precision machine tool; utilizing the tool setting system to rapidly accurately perform tool setting; dismantling the tool setting system, starting the super precision machine tool and the ultrasonic vibration system, utilizing the force measurement system to perform on-line detection and recording on single abrasive grain stress conditions in the experiment processing, and transmitting data to a computer; and utilizing the high-speed camera shooting system to perform on-line observation and recording on a abrasive grain movement trail in the grinding process, the microscopic changing process and the material removing process. The device and the method genuinely reflect the grinding process of a whole grinding wheel and can particularly reflect the abrasive grain cutting process under the conditions of ultrasonic grinding and can provide valuable experimental data for manufacture and research of the grinding wheel and a cutting mechanism of the grinding wheel.