Silver coated nickel powder conductive adhesive and preparation method thereof

A silver-coated nickel powder, conductive adhesive technology, applied in conductive adhesives, adhesives, epoxy resin adhesives and other directions, can solve the problems of conductive adhesive storage, application and stability, difficult conductivity, adhesion, viscosity control , the mutual reaction of conductive adhesive components, etc., to achieve the effect of improving antioxidant performance, low cost, and improving mechanical properties

Inactive Publication Date: 2013-12-25
SUZHOU NIUJIAN NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In terms of preparation process, the conventional conductive adhesive preparation process usually mixes conductive materials, resins, curing agents, solvents and other materials and then disperses or grinds them. The production efficiency is low, and it is difficult to effectively control parameters such as conductivity, adhesio

Method used

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  • Silver coated nickel powder conductive adhesive and preparation method thereof
  • Silver coated nickel powder conductive adhesive and preparation method thereof
  • Silver coated nickel powder conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] According to the components in Table 1 and their parts by weight, materials such as resin, additives, conductive fillers, etc. were put into a dispersion tank and stirred, and ground for 3 hours with a three-roll mill, and the fineness was detected by a scraper fineness meter until The fineness is less than 5 microns, add curing agent and solvent to the ground material, and disperse at 500 rpm for 60 minutes under vacuum conditions, and adjust the viscosity to 22 Pa s (25 ℃), inspect and pack, that is A low-cost silver-coated nickel powder nano-conductive adhesive is obtained.

[0046] Coat the prepared nano-conductive adhesive on a glass plate or pour it into a mold, let it stand at room temperature for 10 minutes (to let part of the solvent evaporate), and then put the sample into an oven at 150°C for 45 minutes to cure.

[0047] Table 1: Components and parts by weight of Example 1:

[0048] The technical indicators of the silver-coated nickel powder conductive adhes...

Embodiment 2

[0053] Table 3: Components and parts by weight of Example 2:

[0054]

[0055] The preparation method of embodiment 2 is the same as embodiment 1, and difference is: the selection of each component and its parts by weight, and the fineness that reaches in the preparation process, viscosity requirement, curing temperature and curing time, then according to embodiment 1 The preparation method finally prepares the silver-coated nickel powder conductive glue that is a kind of low-cost micronano silver-coated nickel powder conductive glue, and its technical indicators are as shown in table 4:

[0056] Table 4: Technical indicators of low-cost micro-nano silver-coated nickel powder conductive adhesive:

[0057]

[0058] The micro-nano silver-coated nickel powder conductive adhesive prepared in Example 2 is due to the combination of three conductive powders, the sheet-like micro-silver-coated nickel powder, the sheet-like nano-silver-coated nickel powder, and the spherical nano...

Embodiment 3

[0060] Table 5: Components and parts by weight of Example 3:

[0061]

[0062] The preparation method of embodiment 3 is the same as that of embodiment 1, and the difference is: the selection of each component and its parts by weight, and the fineness, viscosity requirement, curing temperature and curing time achieved in the preparation process, according to the composition of table 5 The distribution ratio and the parts by weight of each component are then finally prepared according to the preparation method of Example 1 to obtain a one-component silicone-based silver-coated nickel powder conductive adhesive.

[0063] The technical indicators of the silver-coated nickel powder conductive adhesive of the single-component silicones prepared in Example 3 are shown in Table 6:

[0064] Table 6: Technical indicators of low-cost single-component silicone silver-coated nickel powder conductive adhesive

[0065]

[0066] The one-component silicone silver-coated nickel powder c...

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Abstract

The invention relates to a silver coated nickel powder conductive adhesive. The silver coated nickel powder conductive adhesive comprises, by mass, 40-90% of a conductive filler, 5-45% of a resin, 0.5-20% of a curing agent, 0-50% of a solvent and 0.1-20.0% of an assistant, and the conductive filler comprises at least one of micro-silver coated nickel powder and nano-silver coated nickel powder. The silver coated nickel powder conductive adhesive has the advantages of excellent conductivity, low cost, no lead, no halogens and the like. The invention also discloses a preparation method of the silver coated nickel powder conductive adhesive. The method is characterized in that the curing agent is added in a dispersion process after grinding, so the conductivity, the cementability, the viscosity and the like can be effectively regulated, and the untoward influences of the interaction of all components of the conductive adhesive in the dispersion and grinding processes to the storage, application and stability of the conductive adhesive are avoided.

Description

[0001] The invention relates to a conductive adhesive and a preparation method thereof, in particular to a silver-coated nickel powder conductive adhesive and a preparation method thereof, belonging to the technical field of conductive adhesives. Background technique [0002] With the development of electronic technology, semiconductor industry and other fields and the enhancement of environmental awareness, traditional lead-containing electronic assembly materials can no longer meet the needs of electronic devices and chip connections. In recent years, as solders containing tin and lead have been banned in Europe and other regions, emerging green technologies such as lead-free solders have emerged. The reflow soldering process of lead-tin solder paste and lead-free solder generally requires a soldering temperature of 220 ℃ to 240 ℃, and the high temperature and the resulting thermal stress will also damage the device and the substrate. As a new lead-free and green electronic ...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J161/06C09J167/00C09J183/04C09J133/00C09J161/28C09J175/04
Inventor 吴卫平施红华
Owner SUZHOU NIUJIAN NEW MATERIAL
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