502results about How to "Reduce filling" patented technology

A method and system for generating a bloom filter by mapping into respective groups each of a plurality of initial keys according to a first hash function and mapping each group hashed key into a bloom filter using k respective hash functions.

A metalized plastic antenna includes a plastic antenna body with metallization on the inside. In this arrangement metallization is used for conducting electromagnetic waves. Furthermore, metallization may be implemented as a protective coating so that chemical resistance of the plastic antenna may be ensured even in the case of corrosive environmental conditions.

The invention relates to graphene conductive ink comprising the following components by weight percent: 0.01-25% of resin, 0.1-95% of graphene, 0.1-30.0% of assistant, and 5.0-99.79% of solvent. The two-dimensional conductive material graphene is used for the conductive ink; the graphene with special ratio is adopted as a conductive phase; the resin is taken as a binder; the assistant and the solvent are used for assisting; the prepared ink is good in anti-sedimentation property, and adjustable in viscosity and rheological behavior, and can be used for flexibly printing on the surfaces of a plurality of substrates; and the ink is stable in mechanical property, stable in electrical properties, oxidation resistance, acid resistance, alkali resistance and resistance to a chemical solvent after being cured.

An image sensor array includes image sensors having photo TFTs to generate photocurrent in response to received images. The photo TFTs each have their respective gate electrodes and source electrodes independently biased to reduce the effects of dark current. Storage capacitors are coupled to each photo TFT and discharged upon generation of a photocurrent. Each storage capacitor is coupled to a readout TFT that passes a current from the storage capacitor to a data line. The photo TFT may be disposed above the storage capacitor to increase the exposed surface area of the photo TFT.

A demodulation image sensor, such as used in time of flight (TOF) cameras, extracts all storage- and post-processing-related steps from the pixels to another array of storage and processing elements (proxels) on the chip. The pixel array has the task of photo-detection, first processing and intermediate storage, while the array of storage and processing elements provides further processing and enhanced storage capabilities for each pixel individually. The architecture can be used to address problems due to the down-scaling of the pixel size. Typically, either the photo-sensitivity or the signal storage capacitance suffers significantly. Both a lower sensitivity and smaller storage capacitances have negative influence on the image quality. The disclosed architecture allows for keeping the storage capacitance unaffected by the pixel down-scaling. In addition to that, it provides a high degree of flexibility in integrating more intelligence into the image sensor design already on the level of the pixel array. In particular, if applied to demodulation pixels, the flexibility of the architecture allows for integrating on sensor-level concepts for multi-tap sampling, mismatch compensation, background suppression and so on, without any requirement to adjust the particular demodulation pixel architecture.

A shunt for regulating blood pressure between a patient's left atrium and right atrium comprises an anchor comprising a neck region, first and second end regions, and a conduit affixed with the anchor that formed of a biocompatible material that is resistant to transmural and translation tissue ingrowth and that reduces a risk of paradoxical embolism.

The invention provides a conductive polymer composite material and a preparation method thereof. The composite material includes following blended components: a. thermoplastic resin; b. rubber particles having crosslinking structures; c. a conductive filling material; and d. low-melting-point metal. Gel content in the component b is, by weight, 60% or more than 60%. An average particle size of the rubber particles is 0.02-1 [mu]m. The component c is not melted at a processing temperature of the thermoplastic resin. The component d is at least one of a single-component metal and a metal alloy. A melting point of the component d ranges from 20-480 DEG C and is lower than the processing temperature of the thermoplastic resin. The conductive polymer composite material is low in filling amount of the conductive filling material and the low-melting-point metal, is more excellent in conductive performance, can be prepared through a conventional melt blending method, can be used for manufacturing electronic production devices and tools which have an anti-static function and an electromagnetic wave interference resistant function and is of a dust-free requirement, can be used for manufacturing shells of electronic instruments and meters, can be used as a decoration material in a dust-free production workshop and can be used as shells and circuit boards of various flexible electronic products.

The invention pertains to a system comprising: a source to generate a pulsed radiation pattern; a detector; a processor to process data from the detector when radiation is reflected by an object; a synchronization means interfacing between the detector and the source; wherein: the detector is synchronized with the source so that radiation to be processed is detected only during the pulses, the processor determines a characteristic of the object by determining displacement of detected spots with reference to predetermined positions, the source emits monochromatic light and the detector is equipped with a bandpass filter and optics arranged so as to modify an angle of incidence onto said filter to confine light to a predetermined range around a normal of said filter, said optics comprising an image-space telecentric lens.

The invention provides a conductive thermoplastic elastomer and a preparation method thereof. The thermoplastic elastomer includes following blended components: a. thermoplastic resin; b. rubber particles having crosslinking structures; c. a conductive filling material; and d. low-melting-point metal. Gel content in the component b is, by weight, 60% or more than 60%. An average particle size of the rubber particles is 0.02-1 [mu]m. The component c is not melted at a processing temperature of the thermoplastic resin. The component d is at least one of a single-component metal and a metal alloy. A melting point of the component d ranges from 20-480 DEG C and is lower than the processing temperature of the thermoplastic resin. A weight ratio of the component b to the component a is more than 30:70 and is lower than 75:25. The conductive polymer composite material is low in filling amount of the conductive filling material and the low-melting-point metal, is excellent in conductive performance, can be prepared through a melt blending method, can be used for manufacturing electronic production devices and tools which have an anti-static function and an electromagnetic wave interference resistant function and is of a dust-free requirement, can be used for manufacturing shells of electronic instruments and meters, can be used as a decoration material in a dust-free production workshop and can be used as shells and circuit boards of various flexible electronic products.

The invention provides a method for welding Q500qE ultralow-carbon bainite steel for a bridge. The method is excellent in joint mechanical performance and high in welding efficiency and specifically includes that aiming at specific chemical components, applicable technical conditions and different plate thicknesses of the Q500qE ultralow-carbon bainite steel for the bridge, preheating temperature before welding, groove types and welding process parameters are determined; a welding joint type adopts butt joint, penetration angle joint or ship position T-shaped angle joint; a welding method adopts submerged arc welding, CO2 gas shielded semiautomatic welding or shielded metal arc welding. By the welding method, the joint type and thickness specifications of a bridge structure are comprehensively covered, the technical scheme is simple, convenient and high in adaptivity, all implementing effects meet technical requirements of standards related to building of bridge steel and the bridge structure, and the method is of great significance in promoting upgrading of the bridge steel and development of large-span steel bridge building technology. The method can be applied to building of the bridge structure, can also be applied to welding of other ultrathin-carbon bainite steel and is high in adaptivity.

A method and structure for providing a high energy implant in only the red pixel location of a CMOS image sensor. The implant increases the photon collection depth for the red pixels, which in turn increases the quantum efficiency for the red pixels. In one embodiment, a CMOS image sensor is formed on an p-type substrate and the high energy implant is a p-type implant that creates a p-type ground contact under the red pixel, thus reducing dark non-uniformity effects. In another embodiment, a CMOS image sensor is formed on an n-type substrate and a high energy p-type implant creates a p-type region under only the red pixel to increase photon collection depth, which in turn increases the quantum efficiency for the red pixels.

Ecteinascidin formulations, methods of preparing the same, articles of manufacture and kits with such formulations, and methods of treating proliferative diseases with the same formulations are provided.

The invention provides a conductive plastic and a preparation method thereof. The conductive plastic comprises the following blended compositions: a, thermoplastic resin; b, rubber particle with a crosslinking structure; c, a conductive filter; and d, a low-melting-point metal. The gel content of the composition b is 60% by weight or more, and the average particle size of the composition b is 0.02-1 mu m; the composition c is not fused at a thermoplastic-resin processing temperature; the composition d is at least one of a single-composition metal or metal alloy, the melting point of the composition d is 20-480 DEG C and is lower than the thermoplastic-resin processing temperature; and the weight ratio of the composition b to the composition a is 0.1:99.9-30:70. The conductive plastic is low in filling content of the conductive filler and the metal, is relatively low in conductive performance, can be prepared by using a common melt blending method, and can be used to prepare antistatic electromagnetic-wave-interference-resisting electron production equipment and tools with dust-free requirements, and electronic apparatuses, instrument housings and decoration materials of dust-free production workshops.

The invention discloses a thermal-conductive antistatic PC/ABS (polycarbonate/acrylonitrile butadiene styrene) material and a preparation method thereof. The PC/ABS material comprises the following compositions in percentage by weight: 30-50% of PC resin, 10-25% of ABS resin, 20-35% of thermal conductive powder, 10-20% of antistatic agent, 2.5-5.5% of a compatilizer, 4-7% of toughening agent, 0.1-0.5% of lubricant, 0.1-1% of antioxidant, and 0.1-1% of anti-ultraviolet agent, wherein the thermal conductive powder is treated by using a coupling agent. According to the PC/ABS material prepared in the invention, the thermal conductive powder is treated by using the coupling agent, and due to the mutually cooperated and coordinated action of the two fillers (namely, the thermal conductive powder and the antistatic agent), the high-performance thermal conductivity and antistatic property can be realized with less filling quantity; and the physical and mechanical properties of the prepared PC/ABS material are excellent.

The invention discloses a full-position welding method for a pipeline by a full-automatic external welding machine, which comprises the following steps of: pretreating a pipe orifice end face of the pipeline; conventionally checking a welded pipeline, and performing environmental protection and equipment debugging; inputting and saving welding technical parameters into a tractor controller of an automatic external welding machine; machining the pipe orifice end face of the pipeline to be welded to form the needed groove by using a groove processing machine, and clearing and assembling the pipe orifice end face with the machined groove; checking welding rails and loading a welding tractor; and performing pre-welding preheating on the pipeline to be welded according to regulation requirement in welding technology, and welding according to the specified welding technical parameters. The method realizes real full-automatic pipeline welding, guarantees stable control of the welding process, ensures effective protection on electric arcs and molten baths, guarantees impact toughness of welded joints and welding quality, solves the bottleneck problems which restrict semi-automatic welding flow construction work, and improves the working efficiency.

The invention relates to a conductive silicon rubber material with ultralow compressive deformation and low hardness and a preparation method thereof and belongs to the technical field of conductive silicon rubber materials. The rubber material is prepared by filling conductive fillers with different shape factors so as to ensure that a network passage is formed under the condition of low-usage conductive filler. The rubber material comprises the following ingredients in parts by mass: 100 parts of silicon rubber, 1-15 parts of vulcanizing agent, 0 or 1-8 parts of vulcanizing assistant, 5-15 parts of carbon black and 0.5-5 parts of carbon nanotubes. According to the material, the material is endowed with higher conductivity under the condition that lower compression permanent deformation and lower hardness are guaranteed; the preparation process is simple, and the cost is low; and through testing the electrical and mechanical properties of the material, the conductive silicon rubber material has the following properties: the Shore A hardness is not higher than 50, the 25% constant compression permanent deformation is not higher than 10% (100 DEG C * 24 h), the instantaneous resilience performance is not lower than 60%, and the volume resistivity is not higher than 50 omega.cm.

The invention is suitable for the technical field of high polymer materials and provides a nylon 66 composite material, a preparation method thereof and an electronic device. the nylon 66 composite material comprises the raw materials in percentage by weight as follows: 40%-65% of PA 66 resins, 8%-12% of a roughening agent, 20%-35% of heat conduction powder; 10%-15% of an antistatic agent, 2.5%-5.5% of a compatilizer, 0.1%-0.5% of a lubricating agent, 0.1%-1% of an antioxidant agent, 0.1%-2% of a coupling agent and 0.2%-0.5% of a nucleating agent, wherein the heat conduction powder is processed by the coupling agent. According to the invention, when the nylon 66 composite material is prepared, the coupling agent is used for processing the heat conduction powder, and two fillers of the heat conduction powder and a conductive agent are mutually matched and coordinated, so that the excellent heat conductivity and antistatic property can be obtained with low filler consumption, and simultaneously the prepared nylon 66 composite material has excellent physical and mechanical properties.

Optical fiber cable with a central strength member structure and with four or five buffer tubes each loosely receiving optical fiber ribbons in a stack and is disposed around and contacting the strength member. The optical fiber count is in excess of 1000 and the fill factor is not greater than 85% in a two inch duct. Each buffer tube contacts adjacent buffer tubes, and the buffer tubes are encircled by a jacket. Optionally, spaces bounded by pairs of buffer tubes and the jacket have optical fibers therein and can also include flexible longitudinal strength members and/or water blocking filaments. Preferably, the strength member structure and/or the buffer tubes are encircled by a water blocking tape. The optical fiber ribbons in the stacks can include different numbers of fibers, and hence, can have different width.

A silicon wafer-based photovoltaic module is described, which includes a first outer protective layer and a second outer protective layer, wherein both outer protective layers comprise a low- or no-sodium glass or low- or no-alkali compositions. The photovoltaic modules show resistance to water ingress, no or reduced potential-induced sodium ion drift, and reduced potential induced degradation.

A shunt for regulating blood pressure between a patient's left atrium and right atrium comprises an anchor comprising a neck region, first and second end regions, and a conduit affixed with the anchor that formed of a biocompatible material that is resistant to transmural and translation tissue ingrowth and that reduces a risk of paradoxical embolism.