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Thermal-conductive antistatic PC/ABS (polycarbonate/acrylonitrile butadiene styrene) material and preparation method thereof

An ABS material, antistatic technology, applied in the field of thermal conductivity and antistatic PC/ABS material and its preparation, can solve the problems of high volume resistivity, electric shock, dust collection, etc., and achieve the effect of excellent physical and mechanical properties and high filling capacity

Inactive Publication Date: 2012-07-25
ANHUI KEJU NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most polymer materials have excellent electrical insulation properties, and their volume resistivity is very high, about 1×1010-1×1020Ω·cm. It is easy to generate static electricity accumulation during use, resulting in dust collection, electric shock, and even spark discharge And other bad phenomena, especially in some electronic products can not be used

Method used

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  • Thermal-conductive antistatic PC/ABS (polycarbonate/acrylonitrile butadiene styrene) material and preparation method thereof
  • Thermal-conductive antistatic PC/ABS (polycarbonate/acrylonitrile butadiene styrene) material and preparation method thereof
  • Thermal-conductive antistatic PC/ABS (polycarbonate/acrylonitrile butadiene styrene) material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The thermally conductive and antistatic PC / ABS material in this embodiment, by weight percentage, consists of the following components:

[0025] 40% of PC resin, 15.8% of ABS resin, 20% of aluminum oxide or silicon carbide treated with coupling agent (or a mixture of the two by weight 1:1), 15% of graphite, 3% of compatibilizer, and toughening agent 5%, lubricant 0.5%, antioxidant 0.4%, anti-ultraviolet agent 0.3%.

[0026] Its preparation method is as follows:

[0027] Step 1. Weigh each component according to the above-mentioned weight percentage; wherein, the thermally conductive powder is treated with a coupling agent;

[0028] Step 2. Pour the weighed components into the mixing bucket and stir for 8min, and the stirring speed is 400r / min;

[0029] Step 3: Put the mixed material into the twin-screw extruder, and then extrude and granulate through the melting reaction; the technological conditions of the twin-screw extruder are: the temperature of the first zone is...

Embodiment 2

[0031] The thermally conductive and antistatic PC / ABS material in this embodiment, by weight percentage, consists of the following components:

[0032] PC resin 30%, ABS resin 25%, aluminum oxide or silicon carbide treated with coupling agent (or a mixture of the two by weight 1:1) 25.8%, graphite 10%, compatibilizer 4%, toughening agent 4%, lubricant 0.3%, antioxidant 0.6%, anti-ultraviolet agent 0.3%.

[0033] Its preparation method is as follows:

[0034] Step 1. Weigh each component according to the above-mentioned weight percentage; wherein, the thermally conductive powder is treated with a coupling agent;

[0035] Step 2: Pour the weighed components into the mixing bucket and stir for 5min, and the stirring speed is 450r / min;

[0036] Step 3: Put the mixed material into the twin-screw extruder, and then extrude and granulate through the melting reaction; the technological conditions of the twin-screw extruder are: the temperature of the first zone is 220°C, the tempera...

Embodiment 3

[0038] The thermally conductive and antistatic PC / ABS material in this embodiment, by weight percentage, consists of the following components:

[0039] PC resin 50%, ABS resin 10%, aluminum oxide or silicon carbide treated with coupling agent (or a mixture of the two by weight 1:1) 20.8%, graphite 11%, compatibilizer 3%, toughening agent 4%, lubricant 0.3%, antioxidant 0.6%, anti-ultraviolet agent 0.3%.

[0040] Its preparation method is as follows:

[0041] Step 1. Weigh each component according to the above-mentioned weight percentage; wherein, the thermally conductive powder is treated with a coupling agent;

[0042] Step 2. Pour the weighed components into the mixing bucket and stir for 10min, and the stirring speed is 350r / min;

[0043] Step 3: Put the mixed material into the twin-screw extruder, and then extrude and granulate through the melting reaction; the technological conditions of the twin-screw extruder are: the temperature of the first zone is 220°C, the temper...

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Abstract

The invention discloses a thermal-conductive antistatic PC / ABS (polycarbonate / acrylonitrile butadiene styrene) material and a preparation method thereof. The PC / ABS material comprises the following compositions in percentage by weight: 30-50% of PC resin, 10-25% of ABS resin, 20-35% of thermal conductive powder, 10-20% of antistatic agent, 2.5-5.5% of a compatilizer, 4-7% of toughening agent, 0.1-0.5% of lubricant, 0.1-1% of antioxidant, and 0.1-1% of anti-ultraviolet agent, wherein the thermal conductive powder is treated by using a coupling agent. According to the PC / ABS material prepared in the invention, the thermal conductive powder is treated by using the coupling agent, and due to the mutually cooperated and coordinated action of the two fillers (namely, the thermal conductive powder and the antistatic agent), the high-performance thermal conductivity and antistatic property can be realized with less filling quantity; and the physical and mechanical properties of the prepared PC / ABS material are excellent.

Description

[Technical field] [0001] The invention relates to the field of polymer materials, in particular to a thermally conductive and antistatic PC / ABS material and a preparation method thereof. [Background technique] [0002] PC / ABS alloy materials have excellent comprehensive properties and are widely used in electronic equipment such as mobile phones, fax machines, copiers, and computer casings. With the high performance of electronic products such as mobile phones and notebook computers, the rapid development of microelectronic integration technology and assembly technology, the development of thin electronic products, the volume of electronic components and logic circuits is getting smaller and smaller, and the operating frequency is increasing rapidly. , the semiconductor thermal environment changes rapidly towards high temperature. At this time, the heat generated by the electronic equipment accumulates and increases rapidly. Under the normal operating environment temperatur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08L55/02C08K13/06C08K9/04C08K9/06C08K7/06C08K3/22C08K3/38C08K3/28C08K3/04B29C47/92B29C48/92
Inventor 徐东徐永许江威
Owner ANHUI KEJU NEW MATERIALS
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